TWI568875B - 沉積室的邊緣環 - Google Patents

沉積室的邊緣環 Download PDF

Info

Publication number
TWI568875B
TWI568875B TW102111924A TW102111924A TWI568875B TW I568875 B TWI568875 B TW I568875B TW 102111924 A TW102111924 A TW 102111924A TW 102111924 A TW102111924 A TW 102111924A TW I568875 B TWI568875 B TW I568875B
Authority
TW
Taiwan
Prior art keywords
protruding member
edge ring
recess
planar surface
planar
Prior art date
Application number
TW102111924A
Other languages
English (en)
Chinese (zh)
Other versions
TW201348489A (zh
Inventor
戈埃爾艾希思
沙布藍尼安納薩
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201348489A publication Critical patent/TW201348489A/zh
Application granted granted Critical
Publication of TWI568875B publication Critical patent/TWI568875B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3441—Dark space shields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
TW102111924A 2012-04-06 2013-04-02 沉積室的邊緣環 TWI568875B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261621185P 2012-04-06 2012-04-06

Publications (2)

Publication Number Publication Date
TW201348489A TW201348489A (zh) 2013-12-01
TWI568875B true TWI568875B (zh) 2017-02-01

Family

ID=49291383

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102111924A TWI568875B (zh) 2012-04-06 2013-04-02 沉積室的邊緣環

Country Status (7)

Country Link
US (1) US9376752B2 (cg-RX-API-DMAC7.html)
JP (1) JP6141405B2 (cg-RX-API-DMAC7.html)
KR (1) KR102129844B1 (cg-RX-API-DMAC7.html)
CN (1) CN104205295B (cg-RX-API-DMAC7.html)
DE (1) DE112013001929T5 (cg-RX-API-DMAC7.html)
TW (1) TWI568875B (cg-RX-API-DMAC7.html)
WO (1) WO2013151703A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739138B (zh) * 2018-10-30 2021-09-11 日商愛發科股份有限公司 真空處理裝置

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9905443B2 (en) * 2011-03-11 2018-02-27 Applied Materials, Inc. Reflective deposition rings and substrate processing chambers incorporating same
WO2015179081A1 (en) 2014-05-21 2015-11-26 Applied Materials, Inc. Thermal processing susceptor
WO2016099826A1 (en) 2014-12-19 2016-06-23 Applied Materials, Inc. Edge ring for a substrate processing chamber
US10658222B2 (en) * 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
US9932668B2 (en) 2015-10-26 2018-04-03 Tango Systems Inc. Physical vapor deposition system using backside gas cooling of workpieces
JP6688385B2 (ja) * 2016-07-06 2020-04-28 株式会社アルバック 成膜装置、プラテンリング
KR102641441B1 (ko) 2016-09-28 2024-02-29 삼성전자주식회사 링 어셈블리 및 이를 포함하는 척 어셈블리
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR102806341B1 (ko) 2017-01-04 2025-05-12 삼성전자주식회사 포커스 링 및 이를 포함하는 플라즈마 처리 장치
CN110010517B (zh) * 2017-11-27 2022-01-04 台湾积体电路制造股份有限公司 加热台以及用于处理半导体晶片的设备
US12191127B2 (en) * 2018-10-31 2025-01-07 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus for physical vapor deposition and method for forming a layer
KR102406942B1 (ko) * 2019-09-16 2022-06-10 에이피시스템 주식회사 엣지 링 및 이를 포함하는 열처리 장치
CN112501577B (zh) * 2020-11-30 2022-07-15 宁波江丰电子材料股份有限公司 一种晶圆固定环及其制备方法与应用
US11492699B2 (en) * 2021-02-17 2022-11-08 Applied Materials, Inc. Substrate temperature non-uniformity reduction over target life using spacing compensation
JP1741172S (ja) * 2022-10-20 2023-04-06 サセプタカバー
JP1741176S (ja) * 2022-10-20 2023-04-06 サセプタ用カバーベース
JP1741174S (ja) * 2022-10-20 2023-04-06 サセプタ
JP1745873S (ja) * 2022-10-20 2023-06-08 サセプタ
JP1745925S (ja) * 2022-10-20 2023-06-08 サセプタカバー
JP1746408S (ja) * 2023-01-11 2023-06-15 サセプタ
JP1746407S (ja) * 2023-01-11 2023-06-15 サセプタ
JP1746406S (ja) * 2023-01-11 2023-06-15 サセプタユニット
JP1746403S (ja) * 2023-01-11 2023-06-15 サセプタ
JP1746405S (ja) * 2023-01-11 2023-06-15 サセプタカバー

