TWI563555B - Processes and solutions for substrate cleaning and electroless deposition - Google Patents
Processes and solutions for substrate cleaning and electroless depositionInfo
- Publication number
- TWI563555B TWI563555B TW098110120A TW98110120A TWI563555B TW I563555 B TWI563555 B TW I563555B TW 098110120 A TW098110120 A TW 098110120A TW 98110120 A TW98110120 A TW 98110120A TW I563555 B TWI563555 B TW I563555B
- Authority
- TW
- Taiwan
- Prior art keywords
- solutions
- processes
- substrate cleaning
- electroless deposition
- electroless
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76883—Post-treatment or after-treatment of the conductive material
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Emergency Medicine (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Chemically Coating (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Weting (AREA)
- Electrodes Of Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4064508P | 2008-03-28 | 2008-03-28 | |
US12/407,249 US9048088B2 (en) | 2008-03-28 | 2009-03-19 | Processes and solutions for substrate cleaning and electroless deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201003765A TW201003765A (en) | 2010-01-16 |
TWI563555B true TWI563555B (en) | 2016-12-21 |
Family
ID=41114657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098110120A TWI563555B (en) | 2008-03-28 | 2009-03-27 | Processes and solutions for substrate cleaning and electroless deposition |
Country Status (7)
Country | Link |
---|---|
US (2) | US9048088B2 (zh) |
JP (2) | JP2011519393A (zh) |
KR (1) | KR101563385B1 (zh) |
CN (2) | CN101981667A (zh) |
SG (1) | SG189705A1 (zh) |
TW (1) | TWI563555B (zh) |
WO (1) | WO2009120727A2 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9048088B2 (en) | 2008-03-28 | 2015-06-02 | Lam Research Corporation | Processes and solutions for substrate cleaning and electroless deposition |
US9691622B2 (en) | 2008-09-07 | 2017-06-27 | Lam Research Corporation | Pre-fill wafer cleaning formulation |
WO2011078982A1 (en) | 2009-12-23 | 2011-06-30 | Lam Research Corporation | Post deposition wafer cleaning formulation |
JP6030637B2 (ja) * | 2011-04-25 | 2016-11-24 | エア プロダクツ アンド ケミカルズ インコーポレイテッドAir Products And Chemicals Incorporated | ワイヤーボンディング法を改良するためのリードフレームのクリーニング |
US8918292B2 (en) | 2011-09-23 | 2014-12-23 | Brown Line Metalworks, Llc | Digital angle meter |
US8886492B2 (en) | 2011-09-23 | 2014-11-11 | Brown Line Metal Works, Llc | Digital angle meter |
WO2015126372A1 (en) * | 2014-02-19 | 2015-08-27 | Uni-Pixel Displays, Inc. | Method of passivating a conductive pattern with self-assembling monolayers |
MY192579A (en) * | 2017-03-31 | 2022-08-29 | Kanto Kagaku | Cleaning solution composition |
US10640874B2 (en) | 2017-08-14 | 2020-05-05 | Lam Research Corporation | Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias |
US10763083B2 (en) | 2017-10-06 | 2020-09-01 | Lam Research Corporation | High energy atomic layer etching |
CN110300495A (zh) * | 2018-03-23 | 2019-10-01 | 睿明科技股份有限公司 | 基板镀膜方法 |
EP3776636A4 (en) | 2018-03-30 | 2021-12-22 | Lam Research Corporation | ATOMIC LAYER ENGRAVING AND SMOOTHING OF REFRACTORY METALS AND OTHER HIGH SURFACE BOND ENERGY MATERIALS |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050245080A1 (en) * | 2004-01-23 | 2005-11-03 | Xinming Wang | Method and apparatus for processing substrate |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
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US3993575A (en) | 1975-05-27 | 1976-11-23 | Fine Organics Inc. | Hard surface acid cleaner and brightener |
US4182687A (en) | 1977-12-08 | 1980-01-08 | E. I. Du Pont De Nemours And Company | Liquid-water displacement composition |
US4684550A (en) | 1986-04-25 | 1987-08-04 | Mine Safety Appliances Company | Electroless copper plating and bath therefor |
US5405656A (en) | 1990-04-02 | 1995-04-11 | Nippondenso Co., Ltd. | Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor |
US5167992A (en) | 1991-03-11 | 1992-12-01 | Microelectronics And Computer Technology Corporation | Selective electroless plating process for metal conductors |
US5909742A (en) * | 1993-03-26 | 1999-06-08 | Betzdearborn Inc. | Metal cleaning method |
US5419821A (en) | 1993-06-04 | 1995-05-30 | Vaughan; Daniel J. | Process and equipment for reforming and maintaining electroless metal baths |
TW416987B (en) * | 1996-06-05 | 2001-01-01 | Wako Pure Chem Ind Ltd | A composition for cleaning the semiconductor substrate surface |
US5897692A (en) * | 1996-09-10 | 1999-04-27 | Denso Corporation | Electroless plating solution |
US6156218A (en) * | 1997-12-18 | 2000-12-05 | Japan Energy Corporation | Method of pretreatment for electroless nickel plating |
