TWI540051B - Release film - Google Patents

Release film Download PDF

Info

Publication number
TWI540051B
TWI540051B TW100108641A TW100108641A TWI540051B TW I540051 B TWI540051 B TW I540051B TW 100108641 A TW100108641 A TW 100108641A TW 100108641 A TW100108641 A TW 100108641A TW I540051 B TWI540051 B TW I540051B
Authority
TW
Taiwan
Prior art keywords
release film
film
surface layer
release
item
Prior art date
Application number
TW100108641A
Other languages
English (en)
Chinese (zh)
Other versions
TW201144072A (en
Inventor
Yohsuke Nakao
Hirotake Matsumoto
Yasushi Goto
Masahiro Tsuchiya
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201144072A publication Critical patent/TW201144072A/zh
Application granted granted Critical
Publication of TWI540051B publication Critical patent/TWI540051B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/704—Crystalline
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW100108641A 2010-03-12 2011-03-14 Release film TWI540051B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010056620 2010-03-12
JP2010056621 2010-03-12
JP2010056622 2010-03-12

Publications (2)

Publication Number Publication Date
TW201144072A TW201144072A (en) 2011-12-16
TWI540051B true TWI540051B (zh) 2016-07-01

Family

ID=44563624

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100108641A TWI540051B (zh) 2010-03-12 2011-03-14 Release film

Country Status (5)

Country Link
JP (2) JP5719290B2 (fr)
KR (1) KR101873071B1 (fr)
CN (1) CN102791480B (fr)
TW (1) TWI540051B (fr)
WO (1) WO2011111826A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6014680B2 (ja) * 2012-11-19 2016-10-25 タツタ電線株式会社 積層フィルム及びシールドプリント配線板
JP6126446B2 (ja) * 2013-04-24 2017-05-10 三井化学東セロ株式会社 離型フィルムおよびｌｅｄ素子封止体の製造方法
WO2014178151A1 (fr) * 2013-04-30 2014-11-06 住友ベークライト株式会社 Film antiadhesif et procede d'utilisation de film antiadhesif
JP6223913B2 (ja) * 2013-08-05 2017-11-01 積水化学工業株式会社 離型フィルム
JP2015077783A (ja) * 2013-09-10 2015-04-23 東レ株式会社 離型用二軸配向ポリエステルフィルム
CN106104776B (zh) * 2014-03-07 2019-08-27 Ａｇｃ株式会社 脱模膜、其制造方法以及半导体封装体的制造方法
JP6572616B2 (ja) * 2014-09-17 2019-09-11 東レ株式会社 白色ポリエステルフィルム
JP6531555B2 (ja) * 2014-10-31 2019-06-19 東レ株式会社 光学フィルム製造用ポリエステルフィルム
JP2018167458A (ja) * 2017-03-29 2018-11-01 日本メクトロン株式会社 離型フィルムおよびフレキシブルプリント基板の製造方法
CN111819228B (zh) * 2018-03-19 2023-09-19 积水化学工业株式会社 脱模膜
KR102479873B1 (ko) * 2018-07-06 2022-12-20 타츠타 전선 주식회사 프린트 배선 기판용 접착 필름
CN113840707A (zh) * 2019-09-25 2021-12-24 积水化学工业株式会社 脱模膜
CN111019148B (zh) * 2019-12-10 2021-10-01 河南科技学院 一种改性泡沫铜材料及其制备方法和应用
KR102325676B1 (ko) 2019-12-18 2021-11-11 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법
KR102304403B1 (ko) 2019-12-18 2021-09-17 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
CN117858800A (zh) * 2021-08-31 2024-04-09 东洋纺株式会社 树脂片成型用脱模薄膜

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03240658A (ja) * 1990-02-01 1991-10-28 Teijin Ltd 蓋材
JPH05283862A (ja) 1992-03-31 1993-10-29 Sony Corp 積層プリント基板の製造方法
JP4818541B2 (ja) * 2001-08-07 2011-11-16 三菱樹脂株式会社 ポリエステルフィルム
JP2003192987A (ja) * 2001-12-26 2003-07-09 Toray Ind Inc 無溶剤型ポリシロキサン系塗剤及び離型フィルム
JP3791458B2 (ja) * 2002-05-23 2006-06-28 旭硝子株式会社 離型フィルム
JP4011086B2 (ja) * 2003-09-30 2007-11-21 積水化学工業株式会社 多層シート
JP2005212453A (ja) * 2004-02-02 2005-08-11 Sekisui Chem Co Ltd 離型フィルム及び離型フィルムの製造方法
KR100879003B1 (ko) * 2005-05-26 2009-01-15 주식회사 코오롱 이형필름
JP2007237497A (ja) * 2006-03-07 2007-09-20 Teijin Dupont Films Japan Ltd 離型用フィルム
EP2002973B1 (fr) * 2006-04-05 2011-05-11 Asahi Glass Company, Limited Film de demoulage, materiau d'amortissement pour demoulage, procede de fabrication d'un circuit imprime et procede de fabrication d'un film de demoulage
JP4332204B2 (ja) * 2007-09-21 2009-09-16 積水化学工業株式会社 離型フィルム
JP2009132806A (ja) 2007-11-30 2009-06-18 Sekisui Chem Co Ltd 離型フィルム
JP5587771B2 (ja) * 2008-05-28 2014-09-10 株式会社クレハ ポリフェニレンサルファイド樹脂製回路基板用離型フィルム及び積層体
JP5300372B2 (ja) * 2008-08-25 2013-09-25 ユニチカ株式会社 剥離性ポリエステルフィルム
JP5492542B2 (ja) * 2009-12-24 2014-05-14 積水化学工業株式会社 離型フィルムの製造方法

Also Published As

Publication number Publication date
JP5719290B2 (ja) 2015-05-13
JP5837976B2 (ja) 2015-12-24
KR20130043623A (ko) 2013-04-30
CN102791480A (zh) 2012-11-21
CN102791480B (zh) 2015-06-17
JP2015083379A (ja) 2015-04-30
JPWO2011111826A1 (ja) 2013-06-27
WO2011111826A1 (fr) 2011-09-15
TW201144072A (en) 2011-12-16
KR101873071B1 (ko) 2018-06-29

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