TWI560016B - Cutting method for the polarizing plate, polarizing plate cut using the same - Google Patents

Cutting method for the polarizing plate, polarizing plate cut using the same

Info

Publication number
TWI560016B
TWI560016B TW104131204A TW104131204A TWI560016B TW I560016 B TWI560016 B TW I560016B TW 104131204 A TW104131204 A TW 104131204A TW 104131204 A TW104131204 A TW 104131204A TW I560016 B TWI560016 B TW I560016B
Authority
TW
Taiwan
Prior art keywords
polarizing plate
same
cutting method
cut
plate cut
Prior art date
Application number
TW104131204A
Other languages
English (en)
Other versions
TW201622865A (zh
Inventor
Beom Seok Lee
Eung Jin Jang
Sukjae Lee
Kyoung Sik Kim
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Publication of TW201622865A publication Critical patent/TW201622865A/zh
Application granted granted Critical
Publication of TWI560016B publication Critical patent/TWI560016B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
TW104131204A 2014-09-30 2015-09-22 Cutting method for the polarizing plate, polarizing plate cut using the same TWI560016B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140130819A KR101817388B1 (ko) 2014-09-30 2014-09-30 편광판의 절단 방법 및 이를 이용하여 절단된 편광판

Publications (2)

Publication Number Publication Date
TW201622865A TW201622865A (zh) 2016-07-01
TWI560016B true TWI560016B (en) 2016-12-01

Family

ID=55630879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131204A TWI560016B (en) 2014-09-30 2015-09-22 Cutting method for the polarizing plate, polarizing plate cut using the same

Country Status (7)

Country Link
US (1) US10821553B2 (zh)
EP (1) EP3202527B1 (zh)
JP (1) JP2017531813A (zh)
KR (1) KR101817388B1 (zh)
CN (1) CN106687249B (zh)
TW (1) TWI560016B (zh)
WO (1) WO2016052902A1 (zh)

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JP6754621B2 (ja) * 2016-06-10 2020-09-16 日東電工株式会社 フィルムの切り抜き方法
KR20180081197A (ko) 2017-01-05 2018-07-16 삼성디스플레이 주식회사 편광판 제조방법 및 편광판을 구비하는 표시장치
WO2019103137A1 (ja) * 2017-11-27 2019-05-31 日東電工株式会社 プラスチックフィルムのレーザ加工方法及びプラスチックフィルム
WO2019112000A1 (ja) * 2017-12-07 2019-06-13 住友化学株式会社 積層フィルムの切断方法及び製造方法
JP7260993B2 (ja) * 2017-12-07 2023-04-19 住友化学株式会社 積層フィルムの切断方法及び製造方法
CN108581189B (zh) * 2018-06-01 2020-04-17 业成科技（成都）有限公司 激光切割方法
MX2021002001A (es) 2018-08-31 2021-04-28 Kimberly Clark Co Metodos y sistemas para cortar o perforar una trama con un laser.
TWI824051B (zh) * 2018-11-02 2023-12-01 日商日東電工股份有限公司 偏光性光學功能薄膜積層體之雷射切割加工方法
JP6792660B2 (ja) * 2019-03-04 2020-11-25 住友化学株式会社 光学積層体及びその製造方法
CN110646875A (zh) * 2019-09-26 2020-01-03 东莞市微科光电科技有限公司 一种滤光片制作方法
KR20220149510A (ko) * 2020-03-16 2022-11-08 수미토모 케미칼 컴퍼니 리미티드 적층 시트 및 그 제조 방법
JP7402723B2 (ja) * 2020-03-26 2023-12-21 日東電工株式会社 偏光板およびその製造方法、ならびに該偏光板を用いた画像表示装置
CN115167025B (zh) * 2022-07-15 2023-08-22 苏州华星光电技术有限公司 一种显示装置的制备方法

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CN1966198B (zh) * 2005-11-16 2010-06-16 株式会社迪斯科 激光加工装置
JP2012030243A (ja) * 2010-07-29 2012-02-16 Sumitomo Chemical Co Ltd 偏光板切断方法および当該方法によって切断された偏光板
TW201221262A (en) * 2010-10-06 2012-06-01 Sumitomo Chemical Co Laser cutter and slitter provided with the laser cutter
TW201430408A (zh) * 2007-12-06 2014-08-01 Nitto Denko Corp 偏光板及圖像顯示裝置
TW201433393A (zh) * 2012-11-20 2014-09-01 Univ Kyushu Nat Univ Corp 雷射加工裝置及雷射加工方法

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US5632083A (en) * 1993-08-05 1997-05-27 Hitachi Construction Machinery Co., Ltd. Lead frame fabricating method and lead frame fabricating apparatus
JP4396953B2 (ja) 1998-08-26 2010-01-13 三星電子株式会社 レーザ切断装置および切断方法
KR100628438B1 (ko) * 1998-12-04 2006-12-05 삼성전자주식회사 액정표시기 패널의 제조방법
US6297869B1 (en) 1998-12-04 2001-10-02 Samsung Electronics Co., Ltd. Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same
JP3728124B2 (ja) * 1999-01-07 2005-12-21 ペンタックス株式会社 ビーム形状補正光学系および描画装置
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JP2005081715A (ja) * 2003-09-09 2005-03-31 Sony Corp レーザ加工装置およびレーザ加工方法
JP4233999B2 (ja) * 2003-12-25 2009-03-04 日東電工株式会社 積層型偏光板およびその製造方法
JP4440036B2 (ja) 2004-08-11 2010-03-24 株式会社ディスコ レーザー加工方法
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JP5766423B2 (ja) 2010-10-15 2015-08-19 三菱重工業株式会社 レーザ切断装置及びレーザ切断方法
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Publication number Priority date Publication date Assignee Title
CN1966198B (zh) * 2005-11-16 2010-06-16 株式会社迪斯科 激光加工装置
TW201430408A (zh) * 2007-12-06 2014-08-01 Nitto Denko Corp 偏光板及圖像顯示裝置
JP2012030243A (ja) * 2010-07-29 2012-02-16 Sumitomo Chemical Co Ltd 偏光板切断方法および当該方法によって切断された偏光板
TW201221262A (en) * 2010-10-06 2012-06-01 Sumitomo Chemical Co Laser cutter and slitter provided with the laser cutter
TW201433393A (zh) * 2012-11-20 2014-09-01 Univ Kyushu Nat Univ Corp 雷射加工裝置及雷射加工方法

Also Published As

Publication number Publication date
EP3202527A1 (en) 2017-08-09
KR101817388B1 (ko) 2018-01-10
TW201622865A (zh) 2016-07-01
CN106687249A (zh) 2017-05-17
US20170120389A1 (en) 2017-05-04
EP3202527B1 (en) 2021-12-22
US10821553B2 (en) 2020-11-03
CN106687249B (zh) 2020-02-28
WO2016052902A1 (ko) 2016-04-07
KR20160038272A (ko) 2016-04-07
EP3202527A4 (en) 2018-07-11
JP2017531813A (ja) 2017-10-26

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