TWI553817B - 具有電磁防護功能之積體電路及其製造方法 - Google Patents

具有電磁防護功能之積體電路及其製造方法 Download PDF

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TWI553817B
TWI553817B TW103120794A TW103120794A TWI553817B TW I553817 B TWI553817 B TW I553817B TW 103120794 A TW103120794 A TW 103120794A TW 103120794 A TW103120794 A TW 103120794A TW I553817 B TWI553817 B TW I553817B
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electromagnetic
integrated circuit
contact
layer
electromagnetic shielding
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TW103120794A
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TW201601279A (zh
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李朝政
王文山
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瑞昱半導體股份有限公司
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Priority to US14/728,830 priority patent/US9269674B2/en
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Description

具有電磁防護功能之積體電路及其製造方法
本發明是關於積體電路及其製造方法，尤其是關於具有電磁防護功能之積體電路及其製造方法。
電子產品於運作時會產生電磁波，可能會干擾其它裝置的正常運作甚至影響人體健康，因此多數國家均針對電子產品之電磁波立下規範，以防止電磁干擾(Electromagnetic Interference,EMI)帶來危害。
電子產品的主要元件「積體電路(Integrated Circuit,IC)」是電磁波的主要來源之一，為避免積體電路的電磁波造成干擾，一種先前技術是於積體電路的封裝體設置於電路板後以軟性或硬性金屬物或吸波材料來遮蓋該積體電路封裝體，藉此隔離其所產生之電磁波，然而此種解決方式會使成本顯著增加，且會耗用較多電路板面積與整體空間，因此不利於經濟考量與微型化的應用。
鑑於上述，本領域需要一種在不增加過多成本下能夠避免電磁干擾且不耗用太多面積及/或體積的解決方式。
本發明之一目的在於提出一種具有電磁防護功能之積體電路及其製造方法，以解決先前技術的問題。
本發明提出一種具有電磁防護功能之積體電路，其一實施例包含：一半導體電路結構，包含一第一表面，該第一表面覆蓋一電磁波發散區域；一電磁防護層，例如一金屬層，覆蓋該第一表面，包含至少一接 點；以及至少一導電路徑，例如一打線，用來將該至少一接點電性連接至一穩定電位，藉此阻隔該電磁波發散區域之電磁波，其中流經該電磁防護層之電流為零或者小於流經該電磁波發散區域之最大電流，舉例來說，流經該電磁防護層之電流小於該最大電流的N分之一，該N例如為10或其它不致使電磁防護層產生所屬應用領域中無法忽視的電磁波的值。上述實施例中，該穩定電位是一接地電位、一直流高電位或一直流低電位；而於一替代實施例中，該穩定電位之單位時間內的變化率小於一預定值。
本發明亦提出一種具有電磁防護功能之積體電路製造方法，其一實施例包含下列步驟：形成一半導體電路結構包含一第一表面，該第一表面包含一電磁波發散區域；形成一電磁防護層覆蓋該第一表面且包含至少一接點；以及形成至少一導電路徑用來將該至少一接點電性連接至一穩定電位，藉此阻隔該電磁波發散區域之電磁波，其中流經該電磁防護層之電流為零或者小於流經該電磁波發散區域之最大電流。
