TWI550977B - Contact sheet and socket structure - Google Patents

Contact sheet and socket structure Download PDF

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Publication number
TWI550977B
TWI550977B TW104117876A TW104117876A TWI550977B TW I550977 B TWI550977 B TW I550977B TW 104117876 A TW104117876 A TW 104117876A TW 104117876 A TW104117876 A TW 104117876A TW I550977 B TWI550977 B TW I550977B
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Taiwan
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contact
sheet
contact piece
pin
pattern
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TW104117876A
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Chinese (zh)
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TW201611443A (en
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鄭永倍
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Isc股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

接觸片與接腳座 Contact piece and pin holder

本發明是關於一種接觸片,且更明確而言,是關於一種經設置以使之與包含電極圖案的測試目標裝置接觸的接觸片,所述電極圖案具有用於與所述測試目標裝置電連接的預定配置,所述接觸片經設置為具有預定面積以及厚度的薄片,所述接觸片包含:作為所述接觸片的主要部分的薄片本體,所述薄片本體具有預定面積且由絕緣材料形成,所述薄片本體形成接觸片的主要部分;以及多個接觸圖案元件,其配置於薄片本體中且經設置以電連接至所述測試目標裝置的電極圖案,其中接觸片在其外部部分與中心部分處具有不同厚度。 The present invention relates to a contact sheet, and more particularly to a contact sheet that is disposed to be in contact with a test target device including an electrode pattern, the electrode pattern having electrical connection for electrical connection with the test target device a predetermined configuration, the contact piece is provided as a sheet having a predetermined area and a thickness, the contact sheet comprising: a sheet body as a main portion of the contact sheet, the sheet body having a predetermined area and formed of an insulating material, The sheet body forms a main portion of the contact sheet; and a plurality of contact pattern elements disposed in the sheet body and configured to be electrically connected to the electrode pattern of the test target device, wherein the contact sheet is at an outer portion thereof and a central portion There are different thicknesses.

接腳為用以連接電裝置的中間部分。即,接腳與電裝置一起用於使連接電裝置變得容易。又由於接腳與一般電組件一起使用,因此接腳用於各種應用中,例如,在測試各種電組件時。 The pin is an intermediate portion for connecting the electrical device. That is, the pins are used together with the electrical device to facilitate the connection of the electrical device. Also because the pins are used with conventional electrical components, the pins are used in a variety of applications, for example, when testing various electrical components.

當接腳連接至待測試裝置時,極其重要的是,建立接腳的墊片與裝置的端子之間的可靠接觸。 When the pin is connected to the device to be tested, it is extremely important to establish a reliable contact between the pad of the pin and the terminal of the device.

然而,具有大尺寸與大數目端子的裝置易於翹曲,且因此裝置的平坦度可自其外部部分至中間部分發生變化。因此,此 等裝置的端子可具有不同高度,且因此接觸錯誤可能發生。 However, a device having a large size and a large number of terminals is susceptible to warping, and thus the flatness of the device may vary from its outer portion to the intermediate portion. So this The terminals of the devices may have different heights, and thus contact errors may occur.

舉例而言,圖1說明具有向下彎曲的外部部分的裝置D1。在此狀況下,連接錯誤可發生於接腳D2與裝置D1的端子之間。特定言之,連接錯誤的可能性在裝置D1的中心端子處可很高。相反狀況亦有可能。在相反狀況下,連接錯誤可特別地發生於裝置D1的外部端子處。 By way of example, Figure 1 illustrates a device D1 having an outer portion that is curved downward. In this case, a connection error can occur between pin D2 and the terminal of device D1. In particular, the possibility of a connection error can be high at the center terminal of device D1. The opposite is also possible. In the opposite case, a connection error may occur particularly at the external terminals of device D1.

因此,需要一種保證接腳與裝置之間的可靠連接的部件。 Therefore, there is a need for a component that ensures a reliable connection between the pin and the device.

提供本發明以解決上述問題,且本發明的目標為提供一種接觸片,所述接觸片經設置以使之與包含電極圖案的測試目標裝置接觸,所述電極圖案具有用於與測試目標裝置電連接的預定配置,接觸片經設置為具有預定面積以及厚度的薄片,接觸片包含:薄片本體,其具有預定面積並由絕緣材料形成,薄片本體形成接觸片的主要部分;以及多個接觸圖案元件,其配置於薄片本體中且經設置以電連接至測試目標裝置的電極圖案,其中接觸片在外部部分與中心部分處具有不同厚度。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a contact piece which is disposed to be in contact with a test target device including an electrode pattern having a function for electrically reacting with a test target device a predetermined configuration of the connection, the contact piece being provided as a sheet having a predetermined area and a thickness, the contact sheet comprising: a sheet body having a predetermined area and formed of an insulating material, the sheet body forming a main portion of the contact sheet; and a plurality of contact pattern elements An electrode pattern disposed in the sheet body and disposed to be electrically connected to the test target device, wherein the contact piece has a different thickness at the outer portion and the central portion.

根據本發明的實施例,一種接觸片經設置以使之與包含電極圖案的測試目標裝置接觸,所述電極圖案具有用於與所述測試目標裝置的電連接的預定配置,所述接觸片經設置為具有預定面積以及厚度的薄片,所述接觸片包含:作為所述接觸片的主要部分的薄片本體,其具有預定面積且由絕緣材料形成;以及多個 接觸圖案元件,其配置於所述薄片本體中且經設置以電連接至所述測試目標裝置的所述電極圖案,其中所述接觸片在所述接觸片的外部部分與中心部分處具有不同厚度。 According to an embodiment of the invention, a contact strip is arranged to be in contact with a test target device comprising an electrode pattern having a predetermined configuration for electrical connection with the test target device, the contact patch Provided as a sheet having a predetermined area and a thickness, the contact sheet comprising: a sheet body as a main portion of the contact sheet, having a predetermined area and formed of an insulating material; and a plurality of a contact pattern element disposed in the sheet body and configured to be electrically connected to the electrode pattern of the test target device, wherein the contact piece has a different thickness at an outer portion and a central portion of the contact piece .

較佳地,所述接觸片具有自所述接觸片的所述外部部分至所述中心部分增大的厚度。 Preferably, the contact piece has an increased thickness from the outer portion of the contact piece to the central portion.

較佳地,所述接觸片具有自所述接觸片的所述外部部分至所述中心部分減小的厚度。 Preferably, the contact piece has a reduced thickness from the outer portion of the contact piece to the central portion.

較佳地,所述接觸片的自上表面以及下表面選出的至少一者為具有預定曲率半徑的圓形。 Preferably, at least one of the contact piece selected from the upper surface and the lower surface is a circle having a predetermined radius of curvature.

