TWI555644B - Transparent sheet and its manufacturing method - Google Patents
Transparent sheet and its manufacturing method Download PDFInfo
- Publication number
- TWI555644B TWI555644B TW102111737A TW102111737A TWI555644B TW I555644 B TWI555644 B TW I555644B TW 102111737 A TW102111737 A TW 102111737A TW 102111737 A TW102111737 A TW 102111737A TW I555644 B TWI555644 B TW I555644B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin film
- resin
- inorganic glass
- transparent sheet
- thickness
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims description 228
- 239000011347 resin Substances 0.000 claims description 225
- 239000011521 glass Substances 0.000 claims description 150
- 239000012790 adhesive layer Substances 0.000 claims description 63
- 239000010410 layer Substances 0.000 claims description 52
- 229920005992 thermoplastic resin Polymers 0.000 claims description 40
- 239000011247 coating layer Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 14
- 239000002356 single layer Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 36
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 34
- 239000000243 solution Substances 0.000 description 28
- 239000007822 coupling agent Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 23
- 125000001931 aliphatic group Chemical group 0.000 description 19
- 125000002723 alicyclic group Chemical group 0.000 description 16
- 239000002904 solvent Substances 0.000 description 16
- -1 for example Substances 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 11
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 238000003851 corona treatment Methods 0.000 description 5
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 239000002253 acid Chemical group 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229920001230 polyarylate Polymers 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical group ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920002098 polyfluorene Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- UBOXGVDOUJQMTN-UHFFFAOYSA-N 1,1,2-trichloroethane Chemical group ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- QZLZITSAKXSAMC-UHFFFAOYSA-N NCCCC(C(OC)(OC)C)CCCCCCCC Chemical compound NCCCC(C(OC)(OC)C)CCCCCCCC QZLZITSAKXSAMC-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical class CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- LNOLJFCCYQZFBQ-BUHFOSPRSA-N (ne)-n-[(4-nitrophenyl)-phenylmethylidene]hydroxylamine Chemical compound C=1C=C([N+]([O-])=O)C=CC=1C(=N/O)/C1=CC=CC=C1 LNOLJFCCYQZFBQ-BUHFOSPRSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- ZZHIDJWUJRKHGX-UHFFFAOYSA-N 1,4-bis(chloromethyl)benzene Chemical compound ClCC1=CC=C(CCl)C=C1 ZZHIDJWUJRKHGX-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- PBODPHKDNYVCEJ-UHFFFAOYSA-M 1-benzyl-3-dodecyl-2-methylimidazol-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCCN1C=C[N+](CC=2C=CC=CC=2)=C1C PBODPHKDNYVCEJ-UHFFFAOYSA-M 0.000 description 1
- JPEWDCTZJFUITH-UHFFFAOYSA-N 1-methoxydecane Chemical compound CCCCCCCCCCOC JPEWDCTZJFUITH-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RUFZNDNBXKOZQV-UHFFFAOYSA-N 2,3-dihydro-1h-pyrrolo[1,2-a]benzimidazole Chemical compound C1=CC=C2N(CCC3)C3=NC2=C1 RUFZNDNBXKOZQV-UHFFFAOYSA-N 0.000 description 1
- LJWZDTGRJUXOCE-UHFFFAOYSA-N 2-(2-ethylhexyl)oxetane Chemical compound CCCCC(CC)CC1CCO1 LJWZDTGRJUXOCE-UHFFFAOYSA-N 0.000 description 1
- PJGMVHVKKXYDAI-UHFFFAOYSA-O 2-(2-undecyl-1h-imidazol-1-ium-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=C[NH+]1C(C)C#N PJGMVHVKKXYDAI-UHFFFAOYSA-O 0.000 description 1
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 1
