TWI539638B - Organic electroluminescent light sealing device - Google Patents

Organic electroluminescent light sealing device Download PDF

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TWI539638B
TWI539638B TW102143642A TW102143642A TWI539638B TW I539638 B TWI539638 B TW I539638B TW 102143642 A TW102143642 A TW 102143642A TW 102143642 A TW102143642 A TW 102143642A TW I539638 B TWI539638 B TW I539638B
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substrate
sealing
organic
oled
bed portion
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TW102143642A
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Chinese (zh)
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TW201442313A (en
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Toshiharu Kishimura
Takeshi Ishida
Ryo Onishi
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Hitachi Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Description

有機電激發光密封裝置 Organic electroluminescent sealing device

本發明係有關貼附密封膜到有機EL(電激發光)面板之有機EL密封裝置。 The present invention relates to an organic EL sealing device for attaching a sealing film to an organic EL (Electrically Excited Light) panel.

以往,是有作為貼附密封基板到有機EL即有機發光二極體(OLED:Organic Light-Emitting Diode)的面板之技術記載到專利文獻1之技術。該技術,乃是在製造使用於有機EL照明裝置等的有機EL面板之際,於具有為OLED基板之複數個元件基板的元件主基板,貼附了具有複數個密封基板之密封主基板後,分斷每1對的元件基板及密封基板而得到1片有機EL面板。 In the related art, the technique of attaching a sealing substrate to a panel of an organic EL, that is, an organic light-emitting diode (OLED), is described in Patent Document 1. In the case of manufacturing an organic EL panel for use in an organic EL illumination device or the like, after a sealed main substrate having a plurality of sealing substrates is attached to an element main substrate having a plurality of element substrates which are OLED substrates, One element of the element substrate and the sealing substrate were separated to obtain one organic EL panel.

該有機EL面板的特徵,為具備有:形成有機EL元件及端子範圍且把玻璃基板當作基底之元件基板、被覆該有機EL元件之密封構件、及介隔著密封構件貼合到元件基板之密封基板,且備有僅配置在有機EL元件及端子範圍之間的範圍之第一間隔件。接著,以第一間隔件,抑制因分斷製程之應力集中或環境溫度的變化等之外部的應力所致有機EL面板的變形,抑制密封構件剝離的 發生。更進一步,抑制有起因於該剝離之密封構件氣密性的下降。 The organic EL panel is characterized in that it includes an element substrate in which an organic EL element and a terminal range are formed, a glass substrate is used as a base, a sealing member that covers the organic EL element, and a device that is bonded to the element substrate via a sealing member. The substrate is sealed, and a first spacer which is disposed only in a range between the organic EL element and the terminal range is provided. Then, the first spacer is used to suppress deformation of the organic EL panel due to external stress such as stress concentration of the breaking process or change in ambient temperature, and to suppress peeling of the sealing member. occur. Further, the decrease in the airtightness of the sealing member due to the peeling is suppressed.

還有,利用使用把捲在捲筒的膜捲繞到其他的捲筒而進行搬送之捲繞式法(roll-to-roll process),貼附複數個片狀密封材到密封主基板上的方式,以複數行同時貼附片狀密封材,可以縮短該貼附所必要的產距時間。 Further, by using a roll-to-roll process in which a film wound around a roll is wound around another roll, a plurality of sheet-shaped sealing materials are attached to the sealed main substrate. In the manner of attaching the sheet-like sealing material to the plurality of rows at the same time, the production time required for the attachment can be shortened.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

[專利文獻1]國際公開第2010/024006號專利公報 [Patent Document 1] International Publication No. 2010/024006

順便一說,專利文獻1的有機EL面板中,係使用捲繞式法,貼附複數個片狀密封材到密封主基板上,以圖求製造的效率化。但是,此為密封基板的製造,為了製造有機EL面板,是有必要貼附密封主基板到元件主基板後,分斷而得到各1片的有機EL面板。從而,是有無法高效率製造有機EL面板之問題。 By the way, in the organic EL panel of the patent document 1, the winding type method is attached, and a plurality of sheet-like sealing materials are attached to the sealing main substrate, and the manufacturing efficiency is improved. However, this is a production of a sealing substrate. In order to manufacture an organic EL panel, it is necessary to attach the sealing main substrate to the element main substrate, and then to obtain one organic EL panel. Therefore, there is a problem that the organic EL panel cannot be manufactured efficiently.

更進一步,以第一間隔件吸收用以作成1片有機EL面板之分斷時外部的應力,但只要是分斷是有必要的,就無法否定因分斷動作所致的應力致使在有機EL面板發生有任何的故障。從而,是有所謂無法維持高精度地貼合密封基板到乃是OLED基板之元件基板後的密封狀 態之問題。 Further, the first spacer absorbs the external stress at the time of breaking the organic EL panel, but if it is necessary to break, it is impossible to deny the stress caused by the breaking action in the organic EL. There is any fault in the panel. Therefore, there is a seal shape in which the sealing substrate cannot be bonded to the element substrate of the OLED substrate with high precision. State problem.

本發明,係有鑑於這樣的事情而為之發明,其目的在於提供一種有機EL密封裝置,可以高精度貼合密封基板到OLED基板,且高效率進行該製造作業。 The present invention has been made in view of such circumstances, and an object of the invention is to provide an organic EL sealing device capable of bonding a sealing substrate to an OLED substrate with high precision and performing the manufacturing operation with high efficiency.

