TWI560300B - Film forming device and film forming method - Google Patents

Film forming device and film forming method

Info

Publication number
TWI560300B
TWI560300B TW103128367A TW103128367A TWI560300B TW I560300 B TWI560300 B TW I560300B TW 103128367 A TW103128367 A TW 103128367A TW 103128367 A TW103128367 A TW 103128367A TW I560300 B TWI560300 B TW I560300B
Authority
TW
Taiwan
Prior art keywords
film forming
forming method
forming device
film
forming
Prior art date
Application number
TW103128367A
Other languages
English (en)
Chinese (zh)
Other versions
TW201510263A (zh
Inventor
Satoru Ozaki
Yuu TOKUTAKE
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of TW201510263A publication Critical patent/TW201510263A/zh
Application granted granted Critical
Publication of TWI560300B publication Critical patent/TWI560300B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
TW103128367A 2013-09-10 2014-08-19 Film forming device and film forming method TWI560300B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013187429 2013-09-10

Publications (2)

Publication Number Publication Date
TW201510263A TW201510263A (zh) 2015-03-16
TWI560300B true TWI560300B (en) 2016-12-01

Family

ID=52665438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103128367A TWI560300B (en) 2013-09-10 2014-08-19 Film forming device and film forming method

Country Status (4)

Country Link
JP (1) JP6202098B2 (fr)
CN (1) CN105555995B (fr)
TW (1) TWI560300B (fr)
WO (1) WO2015037315A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6477221B2 (ja) * 2015-05-12 2019-03-06 株式会社島津製作所 成膜方法
JP6555078B2 (ja) * 2015-10-29 2019-08-07 株式会社島津製作所 成膜方法
JP7094154B2 (ja) * 2018-06-13 2022-07-01 東京エレクトロン株式会社 成膜装置および成膜方法
JP7188281B2 (ja) * 2019-06-05 2022-12-13 株式会社島津製作所 成膜方法、樹脂製品の製造方法および成膜装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002088472A (ja) * 2000-04-11 2002-03-27 Applied Materials Inc プラズマ波を励起可能なイオン化金属堆積のための高密度プラズマ源

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0371600A (ja) * 1989-08-09 1991-03-27 Sumitomo Metal Ind Ltd プラズマ装置および該装置の使用方法
JP3091326B2 (ja) * 1992-08-25 2000-09-25 松下電工株式会社 成膜方法
JP3071600B2 (ja) * 1993-02-26 2000-07-31 日本電気株式会社 半導体記憶装置
JP2003306771A (ja) * 2002-04-17 2003-10-31 Ulvac Japan Ltd グローブボックス付き成膜装置
JP2007188707A (ja) * 2006-01-12 2007-07-26 Sony Corp 透明導電膜及びその製造方法、並びにタッチパネル
GB0613877D0 (en) * 2006-07-13 2006-08-23 Teer Coatings Ltd Coating apparatus and coating for an article
CA2660085C (fr) * 2006-07-13 2016-02-09 Teer Coatings Limited Appareil de depot et procede associe
JP2010047783A (ja) * 2008-08-19 2010-03-04 Toppan Printing Co Ltd 真空成膜装置およびそのメンテナンス方法
JP2010163662A (ja) * 2009-01-16 2010-07-29 National Institute For Materials Science ドライプロセス装置
KR20120023799A (ko) * 2009-07-17 2012-03-13 가부시키가이샤 아루박 성막 장치 및 성막 방법
JP2011058048A (ja) * 2009-09-10 2011-03-24 Nikuni:Kk 真空成膜方法およびその装置
JP2011091242A (ja) * 2009-10-23 2011-05-06 Elpida Memory Inc 半導体装置の製造方法
JP2012177191A (ja) * 2011-02-03 2012-09-13 Canon Inc 成膜装置及び成膜方法
JP5405549B2 (ja) * 2011-10-20 2014-02-05 株式会社日本製鋼所 真空成膜方法および真空成膜装置
JP6042196B2 (ja) * 2011-12-22 2016-12-14 キヤノンアネルバ株式会社 スパッタ装置、スパッタ装置の制御装置、および成膜方法
JP5871055B2 (ja) * 2012-03-16 2016-03-01 株式会社島津製作所 成膜装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002088472A (ja) * 2000-04-11 2002-03-27 Applied Materials Inc プラズマ波を励起可能なイオン化金属堆積のための高密度プラズマ源

Also Published As

Publication number Publication date
CN105555995B (zh) 2017-11-07
TW201510263A (zh) 2015-03-16
CN105555995A (zh) 2016-05-04
JP6202098B2 (ja) 2017-09-27
JPWO2015037315A1 (ja) 2017-03-02
WO2015037315A1 (fr) 2015-03-19

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