- RXNOYRCWKRFNIM-UHFFFAOYSA-N 2-carbonochloridoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(Cl)=O RXNOYRCWKRFNIM-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- CGRJJOYCFCCGPX-UHFFFAOYSA-N 3-ethyloxetane Chemical compound CCC1COC1 CGRJJOYCFCCGPX-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- FXPCFGZWQHOKJF-UHFFFAOYSA-N 4-(1,1-diethoxyethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)C)CCCCCCCC FXPCFGZWQHOKJF-UHFFFAOYSA-N 0.000 description 1
- SXPGQGNWEWPWQZ-UHFFFAOYSA-N 4-(triethoxymethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)OCC)CCCCCCCC SXPGQGNWEWPWQZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MTDLVDBRMBSPBJ-UHFFFAOYSA-N C(C1CO1)OCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(C1CO1)OCCCC(C(OCC)(OCC)OCC)CCCCCCCC MTDLVDBRMBSPBJ-UHFFFAOYSA-N 0.000 description 1
- DKCXIJLUMAOOHX-UHFFFAOYSA-N C(CCCCC)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(CCCCC)C(C(OC)(OC)OC)CCCCCCCC DKCXIJLUMAOOHX-UHFFFAOYSA-N 0.000 description 1
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 description 1
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 1
- BVTJGGGYKAMDBN-UHFFFAOYSA-N Dioxetane Chemical compound C1COO1 BVTJGGGYKAMDBN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- MVHHWXMNTNCENE-UHFFFAOYSA-N NCCCC(C(Cl)(C)C)CCCCCCCC Chemical compound NCCCC(C(Cl)(C)C)CCCCCCCC MVHHWXMNTNCENE-UHFFFAOYSA-N 0.000 description 1
- YVAJEVBMXJOOJX-UHFFFAOYSA-N NCCCC(C(Cl)(Cl)C)CCCCCCCC Chemical compound NCCCC(C(Cl)(Cl)C)CCCCCCCC YVAJEVBMXJOOJX-UHFFFAOYSA-N 0.000 description 1
- NNNFXWMULPXNJL-UHFFFAOYSA-N NCCCC(C(Cl)(Cl)Cl)CCCCCCCC Chemical compound NCCCC(C(Cl)(Cl)Cl)CCCCCCCC NNNFXWMULPXNJL-UHFFFAOYSA-N 0.000 description 1
- XJDCHDFUMGSEHD-UHFFFAOYSA-N NCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCCC(C(OC)(OC)OC)CCCCCCCC XJDCHDFUMGSEHD-UHFFFAOYSA-N 0.000 description 1
- FZTVUIIRTOXBTR-UHFFFAOYSA-N NCCCCCCC(C(Cl)(Cl)Cl)CCCCCCCC Chemical compound NCCCCCCC(C(Cl)(Cl)Cl)CCCCCCCC FZTVUIIRTOXBTR-UHFFFAOYSA-N 0.000 description 1
- KXPDOOXUFZFWFG-UHFFFAOYSA-N NCCCCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound NCCCCCCC(C(OCC)(OCC)OCC)CCCCCCCC KXPDOOXUFZFWFG-UHFFFAOYSA-N 0.000 description 1
- UJMSVHMCPMDOGV-UHFFFAOYSA-N NCCCCCCCCCCCC(C(Cl)(Cl)Cl)CCCCCCCC Chemical compound NCCCCCCCCCCCC(C(Cl)(Cl)Cl)CCCCCCCC UJMSVHMCPMDOGV-UHFFFAOYSA-N 0.000 description 1
- LOKNZOLGCBCPHV-UHFFFAOYSA-N NCCCCCCCCCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCCCCCCCCCCC(C(OC)(OC)OC)CCCCCCCC LOKNZOLGCBCPHV-UHFFFAOYSA-N 0.000 description 1
- QNPNQCQCLQKTIQ-UHFFFAOYSA-N NCCCCCCCCCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound NCCCCCCCCCCCC(C(OCC)(OCC)OCC)CCCCCCCC QNPNQCQCLQKTIQ-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- ZIXLDMFVRPABBX-UHFFFAOYSA-N alpha-methylcyclopentanone Natural products CC1CCCC1=O ZIXLDMFVRPABBX-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000012258 stirred mixture Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000005494 tarnishing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10779—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyester
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2386/00—Specific polymers obtained by polycondensation or polyaddition not provided for in a single one of index codes B32B2363/00 - B32B2383/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
Landscapes
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本發明係關於一種透明片材及其製造方法。
近年來,平板顯示器(FPD(Flat Panel Display):例如液晶顯示元件、有機EL(Electroluminescence)顯示元件)之類之顯示元件及太陽電池就搬送性、收納性、設計性等觀點而言,推進輕量、薄型化,又,亦要求可撓性之提昇。進而,就生產性之觀點而言,要求顯示元件及太陽電池之部材具有可藉由卷對卷製程連續生產之較高之可撓性。先前,顯示元件及太陽電池中所使用之透明基板大多情況下係使用玻璃基板。玻璃基板之透明性或耐溶劑性、阻氣性、耐熱性優異。然而,若實現構成玻璃基板之玻璃之輕量、薄型化,獲得可捲繞成卷狀之程度之可撓性,則產生玻璃明顯變脆而操作變困難之問題。