較佳地,所述接觸片包含:平坦下表面;以及上表面,其具有在自所述接觸片的所述外部部分至所述中心部分的方向上上升的凸面形狀,或在自所述接觸片的所述外部部分至所述中心部分的方向上下降的凹面形狀。 Preferably, the contact piece comprises: a flat lower surface; and an upper surface having a convex shape rising in a direction from the outer portion of the contact piece to the central portion, or from the contact a concave shape in which the outer portion of the sheet descends in the direction of the central portion.

較佳地,所述接觸圖案元件包含彈性絕緣材料以及含於所述彈性絕緣材料中的導電粉末。 Preferably, the contact pattern element comprises an elastic insulating material and a conductive powder contained in the elastic insulating material.

較佳地,所述接觸片更包含覆蓋所述接觸片的上表面的上部薄膜。 Preferably, the contact piece further comprises an upper film covering the upper surface of the contact piece.

根據本發明的實施例,一種接腳座經設置以使之與包含電極圖案的測試目標裝置接觸,所述電極圖案具有用於與所述測試目標裝置電連接的預定配置,所述接腳座包含:接腳主體,其包含預定接腳圖案;以及接觸片,其安置於所述接腳主體上,其中所述接觸片經設置為具有預定面積以及厚度的薄片,且包含:作為所述接觸片的主要部分的薄片本體,其具有預定面積且包含絕緣材料;以及多個接觸圖案元件,其配置於所述薄片本體中且 經設置以電連接至所述測試目標裝置的所述電極圖案以及所述接腳主體的所述接腳圖案,其中所述接觸片在所述接觸片的外部部分與中心部分處具有不同厚度。 According to an embodiment of the present invention, a pin holder is disposed to be in contact with a test target device including an electrode pattern having a predetermined configuration for electrically connecting to the test target device, the pin holder The method includes a pin body including a predetermined pin pattern, and a contact piece disposed on the pin body, wherein the contact piece is disposed as a sheet having a predetermined area and a thickness, and includes: as the contact a sheet body of a main portion of the sheet having a predetermined area and comprising an insulating material; and a plurality of contact pattern elements disposed in the sheet body and The electrode pattern disposed to be electrically connected to the test target device and the pin pattern of the pin body, wherein the contact piece has a different thickness at an outer portion and a central portion of the contact piece.

較佳地,接腳座更包含所述接觸片與所述接腳主體之間的接觸薄膜,其中所述接觸薄膜包含:薄膜本體,其具有預定面積且包含絕緣材料,所述薄膜本體形成所述接觸薄膜的主要部分;以及多個薄膜圖案元件,其配置於所述薄膜本體中且接觸所述接觸片的所述接觸圖案元件以及所述接腳主體的所述接腳圖案,以用於在其間進行電連接,其中所述薄膜圖案元件形成導電彈性區。 Preferably, the pin base further comprises a contact film between the contact piece and the pin body, wherein the contact film comprises: a film body having a predetermined area and comprising an insulating material, the film body forming body a main portion of the contact film; and a plurality of thin film pattern elements disposed in the film body and contacting the contact pattern element of the contact piece and the pin pattern of the pin body for use in Electrical connections are made therebetween, wherein the thin film pattern elements form a conductive elastic region.

較佳地,所述接觸圖案元件包含彈性絕緣材料以及含於所述彈性絕緣材料中的導電粉末。 Preferably, the contact pattern element comprises an elastic insulating material and a conductive powder contained in the elastic insulating material.

較佳地,所述薄膜本體包括穿透孔區,且所述接觸圖案元件安置於所述穿透孔區中。 Preferably, the film body includes a through hole region, and the contact pattern member is disposed in the through hole region.

根據本發明,由於接觸片在其外部部分與中心部分處具有不同厚度,因此當使接觸片與待測試裝置接觸時,接觸片可確信地電連接至裝置以用於保證測試可靠性。 According to the present invention, since the contact piece has a different thickness at its outer portion and the central portion, when the contact piece is brought into contact with the device to be tested, the contact piece can be surely electrically connected to the device for ensuring test reliability.

100‧‧‧接觸片 100‧‧‧Contact film

110‧‧‧薄片本體 110‧‧‧Sheet body

120‧‧‧接觸圖案元件 120‧‧‧Contact pattern elements

122‧‧‧導電粉末 122‧‧‧Electrical powder

124‧‧‧彈性絕緣材料 124‧‧‧elastic insulation

140‧‧‧上部薄膜 140‧‧‧Upper film

200‧‧‧接腳主體 200‧‧‧ pin body

210‧‧‧接腳圖案 210‧‧‧ pin pattern

300‧‧‧測試目標裝置 300‧‧‧Test target device

310‧‧‧電極圖案 310‧‧‧electrode pattern

400‧‧‧接觸薄膜 400‧‧‧Contact film

D1‧‧‧裝置 D1‧‧‧ device

D2‧‧‧接腳座 D2‧‧‧ feet

H‧‧‧間隙 H‧‧‧ gap

M‧‧‧厚度 M‧‧‧ thickness

m‧‧‧模具 m‧‧‧Mold

N‧‧‧厚度 N‧‧‧ thickness

P‧‧‧凹入區 P‧‧‧ recessed area

Q‧‧‧模具接腳 Q‧‧‧Mold pins

S‧‧‧矽酮 S‧‧矽矽

圖1為說明相關技術的接腳座如何連接至裝置的圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining how a pin base of the related art is connected to a device.

圖2為說明根據本發明的實施例的接觸片的圖。 2 is a diagram illustrating a contact piece in accordance with an embodiment of the present invention.

圖3為說明根據本發明的另一實施例的接觸片的圖。 FIG. 3 is a view illustrating a contact piece according to another embodiment of the present invention.

圖4為說明根據本發明的實施例的接觸片的放大圖。 4 is an enlarged view illustrating a contact piece in accordance with an embodiment of the present invention.

圖5為說明根據本發明的另一實施例的接觸片的放大圖。 FIG. 5 is an enlarged view illustrating a contact piece according to another embodiment of the present invention.

圖6為說明根據本發明的實施例的包含接觸片的接腳座的圖。 6 is a diagram illustrating a pin holder including a contact piece in accordance with an embodiment of the present invention.

圖7為說明根據本發明的另一實施例的包含接觸片的接腳座的圖。 FIG. 7 is a view illustrating a pin holder including a contact piece according to another embodiment of the present invention.

圖8為說明根據本發明的另一實施例的包含接觸片的接腳座的圖。 FIG. 8 is a view illustrating a pin holder including a contact piece according to another embodiment of the present invention.

圖9為說明根據本發明的另一實施例的包含接觸片的接腳座的圖。 9 is a diagram illustrating a pin base including a contact piece in accordance with another embodiment of the present invention.

