JP2015519472A - 堆積チャンバ用のエッジリング - Google Patents
堆積チャンバ用のエッジリング Download PDFInfo
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- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
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- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
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Abstract
Description
別の実施形態では、エッジリングが設けられる。エッジリングは、内側周囲端面、第1の表面、および第1の表面の反対側の第2の表面を有する環状本体と、内側周囲端面に隣接する平面の表面を画定する第2の表面から延びる第1の隆起部材と、第1の隆起部材の径方向外向きに第2の表面から延び、第1のくぼみによって第1の隆起部材から分離された第2の隆起部材と、第2の隆起部材の径方向外向きに第2の表面から延び、第2のくぼみによって分離された第3の隆起部材と、第3の隆起部材の径方向外向きに配設された凹型フランジであって、第1の表面の平面に対して平行であり、本体の外側周囲表面にほぼ直角である表面を含む、凹型フランジとを含む。
別の実施形態では、エッジリングが設けられる。エッジリングは、内側周囲端面、第1の表面、および第1の表面とは反対の第2の表面を有する環状本体と、第1の表面にほぼ平行である内側周囲端面に隣接する平面の表面を画定する第2の表面から直角に延びる第1の隆起部材と、第1の隆起部材の径方向外向きに第2の表面から延び、第1のくぼみによって第1の隆起部材から分離された第2の隆起部材であって、第1の側部および第2の側部を有する第2の隆起部材と、第2の隆起部材の径方向外向きに第2の表面から延び、第2のくぼみによって分離された第3の隆起部材であって、第2のくぼみが、第2の隆起部材の第2の側部の表面にほぼ垂直である角度を有する平面内に配設されたテーパ状の平面の表面を含む、第3の隆起部材と、第3の隆起部材の径方向外向きに配設された凹型フランジであって、本体の外側周囲表面にほぼ直角である表面を含む、凹型フランジとを含む。
図1は、1つの実施形態による堆積チャンバ100の概略断面図である。堆積チャンバ100は、その内部容積部106を封入する本体105を画定する上側側壁102、下側側壁103、および蓋部分104を有する。アダプタプレート107が、上側側壁102と下側側壁103の間に配設され得る。ペデスタル108などの基板支持体が、堆積チャンバ100の内部容積部106内に配置される。基板移送ポート109が、基板を内部容積部106内におよびそこから外に移送するために下側側壁103内に形成される。
1つの実施形態では、堆積チャンバ100は、たとえば、チタン、酸化アルミニウム、アルミニウム、銅、タンタル、窒化タンタル、タングステン、または窒化タングステンを基板上に堆積することができる、物理的気相堆積(PVD)チャンバとしても知られているスパッタリングチャンバを備える。適切なPVDチャンバの例は、ALPS(登録商標)PlusおよびSIP ENCORE(登録商標)PVD処理チャンバを含み、いずれもカリフォルニア州、サンタクララのApplied Materials,Incから市販されている。他の製造者から入手可能な処理チャンバもまた、本明細書において説明する実施形態を利用できることが企図される。
アダプタプレート107内に形成された貫通孔129もまた、処理中、ガス伝導性の増大のために利用され得る。貫通孔129の各々は、約0.40インチ(1.01cm)から約0.55インチ(1.4cm)の直径を含むことができ、アダプタプレート107は、約30から約70個の貫通孔129を含むことができる。処理中、リフレクタリング148と径方向フランジ130の間の間隙内の流れは、貫通孔129を通り抜ける流れと組み合わせて、約400℃において約14.22の組み合わされた伝導値をもたらす。
基板を第1の温度に加熱した後、基板138は、ペデスタル108の基板受け入れ表面144上の位置に下げられる。基板138は、ペデスタル108内の熱制御チャネル146を利用して伝導によってすばやく冷却され得る。基板の温度は、数秒から約1分の間に第1の温度から第2の温度まで下降され得る。第2の温度は、約23℃から約30℃など、たとえば約25℃のほぼ室温であってもよい。基板138は、さらなる処理のために、基板移送ポート109を通して堆積チャンバ100から取り出され得る。