為了提昇薄型玻璃基板之操作性,揭示有於玻璃表面上形成有樹脂層之基板(例如專利文獻1、2)。又,如引用文獻2所示般,作為構成此種樹脂層之樹脂,較佳為強韌之熱塑性樹脂。然而,於在玻璃表面上直接塗敷樹脂溶液之情形時,有由於將樹脂溶液乾燥時之樹脂層之收縮而玻璃基板容易產生捲曲之問題。另一方面,若為於玻璃表面上經由接著層貼合樹脂膜之方法,則不易產生捲曲之問題。然而,於以此種方式進行貼合之情形時,若接著層較薄,則容易產生由玻璃表面之異物(例如玻璃屑)所致之外觀缺點,若接著層較厚,則有樹脂層之強韌性難以傳至玻璃,樹脂層對玻璃之補強效果變得不充分之問
題。
[專利文獻1]:日本專利第4332579號
[專利文獻2]:日本專利特開2010-132526號公報
本發明係為了解決上述先前之課題而成者,其目的在於提供一種可防止捲曲之產生、外觀優異、可防止玻璃之裂縫之進展及斷裂、且可撓性優異之透明片材。
本發明之透明片材具備無機玻璃、及於該無機玻璃之單側或兩側經由接著層貼合之樹脂膜,且該無機玻璃之厚度為35 μm~100 μm,該接著層之單層厚度大於10 μm且為(無機玻璃之厚度×0.3)μm以下,該接著層於25℃下之彈性模數為1.2 GPa~10 GPa,該樹脂膜之總厚度相對於該無機玻璃之厚度之比率為0.9~4。
於較佳實施態樣中,樹脂膜於25℃下之彈性模數為1.5 GPa~10 GPa。
於較佳實施態樣中,含有玻璃轉移溫度為150℃~350℃之樹脂。
於較佳實施態樣中,上述樹脂膜含有熱塑性樹脂。
於較佳實施態樣中,上述接著層係藉由紫外線硬化性樹脂形成。
於較佳實施態樣中,本發明之透明片材之總厚度為150 μm以下。
於較佳實施態樣中,本發明之透明片材可用作顯示元件或太陽
電池之基板。
根據本發明之另一態樣,提供一種透明片材之製造方法。該製造方法包括:於無機玻璃或樹脂膜上塗佈接著層形成用樹脂溶液而形成塗佈層之步驟;及經由該塗佈層將該無機玻璃與該樹脂膜積層,其後使塗佈層硬化而形成接著層,將該無機玻璃與該樹脂膜貼合的步驟;且該無機玻璃之厚度為35 μm~100 μm,該接著層之單層厚度大於10 μm且小於(無機玻璃之厚度×0.3)μm,該接著層於25℃下之彈性模數為1.2 GPa~10 GPa,該樹脂膜之總厚度相對於該無機玻璃之厚度之比率為0.9~4。
根據本發明,提供一種透明片材,該透明片材即便為於無機玻璃之單側或兩側具備特定厚度之樹脂膜,進而於該無機玻璃與樹脂膜之間具備具有特定厚度及彈性模數之接著層,藉此經由接著層將無機玻璃與樹脂膜貼合而成的情形時,亦外觀優異,可防止玻璃之裂縫之進展及斷裂,且可撓性優異。又,本發明之透明片材係經由接著層將無機玻璃與樹脂膜貼合,藉此可防止捲曲之產生。
10‧‧‧無機玻璃
11、11'‧‧‧樹脂膜
12、12'‧‧‧接著層
100‧‧‧透明片材
圖1係本發明之較佳實施形態之透明片材之概略剖面圖。
圖1係本發明之較佳實施形態之透明片材的概略剖面圖。該透明片材100具備無機玻璃10、及配置於無機玻璃10之單側或兩側(較佳為如圖示例般配置於兩側)之樹脂膜11、11',且於無機玻璃10與樹脂膜11、11'之間具備接著層12、12'。雖未圖示,但上述透明片材視需要可於上述樹脂膜之與上述無機玻璃相反之側具備任意適當之其他層。作為上述其他層,例如可列舉透明導電性層、硬塗層等。
上述透明片材之總厚度較佳為150 μm以下,進而較佳為140 μm以下,尤佳為80 μm~135 μm。根據本發明,藉由如上述般具有樹脂膜,可使無機玻璃之厚度較先前之玻璃基板格外薄。
上述無機玻璃之厚度為35 μm~100 μm,較佳為40 μm~80 μm,進而較佳為45 μm~70 μm。於本發明中,藉由於無機玻璃之單側或兩側具有樹脂膜,即便使無機玻璃之厚度變薄,亦可獲得耐衝擊性優異之透明片材。
上述樹脂膜之單膜厚度較佳為16 μm~400 μm,進而較佳為20 μm~200 μm,尤佳為30 μm~150 μm,最佳為30 μm~80 μm。於上述樹脂膜係配置於上述無機玻璃之兩側之情形時,各樹脂膜之厚度可相同亦可不同。較佳為各樹脂膜之厚度相同。進而,各樹脂膜可由相同樹脂或具有相同特性之樹脂構成,亦可由不同樹脂構成。較佳為各樹脂膜係由相同樹脂構成。因此,最佳為各樹脂膜係由相同樹脂以成為相同厚度之方式構成。若為此種構成,則即便經加熱處理,亦對無機玻璃之兩面均等地施加熱應力,因此極難產生翹曲或不平整。
上述樹脂膜之總厚度相對於上述無機玻璃之厚度之比率為0.9~4,較佳為0.9~3,進而較佳為0.9~2.2。若上述樹脂膜之總厚度之比率在此種範圍內,則可獲得彎曲性優異之透明片材。再者,於本發明之透明片材於上述無機玻璃之兩側具備樹脂膜之情形時,於本說明書中,所謂「樹脂膜之總厚」意指各樹脂膜之厚度之和。
上述接著層之單層厚度之下限大於10 μm,較佳為大於11 μm。上述接著層之單層厚度之上限為(無機玻璃之厚度×0.3)μm以下,較佳為小於(無機玻璃之厚度×0.25)μm。若上述接著層之單層厚度在此種範圍內,則可使上述無機玻璃與樹脂膜良好地密接。又,可獲得外觀優異、且良好地補強無機玻璃而耐衝擊性優異之透明片材。於較佳實施態樣中,上述接著層之單層厚度大於10 μm且為20 μm以下。進而,
於進而較佳之實施態樣中,上述接著層之單層厚度大於10 μm且為15 μm以下。
於上述透明片材中劃入裂縫並使其彎曲時之斷裂直徑較佳為50 mm以下,進而較佳為40 mm以下,尤佳為30 mm以下。
僅於無機玻璃之單側具備樹脂膜、且大小為寬度30 mm×長度125 mm之透明片材之曲率半徑較佳為1000 mm以上,進而較佳為2000 mm以上。本發明之透明片材係經由接著層將無機玻璃與樹脂膜貼合,藉此可抑制捲曲。
上述透明片材於波長550 nm下之透光率較佳為80%以上,進而較佳為85%以上。較佳為上述透明片材於180℃下實施2小時加熱處理後之透光率之減少率在5%以內。其原因在於:若為此種減少率,則即便於例如顯示元件及太陽電池之製造製程中實施必要之加熱處理,亦可確保實用上可容許之透光率。
關於上述透明片材,其線膨脹係數較佳為15 ppm/℃以下,進而較佳為10 ppm/℃以下,尤佳為1 ppm/℃~10 ppm/℃。上述透明片材藉由具備上述無機玻璃而顯示出優異之尺寸穩定性(例如,如上所述之範圍之線膨脹係數)。
本發明之透明片材中所使用之無機玻璃只要為板狀者,則可採用任意適當者。上述無機玻璃若根據組成分類,則例如可列舉鈉鈣玻璃、硼酸玻璃、鋁矽酸玻璃、石英玻璃等。又,若根據鹼成分進行分類,則可列舉無鹼玻璃、低鹼玻璃。上述無機玻璃中之鹼金屬成分(例如Na2O、K2O、Li2O)之含量較佳為15重量%以下,進而較佳為10重量%以下。
上述無機玻璃於波長550 nm下之透光率較佳為85%以上。上述無機玻璃於波長550 nm下之折射率較佳為1.4~1.65。
上述無機玻璃之密度較佳為2.3 g/cm3~3.0 g/cm3,進而較佳為2.3 g/cm3~2.7 g/cm3。若為上述範圍之無機玻璃,則可獲得輕量之透明片材。
上述無機玻璃之成形方法可採用任意適當之方法。具代表性的是上述無機玻璃係將含有二氧化矽或氧化鋁等主原料、芒硝或氧化銻等消泡劑及碳等還原劑之混合物於1400℃~1600℃之溫度下熔融,成形為薄板狀後,進行冷卻而製作。作為上述無機玻璃之薄板成形方法,例如可列舉:流孔下引法、熔融法、浮式法等。藉由該等方法成形為板狀之無機玻璃為了實現薄板化或提高平滑性,視需要亦可藉由氫氟酸等溶劑進行化學研磨。
上述無機玻璃可直接使用市售品,或亦可將市售之無機玻璃以成為所需厚度之方式研磨而使用。作為市售之無機玻璃,例如可列舉:Corning公司製造之「7059」、「1737」或「EAGLE2000」,旭硝子公司製造之「AN100」,NH Techno Glass公司製造之「NA-35」,日本電氣硝子公司製造之「OA-10」,Schott公司製造之「D263」或「AF45」等。
上述樹脂膜於25℃下之彈性模數較佳為1.5 GPa~10 GPa,進而較佳為1.7 GPa~8 GPa,尤佳為1.9 GPa~6 GPa;。若上述樹脂膜之彈性模數在此種範圍內,則即便於使無機玻璃變薄之情形時,於該樹脂膜變形時之朝向缺陷之撕裂方向之局部應力亦緩和,因此難以於無機玻璃中產生裂縫或斷裂。
上述樹脂膜於25℃下之破壞韌性值為1.5 MPa.m1/2~10 MPa.m1/2,較佳為2 MPa.m1/2~6 MPa.m1/2,進而較佳為2 MPa.m1/2~5 MPa.m1/2。若破壞韌性值在此種範圍內,則樹脂膜具有充分之黏著強度,因此可獲得補強上述無機玻璃而無機玻璃之裂縫之進展及斷裂受
抑制、且彎曲性優異之透明片材。又,即便於無機玻璃於透明片材內部斷裂之情形時,樹脂膜亦不易斷裂,故可藉由樹脂膜防止無機玻璃之飛散,且可保持透明片材之形狀,因此可防止顯示元件及太陽電池之製造步驟中之設施之污染,可提昇良率。