圖10為說明根據本發明的另一實施例的包含接觸片的接腳座的圖。 FIG. 10 is a view illustrating a pin base including a contact piece according to another embodiment of the present invention.

圖11為說明裝置如何連接至根據本發明的實施例的包含接觸片的接腳座的圖。 Figure 11 is a diagram illustrating how a device is coupled to a pin header including a contact strip in accordance with an embodiment of the present invention.

圖12為說明裝置如何連接至根據本發明的另一實施例的包含接觸片的接腳座的圖。 Figure 12 is a diagram illustrating how a device is coupled to a pin holder including a contact strip in accordance with another embodiment of the present invention.

圖13至圖15為說明根據本發明的實施例的製造接觸片的方法的圖。 13 through 15 are diagrams illustrating a method of manufacturing a contact piece in accordance with an embodiment of the present invention.

下文中,將參考附圖描述本發明的較佳實施例。 Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

圖2以及圖3為說明根據本發明的實施例的接觸片100的圖,且圖4以及圖5為說明根據本發明的實施例的接觸片100的放大圖。圖6至圖10為說明根據本發明的實施例的包含接觸片 100的接腳座的圖,且圖11以及圖12為說明裝置如何連接至根據本發明的實施例的包含接觸片100的接腳座的圖。圖13至圖15為說明根據本發明的實施例的製造接觸片100的方法的圖。 2 and 3 are diagrams illustrating a contact sheet 100 in accordance with an embodiment of the present invention, and FIGS. 4 and 5 are enlarged views illustrating a contact sheet 100 in accordance with an embodiment of the present invention. 6 through 10 illustrate the inclusion of contact pads in accordance with an embodiment of the present invention. A diagram of a pin header of 100, and Figures 11 and 12 are diagrams illustrating how the device is coupled to a pin header including a contact strip 100 in accordance with an embodiment of the present invention. 13 through 15 are diagrams illustrating a method of manufacturing a contact piece 100 in accordance with an embodiment of the present invention.

根據本發明的實施例,接觸片100經設置以使之與測試目標裝置接觸,所述測試目標裝置具有用於與測試目標裝置電連接的電極圖案。接觸片100由具有預定面積以及厚度的薄片形成。接觸片100包含:作為主體的薄片本體110,其由絕緣材料形成且具有預定面積;以及多個接觸圖案元件120,其配置於所述薄片本體110中,且經設置以電連接至測試目標裝置的電極圖案。接觸片100在其外部部分與中心部分處具有不同厚度。 According to an embodiment of the invention, the contact strip 100 is arranged to be in contact with a test target device having an electrode pattern for electrical connection with the test target device. The contact piece 100 is formed of a sheet having a predetermined area and thickness. The contact sheet 100 includes: a sheet body 110 as a main body formed of an insulating material and having a predetermined area; and a plurality of contact pattern elements 120 disposed in the sheet body 110 and configured to be electrically connected to the test target device Electrode pattern. The contact piece 100 has a different thickness at its outer portion and the central portion.

作為整體,接觸片100為具有預定面積以及厚度的薄片。 As a whole, the contact piece 100 is a sheet having a predetermined area and thickness.

接觸片100包含薄片本體110作為主體,所述主體由絕緣材料形成且具有預定面積。薄片本體110為薄片型部件,其具有預定厚度以及面積且形成接觸片100的主體。薄片本體110由絕緣可撓性材料形成。舉例而言,薄片本體110可由以下各者形成:橡膠;合成樹脂,諸如,聚醯亞胺樹脂(polyimide resin)、液晶聚合物(liquid crystalline polymer)、聚酯(polyester)或含氟樹脂(fluorine-containing resin);或矽酮(silicone)。然而,薄片本體110不限於此。 The contact piece 100 includes a sheet body 110 as a main body, which is formed of an insulating material and has a predetermined area. The sheet body 110 is a sheet-shaped member having a predetermined thickness and area and forming a body of the contact sheet 100. The sheet body 110 is formed of an insulating flexible material. For example, the sheet body 110 may be formed of: a rubber; a synthetic resin such as a polyimide resin, a liquid crystalline polymer, a polyester, or a fluorine resin (fluorine) -containing resin); or silicone. However, the sheet body 110 is not limited thereto.

接觸圖案元件120的數目為兩個或兩個以上,且接觸圖案元件120以對應於待使之與接觸圖案元件120接觸的測試目標裝置的電極圖案的形狀配置於薄片本體110中。接觸圖案元件120的配置以及數目並不受限,只要接觸圖案元件120對應於待使用接觸片100測試的裝置的電極圖案並可連接至裝置的電極圖案。 接觸圖案元件120可為墊片,所述墊片具有預定面積以及厚度,且配置於薄片本體110中,同時佔用薄片本體110的一些區。接觸圖案元件120藉由在諸如矽酮橡膠的彈性絕緣材料的厚度方向上將導電粉末分佈於所述彈性絕緣材料中來形成。 The number of contact pattern elements 120 is two or more, and the contact pattern elements 120 are disposed in the sheet body 110 in a shape corresponding to the electrode pattern of the test target device to be brought into contact with the contact pattern elements 120. The configuration and number of contact pattern elements 120 are not limited as long as the contact pattern elements 120 correspond to the electrode patterns of the device to be tested using the contact strips 100 and can be connected to the electrode patterns of the device. The contact pattern element 120 can be a shim having a predetermined area and thickness and disposed in the sheet body 110 while occupying some areas of the sheet body 110. The contact pattern element 120 is formed by distributing a conductive powder in the elastic insulating material in a thickness direction of an elastic insulating material such as an anthrone rubber.

接觸圖案元件120按以下方式配置:接觸圖案元件120的至少部分可與裝置的電極圖案重疊。即,接觸圖案元件120的配置對應於待測試裝置的電極圖案,使得接觸圖案元件120的至少部分可與裝置的電極圖案重疊。本文中,術語「重疊」可被解釋為表達如下狀態的詞語:當接觸片100置放於裝置上並自上方檢視時,接觸片100的接觸圖案元件120至少部分覆蓋待測試裝置的電極圖案。 The contact pattern element 120 is configured in such a manner that at least a portion of the contact pattern element 120 can overlap the electrode pattern of the device. That is, the configuration of the contact pattern element 120 corresponds to the electrode pattern of the device to be tested such that at least a portion of the contact pattern element 120 can overlap the electrode pattern of the device. Herein, the term "overlap" may be interpreted as a word expressing a state in which the contact pattern element 120 of the contact piece 100 at least partially covers the electrode pattern of the device to be tested when the contact piece 100 is placed on the device and viewed from above.

