TWI566282B - Cut the adhesive sheet - Google Patents
Cut the adhesive sheet Download PDFInfo
- Publication number
- TWI566282B TWI566282B TW101126559A TW101126559A TWI566282B TW I566282 B TWI566282 B TW I566282B TW 101126559 A TW101126559 A TW 101126559A TW 101126559 A TW101126559 A TW 101126559A TW I566282 B TWI566282 B TW I566282B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- mass
- adhesive
- parts
- propylene polymer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011201167A JP5951207B2 (ja) | 2011-09-14 | 2011-09-14 | ダイシング・ダイボンディングシート |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201327653A TW201327653A (zh) | 2013-07-01 |
TWI566282B true TWI566282B (zh) | 2017-01-11 |
Family
ID=48179321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101126559A TWI566282B (zh) | 2011-09-14 | 2012-07-24 | Cut the adhesive sheet |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5951207B2 (ko) |
KR (2) | KR102105515B1 (ko) |
TW (1) | TWI566282B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6877982B2 (ja) * | 2016-12-08 | 2021-05-26 | 日東電工株式会社 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
CN108987294B (zh) * | 2018-06-21 | 2021-02-02 | 上海飞骧电子科技有限公司 | 解决封装溢胶问题的无源器件砷化镓刷胶方法 |
US11639410B2 (en) | 2019-12-18 | 2023-05-02 | Shin-Etsu Chemical Co., Ltd. | Heat-curable resin composition and uses thereof |
JP7298468B2 (ja) * | 2019-12-18 | 2023-06-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物及びその使用 |
CN112341975B (zh) * | 2020-11-25 | 2022-03-08 | 中路交科科技股份有限公司 | 一种二阶环氧粘层油、制备方法及其应用方法 |
JPWO2022138341A1 (ko) | 2020-12-25 | 2022-06-30 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006261657A (ja) * | 2005-02-21 | 2006-09-28 | Nitto Denko Corp | 半導体装置の製造方法 |
US20070141330A1 (en) * | 2004-08-03 | 2007-06-21 | The Furukawa Electric Co., Ltd. | Method of producing a semiconductor device, and wafer-processing tape |
JP2010219293A (ja) * | 2009-03-17 | 2010-09-30 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3383227B2 (ja) * | 1998-11-06 | 2003-03-04 | リンテック株式会社 | 半導体ウエハの裏面研削方法 |
JP4841802B2 (ja) * | 2003-05-02 | 2011-12-21 | リンテック株式会社 | 粘着シートおよびその使用方法 |
JP4274867B2 (ja) * | 2003-08-06 | 2009-06-10 | リンテック株式会社 | Icタグ |
US7768141B2 (en) * | 2006-02-14 | 2010-08-03 | Lg Innotek Co., Ltd. | Dicing die attachment film and method for packaging semiconductor using same |
JP5005258B2 (ja) | 2006-05-23 | 2012-08-22 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
JP2010171402A (ja) * | 2008-12-24 | 2010-08-05 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
-
2011
- 2011-09-14 JP JP2011201167A patent/JP5951207B2/ja active Active
-
2012
- 2012-07-24 TW TW101126559A patent/TWI566282B/zh active
- 2012-09-11 KR KR1020120100670A patent/KR102105515B1/ko active IP Right Grant
-
2019
- 2019-03-11 KR KR1020190027593A patent/KR20190030667A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070141330A1 (en) * | 2004-08-03 | 2007-06-21 | The Furukawa Electric Co., Ltd. | Method of producing a semiconductor device, and wafer-processing tape |
JP2006261657A (ja) * | 2005-02-21 | 2006-09-28 | Nitto Denko Corp | 半導体装置の製造方法 |
JP2010219293A (ja) * | 2009-03-17 | 2010-09-30 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
Also Published As
Publication number | Publication date |
---|---|
JP2013062446A (ja) | 2013-04-04 |
TW201327653A (zh) | 2013-07-01 |
JP5951207B2 (ja) | 2016-07-13 |
KR102105515B1 (ko) | 2020-04-28 |
KR20130029341A (ko) | 2013-03-22 |
KR20190030667A (ko) | 2019-03-22 |
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