SG10201605147WA - Semiconductor device and method of forming thin profile wlcsp withvertical interconnect over package footprint - Google Patents
Semiconductor device and method of forming thin profile wlcsp withvertical interconnect over package footprintInfo
- Publication number
- SG10201605147WA SG10201605147WA SG10201605147WA SG10201605147WA SG10201605147WA SG 10201605147W A SG10201605147W A SG 10201605147WA SG 10201605147W A SG10201605147W A SG 10201605147WA SG 10201605147W A SG10201605147W A SG 10201605147WA SG 10201605147W A SG10201605147W A SG 10201605147WA
- Authority
- SG
- Singapore
- Prior art keywords
- withvertical
- wlcsp
- semiconductor device
- forming thin
- thin profile
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
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US12/696,923 US8138014B2 (en) | 2010-01-29 | 2010-01-29 | Method of forming thin profile WLCSP with vertical interconnect over package footprint |
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SG10201605147WA SG10201605147WA (en) | 2010-01-29 | 2010-12-23 | Semiconductor device and method of forming thin profile wlcsp withvertical interconnect over package footprint |
SG2010095545A SG173258A1 (en) | 2010-01-29 | 2010-12-23 | Semiconductor device and method of forming thin profile wlcsp with vertical interconnect over package footprint |
SG2013011861A SG188163A1 (en) | 2010-01-29 | 2010-12-23 | Semiconductor device and method of forming thin profile wlcsp with vertical interconnect over package footprint |
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SG2010095545A SG173258A1 (en) | 2010-01-29 | 2010-12-23 | Semiconductor device and method of forming thin profile wlcsp with vertical interconnect over package footprint |
SG2013011861A SG188163A1 (en) | 2010-01-29 | 2010-12-23 | Semiconductor device and method of forming thin profile wlcsp with vertical interconnect over package footprint |
Country Status (4)
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US (3) | US8138014B2 (en) |
CN (1) | CN102157391B (en) |
SG (3) | SG10201605147WA (en) |
TW (1) | TWI557872B (en) |
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SG173258A1 (en) | 2011-08-29 |
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US20120153467A1 (en) | 2012-06-21 |
TW201140792A (en) | 2011-11-16 |
US20120153505A1 (en) | 2012-06-21 |
US8138014B2 (en) | 2012-03-20 |
US20110186977A1 (en) | 2011-08-04 |
CN102157391B (en) | 2016-05-11 |
US9558965B2 (en) | 2017-01-31 |
TWI557872B (en) | 2016-11-11 |
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