TWI568792B - 用於電容去離子電極的黏結劑與其形成方法 - Google Patents
用於電容去離子電極的黏結劑與其形成方法 Download PDFInfo
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- TWI568792B TWI568792B TW104142429A TW104142429A TWI568792B TW I568792 B TWI568792 B TW I568792B TW 104142429 A TW104142429 A TW 104142429A TW 104142429 A TW104142429 A TW 104142429A TW I568792 B TWI568792 B TW I568792B
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- Prior art keywords
- binder
- electrode
- active material
- electrode according
- deionization electrode
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- 239000011230 binding agent Substances 0.000 title claims description 45
- 238000002242 deionisation method Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 55
- 239000011149 active material Substances 0.000 claims description 21
- 239000003990 capacitor Substances 0.000 claims description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 14
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 12
- -1 polytetramethylene Polymers 0.000 claims description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 claims description 3
- 239000006230 acetylene black Substances 0.000 claims description 3
- 239000007767 bonding agent Substances 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 229940075529 glyceryl stearate Drugs 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 235000014113 dietary fatty acids Nutrition 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 229930195729 fatty acid Natural products 0.000 claims 1
- 239000000194 fatty acid Substances 0.000 claims 1
- CKQVRZJOMJRTOY-UHFFFAOYSA-N octadecanoic acid;propane-1,2,3-triol Chemical compound OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O CKQVRZJOMJRTOY-UHFFFAOYSA-N 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 description 68
- 230000002209 hydrophobic effect Effects 0.000 description 22
- 239000002033 PVDF binder Substances 0.000 description 20
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 17
- 229920002635 polyurethane Polymers 0.000 description 16
- 239000004721 Polyphenylene oxide Substances 0.000 description 11
- 229920000570 polyether Polymers 0.000 description 11