上述樹脂膜於波長550 nm下之透光率較佳為80%以上。上述樹脂膜於波長550 nm下之折射率較佳為1.3~1.7。
構成上述樹脂膜之材料只要在可獲得本發明之效果之範圍內,則可採用任意適當之樹脂。作為上述樹脂,例如可列舉:熱塑性樹脂、藉由熱或活性能量線而硬化之硬化性樹脂等。較佳為熱塑性樹脂。作為上述樹脂之具體例,可列舉:聚醚碸系樹脂;聚碳酸酯系樹脂;丙烯酸系樹脂;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯等聚酯系樹脂;聚烯烴系樹脂;降烯系樹脂等環烯烴系樹脂;聚醯亞胺系樹脂;聚醯胺系樹脂;聚醯亞胺醯胺系樹脂;聚芳酯系樹脂;聚碸系樹脂;聚醚醯亞胺系樹脂等。
上述樹脂膜中所含之樹脂之玻璃轉移溫度較佳為150℃~350℃,進而較佳為180℃~320℃,尤佳為210℃~290℃。若上述樹脂膜中所含之樹脂之玻璃轉移溫度在此種範圍內,則可獲得耐熱性優異之透明片材。
上述樹脂膜較佳為含有具有下述通式(1)及/或(2)所表示之重複單元之熱塑性樹脂(A)。含有熱塑性樹脂(A)之樹脂膜與上述接著層之密接性優異,且韌性亦優異。藉由使用此種樹脂膜,可獲得切割時裂縫難以進展之透明片材。又,與接著層之密接性優異之含有熱塑性樹脂(A)的樹脂膜受到無機玻璃之強力束縛,尺寸變動變小。其結果,具備含有熱塑性樹脂(A)之樹脂膜之透明片材顯示出優異之尺寸穩定性。
[化1]
式(1)中,R1為碳數6~24之經取代或未經取代之芳香族烴基、碳數4~14之脂環烴基或碳數1~8之直鏈狀或支鏈狀之脂肪族烴基,較佳為碳數6~20之經取代或未經取代之芳香族烴基、碳數4~12之脂環烴基或碳數1~6之直鏈狀或支鏈狀之脂肪族烴基,進而較佳為碳數6~18之經取代或未經取代之芳香族烴基、碳數5~10之脂環烴基或碳數1~4之直鏈狀或支鏈狀之脂肪族烴基。R2為碳數6~24之經取代或未經取代之芳香族烴基、碳數1~8之直鏈狀或支鏈狀之脂肪族烴基、碳數5~12之脂環烴基或氫原子,較佳為碳數6~20之經取代或未經取代之芳香族烴基、碳數1~6之直鏈狀或支鏈狀之脂肪族烴基、碳數5~10之脂環烴基或氫原子。式(2)中,R3及R4分別獨立為碳數1~8之直鏈狀或支鏈狀之脂肪族烴基、氫原子或碳數5~12之脂環烴基,較佳為碳數1~5之直鏈狀或支鏈狀之脂肪族烴基、氫原子或碳數5~10之脂環烴基,進而較佳為碳數1~4之直鏈狀或支鏈狀之脂肪族烴基、氫原子或碳數5~8之脂環烴基。A為羰基或碳數1~8之直鏈狀或支鏈
狀之脂肪族烴基,較佳為羰基或碳數1~6之直鏈狀或支鏈狀之脂肪族烴基,進而較佳為羰基或碳數1~4之直鏈狀或支鏈狀之脂肪族烴基。m表示0~8之整數,較佳為表示0~6之整數,進而較佳為表示0~3之整數。n表示0~4之整數,較佳為表示0~2之整數。
上述熱塑性樹脂(A)之聚合度較佳為10~6000,進而較佳為20~5000,尤佳為50~4000。
作為上述熱塑性樹脂(A)之具體例,例如可列舉:苯乙烯-順丁烯二酸酐共聚物、含酯基之環烯烴聚合物。該等熱塑性樹脂可單獨使用或將兩種以上混合使用。
上述樹脂膜較佳為含有熱塑性樹脂(B),該熱塑性樹脂(B)具有一個以上之下述通式(3)所表示之重複單元。含有熱塑性樹脂(B)之樹脂膜與上述接著層之密接性優異,且韌性亦優異。藉由使用此種樹脂膜,可獲得切割時裂縫難以進展之透明片材。又,與接著層之密接性優異之含有熱塑性樹脂(B)的樹脂膜受到無機玻璃之強力束縛,尺寸變動變小。其結果,具備含有熱塑性樹脂(B)之樹脂膜之透明片材顯示出優異之尺寸穩定性。
式(3)中,R5為碳數6~24之經取代或未經取代之芳香族烴基、碳數1~8之直鏈狀或支鏈狀之脂肪族烴基、碳數4~14之脂環烴基或酸素原子,較佳為碳數6~20之經取代或未經取代之芳香族烴基、碳數1~6之直鏈狀或支鏈狀之脂肪族烴基、碳數4~12之脂環烴基或酸素原
子,進而較佳為碳數6~18之經取代或未經取代之芳香族烴基、碳數1~4之直鏈狀或支鏈狀之脂肪族烴基、碳數5~10之脂環烴基或酸素原子。R6為碳數6~24之經取代或未經取代之芳香族烴基、碳數1~8之直鏈狀或支鏈狀之脂肪族烴基、碳數5~12之脂環烴基或氫原子,較佳為碳數6~20之經取代或未經取代之芳香族烴基、碳數1~6之直鏈狀或支鏈狀之脂肪族烴基、碳數5~10之脂環烴基或氫原子。
上述熱塑性樹脂(B)之聚合度較佳為10~6000,進而較佳為20~5000,尤佳為50~4000。
作為上述熱塑性樹脂(B)之具體例,例如可列舉:聚芳酯、聚酯、聚碳酸酯。該等熱塑性樹脂可單獨使用或將兩種以上混合使用。
上述樹脂膜較佳為含有於末端具有羥基之熱塑性樹脂(C)。作為熱塑性樹脂(C)之具體例,可列舉:對聚醯亞胺、聚醯亞胺醯胺、聚醚碸、聚醚醯亞胺、聚碸、聚芳酯、聚碳酸酯等進行末端羥基改質而成之熱塑性樹脂。該等熱塑性樹脂可單獨使用或將兩種以上混合使用。若使用此種熱塑性樹脂,則可獲得韌性優異樹脂膜。其結果,可獲得切割時裂縫難以進展之透明片材。再者,上述末端羥基改質可使用任意適當之方法。
上述熱塑性樹脂(C)之聚合度較佳為90~6200,進而較佳為130~4900,尤佳為150~3700。
上述熱塑性樹脂(C)之重量平均分子量以聚環氧乙烷換算計,較佳為2.0×104~150×104,進而較佳為3×104~120×104,尤佳為3.5×104~90×104。若上述熱塑性樹脂(C)之重量平均分子量未達2.0×104,則有上述樹脂膜之韌性不足,補強無機玻璃之效果變得不充分之虞,若超過150×104,則有黏度變得過高,因此操作性變差之虞。
上述羥基較佳為酚性羥基。
相對於熱塑性樹脂(C)每100聚合度,上述羥基之含量較佳為0.3
以上,進而較佳為0.5~2.0。若羥基之含量在此種範圍內,則可獲得與末端為環氧基之偶合劑的反應性優異之熱塑性樹脂。
於上述樹脂膜含有熱塑性樹脂(C)之情形時,上述樹脂膜較佳為進而含有咪唑類、環氧類及/或氧雜環丁烷類。作為上述咪唑類之含量,相對於熱塑性樹脂(C),較佳為0.5重量%~5重量%,進而較佳為1重量%~4重量%。作為上述環氧類之含量,相對於熱塑性樹脂(C),較佳為1重量%~15重量%,進而較佳為3重量%~10重量%。作為上述氧雜環丁烷類之含量,相對於熱塑性樹脂(C),較佳為0.5重量%~10重量%,進而較佳為1重量%~5重量%。
作為上述咪唑類,例如可列舉:2-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、1,2-二甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-甲基咪唑、1-苄基-2-苯基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-十一烷基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、1-氰基乙基-2-苯基咪唑、環氧咪唑加合物、2,3-二氫-1H-吡咯并[1,2-a]苯并咪唑、氯化1-十二烷基-2-甲基-3-苄基咪唑鎓、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、偏苯三酸1-氰基乙基-2-十一烷基咪唑鎓、偏苯三酸1-氰基乙基-2-苯基咪唑鎓、2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-均三、2,4-二胺基-6-[2'-十一烷基咪唑基-(1')]-乙基-均三、2,4-二胺基-6-[2'-乙基-4'-甲基咪唑基-(1')]-乙基-均三等。
作為上述環氧類,只要為分子中具有環氧基者,則可使用任意適當者。作為上述環氧類,例如可列舉:雙酚A型、雙酚F型、雙酚S型及該等之氫化物等雙酚型;苯酚酚醛清漆型或甲酚酚醛清漆型等酚醛清漆型;異氰尿酸三縮水甘油酯型或乙內醯脲型等含氮環型;脂環式型;脂肪族型;萘型、聯苯型等芳香族型;縮水甘油醚型、縮水甘油胺型、縮水甘油酯型等縮水甘油基型;二環戊二烯型等二環型;酯
型;醚酯型;及該等之改質型等環氧系樹脂。該等環氧系樹脂可單獨使用或將兩種以上混合使用。較佳為上述環氧類為雙酚A型環氧系樹脂、脂環式型環氧系樹脂、含氮環型環氧系樹脂或縮水甘油基型環氧系樹脂。
上述氧雜環丁烷類較佳為下述通式(4)、(5)或(6)所表示之化合物。
上述式(4)中,R7表示氫原子、脂環烴基、苯基、萘基或碳數1~10之脂肪族烴基。
上述式(6)中,R8表示脂環烴基、苯基、萘基或碳數1~10之脂肪族烴基。p表示1~5之整數。
作為上述氧雜環丁烷類,例如可列舉:3-乙基-3-羥基甲基氧雜
環丁烷(氧雜環丁烷醇)、2-乙基己基氧雜環丁烷、二甲苯雙氧雜環丁烷、3-乙基-3(((3-乙基氧雜環丁烷-3-基)甲氧基)甲基)氧雜環丁烷等。