為了解決上述課題,本發明為一種有機EL密封裝置,係具備:搬送手段,係把以在搬送方向上預定的間隔貼附複數個有機EL元件製作用的第1基板到長條狀的膜而成之基材膜,以捲繞方式做搬送;轉寫滾子,係在滾子環繞方向以與前述間隔同間隔貼附利用膜材料所製成之複數個有機EL元件製作用的第2基板;以及旋轉移動手段,係使前述轉寫滾子自在地旋轉驅動且移動在與前述搬送方向垂直的上下方向;利用前述旋轉移動手段,移動前述轉寫滾子,把被貼附到該轉寫滾子之第2基板抵接到被貼附到前述基材膜之第1基板,使該旋轉移動手段所致之該轉寫滾子的旋轉動作、與前述搬送手段所致之該基材膜的搬送手段同步,把該第2基板貼合到該第1基板,藉由另一方密封其中一方。 In order to solve the problem, the present invention provides an organic EL sealing device which is provided with a first substrate to a long film which is formed by attaching a plurality of organic EL elements at a predetermined interval in the transport direction. The base film is conveyed by winding; the transfer roller is attached to the second substrate of the plurality of organic EL elements produced by using the film material at the same interval from the roller in the direction around the roller. And a rotational movement means for freely rotating and moving the transfer roller in a vertical direction perpendicular to the transport direction; and moving the transfer roller by the rotational movement means to attach the transfer roller to the transfer The second substrate of the roller abuts against the first substrate attached to the base film, and the rotation operation of the transfer roller by the rotational movement means and the substrate film by the transfer means The transport means is synchronized, and the second substrate is bonded to the first substrate, and the other is sealed by the other.

根據本發明,可以提供一種有機EL密封裝置,可以高精度貼合密封基板到OLED基板,且高效率進行該製造作業。 According to the present invention, it is possible to provide an organic EL sealing device which can apply a sealing substrate to an OLED substrate with high precision and perform the manufacturing operation with high efficiency.

10、60‧‧‧有機EL密封裝置 10, 60‧‧‧Organic EL sealing device

17‧‧‧密封基板(第2基板) 17‧‧‧Seal substrate (2nd substrate)

21‧‧‧OLED基材膜 21‧‧‧OLED substrate film

22‧‧‧OLED基板(第1基板) 22‧‧‧OLED substrate (first substrate)

24‧‧‧製品膜 24‧‧‧Product film

48‧‧‧膜捲繞部 48‧‧‧ Film winding department

30、31、32、33、34、35、35a、35b、36、37‧‧‧導引滾子(搬送手段) 30, 31, 32, 33, 34, 35, 35a, 35b, 36, 37‧‧‧ guide rollers (transport means)

38、39‧‧‧浮動滾子(搬送手段) 38, 39‧‧‧Floating roller (transport means)

41~43‧‧‧夾持滾子(搬送手段) 41~43‧‧‧Clamping roller (transport means)

45a、45b‧‧‧加熱滾子(加熱手段) 45a, 45b‧‧‧heating rollers (heating means)

52‧‧‧轉寫滾子 52‧‧‧Transfer roller

40‧‧‧蛇行檢測感測器(蛇行補正手段) 40‧‧‧Snake detection sensor (snake correction method)

51‧‧‧密封基板貼附機構(旋轉移動手段) 51‧‧‧Seal substrate attachment mechanism (rotary movement means)

53‧‧‧支撐部(旋轉移動手段) 53‧‧‧Support (rotary movement means)

62‧‧‧真空壓密封機構 62‧‧‧Vacuum pressure sealing mechanism

63‧‧‧下床台部 63‧‧‧Get out of bed

63a‧‧‧外框床台 63a‧‧‧Outer frame bed

63b‧‧‧平板床台 63b‧‧‧Platform bed

63c、64a‧‧‧加熱器 63c, 64a‧‧‧heater

63d‧‧‧XYZθ移動機構 63d‧‧‧XYZθ moving mechanism

64‧‧‧上床台部 64‧‧‧Going to the table

65‧‧‧分配部(塗布手段) 65‧‧‧Distribution Department (Coating means)

66‧‧‧攝像部 66‧‧‧Photography Department

66a、66b‧‧‧透鏡部 66a, 66b‧‧‧ lens section

66c‧‧‧偏光機構 66c‧‧‧ polarizing mechanism

71‧‧‧UV照射器(UV照射手段) 71‧‧‧UV illuminator (UV irradiation means)

101‧‧‧控制裝置 101‧‧‧Control device

〔圖1〕為表示從側面方向觀看有關本發明之第1實施型態的有機EL密封裝置10之主要構成之構成圖。 [Fig. 1] is a configuration diagram showing the main configuration of the organic EL sealing device 10 according to the first embodiment of the present invention as seen from the side surface direction.

〔圖2A〕為長條狀的OLED基材膜的俯視圖。 FIG. 2A is a plan view of a long OLED substrate film.

〔圖2B〕為相當於在圖2A所表示的A1-A1剖面之有機EL元件的剖視圖。 FIG. 2B is a cross-sectional view of the organic EL element corresponding to the A1-A1 cross section shown in FIG. 2A.

〔圖3〕為切斷OLED基材膜在與搬送方向正交之寬度方向,並從搬送方向觀看其切斷面及上下滾子之際的構成圖。 FIG. 3 is a view showing a configuration in which the OLED base film is cut in the width direction orthogonal to the conveyance direction, and the cut surface and the upper and lower rollers are viewed from the conveyance direction.

〔圖4〕為表示進行本實施型態之有機EL密封裝置的動作控制的控制裝置的構成之方塊圖。 [Fig. 4] is a block diagram showing a configuration of a control device that performs operation control of the organic EL sealing device of the present embodiment.

〔圖5〕為用以說明利用第1實施型態的有機EL密封裝置以密封基板來密封OLED基板的動作之流程。 FIG. 5 is a flow chart for explaining an operation of sealing the OLED substrate by sealing the substrate by the organic EL sealing device of the first embodiment.