- 229920005862 polyol Polymers 0.000 description 11
- 150000003077 polyols Chemical class 0.000 description 11
- 150000002009 diols Chemical class 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 125000005442 diisocyanate group Chemical group 0.000 description 6
- 239000012071 phase Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000003575 carbonaceous material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000000157 electrochemical-induced impedance spectroscopy Methods 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000002484 cyclic voltammetry Methods 0.000 description 3
- 229920005596 polymer binder Polymers 0.000 description 3
- 239000002491 polymer binding agent Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229910021607 Silver chloride Inorganic materials 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical group [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DBAKFASWICGISY-DASCVMRKSA-N Dexchlorpheniramine maleate Chemical group OC(=O)\C=C/C(O)=O.C1([C@H](CCN(C)C)C=2N=CC=CC=2)=CC=C(Cl)C=C1 DBAKFASWICGISY-DASCVMRKSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011267 electrode slurry Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
- C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
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- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/36—Hydroxylated esters of higher fatty acids
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
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- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
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- C02F1/469—Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis
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Description
本揭露係關於電極，更特別關於電極中的黏結劑。
碳電極在製備的過程中常需使用高分子黏結劑(polymer binder)，用以黏結電極材料顆粒並固定電極材料顆粒與集電板(current collector)。高分子黏結劑接合的效果對電極的功能影響甚鉅，故高分子黏結劑特性的調控非常重要。一般電極製備常使用氟系高分子作為黏結劑，其中以PVDF(polyvinylidene fluoride)最為普遍。PVDF黏結劑可形成化學安定網路結構(chemically inert network)，其機械強度可有效且大範圍支撐活性材料顆粒間的相互連結，於適當用量下不會影響到活性材料之電化學特性。然而PVDF黏結劑具有成本高、可撓性(flexibility)低、及環境友善性低等缺點。
綜上所述，目前亟需新的黏結劑組成取代PVDF黏結劑，以用於黏結電極材料顆粒並將其固定至集電板。