有關本發明的特徵、實作與功效，茲配合圖式作較佳實施例詳細說明如下。
100‧‧‧積體電路
110‧‧‧半導體電路結構
112‧‧‧第一表面
114‧‧‧電磁波發散區域
116‧‧‧第二表面
118‧‧‧無電磁波發散區域
120‧‧‧電磁防護層
122‧‧‧接點
130‧‧‧導電路徑
140‧‧‧外露墊
150‧‧‧電磁防護接腳
160‧‧‧接地接腳
170‧‧‧導電體
Vs‧‧‧穩定電位
S610‧‧‧形成一半導體電路結構包含一第一表面，該第一表面包含一電磁波發散區域
S620‧‧‧形成一電磁防護層覆蓋該第一表面且包含至少一接點
S630‧‧‧形成至少一導電路徑用來將該至少一接點電性連接至一穩定電位，藉此阻隔該電磁波發散區域之電磁波，其中流經該電磁防護層之電流為零或者小於流經該電磁波發散區域之最大電流
圖1是本發明之具有電磁防護功能之積體電路的一實施例的示意圖；圖2a是圖1之實施例的一實施變化型態的示意圖；圖2b是圖1之實施例的另一實施變化型態的示意圖；圖3a是圖1之實施例的一實施變化型態的示意圖；圖3b是圖1之實施例的另一實施變化型態的示意圖；圖3c是圖1之實施例的又一實施變化型態的示意圖；圖3d是圖1之實施例的再一實施變化型態的示意圖；圖4是圖1之實施例的一實施變化型態的示意圖；圖5a是圖1之實施例的一實施變化型態的示意圖； 圖5b是圖1之實施例的另一實施變化型態的示意圖；圖5c是圖1之實施例的又一實施變化型態的示意圖；以及圖6是本發明之具有電磁防護功能之積體電路製造方法的一實施例的流程圖。
以下說明內容之技術用語是參照本技術領域之習慣用語，如本說明書對部分用語有加以說明或定義，該部分用語之解釋應以本說明書之說明或定義為準。另外，在實施為可能的前提下，本說明書所描述之物件或步驟間的相對關係，涵義可包含直接或間接的關係，所謂「間接」是指物件間尚有中間物或物理空間之存在，或指步驟間尚有中間步驟或時間間隔之存在。此外，以下內容是關於積體電路與其製造方法，對於本領域習見之技術或原理，若不涉及本發明之技術特徵，將不予贅述。再者，圖示中元件之形狀、尺寸、比例以及製程之步驟順序等僅為示意，是供本技術領域具有通常知識者瞭解本發明之用，非對本發明之實施範圍加以限制。
本發明包含具有電磁防護功能之積體電路及其製造方法，該積體電路與製造方法能夠以成本合宜且不佔用過多空間的方式來解決電磁干擾的間題，在實施為可能的前提下，本技術領域具有通常知識者能依本說明書之揭露選擇等效元件或步驟來實現本發明。本發明之積體電路可以是已完成封裝之成品或尚未完成封裝之半成品，可能包含已知元件，在不影響發明揭露要求及可實施性的前提下，已知元件的說明將被適度節略；而本發明之方法可透過已知或自行設計的半導體製程來實施。
請參閱圖1，其是本發明之具有電磁防護功能之積體電路的一實施例的示意圖。如圖1所示，積體電路100包含：一半導體電路結構110；一電磁防護層120；以及至少一導電路徑130。所述半導體電路結構110可以是一已知或自行設計的結構，包含一第一表面112，該第一表面112可以是半導體電路結 構110的部分或全部表面，覆蓋一電磁波發散區域114，該電磁波發散區域114例如是一有電流流通的導體(像是直線導體)或是包含該導體的區域。所述電磁防護層120例如是一金屬層、一吸波材料層或是一金屬與吸波材料的複合層，覆蓋第一表面112，包含至少一接點122，本實施例中，該至少一接點122未與半導體電路結構110中的電路(尤其是耗電的電路)形成電性連接；而於一替代實施例中，該至少一接點122僅與半導體電路結構110中具有穩定電位的電路(例如靜電防護電路)形成電性連接，上述電性連接的定義不含經過接地點所形成的連接。所述至少一導電路徑130用來將至少一接點122電性連接至一穩定電位Vs，藉此使電磁防護層120處於該穩定電位Vs，以阻隔電磁波發散區域114之電磁波，其中穩定電位Vs是一接地電位(像是訊號接地電位(Signal Ground,或稱System Ground)或是機殼接地電位(Chassis Ground))或是一低頻電位(亦即單位時間內電壓變化小於一預定值的電位，例如電源供應之直流高電位VDD或直流低電位VSS)；另外，流經電磁防護層120之電流為零或者小於流經該電磁波發散區域114之最大電流，舉例來說，流經電磁防護層120之電流小於該最大電流的N分之一，該N例如為10或其它不致使電磁防護層120產生所屬應用領域中無法忽視的電磁波的值。