根據本發明,接觸片100在其外部部分與中心部分處具有不同厚度。舉例而言,如圖2中所繪示,接觸片100的外部部分的厚度M可小於接觸片100的中心部分的厚度N。因此,接觸片100可具有傾斜表面,且接觸片100的中心部分可具有大體上升形狀。在圖2中,接觸片100的最外部分是鋒利的。然而,接觸片100不限於此。在另一實例中,接觸片100的最外部分可部分具有恆定厚度。 According to the invention, the contact strip 100 has a different thickness at its outer portion and the central portion. For example, as illustrated in FIG. 2 , the thickness M of the outer portion of the contact strip 100 may be less than the thickness N of the central portion of the contact strip 100 . Therefore, the contact piece 100 may have an inclined surface, and the central portion of the contact piece 100 may have a substantially elevated shape. In Figure 2, the outermost portion of the contact strip 100 is sharp. However, the contact piece 100 is not limited thereto. In another example, the outermost portion of the contact strip 100 can have a portion of a constant thickness.

在另一實例中,如圖3中所繪示,接觸片100的外部部分的厚度M可大於接觸片100的中心部分的厚度N。因此,接觸片100可具有傾斜表面,且接觸片100的外部部分可具有大體上升形狀。接觸片100並不限於在其整個區上具有變化的厚度。舉例而言,接觸片100可具有恆定厚度區。 In another example, as depicted in FIG. 3, the thickness M of the outer portion of the contact strip 100 can be greater than the thickness N of the central portion of the contact strip 100. Accordingly, the contact piece 100 may have an inclined surface, and the outer portion of the contact piece 100 may have a substantially elevated shape. The contact piece 100 is not limited to having a varying thickness over its entire area. For example, the contact strip 100 can have a constant thickness region.

根據一實施例,接觸片100的厚度可在自其外部部分至 中心部分的方向上增大或減小,且接觸片100可具有具預定曲率半徑的圓形橫截面形狀。即,根據一實施例,接觸片100可具有並非筆直而是漸圓的傾斜橫截面形狀。 According to an embodiment, the thickness of the contact strip 100 can be from its outer portion to The direction of the central portion increases or decreases, and the contact piece 100 may have a circular cross-sectional shape with a predetermined radius of curvature. That is, according to an embodiment, the contact piece 100 may have an inclined cross-sectional shape that is not straight but rounded.

根據一實施例,接觸片100具有平坦下表面以及凸或凹上表面,其自外部部分至中心部分逐漸上升或降低。即,根據一實施例,接觸片100可具有相對較厚內部區、平坦下表面以及在自其外部部分至中心部分的方向上上升的凸上表面。在另一實例中,接觸片100可具有相對薄的外部部分、相對厚的中心部分、平坦下表面以及在自中心部分至外部部分的方向上上升的凹上表面。 According to an embodiment, the contact strip 100 has a flat lower surface and a convex or concave upper surface that gradually rises or falls from the outer portion to the central portion. That is, according to an embodiment, the contact piece 100 may have a relatively thick inner region, a flat lower surface, and a convex upper surface that rises in a direction from the outer portion to the central portion. In another example, the contact strip 100 can have a relatively thin outer portion, a relatively thick central portion, a flat lower surface, and a concave upper surface that rises in a direction from the central portion to the outer portion.

如上文所描述,本發明的接觸片100在其中心部分與外部部分處具有不同厚度。因此,當使接觸片100與待測試裝置接觸時,可進行可靠電連接。 As described above, the contact sheet 100 of the present invention has different thicknesses at its central portion and outer portion. Therefore, when the contact piece 100 is brought into contact with the device to be tested, a reliable electrical connection can be made.

舉例而言,在相關技術中,由於使用如圖1中所繪示的具有均勻高度的接腳,因此可能並不可靠地使待測試裝置的電極與接腳接觸。即,當測試目標裝置D1與接腳座D2電連接時,若裝置D1為大的且具有由大量端子形成的電極圖案,則裝置D1可翹曲。在此狀況下,若上部裝置D1的電極圖案的外部部分如圖1中所繪示般降低,則形成於電極圖案下方的間隙H可變得不均勻,且因此與電極圖案的外部部分相比較,可能並不可靠地使電極圖案的內部部分與接腳座D2接觸。因此,接觸錯誤可能發生。相反,若電極圖案的外部部分相對高且電極圖案的內部部分相對低,則接觸錯誤可發生於電極圖案的外部部分處。 For example, in the related art, since the pins having a uniform height as shown in FIG. 1 are used, it is possible to reliably prevent the electrodes of the device to be tested from coming into contact with the pins. That is, when the test target device D1 is electrically connected to the pin base D2, if the device D1 is large and has an electrode pattern formed of a large number of terminals, the device D1 can be warped. In this case, if the outer portion of the electrode pattern of the upper device D1 is lowered as illustrated in FIG. 1, the gap H formed under the electrode pattern may become uneven, and thus compared with the outer portion of the electrode pattern. The inner portion of the electrode pattern may not be reliably brought into contact with the pin holder D2. Therefore, contact errors may occur. On the contrary, if the outer portion of the electrode pattern is relatively high and the inner portion of the electrode pattern is relatively low, a contact error may occur at the outer portion of the electrode pattern.

然而,根據本發明,具有部分變化的厚度的接觸片100 用作待測試裝置與接腳座之間的中間接觸部分,藉此防止上述接觸錯誤並確保裝置與接腳座之間的可靠接觸。此外,本發明的接觸片100在其外部部分與中心部分處具有不同厚度,藉此防止由自電極圖案的外部部分至內部部分變化的間隙引起的此類接觸錯誤。 However, according to the present invention, the contact sheet 100 having a partially varying thickness It serves as an intermediate contact portion between the device to be tested and the pin holder, thereby preventing the above-mentioned contact error and ensuring reliable contact between the device and the pin holder. Further, the contact sheet 100 of the present invention has different thicknesses at its outer portion and the central portion, thereby preventing such contact errors caused by gaps varying from the outer portion to the inner portion of the electrode pattern.

較佳地,薄片本體110包含矽酮橡膠,且接觸圖案元件120由矽酮與導電粉末122的混合物形成。 Preferably, the sheet body 110 comprises an anthrone rubber, and the contact pattern element 120 is formed of a mixture of an anthrone and a conductive powder 122.

根據本發明的實施例,較佳地,接觸圖案元件120由彈性絕緣材料124以及含於彈性絕緣材料124中的導電粉末122形成。彈性絕緣材料124可為具有高彈性以及絕緣性質的諸如矽酮橡膠的材料。然而,彈性絕緣材料124不限於此。舉例而言,彈性絕緣材料124可為彈性材料,諸如,胺基甲酸酯樹脂、環氧樹脂或丙烯酸樹脂。然而,彈性絕緣材料124不限於此。 In accordance with an embodiment of the present invention, preferably, the contact pattern element 120 is formed of an elastic insulating material 124 and a conductive powder 122 contained in the elastic insulating material 124. The elastic insulating material 124 may be a material such as an anthrone rubber having high elasticity and insulating properties. However, the elastic insulating material 124 is not limited thereto. For example, the elastic insulating material 124 can be an elastic material such as a urethane resin, an epoxy resin, or an acrylic resin. However, the elastic insulating material 124 is not limited thereto.