〔圖6〕為表示從側面方向觀看有關本發明之第2實施型態的有機EL密封裝置之主要構成之構成圖。 [Fig. 6] is a configuration diagram showing a main configuration of an organic EL sealing device according to a second embodiment of the present invention as seen from the side surface direction.

〔圖7〕為用以說明利用第2實施型態的有機EL密封裝置以密封基板來密封OLED基板的動作之第1流程。 FIG. 7 is a first flow chart for explaining an operation of sealing the OLED substrate by sealing the substrate by the organic EL sealing device of the second embodiment.

〔圖8〕為用以說明利用第2實施型態的有機EL密封裝置以密封基板來密封OLED基板的動作之第2流程。 FIG. 8 is a second flow for explaining an operation of sealing the OLED substrate by sealing the substrate by the organic EL sealing device of the second embodiment.

以下,參閱圖面說明本發明之實施型態。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<第1實施型態的構成> <Configuration of the first embodiment>

圖1為表示從側面方向觀看有關本發明之第1實施型態的有機EL密封裝置10之主要構成之構成圖。在以下的說明中,以第1基板為OLED基板22,第2基板為密封基板17,來進行說明。 Fig. 1 is a configuration diagram showing a main configuration of an organic EL sealing device 10 according to a first embodiment of the present invention as seen from the side surface direction. In the following description, the first substrate is the OLED substrate 22, and the second substrate is the sealing substrate 17.

有機EL密封裝置10,係配置在氮氣(N2)環境中,從以箭頭Y1所表示之未圖示的前製程開始,於被貼附到捲繞(roll to roll)搬送中的OLED基材膜(基材膜)21的OLED基板(第1基板)22,貼合密封基板(第2基板)17並密封。經此,製作使用在有機EL照明裝置等的電器製品之製品膜24。 The organic EL sealing device 10 is disposed in a nitrogen (N 2 ) environment, and is attached to an OLED substrate that is attached to a roll to roll conveyance from a front process (not shown) indicated by an arrow Y1. The OLED substrate (first substrate) 22 of the film (base material film) 21 is bonded to the sealing substrate (second substrate) 17 and sealed. Thus, the product film 24 of the electrical product used in the organic EL illumination device or the like is produced.

但是,把有機EL密封裝置10配置在氮氣環境中,係因為OLED基材膜21及密封基板17接觸到空氣與水分而不會損傷得以維持高品質。還有,以膜材料形成密封基板17、及OLED基板22的表面。更進一步,OLED基材膜21為具有可撓性的膜。 However, the organic EL sealing device 10 is disposed in a nitrogen atmosphere because the OLED substrate film 21 and the sealing substrate 17 are in contact with air and moisture without being damaged to maintain high quality. Further, the sealing substrate 17 and the surface of the OLED substrate 22 are formed of a film material. Further, the OLED substrate film 21 is a film having flexibility.

圖2A為長條狀的OLED基材膜21之俯視圖;圖2B為相當於在圖2A所表示的A1-A1剖面之有機EL元件的剖視圖。如圖2A所表示,OLED基材膜21,乃是在長條狀的基板膜21a,以預定的間隔L1複數貼附OLED基板22。間隔L1為從OLED基板22的中心到相鄰接的OLED基板22的中心為止的長度。 2A is a plan view of the elongated OLED substrate film 21; and FIG. 2B is a cross-sectional view of the organic EL element corresponding to the A1-A1 cross section shown in FIG. 2A. As shown in FIG. 2A, the OLED substrate film 21 is attached to the OLED substrate 22 at a predetermined interval L1 in the elongated substrate film 21a. The interval L1 is a length from the center of the OLED substrate 22 to the center of the adjacent OLED substrate 22.

OLED基板22,如圖2B所表示,乃是於基板膜21a,貼附有層積陽極22a、有機物膜22b、陰極22c之 各層而成的OLED基板(有機EL元件)22。還有,經由電源Va在陰極22c與陽極22a之間施加規定低電位的電壓,經此發光如以箭頭Y10所表示般。從這樣的構成的OLED基板22的陰極22c側貼合密封基板17,密封OLED基板22不會接觸到水分或氧。但是,OLED基板22與密封基板17為相似形狀,密封基板17那一方,乃如圖2B所表示,做成可以整個包覆OLED基板22之較大的尺寸。從而,在圖1或後述之圖6,OLED基板22與密封基板17表現同一,但實際上是成為於圖2B所顯示之尺寸關係。 The OLED substrate 22, as shown in FIG. 2B, is attached to the substrate film 21a with the laminated anode 22a, the organic film 22b, and the cathode 22c. An OLED substrate (organic EL element) 22 each formed of layers. Further, a voltage having a predetermined low potential is applied between the cathode 22c and the anode 22a via the power source Va, and the light is emitted as indicated by an arrow Y10. The sealing substrate 17 is bonded to the cathode 22c side of the OLED substrate 22 having such a configuration, and the sealed OLED substrate 22 is not exposed to moisture or oxygen. However, the OLED substrate 22 and the sealing substrate 17 have a similar shape, and one of the sealing substrates 17 is as shown in FIG. 2B, and is formed to have a large size in which the OLED substrate 22 can be entirely coated. Therefore, in FIG. 1 or FIG. 6 described later, the OLED substrate 22 and the sealing substrate 17 are identical, but actually have the dimensional relationship shown in FIG. 2B.