本揭露一實施例提供之用於電容去離子電極的黏結劑，包括：具有疏水性之聚醚多元醇、二異氰酸酯、與具有疏水性側鏈之二醇反應而成之產物。
本揭露一實施例提供之用於電容去離子電極的黏結劑之形成方法，包括：混合疏水性之聚醚多元醇、二異氰酸酯、與具有疏水性側鏈之二醇，反應形成黏結劑。
第1A圖係不同分子量之PU電極其容抗對阻抗之曲線圖。
第1B圖係第1A圖之部份放大圖。
第2圖係不同分子量之PU電極其相角對頻率之曲線圖。
第3A圖係PU電極與PVDF電極其容抗對阻抗之曲線圖。
第3B圖係第3A圖之部份放大圖。
第4圖係PU電極與PVDF電極其相角對頻率之曲線圖。
本揭露一實施例提供之聚氨酯，係由1莫耳份之疏水性之聚醚多元醇(HO-R2-OH)、3至20莫耳份之二異氰酸酯(ONC-R1-NCO)、與1至6莫耳份之具有疏水性側鏈之二醇(HO-R3-OH)反應而成。上述反應如式1所示：
在式1中，R1、R2、與R3取決於二異氰酸酯、疏水
性之聚醚多元醇、與具有疏水性側鏈之二醇的種類，而x與y取決於疏水性之聚醚多元醇與具有疏水性側鏈之二醇之莫耳比例。另一方面，聚氨酯為無規共聚物，即上述對應x之重複單元與對應y之重複單元之排列方式為無規。在一實施例中，疏水性之聚醚多元醇種類其碳氫主鏈(hydrocarbon backbone)為具高撓曲性與疏水特性，而具有疏水性側鏈之二醇種類則為控制鏈段軟硬程度，以及側鏈疏水增加黏結劑防水性。在一實施例中，聚氨酯之數目平均分子量大於1.6×105以上。若聚氨酯之數目平均分子量過低，則無法有效黏結活性材料以作為電極。若聚氨酯之數目平均分子量過高，則黏度(viscosity)過高且結構彈性(elasticity)過低，不利於配製電極漿料並降低電極效能。
舉例來說，二異氰酸酯可為六亞甲基二異氰酸酯、甲苯二異氰酸酯、二苯基甲烷二異氰酸酯、或上述之組合。疏水性之二異氰酸酯可降低聚氨酯之對稱性，並降低結晶硬度。疏水性之聚醚多元醇可為聚丁二醇、聚丙二醇、或上述之組合。疏水性之聚醚多元醇之撓曲性高且具疏水特性。在一實施例中，聚醚多元醇之數目平均分子量介於1000至5000之間。若疏水性之聚醚多元醇之數目平均分子量過低，分子結構會較硬及脆，不易服貼。若聚醚多元醇之數目平均分子量過高，則分子結構會較軟，且內聚強度變弱。具有疏水性側鏈之二醇可為C12-26之單脂肪酸甘油酯、C12-26之二聚脂肪酸(dimer acids)、或上述之組合。具有疏水性側鏈之二醇可作為聚氨酯之硬段，控制聚氨酯之軟硬程度。另一方面，具有疏水性側鏈之二醇之疏水側鏈可增加聚氨酯之疏水性，且側鏈碳數愈高則疏水性愈
高。
在一實施例中，可混合90重量份之活性材料與5至25重量份之黏結劑如上述聚氨酯、與溶劑(如N-甲基吡咯烷酮(NMP)、異丙醇、乙醇、或上述之組合)以形成漿料。接著將漿料塗佈於集電板(如銅、鋁、鈦、其他金屬、或上述之合金)上烘乾，即形成電極。若黏結劑之比例過低，則無法有效黏結活性及導電材料與集電板而有脫落問題。若黏結劑之比例過高，則可能會增加電極電阻而降低電極效能。舉例來說，活性材料可為活性碳材、奈米碳管、石墨烯、或上述之組合等高比表面積的材料。上述活性材料之比表面積介於300m2/g至3000m2/g之間，且其孔洞大小介於1至1000nm。若活性材料之比表面積過小，則會影響電吸附離子容量。若活性材料導電度不足(如活性碳材料)，可添加5至20重量份之導電材料幫助導電，且導電材料可為石墨、碳黑、乙炔黑、或上述之組合。但值得注意的是，添加量過多(如石墨或碳黑)之導電材料，會使活性碳之材料重量比例含量下降，導致吸附離子之有效面積降低，進而使其吸附電容下降。
上述聚氨酯在乾燥時，具有良好熱穩定性、高化學穩定性、且能被電解質濕潤，因此含有上述聚氨酯作為黏結劑的電極具有多種用途。在一實施例中，上述電極可搭配對電極與兩者之間的水相溶液，以作電容去離子之用。在其他實施例中，上述聚氨酯作為黏結劑的電極可用於其他裝置如鋰電池、燃料電池、超級電容器、或儲氫裝置。
為了讓本揭露之上述和其他目的、特徵、和優點
能更明顯易懂，下文特舉數實施例作詳細說明如下：
取1莫耳份之聚丁二醇(PTMEG，購自立大化工，數目平均分子量為2000)與3莫耳份之硬脂酸甘油酯(GMS)加入300mL之除水NMP中，加熱至70℃形成均相溶液。接著將上述溶液降溫至50℃後，將3莫耳份之甲苯二異氰酸酯(TDI)加入上述溶液，待溫度穩定後再加熱上述反應物至70℃並於70℃下反應。在反應3小時後，每隔一小時取樣確認反應物中的-NCO官能基殘留量，待-NCO官能基殘留量不再降低後，可進一步添加溶劑稀釋產物，再加入額外TDI以增加產物分子量。上述鏈延長反應可進行多次，即可得多種不同數目平均分子量之聚氨酯。PTMEG與TDI(起始用量與後續添加量之總合)的莫耳比介於1：6至1：16之間。聚氨酯產物依數目平均分子量高低可分為含6莫耳份TDI之PU(A)、含7莫耳份TDI之PU(B)、含8莫耳份TDI之PU(C)、含10.5莫耳份TDI之PU(D)、與含13.5莫耳份TDI之PU(E)，其數目平均分子量如第1表所示。