導電粉末122可包含具有預定尺寸的大量導電粒子。如上文所描述,具有導電率的導電粉末122可分散於彈性絕緣材料124中。 The conductive powder 122 may contain a large amount of conductive particles having a predetermined size. As described above, the electrically conductive powder 122 having electrical conductivity may be dispersed in the elastic insulating material 124.

較佳地,導電粉末122可由磁性材料形成,使得導電粉末122可易於在接觸圖案元件120的厚度方向上分佈。導電粉末122的實例包含:諸如鐵、鈷或鎳的磁性金屬的粒子;其合金的粒子;含有此類磁性金屬的粒子;塗佈有諸如金、銀、鈀或銠的高度導電金屬的此等粒子;諸如非磁性金屬或玻璃的無機材料的粒子或者塗佈有諸如鎳或鈷的導電磁性材料的聚合物的粒子;以及塗佈有導電磁性材料以及高度導電金屬的粒子。 Preferably, the conductive powder 122 may be formed of a magnetic material such that the conductive powder 122 may be easily distributed in the thickness direction of the contact pattern element 120. Examples of the conductive powder 122 include particles of a magnetic metal such as iron, cobalt or nickel; particles of an alloy thereof; particles containing such a magnetic metal; and highly conductive metals coated with gold, silver, palladium or rhodium Particles; particles of an inorganic material such as a non-magnetic metal or glass or particles coated with a polymer of a conductive magnetic material such as nickel or cobalt; and particles coated with a conductive magnetic material and a highly conductive metal.

較佳地,導電粉末122可為塗佈有諸如以下各者的金屬 的鎳粒子:金、銀、銠、鈀、釕、鎢、鉬、鉑或銥。此外,導電粉末122可較佳地為塗佈有多種金屬的粒子,例如,塗佈有銀接著金的鎳粒子。在此狀況下,用導電金屬塗佈粒子(核心粒子)的方法並不受限制。舉例而言,可使用化學電鍍法或電鍍法。 Preferably, the conductive powder 122 may be a metal coated with, for example, the following Nickel particles: gold, silver, rhodium, palladium, rhodium, tungsten, molybdenum, platinum or rhodium. Further, the conductive powder 122 may preferably be a particle coated with a plurality of metals, for example, nickel particles coated with silver and gold. In this case, the method of coating the particles (core particles) with a conductive metal is not limited. For example, electroless plating or electroplating can be used.

若導電粉末122是藉由用導電金屬塗佈核心粒子來獲得,則導電金屬在核心粒子的表面上的塗佈比率(塗佈有導電金屬的面積與核心粒子的總表面面積的比率)可較佳地為40%或40%以上,更佳地45%或45%以上,且甚至更佳地47%至95%。形成於核心粒子上的導電金屬的量可較佳地為核心粒子的0.5wt%至50wt%,更佳地核心粒子的2wt%至30wt%,再更佳地核心粒子的3wt%至25wt%,且甚至更佳地核心粒子的4wt%至20wt%。若導電金屬為金,則金的量較佳為核心粒子的0.5wt%至30wt%,更佳地核心粒子的2wt%至20wt%,再更佳地核心粒子的3wt%至15wt%,且甚至更佳地核心粒子的4wt%至10wt%。若導電金屬為銀,則銀的量較佳為核心粒子的4wt%至50wt%,更佳地核心粒子的5wt%至40wt%,且再更佳地核心粒子的10wt%至30wt%。 If the conductive powder 122 is obtained by coating the core particles with a conductive metal, the coating ratio of the conductive metal on the surface of the core particles (ratio of the area coated with the conductive metal to the total surface area of the core particles) may be compared Preferably, it is 40% or more, more preferably 45% or more, and even more preferably 47% to 95%. The amount of the conductive metal formed on the core particles may preferably be from 0.5% by weight to 50% by weight of the core particles, more preferably from 2% by weight to 30% by weight of the core particles, still more preferably from 3% by weight to 25% by weight of the core particles, And even more preferably from 4 wt% to 20 wt% of the core particles. If the conductive metal is gold, the amount of gold is preferably from 0.5% by weight to 30% by weight of the core particles, more preferably from 2% by weight to 20% by weight of the core particles, still more preferably from 3% by weight to 15% by weight of the core particles, and even More preferably, the core particles are from 4% by weight to 10% by weight. If the conductive metal is silver, the amount of silver is preferably from 4 wt% to 50 wt% of the core particles, more preferably from 5 wt% to 40 wt% of the core particles, and still more preferably from 10 wt% to 30 wt% of the core particles.

此外,導電粉末122的粒徑較佳為1μm至1000μm,更佳地2μm至500μm,再更佳地5μm至300μm,且甚至更佳地10μm至200μm。此外,導電粉末122的顆粒尺寸分佈(Dw/Dn)較佳為1至10,更佳地1.01至7,再更佳地1.05至5,且甚至更佳1.1至4。若導電粉末122滿足上述條件,則可獲得易於因壓力而可變形的接觸圖案元件120,且可充分地使導電粉末122的粒子彼此電接觸。此外,導電粉末122的粒子的形狀並不因此受限。 然而,當考量在聚合物形成材料中的分散時,導電粉末122的粒子可較佳具有球形形狀、星形形狀,或由此等粒子群集在一起的二級粒子形成的群集形狀。 Further, the particle diameter of the conductive powder 122 is preferably from 1 μm to 1000 μm, more preferably from 2 μm to 500 μm, still more preferably from 5 μm to 300 μm, and even more preferably from 10 μm to 200 μm. Further, the particle size distribution (Dw/Dn) of the conductive powder 122 is preferably from 1 to 10, more preferably from 1.01 to 7, still more preferably from 1.05 to 5, and even more preferably from 1.1 to 4. If the conductive powder 122 satisfies the above conditions, the contact pattern element 120 which is easily deformable by pressure can be obtained, and the particles of the conductive powder 122 can be sufficiently brought into electrical contact with each other. Further, the shape of the particles of the conductive powder 122 is not limited thereby. However, when considering the dispersion in the polymer forming material, the particles of the conductive powder 122 may preferably have a spherical shape, a star shape, or a cluster shape formed by secondary particles in which the particles are clustered together.

