TWI559386B - 晶舟加載台用噴嘴組件及具備其的晶舟加載台 - Google Patents

晶舟加載台用噴嘴組件及具備其的晶舟加載台 Download PDF

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Publication number
TWI559386B
TWI559386B TW104100052A TW104100052A TWI559386B TW I559386 B TWI559386 B TW I559386B TW 104100052 A TW104100052 A TW 104100052A TW 104100052 A TW104100052 A TW 104100052A TW I559386 B TWI559386 B TW I559386B
Authority
TW
Taiwan
Prior art keywords
nozzle
outer casing
platform
purge gas
disposed
Prior art date
Application number
TW104100052A
Other languages
English (en)
Chinese (zh)
Other versions
TW201604942A (zh
Inventor
權柄喆
Original Assignee
Ｌｓ Ｔｅｃ股份有限公司
權柄喆
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｌｓ Ｔｅｃ股份有限公司, 權柄喆 filed Critical Ｌｓ Ｔｅｃ股份有限公司
Publication of TW201604942A publication Critical patent/TW201604942A/zh
Application granted granted Critical
Publication of TWI559386B publication Critical patent/TWI559386B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW104100052A 2014-07-17 2015-01-05 晶舟加載台用噴嘴組件及具備其的晶舟加載台 TWI559386B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140090416A KR101606082B1 (ko) 2014-07-17 2014-07-17 로드 포트용 노즐 조립체 및 그것을 구비한 로드 포트

Publications (2)

Publication Number Publication Date
TW201604942A TW201604942A (zh) 2016-02-01
TWI559386B true TWI559386B (zh) 2016-11-21

Family

ID=55309252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104100052A TWI559386B (zh) 2014-07-17 2015-01-05 晶舟加載台用噴嘴組件及具備其的晶舟加載台

Country Status (2)

Country Link
KR (1) KR101606082B1 (ko)
TW (1) TWI559386B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7422577B2 (ja) * 2020-03-23 2024-01-26 平田機工株式会社 ロードポート及び制御方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001039892A1 (en) * 1999-12-06 2001-06-07 Laibovitz Robert A Apparatus and method for delivery of small volumes of liquid
US20130326841A1 (en) * 2012-06-11 2013-12-12 Sinfonia Technology Co., Ltd. Purge nozzle unit, purge apparatus and load port

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4204284B2 (ja) 2002-09-11 2009-01-07 信越ポリマー株式会社 基板収納容器
WO2006095569A1 (ja) 2005-03-08 2006-09-14 Kabushiki Kaisha Yaskawa Denki ロードポートおよびロードポートの制御方法
JP5241607B2 (ja) * 2009-05-21 2013-07-17 信越ポリマー株式会社 基板収納容器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001039892A1 (en) * 1999-12-06 2001-06-07 Laibovitz Robert A Apparatus and method for delivery of small volumes of liquid
US20130326841A1 (en) * 2012-06-11 2013-12-12 Sinfonia Technology Co., Ltd. Purge nozzle unit, purge apparatus and load port

Also Published As

Publication number Publication date
KR20160009904A (ko) 2016-01-27
KR101606082B1 (ko) 2016-03-24
TW201604942A (zh) 2016-02-01

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MM4A Annulment or lapse of patent due to non-payment of fees