請參閱圖2a，其是圖1之實施例的一實施變化型態的示意圖，如圖2a所示，半導體電路結構110除第一表面112外，另包含一第二表面116，且電磁防護層120露出該第二表面116，換言之，基於效能或其餘設計考量，第二表面116所覆蓋之區域(例如一射頻電路區域或一無電磁波發散區域)未被電磁防護層120所覆蓋。另請參閱圖2b，其是圖1之實施例的另一實施變化型態的示意圖，如圖2b所示，第一表面112除了覆蓋電磁波發散區域114，另覆蓋一無電磁波發散區域118，此意謂著無論一區域有無發散電磁波，電磁防護層120均可加以覆蓋。
請參閱圖3a，其是圖1之實施例的一實施變化型態的示意圖，如圖3a所示，接點122有複數個，導電路徑130也有複數個，此時該複數個接點 122分別經由複數導電路徑130電性連接至穩定電位Vs，藉此確保電磁防護層120的電位穩定，加強電磁防護效果，請注意，導電路徑130可能將接點122直接連接至穩定電位Vs，也可能包含磁珠(Bead)、電感、電容、電阻或上述元件的適當組合以構成適當的阻抗而作為接點122與穩定電位Vs間的路徑的一部分，類似變化端視實施本發明者之需求而定。另外，上述複數個接點122之佈局可由本領域人士依需求或設計規格決定，舉例而言，請參閱圖3b，電磁防護層120包含複數邊，且複數接點122中的至少二接點122位於該複數邊中的同一邊；另舉例而言，請參閱圖3c，該複數接點122分佈於電磁防護層120之複數邊的至少二邊；再舉例而言，請參閱圖3d，電磁防護層120的每一邊設有該複數接點122的至少二接點122。
請參閱圖4，其是圖1之實施例的一實施變化型態的示意圖，如圖4所示，積體電路100進一步包含：一外露墊(Exposed Pad,EPad)140，與半導體電路結構110直接或透過至少一中間層(例如一絕緣貼附層)固定在一起，用來電性連接至穩定電位Vs，此時至少一導電路徑130用來將至少一接點122電性連接至外露墊140，藉此使至少一接點122經由外露墊140電性連接至穩定電位Vs。請注意，本實施樣態中，外露墊140用來與一電路板之導電表面(例如銅箔)接合在一起，除能藉此散熱，並能藉此電性連接到電路板所提供之接地電位(亦即穩定電位Vs)，其中電路板不包含於積體電路100中。另請注意，本實施樣態的積體電路100是採用四方扁平無引腳(Quad Flat No Leads,QFN)封裝或其均等，或是採用其它可達到上述說明之連接方式與效果的封裝。
請參閱圖5a，其是圖1之實施例的一實施變化型態的示意圖，如圖5a所示，積體電路100進一步包含：至少一電磁防護接腳(Pin)150，用來電性連接至穩定電位Vs，此時至少一導電路徑130用來將至少一接點122電性連接至至少一電磁防護接腳150，藉此使至少一接點122經由至少一電磁防護接腳150電性連接至穩定電位Vs。另外，如圖5b所示，積體電路100可進一步包含一接地接腳160，其與前述至少一電磁防護接腳150不同，用來耦接至一接地 電位，更明白地說，由於接地接腳160之電位受積體電路100運作之影響可能較穩定電位Vs不穩定，因此本實施樣態使用一或多個獨立的電磁防護接腳150而非接地接腳160來將電磁防護層120的至少一接點122連接至穩定電位Vs；然而，於一替代實施樣態中，在效能可接受的情形下，電磁防護接腳與接地接腳可以是相同接腳。請注意，本實施樣態中，電磁防護接腳150用來與一電路板的接地電位(亦即穩定電位Vs)電性連接在一起，其中電路板不屬於積體電路100的一部分。另請注意，本實施樣態的積體電路100是採用四方扁平封裝(Quad Flat Package,QFP)、球閘陣列(Ball Grid Array,BGA)封裝以及覆晶(Flip Chip)封裝的其中之一或其均等，或是採用其它可達到上述說明之連接方式與效果的封裝。
請參閱圖5c，為避免佔用過多接腳數，積體電路100除圖5a之元件外，可進一步包含：一導電體(例如金屬)170，設於電磁防護層120之至少一邊，用來經由至少一導電路徑130電性連接至少一接點122，並電性連接至少一電磁防護接腳150。本實施樣態中，導電體170是一導電環，環繞於電磁防護層120的周邊，可與電磁防護層120位於同一平面或不同平面，用來經由複數個導電路徑130分別電性連接至複數個接點122，並電性連接單一電磁防護接腳150，使得接點122能夠經由導電路徑130、導電體170以及該單一電磁防護接腳150電性連接至穩定電位Vs，而無需複數個電磁防護接腳來分別對應複數個接點122。請注意，圖5c雖以單一電磁防護接腳150為例，然實施本發明者可依需求或設計規範使用一個以上的電磁防護接腳。