接觸圖案元件120可配置於薄片本體110中,如圖3中所繪示。即,薄片本體110可具有穿透孔區,且接觸圖案元件120可分別安置於穿透孔區中。若配置經相對地解釋,則可理解,構成接觸圖案元件120的圖案電極經分開配置,且薄片本體110安置於圖案電極之間的間隙中以支撐接觸圖案元件120。 The contact pattern element 120 can be disposed in the sheet body 110, as depicted in FIG. That is, the sheet body 110 may have a penetrating aperture region, and the contact pattern elements 120 may be disposed in the penetrating aperture regions, respectively. If the configurations are relatively explained, it will be understood that the pattern electrodes constituting the contact pattern elements 120 are separately disposed, and the sheet body 110 is disposed in a gap between the pattern electrodes to support the contact pattern elements 120.

如上文所描述,接觸圖案元件120包含彈性絕緣材料124,以及分佈於彈性絕緣材料124中的導電粉末122。因此,若接觸圖案元件120由測試目標裝置的端子推動,則使導電粉末122的粒子彼此接觸,且因此進入導電狀態。 As described above, the contact pattern element 120 includes an elastic insulating material 124, and a conductive powder 122 distributed in the elastic insulating material 124. Therefore, if the contact pattern element 120 is pushed by the terminal of the test target device, the particles of the conductive powder 122 are brought into contact with each other, and thus enter a conductive state.

歸因於此結構,接觸圖案元件120可形成導電彈性區,且可根據施加至其的接觸壓力進入導電狀態。如上文所描述,接觸圖案元件120形成為導電彈性區,藉此防止在使裝置的端子與接觸圖案元件120接觸時可由施加至導電彈性區的壓力引起的刮擦以及損害。即,根據本發明,接觸片100的接觸圖案元件120安置於裝置的電極上,且由於接觸圖案元件120具有導電性以及彈性兩者,因此接觸圖案元件120可充當並不引起刮擦以及衝擊損害的中間接觸元件。 Due to this structure, the contact pattern element 120 can form a conductive elastic region and can enter a conductive state according to the contact pressure applied thereto. As described above, the contact pattern element 120 is formed as a conductive elastic region, thereby preventing scratching and damage caused by pressure applied to the conductive elastic region when the terminal of the device is brought into contact with the contact pattern member 120. That is, according to the present invention, the contact pattern element 120 of the contact strip 100 is disposed on the electrode of the device, and since the contact pattern element 120 has both conductivity and elasticity, the contact pattern element 120 can act as a scratch that does not cause scratching and impact damage. Intermediate contact element.

較佳地,如圖5中所繪示,接觸片100可更包含上部薄膜140,所述上部薄膜覆蓋接觸片100的上表面。儘管未清楚地繪示出,但類似於接觸片100,上部薄膜140可較佳地包含非導電區以及導電區,從而允許電流的流動。上部薄膜140可作為覆蓋薄 膜安置於接觸圖案元件120以及薄片本體110的上表面上。在此狀況下,上部薄膜140的導電區可安置於接觸圖案元件120的上表面上。因此,接觸片100的上表面可受到保護而不受衝擊或外來物質影響。圖5說明上部薄膜140安置於接觸片100上的實施例,所述接觸片相較於其外部部分在其中心部分處相對較厚。然而,上部薄膜140可用於接觸片100在其外部部分處相對較厚的狀況。 Preferably, as shown in FIG. 5 , the contact piece 100 may further include an upper film 140 covering the upper surface of the contact piece 100 . Although not clearly illustrated, similar to the contact sheet 100, the upper film 140 may preferably include a non-conductive region and a conductive region to allow current flow. The upper film 140 can be used as a cover film The film is disposed on the contact pattern element 120 and the upper surface of the sheet body 110. In this case, the conductive region of the upper film 140 may be disposed on the upper surface of the contact pattern member 120. Therefore, the upper surface of the contact piece 100 can be protected from impact or foreign matter. Figure 5 illustrates an embodiment in which the upper film 140 is disposed on the contact sheet 100, the contact sheet being relatively thicker at its central portion than its outer portion. However, the upper film 140 can be used for a relatively thick condition of the contact sheet 100 at its outer portion.

圖6至圖10為說明根據本發明的實施例的接腳座的圖,且圖11以及圖12為說明接腳座與裝置之間的連接的圖。 6 to 10 are views illustrating a pin base according to an embodiment of the present invention, and Figs. 11 and 12 are views illustrating a connection between a pin base and a device.

根據本發明的實施例,接腳座經設置以使之與測試目標裝置300接觸,所述測試目標裝置包含具有預定配置的電極圖案310。接腳座包含:接腳主體200,其包含預定接腳圖案210;以及接觸片100,其安置於接腳主體200上。接觸片100具有預定面積以及厚度。接觸片100包含:作為接觸片100的主要部分的薄片本體110,其具有預定面積且由絕緣材料形成;以及多個接觸圖案元件120,其配置於薄片本體110中且經設置以電連接至測試目標裝置300的電極圖案310以及接腳主體200的接腳圖案210。接觸片100在其外部部分與中心部分處具有不同厚度。 According to an embodiment of the invention, the pin holder is arranged to be in contact with the test target device 300, the test target device comprising an electrode pattern 310 having a predetermined configuration. The pin holder includes: a pin body 200 including a predetermined pin pattern 210; and a contact piece 100 disposed on the pin body 200. The contact piece 100 has a predetermined area and a thickness. The contact sheet 100 includes: a sheet body 110 as a main portion of the contact sheet 100 having a predetermined area and formed of an insulating material; and a plurality of contact pattern elements 120 disposed in the sheet body 110 and configured to be electrically connected to the test The electrode pattern 310 of the target device 300 and the pin pattern 210 of the pin body 200. The contact piece 100 has a different thickness at its outer portion and the central portion.

根據本發明,接觸片100可包含於用以對測試目標裝置300進行測試的接腳座中。即,根據本發明,接腳座可包含接觸片100。換言之,本發明的接腳座可包含:接腳主體200;包含於接腳主體200中且包含電極的接腳圖案210;以及接觸片100。在此狀況下,接腳圖案210與接觸片100的接觸圖案元件120接觸以用於與接觸圖案元件120電連接,且接觸片100在其外部部分與 中心部分處部分具有不同厚度。 In accordance with the present invention, the contact strip 100 can be included in a pin holder for testing the test target device 300. That is, according to the present invention, the pin base may include the contact piece 100. In other words, the pin base of the present invention may include: a pin body 200; a pin pattern 210 included in the pin body 200 and including an electrode; and a contact piece 100. In this case, the pin pattern 210 is in contact with the contact pattern element 120 of the contact strip 100 for electrical connection with the contact pattern element 120, and the contact strip 100 is in its outer portion The portions at the center portion have different thicknesses.