US7021319B2 (en) * | 2000-06-26 | 2006-04-04 | Applied Materials Inc. | Assisted rinsing in a single wafer cleaning process |
US6717189B2 (en) * | 2001-06-01 | 2004-04-06 | Ebara Corporation | Electroless plating liquid and semiconductor device |
US7468105B2 (en) * | 2001-10-16 | 2008-12-23 | Micron Technology, Inc. | CMP cleaning composition with microbial inhibitor |
JP3692066B2 (ja) * | 2001-11-28 | 2005-09-07 | 株式会社東芝 | Cmpスラリおよび半導体装置の製造方法 |
JP3821709B2 (ja) | 2001-12-25 | 2006-09-13 | 株式会社荏原製作所 | 無電解めっきの前処理方法 |
US6824612B2 (en) * | 2001-12-26 | 2004-11-30 | Applied Materials, Inc. | Electroless plating system |
KR100913557B1 (ko) | 2002-01-28 | 2009-08-21 | 미쓰비시 가가꾸 가부시키가이샤 | 반도체 디바이스용 기판의 세정액 및 세정방법 |
US20040038840A1 (en) * | 2002-04-24 | 2004-02-26 | Shihying Lee | Oxalic acid as a semiaqueous cleaning product for copper and dielectrics |
US6696399B1 (en) * | 2002-10-15 | 2004-02-24 | Cleaning Systems, Inc. | Cleaning composition |
JP2004193377A (ja) * | 2002-12-12 | 2004-07-08 | Toshiba Corp | 半導体装置の製造方法 |
US6911067B2 (en) * | 2003-01-10 | 2005-06-28 | Blue29, Llc | Solution composition and method for electroless deposition of coatings free of alkali metals |
US20050022909A1 (en) * | 2003-03-20 | 2005-02-03 | Xinming Wang | Substrate processing method and substrate processing apparatus |
JP2004300576A (ja) | 2003-03-20 | 2004-10-28 | Ebara Corp | 基板処理方法及び基板処理装置 |
US7087104B2 (en) * | 2003-06-26 | 2006-08-08 | Intel Corporation | Preparation of electroless deposition solutions |
CN1890401A (zh) * | 2003-10-17 | 2007-01-03 | 应用材料公司 | 用含钴合金对铜进行选择性自引发无电镀覆 |
TW200530427A (en) | 2003-10-17 | 2005-09-16 | Applied Materials Inc | Selective self-initiating electroless capping of copper with cobalt-containing alloys |
WO2005066325A2 (en) * | 2003-12-31 | 2005-07-21 | Ekc Technology, Inc. | Cleaner compositions containing free radical quenchers |
US20050161338A1 (en) * | 2004-01-26 | 2005-07-28 | Applied Materials, Inc. | Electroless cobalt alloy deposition process |
US7268074B2 (en) | 2004-06-14 | 2007-09-11 | Enthone, Inc. | Capping of metal interconnects in integrated circuit electronic devices |
US20060063382A1 (en) * | 2004-09-17 | 2006-03-23 | Dubin Valery M | Method to fabricate copper-cobalt interconnects |
US7273813B2 (en) * | 2005-02-08 | 2007-09-25 | Applied Materials, Inc. | Wafer cleaning solution for cobalt electroless application |
WO2006093770A1 (en) * | 2005-02-25 | 2006-09-08 | Ekc Technology, Inc. | Method to remove resist, etch residue, and copper oxide from substrates having copper and low-k dielectric material |
JP4740330B2 (ja) * | 2006-06-26 | 2011-08-03 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
US7947637B2 (en) * | 2006-06-30 | 2011-05-24 | Fujifilm Electronic Materials, U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
US20080076688A1 (en) * | 2006-09-21 | 2008-03-27 | Barnes Jeffrey A | Copper passivating post-chemical mechanical polishing cleaning composition and method of use |
TW200916564A (en) * | 2007-01-31 | 2009-04-16 | Advanced Tech Materials | Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications |
US9048088B2 (en) | 2008-03-28 | 2015-06-02 | Lam Research Corporation | Processes and solutions for substrate cleaning and electroless deposition |
-
2009
- 2009-03-19 US US12/407,249 patent/US9048088B2/en active Active
- 2009-03-24 WO PCT/US2009/038149 patent/WO2009120727A2/en active Application Filing
- 2009-03-24 CN CN2009801123896A patent/CN101981667A/zh active Pending
- 2009-03-24 KR KR1020107021456A patent/KR101563385B1/ko active IP Right Grant
- 2009-03-24 CN CN201510570414.2A patent/CN105161452A/zh active Pending
- 2009-03-24 JP JP2011501993A patent/JP2011519393A/ja not_active Withdrawn
- 2009-03-24 SG SG2013022447A patent/SG189705A1/en unknown
- 2009-03-27 TW TW098110120A patent/TWI563555B/zh active
-
2013
- 2013-07-01 JP JP2013138146A patent/JP5762475B2/ja active Active
-
2015
- 2015-04-17 US US14/690,240 patent/US20150225679A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050245080A1 (en) * | 2004-01-23 | 2005-11-03 | Xinming Wang | Method and apparatus for processing substrate |
Also Published As
Publication number | Publication date |
---|---|
JP2013243376A (ja) | 2013-12-05 |
WO2009120727A3 (en) | 2009-11-19 |
KR20110002013A (ko) | 2011-01-06 |
TW201003765A (en) | 2010-01-16 |
US20150225679A1 (en) | 2015-08-13 |
CN101981667A (zh) | 2011-02-23 |
JP2011519393A (ja) | 2011-07-07 |
KR101563385B1 (ko) | 2015-10-26 |
JP5762475B2 (ja) | 2015-08-12 |
CN105161452A (zh) | 2015-12-16 |
SG189705A1 (en) | 2013-05-31 |
WO2009120727A2 (en) | 2009-10-01 |
US20090246359A1 (en) | 2009-10-01 |
US9048088B2 (en) | 2015-06-02 |
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