於圖1所表示的有機EL密封裝置10,具備:搬送OLED基材膜21在以箭頭Y1所表示的水平方向之導引滾子30、31、32、33、34、35、36、37,配置在導引滾子31及32間的下方之浮動滾子(dancing roller)38,以及配置在導引滾子36及37間的下方之浮動滾子39。更進一步,具備:與導引滾子30上下成對夾持OLED基材膜21之夾持滾子41、後述的轉寫滾子52從下方施壓把OLED基材膜21的OLED基板22及密封基板17夾入之夾持滾子42、以及與導引滾子37上下成對夾持OLED基材膜21之夾持滾子43。 The organic EL sealing device 10 shown in FIG. 1 includes guide rollers 30, 31, 32, 33, 34, 35, 36, 37 that convey the OLED base film 21 in the horizontal direction indicated by an arrow Y1. A floating roller 38 disposed below the guide rollers 31 and 32, and a floating roller 39 disposed below the guide rollers 36 and 37. Furthermore, the OLED substrate 22 of the OLED substrate film 21 is pressed from below by the nip roller 41 which sandwiches the OLED substrate film 21 in a pair with the guide roller 30, and the transfer roller 52 which will be described later. The pinch roller 42 sandwiched between the sealing substrate 17 and the pinch roller 43 that sandwiches the OLED base film 21 in pairs with the guide roller 37.

浮動滾子38具有在OLED基材膜21通過之際,上下移動而施加張力使其不會產生鬆弛的功用;浮動滾子39具有在製品膜24通過之際,上下移動來施加張力使其不會產生鬆弛的功用。 The floating roller 38 has a function of applying tension to the upper and lower sides of the OLED substrate film 21 so as not to cause slack; the floating roller 39 has a tension applied to the upper and lower sides of the product film 24 when the product film 24 passes. Will produce slack function.

更進一步,有機EL密封裝置10被配置在導引滾子33及34間,具備:上下夾入OLED基材膜21上的OLED基板22及密封基板17而加熱之加熱滾子45a、45b,以及把使用利用加熱讓OLED基材膜21上的OLED基板22硬化的密封基板17a來密封的製品膜24捲繞成捲筒狀之最下游側的膜捲繞部48。但是,上述的硬化,是具有可撓性的硬化。順便說明,幾乎所有的材料是因為變薄而具有可撓性,在本例也是憑藉著薄而具有可撓性。 Further, the organic EL sealing device 10 is disposed between the guide rollers 33 and 34, and includes heating rollers 45a and 45b that are heated by sandwiching the OLED substrate 22 and the sealing substrate 17 on the OLED substrate film 21 up and down, and The product film 24 sealed by the sealing substrate 17a which is cured by heating the OLED substrate 22 on the OLED substrate film 21 is wound into the film winding portion 48 on the most downstream side in the form of a roll. However, the above hardening is hardening with flexibility. Incidentally, almost all materials are flexible due to thinning, and in this case, they are flexible by being thin.

尚且,把導引滾子30~37、浮動滾子38、39、夾持滾子41~43、加熱滾子45a、45b、轉寫滾子52,簡稱為滾子30~37、38、39、41~43、45a、45b、52。把OLED基材膜21及製品膜24,簡稱為膜21、24。把密封基板17及OLED基板22簡稱為基板17、22。 Further, the guide rollers 30 to 37, the floating rollers 38 and 39, the pinch rollers 41 to 43, the heating rollers 45a and 45b, and the transfer roller 52 are simply referred to as rollers 30 to 37, 38, and 39. 41~43, 45a, 45b, 52. The OLED base film 21 and the product film 24 are simply referred to as films 21 and 24. The sealing substrate 17 and the OLED substrate 22 are simply referred to as substrates 17 and 22.

又,配置在OLED基材膜21及製品膜24的下側之滾子30~37,係構成以表示在圖3之滾輪30作為代表而表示。圖3為切斷OLED基材膜21在與搬送方向正交之寬度方向,並從搬送方向觀看其切斷面及上下滾子41、30之際的構成圖。 Further, the rollers 30 to 37 disposed on the lower side of the OLED base film 21 and the product film 24 are shown as being representative of the roller 30 in Fig. 3 . FIG. 3 is a view showing a configuration in which the OLED base film 21 is cut in the width direction orthogonal to the conveyance direction, and the cut surface and the upper and lower rollers 41 and 30 are viewed from the conveyance direction.

如圖3所表示,滾子30,係構成為:以比OLED基板22的寬度還要長的間隔,在該OLED基板22的兩側之膜21上配置直徑r1的滾子30a、30b,各滾子30a、30b的中心是被細長的圓柱棒狀的軸30c固定。 As shown in FIG. 3, the roller 30 is configured such that rollers 30a and 30b having a diameter r1 are disposed on the film 21 on both sides of the OLED substrate 22 at intervals longer than the width of the OLED substrate 22. The centers of the rollers 30a, 30b are fixed by an elongated cylindrical rod-shaped shaft 30c.

在軸30c、與各滾子30a、30b之間形成跨過OLED基板22的凹部,於該凹部由OLED基板22所形成的凸部, 是做成可以非接觸通過的尺寸。 A concave portion spanning the OLED substrate 22 is formed between the shaft 30c and each of the rollers 30a and 30b, and the convex portion formed by the OLED substrate 22 is formed in the concave portion. It is made into a size that can be passed without contact.

於該凹部,表示於圖1之導引滾子33以後的下游側滾子中也是同樣,做成可以通過由OLED基板22及密封基板17(或者是17a)所形成的凸部。 The concave portion is also formed in the downstream side roller after the guide roller 33 of Fig. 1, and the convex portion formed by the OLED substrate 22 and the sealing substrate 17 (or 17a) is formed.