因此,接腳座的上表面的高度自其中心部分至外部部分變化,藉此防止由自電極圖案310的外部部分與內部部分變化的間隙引起的接觸錯誤。附圖說明接觸片100具有比其中心部分較厚的外部部分的狀況,以及接觸片100具有比其中心部分薄的外部部分的狀況。此外,圖10說明接觸片100包含上部薄膜140的實施例。 Therefore, the height of the upper surface of the pin base changes from the central portion thereof to the outer portion, thereby preventing contact errors caused by the gap which varies from the outer portion and the inner portion of the electrode pattern 310. BRIEF DESCRIPTION OF THE DRAWINGS The contact sheet 100 has a condition of an outer portion thicker than its central portion, and the contact sheet 100 has a thinner outer portion than its central portion. In addition, FIG. 10 illustrates an embodiment in which the contact sheet 100 includes the upper film 140.

較佳地,接腳座可更包含安置於接觸片100與接腳主體200之間的接觸薄膜400。接觸薄膜400可包含:薄膜本體,其具有預定面積且由絕緣材料形成,薄膜本體形成接觸薄膜400的主要部分;以及多個薄膜圖案元件,其配置於薄膜本體中且接觸接觸片100的接觸圖案元件120以及接腳主體200的接腳圖案210,以用於進行其間的電連接。所述薄膜圖案元件可形成導電彈性區。 Preferably, the pin base may further include a contact film 400 disposed between the contact piece 100 and the pin body 200. The contact film 400 may include: a film body having a predetermined area and formed of an insulating material, the film body forming a main portion of the contact film 400; and a plurality of thin film pattern elements disposed in the film body and contacting the contact pattern of the contact piece 100 The element 120 and the pin pattern 210 of the pin body 200 are used to make electrical connections therebetween. The thin film pattern element can form a conductive elastic region.

接觸薄膜400可為具有預定面積以及厚度的薄片型部件。接觸薄膜400可包含由絕緣材料形成的薄膜本體;以及配置於薄膜本體中的薄膜圖案元件。薄膜圖案元件可安置於接腳主體200的接腳圖案210與接觸片100的接觸圖案元件120之間,以便在其間進行電連接。較佳地,薄膜本體可包含矽酮橡膠,且薄膜圖案元件可由矽酮與導電粉末的混合物形成。因此,薄膜圖案元件可根據施加於其的接觸壓力而進入導電狀態。即,所述薄膜圖案元件可形成導電彈性區。因此,由壓力引起的刮擦以及損害在使裝置的端子與接腳座接觸時可被防止。 The contact film 400 may be a sheet-shaped member having a predetermined area and thickness. The contact film 400 may include a film body formed of an insulating material; and a film pattern member disposed in the film body. The thin film pattern element may be disposed between the pin pattern 210 of the pin body 200 and the contact pattern element 120 of the contact piece 100 for electrical connection therebetween. Preferably, the film body may comprise an anthrone rubber, and the film pattern element may be formed from a mixture of an anthrone and a conductive powder. Therefore, the thin film pattern element can enter a conductive state in accordance with the contact pressure applied thereto. That is, the thin film pattern element can form a conductive elastic region. Therefore, the scratch and damage caused by the pressure can be prevented when the terminal of the device is brought into contact with the pin holder.

此外,薄膜本體可包含穿透孔區,且薄膜圖案元件可安置於穿透孔區中。換言之,薄膜本體可包含穿透孔區,且用於形 成薄膜圖案元件的材料可填充於穿透孔區中以形成薄膜圖案元件作為導電彈性區。 Further, the film body may include a through hole region, and the thin film pattern member may be disposed in the through hole region. In other words, the film body can include a penetrating hole region and is used for the shape The material of the thin film pattern element may be filled in the through hole region to form a thin film pattern element as a conductive elastic region.

根據本發明的實施例,由於接腳座具有上述結構,因此接腳座可易於連接至測試目標裝置。 According to the embodiment of the present invention, since the pin holder has the above structure, the pin holder can be easily connected to the test target device.

圖13至圖15為依序說明根據本發明的實施例的製造接觸片100的方法的圖。 13 to 15 are views for sequentially explaining a method of manufacturing the contact piece 100 according to an embodiment of the present invention.

首先,製備模具m。模具m具有對應於根據本發明的待形成的接觸片100的形狀的凹座。舉例而言,模具m可具有對應於接觸片100的形狀的凹座,所述接觸片在其外部部分與中心部分處具有不同厚度。舉例而言,若意欲形成具有相對薄的外部部分的接觸片100,則模具m可具有在其內部區處相對深的凹入區P,如圖13至圖15中所繪示。在相對狀況(圖中未示)下,模具m可具有凹入區P,所述凹入區P在內部區處相對淺,且在外部區處相對深。 First, a mold m is prepared. The mold m has a recess corresponding to the shape of the contact piece 100 to be formed according to the present invention. For example, the mold m may have a recess corresponding to the shape of the contact piece 100, the contact piece having a different thickness at its outer portion and the central portion. For example, if it is intended to form a contact piece 100 having a relatively thin outer portion, the mold m may have a relatively deep recessed area P at its inner region, as illustrated in Figures 13-15. In a relative condition (not shown), the mold m may have a recessed area P which is relatively shallow at the inner portion and relatively deep at the outer portion.

接著,諸如矽酮S的材料填入凹入區P中,以形成根據本發明的接觸片100。此時,矽酮S可包含如上文所描述的合成樹脂,且當矽酮S填入凹入區P中時,矽酮S可經由諸如加熱製程的製程硬化,以形成根據本發明的接觸片100。 Next, a material such as an anthrone S is filled in the recessed area P to form the contact piece 100 according to the present invention. At this time, the fluorenone S may contain a synthetic resin as described above, and when the fluorenone S is filled in the concave region P, the fluorenone S may be hardened by a process such as a heating process to form a contact piece according to the present invention. 100.

在此狀況下,模具接腳Q可安置於模具m的凹入區P中。舉例而言,電流可施加至模具接腳Q以形成電場,且模具接腳Q的數目可為至少兩個。 In this case, the die pin Q can be placed in the recessed area P of the mold m. For example, a current may be applied to the mold pin Q to form an electric field, and the number of mold pins Q may be at least two.

舉例而言,待填入凹入區P中的液體矽酮S可含有上述導電粉末122。含於液體矽酮S中的導電粉末122的分佈可由如上文所描述形成的電場來控制。 For example, the liquid fluorenone S to be filled in the recessed area P may contain the above-described conductive powder 122. The distribution of the conductive powder 122 contained in the liquid fluorenone S can be controlled by an electric field formed as described above.

在含有導電粉末122的液體矽酮S在凹入區P中硬化之前,電場可形成於模具接腳Q周圍,以便圍繞模具接腳Q緻密地分佈導電粉末122。接著,接觸圖案元件120可形成於導電粉末122經緻密分佈的區中。以此方式,可製造本發明的接觸片100。 Before the liquid fluorenone S containing the conductive powder 122 is hardened in the recessed region P, an electric field may be formed around the die pin Q to densely distribute the conductive powder 122 around the die pin Q. Next, the contact pattern element 120 may be formed in a region where the conductive powder 122 is densely distributed. In this way, the contact sheet 100 of the present invention can be fabricated.

