CN103377966B - 基板交接装置和基板交接方法 - Google Patents

基板交接装置和基板交接方法 Download PDF

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Publication number
CN103377966B
CN103377966B CN201310093785.7A CN201310093785A CN103377966B CN 103377966 B CN103377966 B CN 103377966B CN 201310093785 A CN201310093785 A CN 201310093785A CN 103377966 B CN103377966 B CN 103377966B
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China
Prior art keywords
door
substrate
wafer
carrier
transfer
Prior art date
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CN201310093785.7A
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English (en)
Chinese (zh)
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CN103377966A (zh
Inventor
饭田成昭
寺本聪宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN103377966A publication Critical patent/CN103377966A/zh
Application granted granted Critical
Publication of CN103377966B publication Critical patent/CN103377966B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201310093785.7A 2012-04-12 2013-03-22 基板交接装置和基板交接方法 Active CN103377966B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012091111A JP5978728B2 (ja) 2012-04-12 2012-04-12 基板受け渡し装置、基板受け渡し方法及び記憶媒体
JP2012-091111 2012-04-12

Publications (2)

Publication Number Publication Date
CN103377966A CN103377966A (zh) 2013-10-30
CN103377966B true CN103377966B (zh) 2017-06-30

Family

ID=49325247

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310093785.7A Active CN103377966B (zh) 2012-04-12 2013-03-22 基板交接装置和基板交接方法

Country Status (5)

Country Link
US (1) US9214370B2 (https=)
JP (1) JP5978728B2 (https=)
KR (1) KR101760311B1 (https=)
CN (1) CN103377966B (https=)
TW (2) TWI603417B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6303556B2 (ja) * 2014-02-05 2018-04-04 東京エレクトロン株式会社 基板搬送機構の位置検出方法、記憶媒体及び基板搬送機構の位置検出装置
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7178223B2 (ja) * 2018-09-21 2022-11-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7300817B2 (ja) * 2018-09-21 2023-06-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法
JP7115947B2 (ja) * 2018-09-21 2022-08-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7185461B2 (ja) * 2018-09-21 2022-12-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および、基板処理装置の制御方法
CN111354667A (zh) * 2018-12-21 2020-06-30 沈阳新松机器人自动化股份有限公司 一种晶圆盒搬运装置
JP7190900B2 (ja) * 2018-12-28 2022-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、キャリア搬送方法およびキャリアバッファ装置
JP6856692B2 (ja) * 2019-03-28 2021-04-07 平田機工株式会社 ロードポート
DE102019109767A1 (de) * 2019-04-12 2020-10-15 Onejoon Gmbh Vorrichtung und Verfahren zur thermischen oder thermo-chemischen Behandlung von Material
TWI862745B (zh) * 2019-12-13 2024-11-21 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
JP7460461B2 (ja) * 2020-06-22 2024-04-02 株式会社ディスコ 加工装置
JP7610939B2 (ja) * 2020-09-04 2025-01-09 川崎重工業株式会社 ロボット及びハンド部姿勢調整方法
FI130279B (fi) * 2021-03-30 2023-05-31 Beneq Oy Atomikerroskasvatuksen reaktorijärjestely ja menetelmä atomikerroskasvatuksen reaktorijärjestelyn käyttämiseksi
JP7771609B2 (ja) * 2021-10-04 2025-11-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008108966A (ja) * 2006-10-26 2008-05-08 Tokyo Electron Ltd 検出装置及び検出方法
TW200843018A (en) * 2006-12-22 2008-11-01 Asyst Technologies Loader and buffer for reduced lot size
JP2009065212A (ja) * 2008-12-19 2009-03-26 Dainippon Screen Mfg Co Ltd 基板検出装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3283798B2 (ja) 1996-08-29 2002-05-20 東京エレクトロン株式会社 処理装置
JP2000286319A (ja) * 1999-03-31 2000-10-13 Canon Inc 基板搬送方法および半導体製造装置
JP2005079250A (ja) * 2003-08-29 2005-03-24 Hitachi Kokusai Electric Inc 基板処理装置
US20060045663A1 (en) * 2004-08-05 2006-03-02 Ravinder Aggarwal Load port with manual FOUP door opening mechanism
JP2006339618A (ja) * 2005-05-31 2006-12-14 Dan-Takuma Technologies Inc 手動式ｆｏｕｐオプナー
NL1036164A1 (nl) 2007-11-15 2009-05-18 Asml Netherlands Bv Substrate processing apparatus and device manufacturing method.
KR101821187B1 (ko) * 2009-06-17 2018-01-23 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 통합된 세정기 및 건조기

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008108966A (ja) * 2006-10-26 2008-05-08 Tokyo Electron Ltd 検出装置及び検出方法
TW200843018A (en) * 2006-12-22 2008-11-01 Asyst Technologies Loader and buffer for reduced lot size
JP2009065212A (ja) * 2008-12-19 2009-03-26 Dainippon Screen Mfg Co Ltd 基板検出装置

Also Published As

Publication number Publication date
KR20130116021A (ko) 2013-10-22
TW201637113A (zh) 2016-10-16
US20130272824A1 (en) 2013-10-17
JP2013219314A (ja) 2013-10-24
TW201405690A (zh) 2014-02-01
TWI548018B (zh) 2016-09-01
US9214370B2 (en) 2015-12-15
CN103377966A (zh) 2013-10-30
KR101760311B1 (ko) 2017-07-21
JP5978728B2 (ja) 2016-08-24
TWI603417B (zh) 2017-10-21

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