更進一步,有機EL密封裝置10,具備:被配置在導引滾子30及31間的蛇行檢測感測器40,以及被配置在導引滾子32及33間的密封基板貼附機構51。 Further, the organic EL sealing device 10 includes a meandering detecting sensor 40 disposed between the guide rollers 30 and 31, and a sealing substrate attaching mechanism 51 disposed between the guide rollers 32 and 33.

蛇行檢測感測器40,是檢測OLED基材膜21搬送時的蛇行,且具備未圖示的蛇行補正部來補正蛇行之蛇行檢測補正手段。 The meandering detecting sensor 40 is a serpentine detecting and correcting means for correcting the meandering of the OLED substrate 21 when it is conveyed, and is provided with a meandering correction unit (not shown).

密封基板貼附機構51,是作為以支撐部53的旋轉軸54來支撐轉寫滾子52成自由旋轉,支撐部53為相對於OLED基材膜21之水平的搬送方向而自在地在垂直的上下方向Y2、Y3可以移動的機構。 The sealing substrate attaching mechanism 51 is configured to support the transfer roller 52 to rotate freely by the rotation shaft 54 of the support portion 53, and the support portion 53 is freely perpendicular to the horizontal conveyance direction of the OLED base film 21. A mechanism in which the vertical direction Y2 and Y3 can be moved.

轉寫滾子52,其環繞面是以具有柔軟性之橡膠等的彈性構件所形成,在該環繞面,於環繞方向以預定的間隔來貼附複數個密封基板17。該貼附,是利用吸引夾具、靜電夾具、或者是黏性物質來進行。在此例中,對轉寫滾子52之各密封基板17的貼附間隔,是與圖2A表示的OLED基材膜21的OLED基板22的貼附間隔L1相同;對轉寫滾子52的貼附,是由人來進行。還有,密封基板17的形狀,是與OLED基板22為同形狀,在本實施型態是做成長方形狀,但可為四角、圓、三角、星等之任意形狀。尚且,可以拉寬或縮窄貼附間隔L1。 The transfer roller 52 is formed by an elastic member such as a rubber having flexibility, and a plurality of sealing substrates 17 are attached to the surrounding surface at predetermined intervals in the circumferential direction. The attachment is performed by using a suction jig, an electrostatic jig, or a viscous substance. In this example, the attachment interval of each of the sealing substrates 17 of the transfer roller 52 is the same as the attachment interval L1 of the OLED substrate 22 of the OLED substrate film 21 shown in FIG. 2A; for the transfer roller 52 Attachment is carried out by people. Further, the shape of the sealing substrate 17 is the same shape as that of the OLED substrate 22. In the present embodiment, the shape of the sealing substrate 17 is a rectangular shape, but may be any shape such as a square, a circle, a triangle, or a star. Also, the attachment interval L1 can be widened or narrowed.

還有,密封基板貼附機構51,係把被貼附了有複數個密封基板17的轉寫滾子52,朝向以箭頭Y2所表示之上方向移動,抵接成把密封基板17的右端覆蓋到OLED基材膜21之OLED基板22的右端。從該抵接狀態,以使其同步於OLED基材膜21的搬送(Y1方向)並使轉寫滾子52旋轉在順時針方向的方式,把密封基板17從右端朝向左端,貼合到OLED基板22成為如圖2B所示的狀態。該貼合,係在密封基板17之朝向OLED基板22的面塗布黏著劑而實現。此時,對OLED基板22之密封基板17的黏著力F1,係比對轉寫滾子52之密封基板17的黏著力F2還要強的緣故,密封基板17滑順地轉移(轉寫)貼附到OLED基板22。但是,OLED基板22之對OLED基材膜21的黏著力F0,為F0>F1。從而,成為F0>F1>F2之關係。 Further, in the sealing substrate attaching mechanism 51, the transfer roller 52 to which the plurality of sealing substrates 17 are attached is moved in the upward direction indicated by the arrow Y2, and is abutted so as to cover the right end of the sealing substrate 17. To the right end of the OLED substrate 22 of the OLED substrate film 21. From the contact state, the sealing substrate 17 is attached to the OLED from the right end toward the left end so as to synchronize the transfer of the OLED substrate film 21 (Y1 direction) and rotate the transfer roller 52 in the clockwise direction. The substrate 22 is in a state as shown in Fig. 2B. This bonding is achieved by applying an adhesive to the surface of the sealing substrate 17 facing the OLED substrate 22. At this time, the adhesive force F1 of the sealing substrate 17 of the OLED substrate 22 is stronger than the adhesive force F2 of the sealing substrate 17 of the transfer roller 52, and the sealing substrate 17 is smoothly transferred (transferred). Attached to the OLED substrate 22. However, the adhesion force F0 of the OLED substrate 22 to the OLED substrate film 21 is F0>F1. Therefore, the relationship of F0>F1>F2 is obtained.

貼附完畢後,搬送OLED基材膜21之下一個OLED基板22,但轉寫滾子52之下一個密封基板17也是以與OLED基板22相同間隔進行貼附的緣故,同樣,下一個密封基板17貼合到下一個OLED基板22。以後同樣地,轉寫滾子52之全部的密封基板17貼合到OLED基板22。 After the attachment is completed, the OLED substrate 22 under the OLED substrate film 21 is transferred, but the sealing substrate 17 under the transfer roller 52 is also attached at the same interval as the OLED substrate 22. Similarly, the next sealing substrate 17 is attached to the next OLED substrate 22. Similarly, all of the sealing substrates 17 of the transfer roller 52 are bonded to the OLED substrate 22 in the same manner.