秤取80重量份之活性碳(activated carbon，AC)作為活性材料、10重量份之石墨粉(購自EMAXWIN)作為導電材、與10重量份上述製備之聚氨酯溶液(15wt%，PU(A)至PU(E))作為黏結劑，均勻攪拌24小時使之成為糊狀漿料。接著以塗佈間隙300μm之刮刀將糊狀物均勻塗佈在50μm鈦箔上，送入120℃烘箱中烘乾4小時，完成PU電極。
秤取80重量份之活性碳(activated carbon，AC)作為活性材料、10重量份之石墨粉(購自EMAXWIN)作為導電材、與10重量份之聚偏二氟乙烯(Poly(vinylidene fluoride，PVDF)溶液(5wt%，數目平均分子量為534,000，購自Aldrich)作為黏結劑，均勻攪拌24小時使之成為糊狀漿料。接著以塗佈間隙300μm之刮刀將糊狀物均勻塗佈在50μm鈦箔上，送入120℃烘箱中烘乾4小時，完成PVDF電極。
黏結劑最基本的要求是對高比表面積活性材料、導電材料、與集電板有好的黏著性，利用萬能拉力機測定活性碳塗層在鈦集電板的剝離強度。將製備好的碳電極裁切為2.5cm寬的長條狀，再將標準膠帶黏上、並以2公斤滾輪來回壓合3次，即可製備成T peel拉伸的樣品，以萬能拉力機定速率30cm/min測試剝離強度，荷重模頭顯示的力量數值即是剝離強度，單位為kg/25mm。上述黏結劑之剝離強度如第1表所示。
較低分子量的PU(A)及PU(B)其分子特性較為軟黏且不成膜，以致電極無法完整成膜，因此活性碳塗層在集電板上易剝離，活性碳分子之間作用力低。由剝離強度的結果也可看出，較低分子量的PU黏結劑接著強度差。隨著PU黏結劑分
子量提高，可看出PU(C)、(D)、(E)接著強度有提升趨勢，由於分子量越大，PU彈性體所含極性胺基比例愈高，與碳材間的接著作用力愈佳，因而黏結劑展現的強度愈高、表面更不沾黏。如第1表所示，某些PU黏結劑之接著強度優於PVDF。
接著以循環伏安法(cyclic voltammetry，CV)分析PU電極與PVDF電極之電容值。測試溶液為0.5M NaCl水溶液，工作電極面積1cm x 1cm，對電極為白金線，參考電極為氯化銀電極(AgCl/Ag)，電位掃瞄範圍為-0.5~0.5V，掃瞄速率為10mV/s，對CV曲線積分得到之電荷變化量，除以電位窗及電極活性材料重量即得電極之比電容值。
在剝離強度測試(peel test)中得知較低分子量的PU(A)及PU(B)會導致電極塗佈的均勻性及接著強度差，以致電極無法完整成膜而無法測得比電容值。如第2表所示，隨著PU黏結劑分子量提高，可觀察到電極塗佈均勻性及接著強度有提升趨勢(比電容值也從54.0F/g增加至91.1F/g)。由於高分子量之PU黏結劑可形成網狀結構，可大範圍包覆顆粒、藉由網狀強度支撐使顆粒相互連結。較長的PU分子鏈可避免發生小分子黏結劑阻塞活性碳材孔洞結構，進而提高其比電容值。
另外，利用交流阻抗頻譜分析(electrochemical impedance spectroscopy,EIS)進行比較不同分子量的PU電極的阻抗特性，如第1A與1B圖所示。第1B圖係第1A圖之部份放大圖。在第1A與1B圖中，縱軸讀值為容抗(capacitance impedance)，而橫軸讀值為電阻值(resistance)。由第1A圖可知，採用高分子量之PU(E)作為黏結劑之電極，在中高頻區域(半圓區間)所產生之阻值，比採用低分子量PU(C)及PU(D)作為黏結劑之電極低，因此具有較高之比電容值。而不同頻率與相角之變化如第2圖所示，PU(E)電極在低頻區域，其相角明顯高於PU(C)及PU(D)電極，顯示PU(E)電極較偏向電容反應。推估應是PU(E)之較長分子鏈不易深入活性碳材孔洞結構，降低孔洞被堵塞的情形，有助於減少碳電極之界面電阻。綜上所述，PU(E)電極具有較高比電容值。
固定活性碳與石墨粉的重量比為80：10，並調整PU黏結劑的添加重量比為5至20重量份，以確認PU黏結劑添加比例對電容的影響，如第3表所示。結果顯示當碳材、導電材與PU重量比為80：10：5的時候，碳電極接著性為中，而隨著PU添加比例增加而提升至高，此外，不同PU添加比例之碳電極均勻性皆為高。在電容表現的方面，活性碳與PU黏結劑的重量比為80：10、80：15與80：20之電極比電容值相近，而以活性碳與PU黏結劑的重量比為80：15時有最高比電容值為101F/g，值得注意的是，在活性碳與PU黏結劑的重量比為80：5時，電極比電容值67.1F/g表現最低，推論原因當添加之PU黏結劑量過少時，會影響
碳顆粒與集電板間有效的連結性，因此反而造成更大的界面電阻而使電容表現較差。
取PU(E)電極與PVDF電極進行循環伏安分析比較，如第4表所示。結果顯示PVDF電極之比電容值為87.3F/g，而PU(E)電極之比電容值為91.1F/g，優於PVDF電極。
另外，利用交流阻抗頻譜分析(electrochemical impedance spectroscopy,EIS)進行比較PU電極與PVDF電極的阻抗特性，如第3A與3B圖所示。第3B圖係第3A圖之部份放大圖。由第3A圖可知，採用PU(E)作為黏結劑之電極，在中高頻區域(半圓區間)所產生之阻值，比採用PVDF作為黏結劑之電極低，因此具有較高之比電容值。而不同頻率與相角之變化如第4圖所示，PU(E)電極在低頻區域，其相角較PVDF電極接近90°，顯示相較於PVDF電極，PU(E)電極較偏向電容反應，因此以PU(E)黏結劑製備電極的比電容值高於PVDF電極。綜上所
