TWI555712B - 在濕式酸蝕刻中用於污泥控制之方法 - Google Patents

在濕式酸蝕刻中用於污泥控制之方法 Download PDF

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Publication number
TWI555712B
TWI555712B TW102119382A TW102119382A TWI555712B TW I555712 B TWI555712 B TW I555712B TW 102119382 A TW102119382 A TW 102119382A TW 102119382 A TW102119382 A TW 102119382A TW I555712 B TWI555712 B TW I555712B
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TW
Taiwan
Prior art keywords
glass
precipitate
concentration
etchant
sludge
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TW102119382A
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English (en)
Chinese (zh)
Other versions
TW201410629A (zh
Inventor
金宇輝
侯駿
泰提克默罕默得得亞
尙姆岡夏馬拉
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康寧公司
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Publication of TW201410629A publication Critical patent/TW201410629A/zh
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Publication of TWI555712B publication Critical patent/TWI555712B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/04Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Glass Compositions (AREA)
TW102119382A 2012-05-31 2013-05-31 在濕式酸蝕刻中用於污泥控制之方法 TWI555712B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261653705P 2012-05-31 2012-05-31

Publications (2)

Publication Number Publication Date
TW201410629A TW201410629A (zh) 2014-03-16
TWI555712B true TWI555712B (zh) 2016-11-01

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ID=48614160

Family Applications (1)

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TW102119382A TWI555712B (zh) 2012-05-31 2013-05-31 在濕式酸蝕刻中用於污泥控制之方法

Country Status (7)

Country Link
US (1) US9290410B2 (enExample)
EP (1) EP2855385A1 (enExample)
JP (1) JP2015523306A (enExample)
KR (1) KR101971316B1 (enExample)
CN (1) CN104684859B (enExample)
TW (1) TWI555712B (enExample)
WO (1) WO2013181123A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013181213A1 (en) * 2012-05-31 2013-12-05 Corning Incorporated Systems and methods for acid-treating glass articles
CN106573829B (zh) 2014-07-30 2020-05-05 康宁股份有限公司 超声槽和均匀玻璃基板蚀刻方法
WO2021030122A1 (en) * 2019-08-13 2021-02-18 Corning Incorporated Textured glass articles and methods of making the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101295673B (zh) * 2007-04-27 2010-11-03 南亚科技股份有限公司 一种形成位线接触插塞的方法与晶体管结构
TW201140848A (en) * 2010-02-18 2011-11-16 Sony Corp Thin film transistor, electronic machine and manufacturing method thereof

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DE3917320A1 (de) 1989-05-27 1990-12-20 Bayer Ag Harnstoffgruppen enthaltende (meth)-acrylsaeure-derivate von triisocyanaten und ihre verwendung
JPH07215736A (ja) * 1994-01-31 1995-08-15 Hoya Corp ガラス体表面の化学的研磨法
JP3523239B2 (ja) * 2001-04-12 2004-04-26 西山ステンレスケミカル株式会社 ガラス基板の化学加工方法及びガラス基板
JP4370737B2 (ja) 2001-06-27 2009-11-25 三菱化学エンジニアリング株式会社 フッ酸の供給方法
JP5132859B2 (ja) * 2001-08-24 2013-01-30 ステラケミファ株式会社 多成分を有するガラス基板用の微細加工表面処理液
JP5197902B2 (ja) * 2001-08-31 2013-05-15 ステラケミファ株式会社 多成分を有するガラス基板用の微細加工表面処理液
JP2006326444A (ja) * 2005-05-25 2006-12-07 Sony Corp エッチングシステム
CN1990402A (zh) * 2005-12-28 2007-07-04 庄大建 防飓风玻璃生产工艺
KR20080022917A (ko) * 2006-09-08 2008-03-12 삼성전자주식회사 식각액 공급장치, 식각장치 및 식각방법
JPWO2009066624A1 (ja) * 2007-11-19 2011-04-07 旭硝子株式会社 ガラス基板のエッチング処理方法
KR100943321B1 (ko) 2008-03-03 2010-02-19 (주)세미로드 유리 식각 장치와 유리 기판의 슬러지 제거 방법
JP5423674B2 (ja) * 2008-06-25 2014-02-19 旭硝子株式会社 無アルカリガラス基板のエッチング方法及び表示デバイス
KR101093362B1 (ko) 2009-09-23 2011-12-14 호서대학교 산학협력단 유리 식각액
KR20110056095A (ko) 2009-11-20 2011-05-26 타코마테크놀러지 주식회사 식각액 조성물
KR101748177B1 (ko) 2011-07-29 2017-06-16 가부시키가이샤 하모닉 드라이브 시스템즈 복합 롤링 베어링부착 파동기어장치
US9926225B2 (en) 2011-12-30 2018-03-27 Corning Incorporated Media and methods for etching glass

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101295673B (zh) * 2007-04-27 2010-11-03 南亚科技股份有限公司 一种形成位线接触插塞的方法与晶体管结构
TW201140848A (en) * 2010-02-18 2011-11-16 Sony Corp Thin film transistor, electronic machine and manufacturing method thereof

Also Published As

Publication number Publication date
KR101971316B1 (ko) 2019-04-22
TW201410629A (zh) 2014-03-16
CN104684859B (zh) 2019-07-12
EP2855385A1 (en) 2015-04-08
WO2013181123A1 (en) 2013-12-05
KR20150027133A (ko) 2015-03-11
CN104684859A (zh) 2015-06-03
US20150136736A1 (en) 2015-05-21
US9290410B2 (en) 2016-03-22
JP2015523306A (ja) 2015-08-13

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