全部的密封基板17的貼合完畢的話,OLED基材膜21的搬送暫且停止,轉寫滾子52下降到以箭頭Y3所表示的下方。經由該下降停止在指定位置的話,人員把指定片數的密封基板17貼附到轉寫滾子52並做設定。 When the bonding of all the sealing substrates 17 is completed, the conveyance of the OLED substrate film 21 is temporarily stopped, and the transfer roller 52 is lowered to the lower side indicated by an arrow Y3. When the drop is stopped at the designated position, the person attaches the specified number of the sealing substrates 17 to the transfer roller 52 and sets them.

加熱滾子45a、45b,其環繞面是以具有柔軟性且耐熱性之橡膠等的彈性構件所形成,把以密封基板17所密封過的OLED基板22,利用從其之上夾住進行加熱的方式,使密封基板17硬化。尚且,硬化過的密封基板以元件符號17a表示。 The heating rollers 45a and 45b are formed of an elastic member such as rubber having flexibility and heat resistance, and the OLED substrate 22 sealed by the sealing substrate 17 is heated by being sandwiched thereon. In this manner, the sealing substrate 17 is hardened. Further, the hardened sealing substrate is indicated by the symbol 17a.

各膜21、24的搬送動作、以蛇行檢測感測器40的蛇行檢測所為之蛇行補正動作、以密封基板貼附機構51所為之貼附動作、以加熱滾子45a、45b所為之加熱動作等之有關有機EL密封裝置10之動作控制,係藉由圖4所表示的控制裝置101來進行。 The conveying operation of each of the films 21 and 24, the meandering correction operation by the meandering detection of the meandering detecting sensor 40, the attaching operation by the sealing substrate attaching mechanism 51, and the heating operation by the heating rollers 45a and 45b The operation control of the organic EL sealing device 10 is performed by the control device 101 shown in FIG.

亦即,控制裝置101,乃是具備:CPU(中央處理單元)101a、ROM(唯讀記憶體)101b、RAM(隨機存取記憶體)101c、記憶裝置(HDD:硬碟等)101d,這些101a~101d連接到匯流排102之一般的構成。在這樣的構成中,例如CPU101a執行寫入在ROM101b的程式101f,來實現控制裝置101的控制。 In other words, the control device 101 includes a CPU (Central Processing Unit) 101a, a ROM (Read Only Memory) 101b, a RAM (Random Access Memory) 101c, and a Memory Device (HDD: Hard Disk) 101d. 101a to 101d are connected to the general configuration of the bus bar 102. In such a configuration, for example, the CPU 101a executes the program 101f written in the ROM 101b to realize the control of the control device 101.

<第1實施型態的動作> <Operation of the first embodiment>

接著,參閱圖5所表示的流程,說明利用圖1所表示的有機EL密封裝置10以密封基板17密封OLED基板22之動作。尚且,說明中之各動作控制,是以控制裝置101來進行。還有,有機EL密封裝置10,係被配置在氮氣(N2)環境中,在轉寫滾子52貼附有指定片數的密封基板17。 Next, an operation of sealing the OLED substrate 22 with the sealing substrate 17 by the organic EL sealing device 10 shown in Fig. 1 will be described with reference to the flow shown in Fig. 5 . Further, each of the operation control in the description is performed by the control device 101. Further, the organic EL sealing device 10 is disposed in a nitrogen (N 2 ) atmosphere, and a predetermined number of sealing substrates 17 are attached to the transfer roller 52.

在圖5所表示的步驟S1中,從如在圖1以箭頭Y1所表示般未圖示之前製程開始,以捲繞方式所搬送著的OLED基材膜21,乃是通過各滾子30~37、38、39、41~43,以最下游段的膜捲繞部48一邊被捲繞一邊被搬送。此時,對膜21,利用浮動滾子38、39施加張力而不會產生鬆弛,更進一步,以蛇行檢測補正手段之蛇行檢測感測器40進行蛇行補正,來適當地進行搬送。 In the step S1 shown in FIG. 5, the OLED base film 21 conveyed in a winding manner from the start of the process shown by the arrow Y1 in FIG. 1 is passed through the respective rollers 30~. 37, 38, 39, and 41 to 43, the film winding portion 48 of the most downstream portion is conveyed while being wound. At this time, tension is applied to the film 21 by the floating rollers 38 and 39 without causing slack, and further, the meandering detecting sensor 40 by the meandering detection correcting means performs meandering correction and appropriately performs the conveyance.

接著,在步驟S2中,判斷貼附到所搬送的OLED基材膜21之OLED基板22,是否到達配置在轉寫滾子52上方之夾持滾子42的上游側之指定位置。在判斷為未到達(No)的情況下,反覆進行步驟S1的動作及步驟S2的判斷。 Next, in step S2, it is determined whether or not the OLED substrate 22 attached to the transported OLED substrate film 21 reaches a predetermined position on the upstream side of the pinch roller 42 disposed above the transfer roller 52. When it is judged that it has not arrived (No), the operation of step S1 and the determination of step S2 are repeatedly performed.

在判斷為已到達(Yes)的情況下,在步驟S3中,經由密封基板貼附機構51轉寫滾子52往以箭頭Y2所表示的上方向上升,抵接成把貼附在轉寫滾子52之密封基板17的右端,覆蓋到OLED基材膜21之OLED基板22的右端。 When it is determined that it has arrived (Yes), in step S3, the roller 52 is transferred via the sealing substrate attaching mechanism 51 to the upper direction indicated by the arrow Y2, and is abutted to be attached to the transfer roller. The right end of the sealing substrate 17 of the sub- 52 covers the right end of the OLED substrate 22 of the OLED substrate film 21.