上述熱塑性樹脂(A)、上述熱塑性樹脂(B)及上述熱塑性樹脂(C)可單獨使用或將兩種以上混合使用。
上述樹脂膜可為單層體,亦可為多層體。於一個實施形態中,上述樹脂膜係具有含有上述熱塑性樹脂(A)之層、及含有不具有上述通式(1)及(2)所表示之重複單元之熱塑性樹脂之層的多層體。於另一實施形態中,上述樹脂膜係具有含有上述熱塑性樹脂(B)之層、及含有不具有上述通式(3)所表示之重複單元之熱塑性樹脂之層的多層體。若樹脂膜為如該等般之多層體,則可獲得機械強度及耐熱性優異之透明片材。
上述樹脂膜較佳為具有耐化學品性。具體而言,較佳為對製作顯示元件及太陽電池時之清洗步驟、抗蝕劑剝離步驟等中所使用之溶劑具有耐化學品性。作為製作顯示元件時之清洗步驟等中所使用之溶劑,可列舉:異丙醇、丙酮、二甲基亞碸(DMSO,Dimethyl Sulfoxide)、N-甲基吡咯烷酮(NMP,N-Methylpyrrolidone)等。
上述樹脂膜可根據目的而進而含有任意適當之添加劑。作為上述添加劑,例如可列舉:稀釋劑、抗老化劑、改質劑、界面活性劑、染料、顏料、防變色劑、紫外線吸收劑、柔軟劑、穩定劑、塑化劑、消泡劑、補強劑等。上述樹脂膜中所含有之添加劑之種類、數及量可根據目的而適當地設定。
上述接著層於25℃下之彈性模數為1.2 GPa~10 GPa,進而較佳為1.5 GPa~8 GPa,尤佳為2 GPa~5 GPa。若上述接著層之彈性模數在此種範圍內,則可獲得可良好地補強無機玻璃且彎曲性及耐衝擊性優異之透明片材。
作為構成上述接著層之材料,只要可形成具有上述彈性模數之接著層,則可採用任意適當之樹脂。作為構成上述接著層之材料,例如可列舉:熱硬化性樹脂、活性能量線硬化性樹脂等。較佳為活性能量線硬化性樹脂,尤佳為紫外線硬化性樹脂。若使用活性能量線硬化性樹脂,則無需加熱便可使接著層硬化,因此可獲得防止樹脂膜之膨脹而表面平滑性優異之透明片材。
亦可於上述接著層中添加偶合劑。上述接著層藉由添加偶合劑,可提昇與無機玻璃及/或樹脂層之接著性。
作為構成上述接著層之樹脂之具體例,例如可列舉:具有環氧基、縮水甘油基或氧雜環丁基等之環狀醚類;聚矽氧系樹脂、丙烯酸系樹脂及該等之混合物。
上述透明片材視需要可於上述樹脂膜之與上述無機玻璃相反之側具備任意適當之其他層。作為上述其他層,例如可列舉透明導電性層、硬塗層等。
上述透明導電性層於使用上述透明片材作為顯示元件及太陽電池之基板時,可發揮作為電極或電磁波遮罩之功能。
作為上述透明導電性層中可使用之材料,例如可列舉:銅、銀等金屬;銦錫氧化物(ITO,Indium Tin Oxide)、銦鋅氧化物(IZO,Indium Tin Zinc)等金屬氧化物;聚噻吩、聚苯胺等導電性高分子;含有碳奈米管之組合物等。
上述硬塗層具有對上述透明片材賦予耐化學品性、耐擦傷性及表面平滑性之功能。
作為構成上述硬塗層之材料,可採用任意適當者。作為構成上述硬塗層之材料,例如可列舉:環氧系樹脂、丙烯酸系樹脂、聚矽氧系樹脂及該等之混合物。其中較佳為耐熱性優異之環氧系樹脂。上述
硬塗層可藉由熱或活性能量線使該等樹脂硬化而獲得。
作為本發明之透明片材之製造方法,例如可列舉以下方法:經由含有接著層形成用樹脂溶液之塗佈層將無機玻璃與樹脂膜積層,其後使塗佈層硬化而形成接著層,將無機玻璃與樹脂膜貼合。
於該製造方法中,首先於無機玻璃或樹脂膜上塗佈接著層形成用樹脂溶液而形成塗佈層。作為無機玻璃,可使用上述A項及B項中說明之無機玻璃。作為樹脂膜,可使用上述A項及C項中說明之樹脂膜。作為接著層形成用樹脂溶液中所含之樹脂,可使用上述D項中說明之樹脂。接著層形成用樹脂溶液亦可含有任意適當之溶劑。作為該溶劑,例如可列舉:甲基乙基酮、環戊酮、甲苯等。又,接著層形成用樹脂溶液可含有聚合起始劑、硬化劑、偶合劑、光增感劑等任意適當之添加劑。
亦可使用進行了易接著處理之無機玻璃及樹脂膜作為上述無機玻璃及樹脂膜。藉由進行易接著處理,可提高對接著層之接著力。作為易接著處理,可列舉:電暈處理、電漿處理等非接觸式表面處理;偶合劑處理等。
作為上述偶合處理之方法,可採用任意適當之方法。具體而言,例如可列舉以下方法:將上述偶合劑之溶液塗敷於上述無機玻璃或樹脂膜之表面上後,進行熱處理。
作為偶合劑,例如可列舉:胺基系偶合劑、環氧系偶合劑、異氰酸酯系偶合劑、乙烯基系偶合劑、巰基系偶合劑、(甲基)丙烯醯氧基系偶合劑等。於樹脂膜含有具有酯鍵之樹脂之情形時,可較佳地使用環氧系偶合劑、胺基系偶合劑及/或異氰酸酯系偶合劑。於樹脂膜含有具有羥基之樹脂之情形時,可較佳地使用環氧系偶合劑。
上述胺基系偶合劑較佳為具有胺基之烷氧基矽烷或具有胺基之鹵化矽烷。尤佳為具有胺基之烷氧基矽烷。
作為上述具有胺基之烷氧基矽烷之具體例,可列舉:3-胺基丙基三甲氧基矽烷、3-胺基丙基甲基二甲氧基矽烷、3-胺基丙基二甲基甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-胺基丙基甲基二乙氧基矽烷、3-胺基丙基甲基二甲氧基矽烷、6-胺基己基三甲氧基矽烷、6-胺基己基三乙氧基矽烷、11-胺基十一烷基三甲氧基矽烷、11-胺基十一烷基三乙氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基-亞丁基)丙基胺。
作為上述具有胺基之鹵化矽烷之具體例,可列舉:3-胺基丙基三氯矽烷、3-胺基丙基甲基二氯矽烷、3-胺基丙基二甲基氯矽烷、6-胺基己基三氯矽烷、11-胺基十一烷基三氯矽烷。
作為上述環氧系偶合劑之具體例,可列舉:2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷。
作為上述異氰酸酯系偶合劑之具體例,可列舉:3-異氰酸酯丙基三乙氧基矽烷。
作為製備上述偶合劑之溶液時所使用之溶劑,只要為與偶合劑不反應之溶劑,則可使用任意適當之溶劑。作為該溶劑,例如可列舉:己烷、十六烷等脂肪族烴系溶劑;苯、甲苯、二甲苯等芳香族系溶劑;二氯甲烷、1,1,2-三氯乙烷等鹵代烴系溶劑;四氫呋喃、1,4-二烷等醚系溶劑;甲醇、丙醇等醇系溶劑;丙酮、2-丁酮等酮系溶劑及水。
上述偶合處理時之熱處理方法可採用任意適當之熱處理方法。具代表性的是熱處理溫度為50℃~150℃,熱處理時間為1分鐘~10分鐘。可藉由熱處理使偶合劑與上述無機玻璃表面藉由化學鍵而結合。
又,亦可使用進行了退火處理之樹脂膜作為上述樹脂膜。藉由進行退火處理,可高效地去除殘存溶劑或未反應之單體成分等雜質。上述退火處理之溫度較佳為100℃~200℃。又,上述退火處理之處理時間較佳為5分鐘~20分鐘。
上述塗佈層之厚度之下限較佳為大於10 μm,進而較佳為大於11 μm。上述塗佈層之厚度之上限小於(無機玻璃之厚度×0.5)μm,小於(無機玻璃之厚度×0.4)μm。上述塗佈層之厚度可考慮接著層形成用樹脂溶液所含之溶劑之量而設定成較所需之接著層厚度更厚之厚度。
形成塗佈層後,經由該塗佈層將無機玻璃與樹脂膜積層,其後,將塗佈層硬化,將上述無機玻璃與樹脂膜貼合。樹脂膜亦可預先形成於任意適當之基材上,將其轉印至無機玻璃上並進行積層。再者,將無機玻璃與樹脂膜積層之時機亦可為與上述塗佈層之形成大致同時。即,亦可一面向無機玻璃與樹脂膜之間供給接著層形成用樹脂溶液,一面將無機玻璃與樹脂膜積層。
作為上述塗佈層之硬化方法,例如可列舉:熱硬化法、活性能量線硬化法。較佳為使用活性能量線硬化法,更佳為使用紫外線硬化法。若藉由活性能量線使塗佈層硬化,則硬化無需加熱,因此可抑制樹脂膜之膨脹,獲得樹脂膜面之平滑性優異之透明片材。
關於上述紫外線硬化法中之上述紫外光照射之照射條件,具代表性的是照射累積光量為100 mJ/cm2~2000 mJ/cm2,照射時間為5分鐘~30分鐘。再者,亦可於上述無機玻璃或樹脂膜之表面上塗佈接著層形成用樹脂溶液而形成塗佈層後、使無機玻璃與樹脂膜積層之前,使塗佈層半硬化。半硬化例如可照射1 mJ/cm2~10 mJ/cm2之紫外光1秒~60秒而進行。
關於上述熱硬化法中之上述加熱處理之條件,具代表性的是加
熱溫度為100℃~200℃,加熱時間為5分鐘~30分鐘。
本發明之透明片材可較佳地用作顯示元件或太陽電池之基板。又,本發明之透明片材可較佳地用作顯示元件或太陽電池之基板之防濕片材。作為顯示元件,例如可列舉:液晶顯示器、電漿顯示器、有機EL顯示器等。
以下,藉由實施例對本發明進行具體說明,但本發明不受該等實施例之任何限定。再者,厚度係使用Anritsu公司製造之數位式測微計「KC-351C型」測定。
將聚芳酯(U-Polymer U-100,Unitika公司製造)、三氯乙烷及調平劑(BYK-302,BYK-Chemie公司製造)以重量比(聚芳酯:三氯乙烷:調平劑)15:85:0.01混合,獲得澆鑄溶液(A)。
