EP2351805A4 - Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same - Google Patents
Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using sameInfo
- Publication number
- EP2351805A4 EP2351805A4 EP10789478A EP10789478A EP2351805A4 EP 2351805 A4 EP2351805 A4 EP 2351805A4 EP 10789478 A EP10789478 A EP 10789478A EP 10789478 A EP10789478 A EP 10789478A EP 2351805 A4 EP2351805 A4 EP 2351805A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- production
- same
- fixing agent
- temporarily fixing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J169/00—Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/24—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having ten or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10789478A EP2351805A4 (en) | 2009-06-15 | 2010-06-15 | Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009142705 | 2009-06-15 | ||
US22139009P | 2009-06-29 | 2009-06-29 | |
KR1020090059143A KR20100134492A (en) | 2009-06-15 | 2009-06-30 | Temporary fixative for semiconductor wafer and method of producing semiconductor device using same |
EP09175317A EP2264113A3 (en) | 2009-06-15 | 2009-11-06 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive |
PCT/JP2010/060081 WO2010147103A1 (en) | 2009-06-15 | 2010-06-15 | Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same |
EP10789478A EP2351805A4 (en) | 2009-06-15 | 2010-06-15 | Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2351805A1 EP2351805A1 (en) | 2011-08-03 |
EP2351805A4 true EP2351805A4 (en) | 2012-09-26 |
Family
ID=42651353
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09175317A Withdrawn EP2264113A3 (en) | 2009-06-15 | 2009-11-06 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive |
EP10789478A Withdrawn EP2351805A4 (en) | 2009-06-15 | 2010-06-15 | Temporarily fixing agent for semiconductor wafer, and process for production of semiconductor device using same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09175317A Withdrawn EP2264113A3 (en) | 2009-06-15 | 2009-11-06 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110263095A1 (en) |
EP (2) | EP2264113A3 (en) |
JP (1) | JPWO2010147103A1 (en) |
KR (2) | KR20100134492A (en) |
CN (1) | CN102232104A (en) |
TW (2) | TW201043658A (en) |
WO (1) | WO2010147103A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2534218A1 (en) | 2010-02-12 | 2012-12-19 | Dow Corning Corporation | Temporary wafer bonding method for semiconductor processing |
JP2012222174A (en) * | 2011-04-11 | 2012-11-12 | Sumitomo Bakelite Co Ltd | Manufacturing method of semiconductor device |
WO2012081608A1 (en) * | 2010-12-14 | 2012-06-21 | 住友ベークライト株式会社 | Temporary fixative and method for finishing substrate |
JP5789974B2 (en) * | 2010-12-14 | 2015-10-07 | 住友ベークライト株式会社 | Temporary fixative and substrate processing method |
KR101409832B1 (en) * | 2011-07-26 | 2014-06-30 | 에스케이종합화학 주식회사 | Self adhesive composition and self adhesivr film for glass therefrom |
WO2013119976A1 (en) * | 2012-02-08 | 2013-08-15 | Brewer Science Inc. | Fluorinated silane coating compositions for thin wafer bonding and handling |
KR102018187B1 (en) * | 2012-05-04 | 2019-09-04 | 에스케이이노베이션 주식회사 | Composition of the hot-melt adhesive having low viscosity |
WO2014036257A1 (en) * | 2012-08-30 | 2014-03-06 | Universal Instruments Corporation | 3d tsv assembly method for mass reflow |
US10052705B2 (en) * | 2012-08-30 | 2018-08-21 | Universal Instruments Corporation | 3D TSV assembly method for mass reflow |
JP6001964B2 (en) * | 2012-09-04 | 2016-10-05 | リンテック株式会社 | Semiconductor processing sheet and method for manufacturing semiconductor device |
CN103778853B (en) * | 2012-10-18 | 2015-10-28 | 瀚宇彩晶股份有限公司 | Segregative electronic installation |
US9269623B2 (en) | 2012-10-25 | 2016-02-23 | Rohm And Haas Electronic Materials Llc | Ephemeral bonding |
US9315696B2 (en) | 2013-10-31 | 2016-04-19 | Dow Global Technologies Llc | Ephemeral bonding |
CN104559852B (en) * | 2014-12-31 | 2018-02-27 | 深圳市化讯半导体材料有限公司 | A kind of ephemeral key rubber alloy for the processing of thin wafer and preparation method thereof |
US9644118B2 (en) | 2015-03-03 | 2017-05-09 | Dow Global Technologies Llc | Method of releasably attaching a semiconductor substrate to a carrier |
JP6913427B2 (en) * | 2016-10-06 | 2021-08-04 | 株式会社きもと | Auxiliary sheet for laser dicing |
JP6088701B1 (en) * | 2016-10-06 | 2017-03-01 | 株式会社きもと | Auxiliary sheet for laser dicing |