在步驟S4中,從該抵接狀態,同步於OLED基材膜21之對搬送方向Y1的移動,使轉寫滾子52順時針方向旋轉,密封基板17從右端朝向左端貼合到OLED基板22。該貼合完畢後,經由OLED基材膜21的搬送,下一個OLED基板22到達指定位置,與其同步後利用轉寫滾子52的旋轉所移動過的密封基板17,從該已到達的OLED基板22的右端開始貼合。以後同樣的密封動作, 為依序執行貼附到轉寫滾子52之密封基板17之片數份。 In step S4, in synchronization with the movement of the OLED substrate film 21 in the transport direction Y1, the transfer roller 52 is rotated in the clockwise direction, and the sealing substrate 17 is bonded to the OLED substrate 22 from the right end toward the left end. . After the bonding is completed, the next OLED substrate 22 reaches the designated position via the OLED substrate film 21, and the sealing substrate 17 that has been moved by the rotation of the transfer roller 52 after synchronizing with the OLED substrate 21 is removed from the OLED substrate that has arrived. The right end of 22 begins to fit. The same sealing action in the future, The number of sheets of the sealing substrate 17 attached to the transfer roller 52 is sequentially performed.

接著,在步驟S5中,判斷轉寫滾子52之全部的密封基板17之貼合是否完畢。在判斷為未完畢(No)的情況下,依序反覆進行步驟S4的密封動作及步驟S5的判斷。在以步驟S5判斷為完畢(Yes)的情況下,在步驟S6中,藉由密封基板貼附機構51轉寫滾子52往以箭頭Y3所表示之下方下降,停止在指定位置。在該停止位置,在步驟S7中,人員把指定片數的密封基板17貼附設定到轉寫滾子52。該設定後,回到上述步驟S3,進行上述處理動作。 Next, in step S5, it is determined whether or not the bonding of all the sealing substrates 17 of the transfer roller 52 is completed. When it is judged that it is not completed (No), the sealing operation of step S4 and the determination of step S5 are repeatedly performed in sequence. When it is judged to be "Yes" in the step S5, in the step S6, the roller 52 is retracted by the sealing substrate attaching mechanism 51 to descend downward as indicated by the arrow Y3, and stops at the designated position. At the stop position, in step S7, the person attaches the predetermined number of the sealing substrates 17 to the transfer roller 52. After this setting, the process returns to the above-described step S3, and the above-described processing operation is performed.

還有,在上述步驟S4~S7的處理動作時,在步驟S8中,以已搬送到比轉寫滾子52還要更下游側之密封基板17所密封之OLED基板22,用加熱滾子45a、45b一邊被夾持一邊被加熱而硬化,完成密封。經此製作製品膜24。該製品膜24,係在步驟S9中,以膜捲繞部48被捲繞成捲筒狀。該捲繞後,以其他製程進行加工,做成最終製品。 Further, in the processing operation of the above-described steps S4 to S7, in the step S8, the OLED substrate 22 sealed to the sealing substrate 17 on the downstream side of the transfer roller 52 is heated by the heating roller 45a. 45b is heated and hardened while being clamped, and the sealing is completed. The product film 24 is thus produced. This product film 24 is wound into a roll shape in the film winding portion 48 in step S9. After the winding, it is processed by other processes to form a final product.

<第1實施型態的效果> <Effects of the first embodiment>

根據本實施型態的圖1所示的有機EL密封裝置10,可以得到如下的效果。 According to the organic EL sealing device 10 shown in Fig. 1 of the present embodiment, the following effects can be obtained.

有機EL密封裝置10具備:搬送手段,係把以在搬送方向Y1上預定的間隔L1貼附複數個OLED基板22到長條狀的基板膜21a而成之OLED基材膜21,使用複數個 滾子以捲繞方式做搬送;轉寫滾子52,係在滾子環繞方向以與間隔L1同間隔貼附利用膜材料所製成之複數個密封基板17;以及旋轉移動手段,係使轉寫滾子52自在地旋轉驅動,並移動在與搬送方向Y1垂直的上下方向。搬送手段,係使用各導引滾子30~37、浮動滾子38、39、夾持滾子41~43、膜捲繞部48之各滾子而構成。旋轉移動手段,係利用具有支撐轉寫滾子52成自由旋轉之支撐部53之密封基板貼附機構51所構成。 In the organic EL sealing device 10, the OLED substrate film 21 is formed by attaching a plurality of OLED substrates 22 to a long substrate film 21a at a predetermined interval L1 in the transport direction Y1, and a plurality of OLED substrate films 21 are used. The roller is transported by winding; the transfer roller 52 is attached to the plurality of sealing substrates 17 made of the film material at the same interval from the interval L1 in the direction around the roller; and the rotary moving means is rotated The write roller 52 is rotationally driven freely and moves in the up and down direction perpendicular to the conveyance direction Y1. The conveying means is constituted by using the respective rollers of the guide rollers 30 to 37, the floating rollers 38, 39, the holding rollers 41 to 43, and the film winding portion 48. The rotary moving means is constituted by a sealing substrate attaching mechanism 51 having a support portion 53 that supports the transfer roller 52 to rotate freely.

接著,構成有機EL密封裝置10,使得藉由旋轉移動手段移動轉寫滾子52,把被貼附在該轉寫滾子52之密封基板17抵接到貼附在OLED基材膜21之OLED基板22,使因旋轉移動手段所致該轉寫滾子52的旋轉動作,與因搬送手段所致該OLED基材膜21的搬送動作同步,把該密封基板17貼合到該OLED基板22後進行密封。 Next, the organic EL sealing device 10 is constructed such that the transfer roller 52 attached to the transfer roller 52 is abutted against the OLED attached to the OLED substrate film 21 by the rotational movement means. In the substrate 22, the rotation operation of the transfer roller 52 by the rotational movement means is performed, and the sealing substrate 17 is attached to the OLED substrate 22 in synchronization with the conveyance operation of the OLED substrate film 21 by the transfer means. Sealed.