述，PU可取代PVDF作為電極中活性材料的黏結劑。
雖然本揭露已以數個實施例揭露如上，然其並非用以限定本揭露，任何本技術領域中具有通常知識者，在不脫離本揭露之精神和範圍內，當可作任意之更動與潤飾，因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。
Claims (12)
- 一種用於電容去離子電極的黏結劑，包括：聚丁二醇、甲苯二異氰酸酯、與硬脂酸甘油酯反應而成之一黏結劑，其中該黏結劑之數目平均分子量大於1.6×105。
- 如申請專利範圍第1項所述之用於電容去離子電極的黏結劑，其中該聚丁二醇為1莫耳份，該甲苯二異氰酸酯為3至20莫耳份，且該硬脂酸甘油酯為1至6莫耳份。
- 如申請專利範圍第1項所述之用於電容去離子電極的黏結劑，其中該聚丁二醇之數目平均分子量介於1000~5000之間。
- 如申請專利範圍第1項所述之用於電容去離子電極的黏結劑，係用以黏結一電極中的活性材料，該活性材料包括活性碳材、奈米碳管、石墨烯、或上述之組合，且該活性材料與該黏結劑之重量比介於90：5至90：25之間。
- 如申請專利範圍第4項所述之用於電容去離子電極的黏結劑，其中該活性材料之比表面積介於300m2/g至3000m2/g之間，且其孔洞大小介於1至1000nm。
- 如申請專利範圍第4項所述之用於電容去離子電極的黏結劑，其中該電極更包含5至20重量份之導電材料，且該導電材料包括石墨、碳黑、乙炔黑、或上述之組合。
- 一種用於電容去離子電極的黏結劑之形成方法，包括：混合一聚丁二醇、甲苯二異氰酸酯、與硬脂酸甘油酯，反應形成一黏結劑， 其中該黏結劑之數目平均分子量大於1.6×105。
- 如申請專利範圍第7項所述之用於電容去離子電極的黏結劑之形成方法，其中該聚丁二醇為1莫耳份，該甲苯二異氰酸酯為3至20莫耳份，且該硬脂酸甘油酯為1至6莫耳份。
- 如申請專利範圍第7項所述之用於電容去離子電極的黏結劑之形成方法，其中該聚丁二醇之數目平均分子量介於1000~5000之間。
- 如申請專利範圍第7項所述之用於電容去離子電極的黏結劑之形成方法，其中該黏結劑係用以黏結一電極中的活性材料，該活性材料包括活性碳材、奈米碳管、石墨烯、或上述之組合，且該活性材料與該黏結劑之重量比介於90：5至90：25之間。
- 如申請專利範圍第10項所述之用於電容去離子電極的黏結劑之形成方法，其中該活性材料之比表面積介於300m2/g至3000m2/g之間，且其孔洞大小介於1至1000nm。
- 如申請專利範圍第10項所述之用於電容去離子電極的黏結劑之形成方法，其中該電極更包含5至20重量份之導電材料，且該導電材料包括石墨、碳黑、乙炔黑、或上述之組合。
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2015
- 2015-12-17 TW TW104142429A patent/TWI568792B/zh active
- 2015-12-29 US US14/983,117 patent/US10259904B2/en active Active
- 2015-12-29 CN CN201511015951.7A patent/CN106893545B/zh active Active
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| US20030232956A1 (en) * | 2002-06-10 | 2003-12-18 | Brinkman Larry Frank | Urethane polymer compositions |
| US20140016246A1 (en) * | 2011-04-07 | 2014-01-16 | Corning Incorporated | Ultracapacitor with improved aging performance |
| TW201543513A (zh) * | 2015-08-03 | 2015-11-16 | China Steel Corp | 電雙層電容之碳電極、其製造方法以及電雙層電容 |
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| US20170174820A1 (en) | 2017-06-22 |
| TW201723086A (zh) | 2017-07-01 |
| CN106893545A (zh) | 2017-06-27 |
| CN106893545B (zh) | 2020-10-13 |
| US10259904B2 (en) | 2019-04-16 |
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