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060090706A1 (en) * 2004-11-03 2006-05-04 Applied Materials, Inc. Support ring assembly
JP2007527628A (ja) * 2004-03-05 2007-09-27 アプライド　マテリアルズ　インコーポレイテッド 傾斜した堆積を低減するためのハードウェア開発
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395363B1 (en) * 1996-11-05 2002-05-28 Applied Materials, Inc. Sloped substrate support
JP4003899B2 (ja) * 1997-11-10 2007-11-07 コバレントマテリアル株式会社 回転式気相薄膜成長装置
US6482301B1 (en) 1998-06-04 2002-11-19 Seagate Technology, Inc. Target shields for improved magnetic properties of a recording medium
US6344105B1 (en) 1999-06-30 2002-02-05 Lam Research Corporation Techniques for improving etch rate uniformity
KR100315088B1 (ko) * 1999-09-29 2001-11-24 윤종용 포커스 링을 갖는 반도체 웨이퍼 제조 장치
JP4470274B2 (ja) * 2000-04-26 2010-06-02 東京エレクトロン株式会社 熱処理装置
JP2002134429A (ja) * 2000-10-12 2002-05-10 Applied Materials Inc 基板処理装置用のベアリングカバー、基板処理装置および熱処理方法
US6634882B2 (en) 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
US20030015421A1 (en) 2001-07-20 2003-01-23 Applied Materials, Inc. Collimated sputtering of cobalt
US6620736B2 (en) * 2001-07-24 2003-09-16 Tokyo Electron Limited Electrostatic control of deposition of, and etching by, ionized materials in semiconductor processing
KR100733269B1 (ko) 2005-08-18 2007-06-28 피에스케이 주식회사 반도체 식각 장비의 척 조립체
KR20070025092A (ko) 2005-08-31 2007-03-08 삼성전자주식회사 웨이퍼 리프트 유닛의 리프트핑거
US7520969B2 (en) * 2006-03-07 2009-04-21 Applied Materials, Inc. Notched deposition ring
CN101919041B (zh) 2008-01-16 2013-03-27 索绍股份有限公司 衬底固持器，衬底支撑设备，衬底处理设备以及使用所述衬底处理设备的衬底处理方法
US20090260982A1 (en) * 2008-04-16 2009-10-22 Applied Materials, Inc. Wafer processing deposition shielding components
US20090308739A1 (en) 2008-06-17 2009-12-17 Applied Materials, Inc. Wafer processing deposition shielding components
JP4709945B2 (ja) * 2009-04-13 2011-06-29 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
USD665491S1 (en) 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD665071S1 (en) 2012-01-25 2012-08-07 Applied Materials, Inc. Deposition chamber liner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007527628A (ja) * 2004-03-05 2007-09-27 アプライド　マテリアルズ　インコーポレイテッド 傾斜した堆積を低減するためのハードウェア開発
US20060090706A1 (en) * 2004-11-03 2006-05-04 Applied Materials, Inc. Support ring assembly
CN1790659A (zh) * 2004-11-03 2006-06-21 应用材料有限公司 支承环部件
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739138B (zh) * 2018-10-30 2021-09-11 日商愛發科股份有限公司 真空處理裝置

Also Published As

Publication number Publication date
JP2015519472A (ja) 2015-07-09
KR102129844B1 (ko) 2020-07-03
DE112013001929T5 (de) 2014-12-24
US9376752B2 (en) 2016-06-28
TW201348489A (zh) 2013-12-01
KR20150005556A (ko) 2015-01-14
CN104205295A (zh) 2014-12-10
WO2013151703A1 (en) 2013-10-10
US20130264035A1 (en) 2013-10-10
JP6141405B2 (ja) 2017-06-07
CN104205295B (zh) 2017-05-31

Similar Documents

Publication Publication Date Title
TWI568875B (zh) 沉積室的邊緣環
KR101921199B1 (ko) 램프 조립체를 이용한 기판 하부의 오프­각도형 가열
US10903067B2 (en) Cooled reflective adapter plate for a deposition chamber
US9905443B2 (en) Reflective deposition rings and substrate processing chambers incorporating same
JPH0837193A (ja) 半導体ウエハの表面温度の均一性を改善するための方法および装置
KR20170030581A (ko) 화학 기상 증착 반응기에서의 서셉터의 설계
KR102117234B1 (ko) 반사성 증착 링들 및 그를 포함하는 기판 프로세싱 챔버들
US20250308952A1 (en) High-efficiency led substrate heater for deposition applications