於聚對苯二甲酸乙二酯膜之表面上塗敷澆鑄溶液(A),於110℃下乾燥10分鐘後,剝離聚對苯二甲酸乙二酯膜,獲得25 μm之樹脂膜(I)。其後,將所獲得之樹脂膜(I)於150℃下進行10分鐘退火處理。
將環氧系樹脂(Celloxide 2021P,Daicel Chemical Industries公司製造)、氧雜環丁烷系樹脂(ARON OXETANE OXT-221,東亞合成公司製造)、聚合起始劑(Adeka Optomer SP-170,ADEKA公司製造)及甲基乙基酮以重量比(環氧系樹脂:氧雜環丁烷系樹脂:聚合起始劑:甲基乙基酮)90:10:3:100之比率混合,將所得之混合溶液(接著層形成用樹脂溶液)塗敷於上述樹脂膜(I)上,於40℃下乾燥1分鐘,於上述樹脂膜(I)上形成厚度11 μm之塗佈層。
另外,用甲基乙基酮清洗厚度50 μm、縱10 cm×橫4 cm之無機玻璃(D263,Schott公司製造)之單面表面後,進行電暈處理,繼而塗敷
末端為環氧基之偶合劑(KBM-403,信越化學工業公司製造),於110℃下進行5分鐘熱處理。將上述樹脂膜(I)自上述塗佈層側貼附於如此般經偶合處理之上述無機玻璃之表面上,利用高壓水銀燈照射紫外光(波長:365 nm,強度:1000 mJ/cm2以上),藉此使塗佈層硬化而形成接著層(厚度:11 μm),進而於150℃下進行15分鐘熱處理。對無機玻璃之另一表面亦進行同樣之處理,獲得總厚度122 μm之透明片材(樹脂膜/接著層/無機玻璃/接著層/樹脂膜)。
再者,貼附於無機玻璃上之樹脂膜(I)係分別製成縱10 cm×橫3 cm之大小,使上述無機玻璃之縱10 cm×橫1 cm部分露出。
將環氧系樹脂(Celloxide 2021P,Daicel Chemical Industries公司製造)、氧雜環丁烷系樹脂(ARON OXETANE OXT-221,東亞合成公司製造)、光陽離子聚合起始劑(Adeka Optomer SP-170,ADEKA公司製造)及甲基乙基酮以重量比(環氧系樹脂:氧雜環丁烷系樹脂:光陽離子聚合起始劑:甲基乙基酮)90:10:3:100之比率混合,將所得之混合溶液(接著層形成用樹脂溶液)塗敷於厚度25 μm之聚萘二甲酸乙二酯膜(Teonex Q51DW,Teijin Dupont Films公司製造)上後,於40℃下乾燥1分鐘,於上述聚萘二甲酸乙二酯膜上形成厚度11 μm之塗佈層。其次,對塗佈層之與聚萘二甲酸乙二酯膜相反之側照射紫外光(5 mJ/cm2以下),使塗佈層成為半硬化狀態。
另外,用甲基乙基酮清洗厚度50 μm、縱10 cm×橫4 cm之無機玻璃(D263,Schott公司製造)之單面表面後,進行電暈處理,繼而塗敷末端為環氧基之偶合劑(KBM-403,信越化學工業公司製造),於110℃下進行5分鐘熱處理。將上述聚萘二甲酸乙二酯膜自上述塗佈層側貼附於如此般經偶合處理之上述無機玻璃之表面上,於150℃下進行15分鐘熱處理,藉此使塗佈層硬化而形成接著層(厚度:11 μm)。
對無機玻璃之另一表面亦進行同樣之處理,獲得總厚度122 μm之透明片材(樹脂膜/接著層/無機玻璃/接著層/樹脂膜)。
再者,貼附於無機玻璃上之樹脂膜(聚萘二甲酸乙二酯)係分別製成縱10 cm×橫3 cm之大小,使上述無機玻璃之縱10 cm×橫1 cm部分露出。
除了將接著層之厚度設定為15 μm以外,以與實施例1相同之方式獲得總厚度130 μm之透明片材(樹脂膜(25 μm)/接著層(15 μm)/無機玻璃(50 μm)/接著層(15 μm)/樹脂膜(25 μm))。
於10℃下向甲基乙基酮100 mL中之4,4'-六氟亞異丙基二酚(23.53 g,0.07莫耳)、4,4'-(2-亞降基)雙酚(8.4 g,0.03莫耳)及三乙胺(22.3 g,0.22莫耳)之攪拌混合物中,添加甲基乙基酮60 mL中之對苯二甲醯氯(19.29 g,0.095莫耳)與鄰苯二甲醯氯(1.02 g,0.005莫耳)之溶液。添加後,使溫度上升至室溫,將溶液於氮氣下攪拌4小時,其間鹽酸三乙基胺以明膠形態沈澱,溶液變得具有黏性。其後,以甲苯160 mL稀釋溶液,以稀鹽酸(2%之酸200 mL)清洗,其後以水200 mL清洗3次。其後劇烈地攪拌溶液並注入至乙醇中,使如珠粒般之樹脂沈澱,將其收集並於50℃下進行乾燥。若用示差掃描熱量測定法測定該樹脂之玻璃轉移溫度,則為270℃。
將所獲得之樹脂、環戊酮及調平劑(BYK-302,BYK-Chemie公司製造)以重量比(樹脂:環戊酮:調平劑)10:90:0.01混合,獲得澆鑄溶液(C)。
於聚對苯二甲酸乙二酯膜之表面上塗敷澆鑄溶液(C),於110℃下乾燥10分鐘後,剝離聚對苯二甲酸乙二酯膜,獲得30 μm之樹脂膜(II)。其後,將所獲得之樹脂膜(II)於150℃下進行10分鐘退火處理。
除了使用樹脂膜(II)代替樹脂膜(I)以外,以與實施例1相同之方式獲得總厚度132 μm之透明片材(樹脂膜(30 μm)/接著層(11 μm)/無機玻璃(50 μm)/接著層(11 μm)/樹脂膜(30 μm))。
於聚對苯二甲酸乙二酯膜之表面上塗敷上述澆鑄溶液(C),於110℃下乾燥10分鐘後,剝離聚對苯二甲酸乙二酯膜,獲得45 μm之樹脂膜(III)。其後,將所獲得之樹脂膜(III)於150℃下進行10分鐘退火處理。
使用樹脂膜(III)代替樹脂膜(I),且將該樹脂膜(III)僅貼合於無機玻璃之單側,除此以外,以與實施例1相同之方式獲得總厚度106 μm之透明片材(樹脂膜(45 μm)/接著層(11 μm)/無機玻璃(50 μm))。
使用實施例1中製作之樹脂膜(I)作為樹脂膜。
將橡膠粒子分散環氧樹脂(Kanes MX951,Kaneka公司製造)100重量份(固形物成分)與光陽離子聚合起始劑(Adeka Optomer SP-170,ADEKA公司製造)3重量份混合,將所得之混合溶液(接著層形成用樹脂溶液)塗敷於上述樹脂膜(I)上,於40℃下乾燥1分鐘,於上述樹脂膜(I)上形成厚度15 μm之塗佈層。
另外,用甲基乙基酮清洗厚度50 μm、縱10 cm×橫4 cm之無機玻璃(D263,Schott公司製造)之單面表面後,進行電暈處理,繼而塗敷末端為環氧基之偶合劑(KBM-403,信越化學工業公司製造),於110℃下進行5分鐘熱處理。將上述樹脂膜(I)自上述塗佈層側貼附於經如此般經偶合處理之上述無機玻璃之表面上,利用高壓水銀燈照射紫外光(波長:365 nm,強度:1000 mJ/cm2以上),藉此使塗佈層硬化而形成接著層(厚度:15 μm),進而於150℃下進行15分鐘熱處理。對無機玻璃之另一表面亦進行同樣之處理,獲得總厚度130 μm之透明片材
(樹脂膜/接著層/無機玻璃/接著層/樹脂膜)。
再者,貼合於無機玻璃上之樹脂膜(I)係分別製成縱10 cm×橫3 cm之大小,使上述無機玻璃之縱10 cm×橫1 cm部分露出。
除了將接著層之厚度設定為30 μm以外,以與比較例1相同之方式獲得總厚度160 μm之透明片材(樹脂膜(25 μm)/接著層(30 μm)/無機玻璃(50 μm)/接著層(30 μm)/樹脂膜(25 μm))。
除了將接著層之厚度設定為5 μm以外,以與實施例1相同之方式獲得總厚度110 μm之透明片材(樹脂膜(25 μm)/接著層(5 μm)/無機玻璃(50 μm)/接著層(5 μm)/樹脂膜(25 μm))。
除了將接著層之厚度設定為30 μm以外,以與實施例1相同之方式獲得總厚度160 μm之透明片材(樹脂膜(25 μm)/接著層(30 μm)/無機玻璃(50 μm)/接著層(30 μm)/樹脂膜(25 μm))。
用甲基乙基酮清洗厚度50 μm、縱10 cm×橫4 cm之無機玻璃(D263,Schott公司製造)之單面表面後,進行電暈處理,繼而塗敷末端為環氧基之偶合劑(KBM-403,信越化學工業公司製造),於110℃下進行5分鐘熱處理。將上述澆鑄溶液(C)塗敷於如此般經偶合處理之上述無機玻璃之表面上,於110℃下乾燥10分鐘形成厚度45 μm之樹脂層,獲得總厚度95 μm之透明片材(樹脂層(45 μm)/無機玻璃(50 μm))。
利用下述方法對上述所獲得之透明片材進行評價。將結果示於表1中。
(a)準備實施例及比較例中獲得之透明片材作為評價用試樣。
(b)於無機玻璃露出部分之縱邊端部之中央劃入5 mm以下之裂縫。
(c)使評價用試樣之縱邊彎曲,裂縫於無機玻璃露出部分中進展,進而於樹脂等之積層區域進展1 cm之時,將以該時刻之縱邊作為圓周之圓之直徑設定為斷裂直徑。再者,於無機玻璃之單側具備樹脂膜之透明片材(實施例5)係以樹脂膜側成為凸部(如樹脂膜側成為外側)之方式彎曲。
於20 W之螢光燈下,自距離透明片材30 cm之處目測確認缺點(由異物所致之局部之厚度不均)。將每10 cm2之缺點數為3個以下之情形記作○,將4個以上之情形記作×。