Claims (17)
- 内側周囲端面、第1の表面、および前記第1の表面とは反対側の第2の表面を有する環状本体と、
前記第2の表面からほぼ直角に延びる第1の隆起部材と、
前記第1の隆起部材に隣接する前記第2の表面から延び、第1のくぼみによって前記第1の隆起部材から分離された第2の隆起部材と、
前記第2の隆起部材に隣接する前記第2の表面から延び、第2のくぼみによって分離された第3の隆起部材であって、前記第2のくぼみが、前記第1の表面の反射値とは異なる反射値を有する傾斜表面を含み、前記傾斜表面は、光エネルギーを径方向内向きに向けるように構成される、第3の隆起部材と
を備えるエッジリング。 - 前記環状本体が、セラミック材料を含む、請求項1に記載のエッジリング。
- 前記傾斜表面が、金属材料によってコーティングされる、請求項2に記載のエッジリング。
- 前記金属材料が、銅含有材料である、請求項3に記載のエッジリング。
- 前記傾斜表面が、約75Raから約120Raの中間値の表面粗さを含む、請求項2に記載のエッジリング。
- 前記第2のくぼみおよび前記傾斜表面が、約75Raから約120Raの中間値の表面粗さを含む、請求項2に記載のエッジリング。
- 前記第2の表面が、前記第1のくぼみと第3の隆起部材の間に約75Raから約120Raの中間値の表面粗さを含む、請求項2に記載のエッジリング。
- 前記傾斜表面が、前記第1の表面の平面に対して約15度から約25度の角度で配向される、請求項1に記載のエッジリング。
- 前記本体が、焼結されたセラミック材料を含み、前記傾斜表面が、銅含有材料を含むコーティングを含む、請求項8に記載のエッジリング。
- 前記環状本体の前記内側周囲端面上に配設された複数の拡張部材をさらに備える、請求項1に記載のエッジリング。
- 内側周囲端面、第1の表面、および前記第1の表面とは反対側の第2の表面を有する環状本体と、
前記内側周囲端面に隣接する平面の表面を画定する前記第2の表面から延びる第1の隆起部材と、
前記第1の隆起部材の径方向外向きに前記第2の表面から延び、第1のくぼみによって前記隆起部材から分離された第2の隆起部材と、
前記第2の隆起部材の径方向外向きに前記第2の表面から延び、第2のくぼみによって分離された第3の隆起部材と、
前記第3の隆起部材の径方向外向きに配設された凹型フランジであって、前記第1の表面の平面に対して平行であり、前記本体の外側周囲表面にほぼ直角である表面を含む、凹型フランジと
を備えるエッジリング。 - 前記第2のくぼみが、前記第1の表面の前記平面に対して鋭角に配設されたテーパ状の平面の表面を含む、請求項11に記載のエッジリング。
- テーパ状の表面が、前記第1の表面の反射値とは異なる反射値を含む、請求項12に記載のエッジリング。
- 前記テーパ状の平面の表面が、約75Raから約120Raの中間値の表面粗さを含む、請求項12に記載のエッジリング。
- 前記第1のくぼみと前記第3の隆起部材の頂点との間の領域が、約75Raから約120Raの中間値の表面粗さを含む、請求項12に記載のエッジリング。
- 前記テーパ状の平面の表面が、金属材料でコーティングされる、請求項12に記載のエッジリング。
- 内側周囲端面、第1の表面、および前記第1の表面とは反対側の第2の表面を有する環状本体と、
前記第1の表面にほぼ平行である前記内側周囲端面に隣接する平面の表面を画定する前記第2の表面から直角に延びる第1の隆起部材と、
前記第1の隆起部材の径方向外向きに前記第2の表面から延び、第1のくぼみによって前記第1の隆起部材から分離された第2の隆起部材であって、第1の側部および第2の側部を有する、第2の隆起部材と、
前記第2の隆起部材の径方向外向きに前記第2の表面から延び、第2のくぼみによって分離された第3の隆起部材であって、前記第2のくぼみが、前記第2の隆起部材の前記第2の側部の表面に対してほぼ垂直である角度を有する平面内に配設されたテーパ状の平面の表面を含む、第3の隆起部材と、
前記第3の隆起部材の径方向外向きに配設された凹型フランジであって、前記本体の外側周囲表面にほぼ直角である表面を含む、凹型フランジとを備える、エッジリング。
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