TWI560912B - Light emitting diode chip having wavelength converting layer and method of fabricating the same, and package having the light emitting diode chip and method of fabricating the same - Google Patents
Light emitting diode chip having wavelength converting layer and method of fabricating the same, and package having the light emitting diode chip and method of fabricating the sameInfo
- Publication number
- TWI560912B TWI560912B TW100112646A TW100112646A TWI560912B TW I560912 B TWI560912 B TW I560912B TW 100112646 A TW100112646 A TW 100112646A TW 100112646 A TW100112646 A TW 100112646A TW I560912 B TWI560912 B TW I560912B
- Authority
- TW
- Taiwan
- Prior art keywords
- fabricating
- light emitting
- emitting diode
- same
- diode chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/06102—Disposition the bonding areas being at different heights
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/1401—Structure
- H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100046423 | 2010-05-18 | ||
KR1020100090352A KR101719642B1 (en) | 2010-09-15 | 2010-09-15 | Light-emitting diode package and method of manufacturing the same |
KR20100096682 | 2010-10-05 | ||
KR1020100110149A KR101230619B1 (en) | 2010-05-18 | 2010-11-08 | Light emitting diode chip having wavelength converting layer, method of fabricating the same and package having the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201145607A TW201145607A (en) | 2011-12-16 |
TWI560912B true TWI560912B (en) | 2016-12-01 |
Family
ID=45410250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100112646A TWI560912B (en) | 2010-05-18 | 2011-04-12 | Light emitting diode chip having wavelength converting layer and method of fabricating the same, and package having the light emitting diode chip and method of fabricating the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2011243977A (en) |
CN (1) | CN103003966B (en) |
TW (1) | TWI560912B (en) |
Cited By (1)
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US11011681B2 (en) | 2013-11-14 | 2021-05-18 | Epistar Corporation | Light-emitting device and the method of manufacturing the same |
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KR20120092000A (en) | 2011-02-09 | 2012-08-20 | 서울반도체 주식회사 | Light emitting device having wavelength converting layer |
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TWI580079B (en) * | 2013-12-26 | 2017-04-21 | 新世紀光電股份有限公司 | Light emitting diode package structure and light emitting diode module |
TW201616689A (en) * | 2014-06-25 | 2016-05-01 | 皇家飛利浦有限公司 | Packaged wavelength converted light emitting device |
TWI641285B (en) | 2014-07-14 | 2018-11-11 | 新世紀光電股份有限公司 | Light emitting module and method for manufacturing light emitting unit |
TWI570961B (en) * | 2014-09-19 | 2017-02-11 | Wen-Bin Chen | A light emitting diode (LED) wafer having a color purified structure |
KR102263065B1 (en) * | 2014-09-26 | 2021-06-10 | 서울바이오시스 주식회사 | Light emitting device and method of fabricating the same |
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WO2016098853A1 (en) * | 2014-12-19 | 2016-06-23 | エルシード株式会社 | Light-emitting element |
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KR102380825B1 (en) | 2015-05-29 | 2022-04-01 | 삼성전자주식회사 | Semiconductor light emitting diode chip and light emitting device having the same |
TWI583020B (en) * | 2015-07-06 | 2017-05-11 | 隆達電子股份有限公司 | Light emitting element and light emitting device |
JP5980388B2 (en) * | 2015-07-23 | 2016-08-31 | キヤノン株式会社 | Electromechanical converter |
KR102481646B1 (en) * | 2015-11-12 | 2022-12-29 | 삼성전자주식회사 | Semiconductor light emitting device package |
JP7080010B2 (en) * | 2016-02-04 | 2022-06-03 | 晶元光電股▲ふん▼有限公司 | Light emitting element and its manufacturing method |
TWI780041B (en) | 2016-02-04 | 2022-10-11 | 晶元光電股份有限公司 | Light-emitting element and the manufacturing method thereof |
KR102527387B1 (en) * | 2016-02-24 | 2023-04-28 | 삼성전자주식회사 | Light emitting device package and method of manufacturing the same |
JP6668996B2 (en) | 2016-07-29 | 2020-03-18 | 日亜化学工業株式会社 | Light emitting device and method of manufacturing the same |
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JP2018190830A (en) * | 2017-05-08 | 2018-11-29 | 豊田合成株式会社 | Semiconductor light-emitting device |
KR102499308B1 (en) * | 2017-08-11 | 2023-02-14 | 서울바이오시스 주식회사 | Light emitting diode |
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KR20190074233A (en) * | 2017-12-19 | 2019-06-27 | 서울반도체 주식회사 | Light emitting device and light emitting module including the sam |
KR20190132215A (en) * | 2018-05-18 | 2019-11-27 | 서울반도체 주식회사 | Light emitting diode, light emitting diode module and display device having the same |
CN112687775B (en) * | 2019-10-18 | 2021-11-16 | 厦门三安光电有限公司 | Light-emitting diode |
US11398437B2 (en) * | 2019-12-13 | 2022-07-26 | Semiconductor Components Industries, Llc | Power device including metal layer |
CN114068785A (en) * | 2021-09-30 | 2022-02-18 | 华灿光电(浙江)有限公司 | Light emitting diode chip for increasing lateral light emitting and preparation method thereof |
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- 2011-04-22 JP JP2011096347A patent/JP2011243977A/en active Pending
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Publication number | Priority date | Publication date | Assignee | Title |
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US11011681B2 (en) | 2013-11-14 | 2021-05-18 | Epistar Corporation | Light-emitting device and the method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN103003966A (en) | 2013-03-27 |
TW201145607A (en) | 2011-12-16 |
CN103003966B (en) | 2016-08-10 |
JP2011243977A (en) | 2011-12-01 |
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