利用以下之方法對構成實施例及比較例中獲得之透明片材之接著層及樹脂膜的彈性模數進行評價。
製作厚度50 μm、寬度2 cm、長度15 cm之短條狀樹脂樣品,使用自動立體測圖儀(島津製作所公司製造,AG-I),根據25℃下之短條狀樹脂樣品之長度方向之伸長率與應力測定彈性模數。試驗條件係將吸盤間距離設定為10 cm,拉伸速度設定為10 mm/min。
如表1所表明般,根據本發明,可提供一種透明片材,該透明片材即便於在無機玻璃之單側或兩側具備特定厚度之樹脂膜,進而於該無機玻璃與樹脂膜之間具備具有特定厚度及彈性模數之接著層,藉此經由接著層將無機玻璃與樹脂膜貼合而成之情形時,外觀亦優異,防止玻璃之裂縫之進展及斷裂,且可撓性優異。
又,本發明之透明片材於無機玻璃之兩側具備樹脂膜之情形理所當然並無捲曲之產生,但即便為如實施例5般於無機玻璃之單側具備樹脂膜之情形,亦無捲曲之產生。另一方面,於如比較例5般於無機玻璃之單側直接塗敷樹脂溶液之情形時,樹脂層於乾燥時收縮,產生較大之捲曲。
本發明之透明片材可廣泛用於液晶顯示器、有機EL顯示器、電漿顯示器等顯示元件及太陽電池中。
10‧‧‧無機玻璃
11、11'‧‧‧樹脂膜
12、12'‧‧‧接著層
100‧‧‧透明片材
Claims (9)
- 一種透明片材,其具備無機玻璃、及於該無機玻璃之單側或兩側經由接著層貼合之樹脂膜,且該無機玻璃之厚度為40μm~100μm,該接著層之單層厚度係11μm以上,且為(無機玻璃之厚度×0.3)μm以下,該接著層於25℃下之彈性模數為1.2GPa~10GPa,該樹脂膜之總厚度相對於該無機玻璃之厚度之比率為0.9~4。
- 如請求項1之透明片材,其中上述樹脂膜於25℃下之彈性模數為1.5GPa~10GPa。
- 如請求項1或2之透明片材,其中上述樹脂膜含有玻璃轉移溫度為150℃~350℃之樹脂。
- 如請求項1或2之透明片材,其中上述樹脂膜含有熱塑性樹脂。
- 如請求項1或2之透明片材,其中上述接著層係藉由紫外線硬化性樹脂形成。
- 如請求項1或2之透明片材,其總厚度為150μm以下。
- 如請求項1或2之透明片材,其可用作顯示元件或太陽電池之基板。
- 如請求項1或2之透明片材,其可用作顯示元件或太陽電池之防濕層。
- 一種透明片材之製造方法,其包括於無機玻璃或樹脂膜上塗佈接著層形成用樹脂溶液而形成塗佈層之步驟;及經由該塗佈層將該無機玻璃與該樹脂膜積層,其後使塗佈層 硬化而形成接著層,將該無機玻璃與該樹脂膜貼合之步驟;且該無機玻璃之厚度為40μm~100μm,該接著層之單層厚度係11μm以上,且為(無機玻璃之厚度×0.3)μm以下,該接著層於25℃下之彈性模數為1.2GPa~10GPa,該樹脂膜之總厚度相對於該無機玻璃之厚度之比率為0.9~4。
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Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3183116B1 (en) | 2014-08-19 | 2022-05-04 | Corning Incorporated | Bendable glass stack assemblies and methods of making the same |
KR20160109526A (ko) * | 2015-03-11 | 2016-09-21 | 동우 화인켐 주식회사 | 필름 터치 센서 |
KR20170129185A (ko) * | 2015-03-13 | 2017-11-24 | 코닝 인코포레이티드 | 유리 리본을 가공하기 위한 방법 및 시스템 및 이에 의해 형성된 유리 리본 |
SG11201705322QA (en) * | 2015-03-23 | 2017-07-28 | Emd Millipore Corp | Abrasion resistant film for biocontainers |
JP6614833B2 (ja) * | 2015-07-15 | 2019-12-04 | 日東電工株式会社 | 光学積層体の製造方法 |
JP6615520B2 (ja) | 2015-07-15 | 2019-12-04 | 日東電工株式会社 | 光学積層体 |
JP6614834B2 (ja) * | 2015-07-15 | 2019-12-04 | 日東電工株式会社 | 光学積層体の製造方法 |
JP6544134B2 (ja) * | 2015-08-17 | 2019-07-17 | 三菱ケミカル株式会社 | ガラス積層体、ガラス積層体ロール、電子デバイス用基板、及び離型フィルム付きガラス層保護フィルム |
KR102408329B1 (ko) | 2016-01-08 | 2022-06-10 | 동우 화인켐 주식회사 | 필름 터치 센서 및 이의 제조 방법 |
WO2018079545A1 (ja) * | 2016-10-26 | 2018-05-03 | 日東電工株式会社 | ガラスフィルム-樹脂複合体 |
CN114670513A (zh) * | 2016-10-26 | 2022-06-28 | 日东电工株式会社 | 带有树脂膜的玻璃卷 |
EP3604248B1 (en) | 2017-03-29 | 2023-05-03 | Sekisui Chemical Co., Ltd. | Luminous curved glass and curved digital signage |
JP7264047B2 (ja) * | 2017-03-29 | 2023-04-25 | 日本ゼオン株式会社 | 積層体および有機系太陽電池の製造方法 |
JP6802361B2 (ja) * | 2017-03-30 | 2020-12-16 | 富士フイルム株式会社 | 光学フィルムならびにこれを有する画像表示装置の前面板、画像表示装置、画像表示機能付きミラ−、抵抗膜式タッチパネルおよび静電容量式タッチパネル |
JP7124065B2 (ja) | 2017-09-12 | 2022-08-23 | コーニング インコーポレイテッド | デッドフロントガラスのための触覚エレメントおよびその製造方法 |
US11065960B2 (en) | 2017-09-13 | 2021-07-20 | Corning Incorporated | Curved vehicle displays |
KR102436547B1 (ko) * | 2017-09-29 | 2022-08-29 | 삼성디스플레이 주식회사 | 전자 장치 |
TWI844520B (zh) | 2017-10-10 | 2024-06-11 | 美商康寧公司 | 具有改善可靠性的彎曲的覆蓋玻璃的車輛內部系統及其形成方法 |
CN111315573B (zh) | 2017-10-30 | 2023-01-13 | 日东电工株式会社 | 图像显示装置用层叠体 |
JP7348719B2 (ja) * | 2017-11-10 | 2023-09-21 | 住友化学株式会社 | 複合位相差板、光学積層体、及び画像表示装置 |
WO2019177952A1 (en) | 2018-03-13 | 2019-09-19 | Corning Incorporated | Vehicle interior systems having a crack resistant curved cover glass and methods for forming the same |
JP7296950B2 (ja) * | 2018-04-25 | 2023-06-23 | 日東電工株式会社 | ガラスフィルム-樹脂複合体 |
WO2020085183A1 (ja) * | 2018-10-26 | 2020-04-30 | 三井化学株式会社 | 基板積層体の製造方法及び積層体 |
WO2020203124A1 (ja) * | 2019-03-29 | 2020-10-08 | 日東電工株式会社 | ガラス樹脂積層体の製造方法 |
EP3785897B1 (en) | 2019-08-29 | 2021-12-29 | SHPP Global Technologies B.V. | Transparent, flexible, impact resistant, multilayer film comprising polycarbonate copolymers |