CN111315541B (en) | 2017-11-02 | 2023-09-01 | 环球仪器公司 | Clamp and method for clamping parts before and after reflow soldering |
CN108587548B (en) * | 2018-05-11 | 2021-03-09 | 万华化学集团股份有限公司 | Silane-terminated modified polycarbonate polyurethane adhesive resin and preparation method and application thereof |
JP7370229B2 (en) * | 2018-12-28 | 2023-10-27 | 旭化成株式会社 | Semiconductor device and its manufacturing method |
CN112261792B (en) * | 2020-11-03 | 2022-02-08 | 生益电子股份有限公司 | PCB manufacturing method for improving drilling burrs and PCB |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000020472A1 (en) * | 1998-10-05 | 2000-04-13 | The B.F. Goodrich Company | Catalyst and methods for polymerizing cycloolefins |
WO2008005979A1 (en) * | 2006-07-05 | 2008-01-10 | The Arizona Board Of Regents, A Body Corporate Acting For And On Behalf Of Arizona State University | Method of temporarily attaching a rigid carrier to a substrate |
WO2010060038A1 (en) * | 2008-11-23 | 2010-05-27 | Novomer, Inc. | Polycarbonates as adhesives in electronics manufacturing |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0885405B1 (en) | 1996-03-07 | 2005-06-08 | Sumitomo Bakelite Co., Ltd. | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
US6141072A (en) * | 1997-04-04 | 2000-10-31 | Georgia Tech Research Corporation | System and method for efficient manufacturing of liquid crystal displays |
US7799516B2 (en) | 2002-10-16 | 2010-09-21 | Georgia Tech Research Corporation | Polymers, methods of use thereof, and methods of decomposition thereof |
AU2003291668A1 (en) | 2002-11-01 | 2004-06-07 | Georgia Tech Research Corporation | Sacrificial compositions, methods of use thereof, and methods of decomposition thereof |
JP2004256788A (en) * | 2002-11-29 | 2004-09-16 | Sekisui Chem Co Ltd | Thermally eliminable material |
JP2004186263A (en) * | 2002-11-29 | 2004-07-02 | Sekisui Chem Co Ltd | Reinforced semiconductor wafer and method for manufacturing ic chip |
JP4426867B2 (en) * | 2004-02-19 | 2010-03-03 | 積水化学工業株式会社 | Heat extinguishing material |
JP4426866B2 (en) * | 2004-02-19 | 2010-03-03 | 積水化学工業株式会社 | Heat extinguishing material |
US7005371B2 (en) * | 2004-04-29 | 2006-02-28 | International Business Machines Corporation | Method of forming suspended transmission line structures in back end of line processing |
-
2009
- 2009-06-30 KR KR1020090059143A patent/KR20100134492A/en unknown
- 2009-06-30 TW TW098121978A patent/TW201043658A/en unknown
- 2009-11-06 EP EP09175317A patent/EP2264113A3/en not_active Withdrawn
-
2010
- 2010-06-15 JP JP2011519783A patent/JPWO2010147103A1/en not_active Withdrawn
- 2010-06-15 WO PCT/JP2010/060081 patent/WO2010147103A1/en active Application Filing
- 2010-06-15 KR KR1020117011403A patent/KR20120027102A/en not_active Application Discontinuation
- 2010-06-15 EP EP10789478A patent/EP2351805A4/en not_active Withdrawn
- 2010-06-15 CN CN2010800033147A patent/CN102232104A/en active Pending
- 2010-06-15 US US13/126,934 patent/US20110263095A1/en not_active Abandoned
- 2010-06-15 TW TW099119423A patent/TW201109414A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000020472A1 (en) * | 1998-10-05 | 2000-04-13 | The B.F. Goodrich Company | Catalyst and methods for polymerizing cycloolefins |
WO2008005979A1 (en) * | 2006-07-05 | 2008-01-10 | The Arizona Board Of Regents, A Body Corporate Acting For And On Behalf Of Arizona State University | Method of temporarily attaching a rigid carrier to a substrate |
WO2010060038A1 (en) * | 2008-11-23 | 2010-05-27 | Novomer, Inc. | Polycarbonates as adhesives in electronics manufacturing |
Also Published As
Publication number | Publication date |
---|---|
JPWO2010147103A1 (en) | 2012-12-06 |
CN102232104A (en) | 2011-11-02 |
WO2010147103A1 (en) | 2010-12-23 |
TW201043658A (en) | 2010-12-16 |
EP2264113A3 (en) | 2012-09-26 |
EP2264113A2 (en) | 2010-12-22 |
KR20120027102A (en) | 2012-03-21 |
EP2351805A1 (en) | 2011-08-03 |
US20110263095A1 (en) | 2011-10-27 |
TW201109414A (en) | 2011-03-16 |
KR20100134492A (en) | 2010-12-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20110503 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20120823 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C09J 145/00 20060101ALI20120817BHEP Ipc: C09J 201/00 20060101AFI20120817BHEP Ipc: C09J 169/00 20060101ALI20120817BHEP Ipc: H01L 21/683 20060101ALI20120817BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20130322 |