儘管已參看附圖描述了本發明的較佳實施例,但本發明並不限於所述實施例。因此,熟習此項技術者將理解,在不脫離本發明的精神以及範疇的情況下可對本發明進行各種修改以及改變。 Although the preferred embodiments of the present invention have been described with reference to the drawings, the invention is not limited to the embodiments. It will be appreciated by those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention.

100‧‧‧接觸片 100‧‧‧Contact film

110‧‧‧薄片本體 110‧‧‧Sheet body

120‧‧‧接觸圖案元件 120‧‧‧Contact pattern elements

M‧‧‧厚度 M‧‧‧ thickness

N‧‧‧厚度 N‧‧‧ thickness

Claims (11)

一種接觸片,其經設置以使之與包含電極圖案的測試目標裝置接觸,所述電極圖案具有用於與所述測試目標裝置電連接的預定配置,所述接觸片經設置為具有預定面積以及厚度的薄片,所述接觸片包括: 作為所述接觸片的主要部分的薄片本體,其具有預定面積且由絕緣材料形成;以及 多個接觸圖案元件,其配置於所述薄片本體中且經設置以電連接至所述測試目標裝置的所述電極圖案, 其中所述接觸片在所述接觸片的外部部分與中心部分處具有不同厚度。a contact sheet disposed to be in contact with a test target device including an electrode pattern having a predetermined configuration for electrically connecting to the test target device, the contact sheet being configured to have a predetermined area and a sheet having a thickness, the contact sheet comprising: a sheet body as a main portion of the contact sheet having a predetermined area and formed of an insulating material; and a plurality of contact pattern elements disposed in the sheet body and configured The electrode pattern is electrically connected to the test target device, wherein the contact piece has a different thickness at an outer portion and a central portion of the contact piece. 如申請專利範圍第1項所述的接觸片,其中所述接觸片具有自所述接觸片的所述外部部分至所述中心部分增大的厚度。The contact sheet of claim 1, wherein the contact piece has an increased thickness from the outer portion of the contact piece to the central portion. 如申請專利範圍第1項所述的接觸片,其中所述接觸片具有自所述接觸片的所述外部部分至所述中心部分減小的厚度。The contact sheet of claim 1, wherein the contact piece has a reduced thickness from the outer portion of the contact piece to the central portion. 如申請專利範圍第1項所述的接觸片,其中所述接觸片的自上表面以及下表面選出的至少一者為具有預定曲率半徑的圓形。The contact sheet of claim 1, wherein at least one of the contact piece selected from the upper surface and the lower surface is a circular shape having a predetermined radius of curvature. 如申請專利範圍第1項所述的接觸片,其中所述接觸片包括: 平坦下表面;以及 上表面,其具有在自所述接觸片的所述外部部分至所述中心部分的方向上上升的凸面形狀,或在自所述接觸片的所述外部部分至所述中心部分的方向上下降的凹面形狀。The contact sheet of claim 1, wherein the contact piece comprises: a flat lower surface; and an upper surface having a rise in a direction from the outer portion of the contact piece to the central portion a convex shape, or a concave shape that descends in a direction from the outer portion of the contact piece to the central portion. 如申請專利範圍第1項所述的接觸片,其中所述接觸圖案元件包括彈性絕緣材料以及含於所述彈性絕緣材料中的導電粉末。The contact sheet of claim 1, wherein the contact pattern element comprises an elastic insulating material and a conductive powder contained in the elastic insulating material. 如申請專利範圍第1項所述的接觸片,其更包括覆蓋所述接觸片的上表面的上部薄膜。The contact sheet of claim 1, further comprising an upper film covering an upper surface of the contact piece. 一種接腳座,其經設置以使之與包含電極圖案的測試目標裝置接觸,所述電極圖案具有用於與所述測試目標裝置電連接的預定配置,所述接腳座包括: 接腳主體,其包括預定接腳圖案;以及 接觸片,其安置於所述接腳主體上, 其中所述接觸片經設置為具有預定面積以及厚度的薄片,且包括: 作為所述接觸片的主要部分的薄片本體,其具有預定面積且包括絕緣材料;以及 多個接觸圖案元件,其配置於所述薄片本體中且經設置以電連接至所述測試目標裝置的所述電極圖案以及所述接腳主體的所述接腳圖案, 其中所述接觸片在所述接觸片的外部部分與中心部分處具有不同厚度。A pin holder configured to be in contact with a test target device including an electrode pattern having a predetermined configuration for electrically connecting to the test target device, the pin holder comprising: a pin body And including a predetermined pin pattern; and a contact piece disposed on the pin body, wherein the contact piece is provided as a sheet having a predetermined area and a thickness, and includes: as a main portion of the contact piece a sheet body having a predetermined area and including an insulating material; and a plurality of contact pattern elements disposed in the sheet body and configured to be electrically connected to the electrode pattern of the test target device and the pin body The pin pattern, wherein the contact piece has a different thickness at an outer portion and a central portion of the contact piece. 如申請專利範圍第8項所述的接腳座,其更包括所述接觸片與所述接腳主體之間的接觸薄膜, 其中所述接觸薄膜包括: 薄膜本體,其具有預定面積且包括絕緣材料,所述薄膜本體形成所述接觸薄膜的主要部分;以及 多個薄膜圖案元件,其配置於所述薄膜本體中且接觸所述接觸片的所述接觸圖案元件以及所述接腳主體的所述接腳圖案,以用於在其間進行電連接, 其中所述薄膜圖案元件形成導電彈性區。The pin base of claim 8, further comprising a contact film between the contact piece and the pin body, wherein the contact film comprises: a film body having a predetermined area and including insulation a material, the film body forming a main portion of the contact film; and a plurality of thin film pattern elements disposed in the film body and contacting the contact pattern element of the contact piece and the body of the pin body The pin pattern is used for electrical connection therebetween, wherein the thin film pattern element forms a conductive elastic region. 如申請專利範圍第9項所述的接腳座,其中所述薄膜圖案元件包括彈性絕緣材料以及含於所述彈性絕緣材料中的導電粉末。The pin base of claim 9, wherein the thin film pattern element comprises an elastic insulating material and a conductive powder contained in the elastic insulating material. 如申請專利範圍第9項所述的接腳座,其中所述薄膜本體包括穿透孔區,且所述接觸圖案元件安置於所述穿透孔區中。The pin base of claim 9, wherein the film body comprises a penetration hole region, and the contact pattern element is disposed in the penetration hole region.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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* Cited by examiner, † Cited by third party
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