CN115916526A (zh) * | 2020-06-24 | 2023-04-04 | 日东电工株式会社 | 光学层叠体、带粘合剂层的光学层叠体以及图像显示装置 |
JP7311479B2 (ja) * | 2020-11-24 | 2023-07-19 | 日東電工株式会社 | 光学積層体および粘着剤層付き光学積層体 |
JP2022006687A (ja) * | 2020-06-24 | 2022-01-13 | 日東電工株式会社 | 光学積層体および画像表示装置 |
KR102276152B1 (ko) * | 2020-09-02 | 2021-07-12 | 에스케이이노베이션 주식회사 | 유리기판 적층체, 이의 제조방법 및 이를 포함하는 플렉서블 디스플레이 패널 |
KR102272739B1 (ko) * | 2020-09-04 | 2021-07-05 | 에스케이이노베이션 주식회사 | 유리기판 적층체, 이의 제조방법 및 이를 포함하는 플렉서블 디스플레이 패널 |
KR102276160B1 (ko) * | 2020-09-04 | 2021-07-12 | 에스케이이노베이션 주식회사 | 유리기판 적층체, 이의 제조방법 및 이를 포함하는 플렉서블 디스플레이 패널 |
JP7242934B2 (ja) * | 2020-11-24 | 2023-03-20 | 日東電工株式会社 | 光学積層体 |
JP7036889B1 (ja) | 2020-11-24 | 2022-03-15 | 日東電工株式会社 | 光学積層体 |
KR20220144724A (ko) * | 2021-04-20 | 2022-10-27 | 엘지디스플레이 주식회사 | 표시 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201130648A (en) * | 2009-10-23 | 2011-09-16 | Nitto Denko Corp | Transparent substrate |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2335884A (en) | 1998-04-02 | 1999-10-06 | Cambridge Display Tech Ltd | Flexible substrates for electronic or optoelectronic devices |
JP4250276B2 (ja) * | 1999-10-20 | 2009-04-08 | 三菱樹脂株式会社 | プラスチックフィルム・ガラスフィルム積層体及びその製造方法 |
JP2004095390A (ja) * | 2002-08-30 | 2004-03-25 | Fujitsu Display Technologies Corp | 照明装置及び表示装置 |
EP2273476A4 (en) * | 2008-04-24 | 2014-04-23 | Nitto Denko Corp | TRANSPARENT SUBSTRATE |
JP5467792B2 (ja) * | 2008-04-24 | 2014-04-09 | 日東電工株式会社 | 可撓性基板 |
JP5108675B2 (ja) * | 2008-08-12 | 2012-12-26 | 帝人デュポンフィルム株式会社 | 複合フィルム |
CN102209693A (zh) * | 2008-11-07 | 2011-10-05 | 日东电工株式会社 | 透明基板及其制造方法 |
JP5330966B2 (ja) * | 2009-05-14 | 2013-10-30 | 日東電工株式会社 | 透明基板ならびに透明基板を用いた表示素子、太陽電池および照明素子 |
WO2011030716A1 (ja) * | 2009-09-08 | 2011-03-17 | 旭硝子株式会社 | ガラス/樹脂積層体、及びそれを用いた電子デバイス |
KR101811893B1 (ko) * | 2009-10-22 | 2017-12-22 | 닛토덴코 가부시키가이샤 | 투명 기판 |
JP5540863B2 (ja) * | 2010-04-22 | 2014-07-02 | 住友化学株式会社 | 粘着剤付き樹脂フィルム及びそれを用いた光学積層体 |
JP5615134B2 (ja) * | 2010-04-30 | 2014-10-29 | 日東電工株式会社 | 透明基板の製造方法 |
JP5874159B2 (ja) * | 2010-08-31 | 2016-03-02 | 日本電気硝子株式会社 | ガラス−樹脂積層体、およびそれを巻き取ったガラスロール、並びにガラスロールの製造方法 |
JP4976531B2 (ja) * | 2010-09-06 | 2012-07-18 | 日東電工株式会社 | 半導体装置用フィルム |
-
2012
- 2012-04-02 JP JP2012083847A patent/JP5883333B2/ja active Active
-
2013
- 2013-03-19 CN CN201380017571.XA patent/CN104220253B/zh active Active
- 2013-03-19 KR KR1020147027703A patent/KR102251442B1/ko active IP Right Grant
- 2013-03-19 WO PCT/JP2013/057843 patent/WO2013150892A1/ja active Application Filing
- 2013-03-19 KR KR1020197038876A patent/KR20200005672A/ko active IP Right Grant
- 2013-03-19 EP EP13771848.2A patent/EP2835256A4/en not_active Withdrawn
- 2013-03-19 US US14/389,849 patent/US20150072125A1/en not_active Abandoned
- 2013-03-19 CN CN201710417698.0A patent/CN107253373B/zh active Active
- 2013-04-01 TW TW102111737A patent/TWI555644B/zh active
-
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- 2020-03-02 US US16/806,050 patent/US20200198302A1/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201130648A (en) * | 2009-10-23 | 2011-09-16 | Nitto Denko Corp | Transparent substrate |
Also Published As
Publication number | Publication date |
---|---|
WO2013150892A1 (ja) | 2013-10-10 |
US20150072125A1 (en) | 2015-03-12 |
CN104220253B (zh) | 2018-12-14 |
KR20200005672A (ko) | 2020-01-15 |
KR20150003727A (ko) | 2015-01-09 |
JP2013212633A (ja) | 2013-10-17 |
CN104220253A (zh) | 2014-12-17 |
US20200198302A1 (en) | 2020-06-25 |
TW201345731A (zh) | 2013-11-16 |
KR102251442B1 (ko) | 2021-05-12 |
CN107253373B (zh) | 2019-10-18 |
JP5883333B2 (ja) | 2016-03-15 |
EP2835256A4 (en) | 2015-12-02 |
CN107253373A (zh) | 2017-10-17 |
EP2835256A1 (en) | 2015-02-11 |
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