TWI560150B - Method and device for treating untreated water from silicon wafer etching process - Google Patents

Method and device for treating untreated water from silicon wafer etching process

Info

Publication number
TWI560150B
TWI560150B TW099144157A TW99144157A TWI560150B TW I560150 B TWI560150 B TW I560150B TW 099144157 A TW099144157 A TW 099144157A TW 99144157 A TW99144157 A TW 99144157A TW I560150 B TWI560150 B TW I560150B
Authority
TW
Taiwan
Prior art keywords
silicon wafer
etching process
untreated water
wafer etching
treating untreated
Prior art date
Application number
TW099144157A
Other languages
English (en)
Other versions
TW201125825A (en
Inventor
Kazuki Hayashi
Naoto Hitotsuyanagi
Satoru Nagai
Original Assignee
Kurita Water Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurita Water Ind Ltd filed Critical Kurita Water Ind Ltd
Publication of TW201125825A publication Critical patent/TW201125825A/zh
Application granted granted Critical
Publication of TWI560150B publication Critical patent/TWI560150B/zh

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W10/00—Technologies for wastewater treatment
    • Y02W10/30—Wastewater or sewage treatment systems using renewable energies
    • Y02W10/37—Wastewater or sewage treatment systems using renewable energies using solar energy
TW099144157A 2010-01-19 2010-12-16 Method and device for treating untreated water from silicon wafer etching process TWI560150B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010009259A JP5440199B2 (ja) 2010-01-19 2010-01-19 シリコンウエハエッチング排水の処理方法及び処理装置

Publications (2)

Publication Number Publication Date
TW201125825A TW201125825A (en) 2011-08-01
TWI560150B true TWI560150B (en) 2016-12-01

Family

ID=44265089

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099144157A TWI560150B (en) 2010-01-19 2010-12-16 Method and device for treating untreated water from silicon wafer etching process

Country Status (3)

Country Link
JP (1) JP5440199B2 (zh)
CN (1) CN102126764B (zh)
TW (1) TWI560150B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103086555A (zh) * 2011-10-31 2013-05-08 库特勒自动化系统(苏州)有限公司 硅晶片蚀刻废水处理系统及处理方法
US9828263B2 (en) * 2014-08-28 2017-11-28 Infineon Technologies Ag Method of removing particulate silicon from an effluent water
CN104649494B (zh) * 2015-01-30 2016-05-04 浙江奇彩环境科技股份有限公司 一种硅溶胶废水的处理及联产钠盐的方法
JP6912192B2 (ja) * 2016-12-09 2021-08-04 オルガノ株式会社 シリカ含有水の処理装置および処理方法
JP6859123B2 (ja) * 2017-02-10 2021-04-14 株式会社クラレ シリカ含有水の処理方法及びその処理装置
CN108103585B (zh) * 2017-12-25 2019-07-05 湖州富优得膜分离科技有限公司 一种单晶硅片制绒废液的处理方法
CN110104842A (zh) * 2019-06-06 2019-08-09 盛隆资源再生（无锡）有限公司 一种含氟含铵蚀刻废水的处理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200604108A (en) * 2004-07-16 2006-02-01 Kurita Water Ind Ltd Silica removing device and silica removing method

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GB1399598A (en) * 1971-06-24 1975-07-02 Norwich Water treatment process and apparatus
JPS55149121A (en) * 1979-05-02 1980-11-20 Kimura Kakoki Kk Treatment of reactive dye dyeing waste water containing sodium silicate
JP2548936B2 (ja) * 1987-04-13 1996-10-30 トヨタ自動車株式会社 水溶性ク−ラント廃液の処理方法
DD296471A5 (de) * 1990-07-05 1991-12-05 Veb Spurenmetalle Freiberg,De Verfahren zur kontinuierlichen und kontrollierten ausfaellung von feinstverteiltem silicium aus einem strom waessriger schleiftruebe
JP2833466B2 (ja) * 1994-03-07 1998-12-09 栗田工業株式会社 金属含有排水の処理方法
JPH08276191A (ja) * 1995-02-06 1996-10-22 Mitsubishi Materials Corp 水溶液中のシリカ回収方法および該方法に用いるシード
JP3340029B2 (ja) * 1996-07-22 2002-10-28 株式会社荏原製作所 ＳｉＯ２ 含有廃水の処理方法
JPH1157740A (ja) * 1997-08-25 1999-03-02 Ebara Corp 水の凝集処理方法
MY119304A (en) * 1997-12-11 2005-04-30 Shinetsu Handotai Kk Silicon wafer etching method and silicon wafer etchant
JP2001129308A (ja) * 1999-11-01 2001-05-15 Ebara Corp 凝集沈殿設備および凝集沈殿方法
CN1114011C (zh) * 2001-05-30 2003-07-09 潍坊学院 一种麦草碱法制浆黑液零排放的方法
JP4554917B2 (ja) * 2003-12-09 2010-09-29 旭化成ケミカルズ株式会社 シリコンウエハーエッチング用苛性アルカリ水溶液の回収再生方法およびそれによって回収された苛性アルカリ水溶液
JP2007029802A (ja) * 2005-07-25 2007-02-08 Fuji Xerox Co Ltd 排水処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200604108A (en) * 2004-07-16 2006-02-01 Kurita Water Ind Ltd Silica removing device and silica removing method

Also Published As

Publication number Publication date
TW201125825A (en) 2011-08-01
JP5440199B2 (ja) 2014-03-12
CN102126764A (zh) 2011-07-20
JP2011147847A (ja) 2011-08-04
CN102126764B (zh) 2014-01-29

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