上述實施例中，在實施為可能的情形下，電磁防護層120可與一重佈層(Redistribution Layer,RDL)位於同一層，換言之，二者是透過同樣的製程手續形成，也可說是一層二用，由於重佈層之製作與應用屬本領域之通常知識，其細節在此予以節略。另外，如前所述，電磁防護層120可以是一金屬層，然為避免該金屬層過度氧化或易腐蝕的問題，本發明選用適當材質(例如鋁等)來形成該金屬層；或於主要材質(例如銅)中摻雜適當材質(例如鋁、鎂、鈦 等)來形成該金屬層；亦或形成一防護層(例如氧化鋁膜或氮化鈦膜等)來保護該金屬層，凡此種種均屬本發明之實施範圍。再者，上述實施例中，電磁防護層120為積體電路100裡所有金屬層的最外層(最上層、最下層或說最外側金屬層)，亦即電磁防護層120是由最後的金屬層製程來形成，然此僅是一較佳實施方式，並非對本發明之限制。進一步言之，一般積體電路的外層金屬層通常是電源與接地網線(Power and Ground Mesh)，然而由於電源與接地網線受限於網線結構無法有效因應電磁波發散區域114之電流來產生鏡像電流(Image Current)以抵銷其電磁波，即便能產生不完全的鏡像電流也無法使該鏡像電流與電磁波發散區域114之電流完全同時與同方向軸以產生抵銷效果，且電源與接地網線本身也有顯著的電流流過，會產生無法忽略也無從抵銷的電磁波，因此，前述實施例中，積體電路100雖可能因設計需求而包含電源與接地網線，然該網線會與電磁防護層120位於不同層且電磁防護層120之面積大於電源/接地網線(Power and/or Ground Mesh)之面積，或者在實施為可能的前提下二者雖位於同層但無任何電性連接關係，或者電源與接地網線之部分(例如電源網線或接地網線)或全部即為或包含於前述電磁波發散區域114，簡言之，電磁防護層120不同於電源與接地網線，且可用來抑制電源與接地網線所導致的電磁波。
除了上述的積體電路100外，本發明另揭露一種具有電磁防護功能之積體電路製造方法，可用來製造積體電路100或其等效電路。如圖6所示，該方法之一實施例包含下列步驟：
步驟S610：形成一半導體電路結構包含一第一表面，該第一表面包含一電磁波發散區域。本步驟可用來形成圖1之半導體電路結構110或其實施變化型態。
步驟S620：形成一電磁防護層覆蓋該第一表面且包含至少一接點。舉例來說，該電磁防護層為一金屬層、一吸波材料層或一金屬與吸波材料之複合層，包含複數接點，該複數接點分佈於電磁防護層之一邊、複數邊或周邊。本 步驟可用來形成圖1之電磁防護層120或其實施變化型態。
步驟S630：形成至少一導電路徑用來將該至少一接點電性連接至一穩定電位，藉此阻隔該電磁波發散區域之電磁波，其中流經該電磁防護層之電流為零或者小於流經該電磁波發散區域之最大電流。舉例而言，該至少一導電路徑包含複數導電路徑，用來將步驟S620之複數接點分別電性連接至該穩定電位；另外，流經該電磁防護層之電流為零或者小於該最大電流的N分之一，該N例如為10或其它不致使電磁防護層產生所屬應用領域無法忽視的電磁波的值。本步驟可用來形成圖1之導電路徑130或其實施變化型態。
除上述步驟外，本實施例可進一步包含下列步驟的至少其中之一：
步驟S640(未圖示)：形成一外露墊用來與該半導體電路結構直接或間接固定在一起，並用來電性連接至該穩定電位，其中該至少一導電路徑用來將該至少一接點電性連接至該外露墊，藉此使該至少一接點經由該外露墊電性連接至該穩定電位。
步驟S650(未圖示)：形成至少一電磁防護接腳用來電性連接至該穩定電位，其中該至少一導電路徑用來將該至少一接點電性連接至該電磁防護接腳，藉此使該至少一接點經由該電磁防護接腳電性連接至該穩定電位。
步驟S660(未圖示)：形成一導電體於該電磁防護層之至少一邊；以及形成至少一電磁防護接腳用來電性連接該導電體與該穩定電位，其中該至少一導電路徑用來將該至少一接點電性連接至該導電體，藉此使該至少一接點經由該導電體電性連接至該穩定電位。
步驟S670(未圖示)：採用下列封裝技術的其中之一或其均等來封裝一積體電路：四方扁平無引腳封裝、四方扁平封裝、球閘陣列封裝以及覆晶封裝。
