TWI548018B - 基板傳送裝置、基板傳送方法及記憶媒體 - Google Patents

基板傳送裝置、基板傳送方法及記憶媒體 Download PDF

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Publication number
TWI548018B
TWI548018B TW102111676A TW102111676A TWI548018B TW I548018 B TWI548018 B TW I548018B TW 102111676 A TW102111676 A TW 102111676A TW 102111676 A TW102111676 A TW 102111676A TW I548018 B TWI548018 B TW I548018B
Authority
TW
Taiwan
Prior art keywords
opening
substrate
wafer
carrier
partition wall
Prior art date
Application number
TW102111676A
Other languages
English (en)
Chinese (zh)
Other versions
TW201405690A (zh
Inventor
飯田成昭
寺本聰寬
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201405690A publication Critical patent/TW201405690A/zh
Application granted granted Critical
Publication of TWI548018B publication Critical patent/TWI548018B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW102111676A 2012-04-12 2013-04-01 基板傳送裝置、基板傳送方法及記憶媒體 TWI548018B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012091111A JP5978728B2 (ja) 2012-04-12 2012-04-12 基板受け渡し装置、基板受け渡し方法及び記憶媒体

Publications (2)

Publication Number Publication Date
TW201405690A TW201405690A (zh) 2014-02-01
TWI548018B true TWI548018B (zh) 2016-09-01

Family

ID=49325247

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102111676A TWI548018B (zh) 2012-04-12 2013-04-01 基板傳送裝置、基板傳送方法及記憶媒體
TW105120104A TWI603417B (zh) 2012-04-12 2013-04-01 基板傳送裝置、基板傳送方法及記憶媒體

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105120104A TWI603417B (zh) 2012-04-12 2013-04-01 基板傳送裝置、基板傳送方法及記憶媒體

Country Status (5)

Country Link
US (1) US9214370B2 (https=)
JP (1) JP5978728B2 (https=)
KR (1) KR101760311B1 (https=)
CN (1) CN103377966B (https=)
TW (2) TWI548018B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6303556B2 (ja) * 2014-02-05 2018-04-04 東京エレクトロン株式会社 基板搬送機構の位置検出方法、記憶媒体及び基板搬送機構の位置検出装置
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7178223B2 (ja) * 2018-09-21 2022-11-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7115947B2 (ja) * 2018-09-21 2022-08-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7300817B2 (ja) * 2018-09-21 2023-06-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法
JP7185461B2 (ja) 2018-09-21 2022-12-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および、基板処理装置の制御方法
CN111354667A (zh) * 2018-12-21 2020-06-30 沈阳新松机器人自动化股份有限公司 一种晶圆盒搬运装置
JP7190900B2 (ja) * 2018-12-28 2022-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、キャリア搬送方法およびキャリアバッファ装置
JP6856692B2 (ja) * 2019-03-28 2021-04-07 平田機工株式会社 ロードポート
DE102019109767A1 (de) * 2019-04-12 2020-10-15 Onejoon Gmbh Vorrichtung und Verfahren zur thermischen oder thermo-chemischen Behandlung von Material
TWI862745B (zh) * 2019-12-13 2024-11-21 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
JP7460461B2 (ja) * 2020-06-22 2024-04-02 株式会社ディスコ 加工装置
JP7610939B2 (ja) * 2020-09-04 2025-01-09 川崎重工業株式会社 ロボット及びハンド部姿勢調整方法
FI130279B (fi) * 2021-03-30 2023-05-31 Beneq Oy Atomikerroskasvatuksen reaktorijärjestely ja menetelmä atomikerroskasvatuksen reaktorijärjestelyn käyttämiseksi
JP7771609B2 (ja) * 2021-10-04 2025-11-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6517304B1 (en) * 1999-03-31 2003-02-11 Canon Kabushiki Kaisha Method for transporting substrates and a semiconductor manufacturing apparatus using the method
JP2008108966A (ja) * 2006-10-26 2008-05-08 Tokyo Electron Ltd 検出装置及び検出方法
TW200843018A (en) * 2006-12-22 2008-11-01 Asyst Technologies Loader and buffer for reduced lot size
JP2009065212A (ja) * 2008-12-19 2009-03-26 Dainippon Screen Mfg Co Ltd 基板検出装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3283798B2 (ja) 1996-08-29 2002-05-20 東京エレクトロン株式会社 処理装置
JP2005079250A (ja) * 2003-08-29 2005-03-24 Hitachi Kokusai Electric Inc 基板処理装置
US20060045663A1 (en) * 2004-08-05 2006-03-02 Ravinder Aggarwal Load port with manual FOUP door opening mechanism
JP2006339618A (ja) * 2005-05-31 2006-12-14 Dan-Takuma Technologies Inc 手動式ｆｏｕｐオプナー
NL1036164A1 (nl) 2007-11-15 2009-05-18 Asml Netherlands Bv Substrate processing apparatus and device manufacturing method.
KR101821187B1 (ko) * 2009-06-17 2018-01-23 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 통합된 세정기 및 건조기

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6517304B1 (en) * 1999-03-31 2003-02-11 Canon Kabushiki Kaisha Method for transporting substrates and a semiconductor manufacturing apparatus using the method
JP2008108966A (ja) * 2006-10-26 2008-05-08 Tokyo Electron Ltd 検出装置及び検出方法
TW200843018A (en) * 2006-12-22 2008-11-01 Asyst Technologies Loader and buffer for reduced lot size
JP2009065212A (ja) * 2008-12-19 2009-03-26 Dainippon Screen Mfg Co Ltd 基板検出装置

Also Published As

Publication number Publication date
CN103377966B (zh) 2017-06-30
CN103377966A (zh) 2013-10-30
US20130272824A1 (en) 2013-10-17
TW201637113A (zh) 2016-10-16
JP5978728B2 (ja) 2016-08-24
KR20130116021A (ko) 2013-10-22
KR101760311B1 (ko) 2017-07-21
US9214370B2 (en) 2015-12-15
TW201405690A (zh) 2014-02-01
JP2013219314A (ja) 2013-10-24
TWI603417B (zh) 2017-10-21

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