TWI566840B - A pattern correcting means and a humidifying unit used in the apparatus - Google Patents

A pattern correcting means and a humidifying unit used in the apparatus Download PDF

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Publication number
TWI566840B
TWI566840B TW100141015A TW100141015A TWI566840B TW I566840 B TWI566840 B TW I566840B TW 100141015 A TW100141015 A TW 100141015A TW 100141015 A TW100141015 A TW 100141015A TW I566840 B TWI566840 B TW I566840B
Authority
TW
Taiwan
Prior art keywords
substrate
nozzle
correction device
humidifying unit
pattern correction
Prior art date
Application number
TW100141015A
Other languages
English (en)
Chinese (zh)
Other versions
TW201240736A (en
Inventor
Takashi Koike
Original Assignee
Ntn Toyo Bearing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ntn Toyo Bearing Co Ltd filed Critical Ntn Toyo Bearing Co Ltd
Publication of TW201240736A publication Critical patent/TW201240736A/zh
Application granted granted Critical
Publication of TWI566840B publication Critical patent/TWI566840B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW100141015A 2010-11-18 2011-11-10 A pattern correcting means and a humidifying unit used in the apparatus TWI566840B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010257955A JP5491363B2 (ja) 2010-11-18 2010-11-18 パターン修正装置およびそれに用いられる加湿ユニット

Publications (2)

Publication Number Publication Date
TW201240736A TW201240736A (en) 2012-10-16
TWI566840B true TWI566840B (zh) 2017-01-21

Family

ID=46083860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100141015A TWI566840B (zh) 2010-11-18 2011-11-10 A pattern correcting means and a humidifying unit used in the apparatus

Country Status (4)

Country Link
JP (1) JP5491363B2 (ja)
KR (1) KR20130132421A (ja)
TW (1) TWI566840B (ja)
WO (1) WO2012066921A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188579A1 (ja) * 2013-05-24 2014-11-27 ヤマハ発動機株式会社 塗布試行装置、ディスペンサおよび電子部品実装装置
JP2020136549A (ja) * 2019-02-22 2020-08-31 株式会社Ｓｃｒｅｅｎホールディングス パターン形成装置、パターン形成方法および吐出データ生成方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070097162A1 (en) * 2003-08-08 2007-05-03 Konica Minolta Holdings, Inc. Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board
JP2007128983A (ja) * 2005-11-01 2007-05-24 Ricoh Co Ltd 導電パターン形成装置及び表示装置
JP2007191701A (ja) * 2005-12-20 2007-08-02 Konica Minolta Holdings Inc インクジェット記録方法
CN101047090A (zh) * 2006-03-30 2007-10-03 Ntn株式会社 图形修正装置及其涂布单元
TW200909223A (en) * 2006-10-26 2009-03-01 Seiko Epson Corp Method for controlling droplet discharge head, drawing method, and droplet discharge device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007175605A (ja) * 2005-12-27 2007-07-12 Fuji Xerox Co Ltd 液滴吐出装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070097162A1 (en) * 2003-08-08 2007-05-03 Konica Minolta Holdings, Inc. Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board
JP2007128983A (ja) * 2005-11-01 2007-05-24 Ricoh Co Ltd 導電パターン形成装置及び表示装置
JP2007191701A (ja) * 2005-12-20 2007-08-02 Konica Minolta Holdings Inc インクジェット記録方法
CN101047090A (zh) * 2006-03-30 2007-10-03 Ntn株式会社 图形修正装置及其涂布单元
TW200909223A (en) * 2006-10-26 2009-03-01 Seiko Epson Corp Method for controlling droplet discharge head, drawing method, and droplet discharge device

Also Published As

Publication number Publication date
JP2012109445A (ja) 2012-06-07
JP5491363B2 (ja) 2014-05-14
KR20130132421A (ko) 2013-12-04
TW201240736A (en) 2012-10-16
WO2012066921A1 (ja) 2012-05-24

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MM4A Annulment or lapse of patent due to non-payment of fees