由於本領域具有通常知識者可透過圖1至圖5c的說明來瞭解本實施例之細節與變化，更明確地說，前述積體電路100之實施例及其從屬技術特徵均可合理應用於本製造方法之實施例，因此，在不影響本實施例的揭露要求與可實施性的前提下，重複及冗餘之說明在此予以節略。
請注意，前揭各實施例包含一或複數個技術特徵，於實施為可能的前提下，本技術領域人士可依本發明之揭露內容及自身的需求選擇性地實施任一實施例之部分或全部技術特徵，或者選擇性地實施複數個實施例之部分或全部技術特徵之組合，藉此增加實施本發明的彈性。
綜上所述，本發明之積體電路與其製造方法能夠提供電磁防護，且可透過成熟、單純的積體電路製程(包含打線或形成電性連接的製程)來實現，故能夠在微幅增加成本及使用空間的情形下解決電磁干擾問題，相較於先前技術具有成本經濟及體積小的優勢。
雖然本發明之實施例如上所述，然而該些實施例並非用來限定本發明，本技術領域具有通常知識者可依據本發明之明示或隱含之內容對本發明之技術特徵施以變化，凡此種種變化均可能屬於本發明所尋求之專利保護範疇，換言之，本發明之專利保護範圍須視本說明書之申請專利範圍所界定者為準。
100‧‧‧積體電路
110‧‧‧半導體電路結構
112‧‧‧第一表面
114‧‧‧電磁波發散區域
120‧‧‧電磁防護層
122‧‧‧接點
130‧‧‧導電路徑

Claims (10)

  1. 一種具有電磁防護功能之積體電路，包含：一半導體電路結構，包含一第一表面與一第二表面，該第一表面與該第二表面屬於該半導體電路結構的同一面，該第一表面朝著一方向覆蓋一電磁波發散區域，該第二表面朝著與該方向同向之一平行方向覆蓋一射頻電路區域；一電磁防護層，位於該第一表面與該第二表面所屬的同一面之上，覆蓋該第一表面且未覆蓋該第二表面，包含至少一接點；以及至少一導電路徑，用來將該至少一接點電性連接至一穩定電位，藉此阻隔該電磁波發散區域之電磁波，其中流經該電磁防護層之電流為零或者小於流經該電磁波發散區域之最大電流。
  2. 如申請專利範圍第1項所述之積體電路，其中該至少一接點包含複數接點，該至少一導電路徑包含複數導電路徑，該複數接點分別經由該複數導電路徑電性連接至該穩定電位。
  3. 如申請專利範圍第2項所述之積體電路，其中該電磁防護層包含複數邊，且該複數接點中的至少二接點位於該複數邊中的同一邊。
  4. 如申請專利範圍第2項所述之積體電路，其中該電磁防護層包含複數邊，且該複數接點分佈於該複數邊之至少二者。
  5. 如申請專利範圍第1項所述之積體電路，進一步包含：一外露墊(Exposed Pad)，與該半導體電路結構直接或透過至少一中間層固定在一起，用來電性連接至該穩定電位， 其中該至少一導電路徑用來將該至少一接點電性連接至該外露墊，藉此使該至少一接點電性連接至該穩定電位。
  6. 如申請專利範圍第1項所述之積體電路，進一步包含：至少一電磁防護接腳(Pin)，用來電性連接至該穩定電位，其中該至少一導電路徑用來將該至少一接點電性連接至該電磁防護接腳，藉此使該至少一接點電性連接至該穩定電位。
  7. 如申請專利範圍第6項所述之積體電路，進一步包含：一接地接腳，與該至少一電磁防護接腳不同，用來耦接至一接地電位。
  8. 如申請專利範圍第1項所述之積體電路，其中該電磁防護層與一重佈層(Redistribution Layer)位於同一層。
  9. 如申請專利範圍第1項所述之積體電路，其中該電磁波發散區域為或包含：一電源及/或接地網線(Power and/or Ground Mesh)的部分或全部。
  10. 一種具有電磁防護功能之積體電路製造方法，包含：形成一半導體電路結構包含一第一表面與一第二表面，該第一表面與該第二表面屬於該半導體電路結構的同一面，該第一表面朝著一方向覆蓋一電磁波發散區域，該第二表面朝著與該方向同向之一平行方向覆蓋一射頻電路區域；形成一電磁防護層，該電磁防護層覆蓋該第一表面、未覆蓋該第二表面且包含至少一接點，其中該電磁防護層位於該第一表面與該第二表面所屬的同一面之上，且是該半導體電路結構所屬之一積體電路中所有金屬層的最外層；以及形成至少一導電路徑用來將該至少一接點電性連接至一穩定電位，藉此阻隔該電磁波發散區域之電磁波。
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