根據該構成,可以執行把密封基板17貼合到OLED基板22後進行密封之製造作業,用轉寫滾子52連續依序貼合複數個密封基板17到以捲繞方式所搬送的OLED基材膜21之各OLED基板22。從而,可以縮短該製造作業的產距時間,可以有效率進行製造作業。 According to this configuration, it is possible to perform a manufacturing operation in which the sealing substrate 17 is bonded to the OLED substrate 22 and then sealed, and the plurality of sealing substrates 17 are successively bonded by the transfer roller 52 to the OLED substrate conveyed by the winding method. Each OLED substrate 22 of the film 21. Therefore, the production time of the manufacturing operation can be shortened, and the manufacturing operation can be performed efficiently.

還有,旋轉移動手段,係構成:移動轉寫滾子52,把貼附在轉寫滾子52的密封基板17的端抵接到OLED基板22的端,以轉寫滾子52的旋轉動作從該已抵接的OLED基板22之其中一端朝向另一端貼合密封基板 17。 Further, the rotational movement means is configured to move the transfer roller 52 to abut the end of the sealing substrate 17 attached to the transfer roller 52 to the end of the OLED substrate 22 to transfer the rotation of the roller 52. Laminating the sealing substrate from one end of the abutted OLED substrate 22 toward the other end 17.

根據該構成,密封基板17從端部徐徐地清除出去空氣(氮氣)而貼附到OLED基板22的緣故,進行密封得以在OLED基板22與密封基板17之間不會產生氣泡。 According to this configuration, the sealing substrate 17 is gradually removed from the end portion and is attached to the OLED substrate 22, and is sealed so that no air bubbles are generated between the OLED substrate 22 and the sealing substrate 17.

還有,使用在搬送手段之滾子(在圖3代表表示之滾輪30),係在以密封基板17密封了貼附到OLED基材膜21之OLED基板22的狀態下,構成具有在搬送方向可以通過從該OLED基材膜21突出成凸狀的OLED基板22及密封基板17、17a之凹部。 In addition, the roller used in the transport means (the roller 30 shown in FIG. 3) is configured to have the OLED substrate 22 attached to the OLED base film 21 with the sealing substrate 17, and has a transport direction. The concave portion of the OLED substrate 22 and the sealing substrates 17, 17a protruding from the OLED substrate film 21 can be formed.

根據該構成,即便在長條狀的OLED基材膜21以指定間隔貼附OLED基板22及密封基板17、17a成凸狀,該凸狀部分通過凹部的緣故,OLED基板22及密封基板17不會破壞損傷,可以用捲繞方式進行連續的搬送。 According to this configuration, even if the OLED substrate 22 and the sealing substrates 17 and 17a are attached to the elongated OLED substrate film 21 at a predetermined interval in a convex shape, the convex portion passes through the concave portion, and the OLED substrate 22 and the sealing substrate 17 do not. It will damage the damage and can be continuously transported by winding.

還有,OLED基板22與密封基板17的形狀,如上述,密封基板17方為較大之相似形狀。 Further, the shape of the OLED substrate 22 and the sealing substrate 17 is as large as the sealing substrate 17 as described above.

藉此,在使OLED基板22與密封基板17之雙方對向之際,雙方為相似形狀的緣故,對合雙方的中心的話可以進行高精度對位。 As a result, when both the OLED substrate 22 and the sealing substrate 17 are opposed to each other, the two sides have a similar shape, and the center of both sides can be aligned with high precision.

還有,構成貼合密封基板17到OLED基板22的力F1,比貼附該密封基板17到轉寫滾子52的力F2還要強。 Further, the force F1 constituting the bonded sealing substrate 17 to the OLED substrate 22 is stronger than the force F2 to which the sealing substrate 17 is attached to the transfer roller 52.

根據該構成,在使貼附在轉寫滾子52之密封基板17,貼合並轉移(轉寫)到OLED基板22時,是可以容易進行的。 According to this configuration, when the sealing substrate 17 attached to the transfer roller 52 is attached and transferred (transferred) to the OLED substrate 22, it can be easily performed.

還有,構成更進一步具備:在密封基板17貼合到已貼附在OLED基材膜21之OLED基板22之狀態下,作為加熱該密封基板17使其硬化(具有可撓性之硬化)之加熱手段的加熱滾子45a、45b。 In addition, the sealing substrate 17 is further bonded to the OLED substrate 22 that has been attached to the OLED substrate film 21, and is cured by heating the sealing substrate 17 (hardening with flexibility). Heating rollers 45a, 45b of the heating means.

根據該構成,在貼合密封基板17到OLED基板22後,使其加熱硬化的緣故,對OLED基板22的密封基板17的貼合強度變高,可以高品質地製作製品膜24。 According to this configuration, after the sealing substrate 17 is bonded to the OLED substrate 22, the bonding strength of the sealing substrate 17 of the OLED substrate 22 is increased, and the product film 24 can be produced with high quality.

還有,構成更進一步具備:作為檢測用搬送手段所搬送的OLED基材膜21的蛇行並進行蛇行補正之蛇行檢測補正手段之蛇行檢測感測器40。 In addition, the configuration further includes a meandering detecting sensor 40 that is a serpentine detecting and correcting means for performing serpentine correction of the OLED base film 21 conveyed by the detecting transport means.

根據該構成,可以以平常直線狀等之指定進給路徑搬送OLED基材膜21的緣故,可以在適當的位置進行膜21上的OLED基板22的停止等。 According to this configuration, the OLED base film 21 can be conveyed in a predetermined feed path such as a straight line, and the OLED substrate 22 on the film 21 can be stopped at an appropriate position.

<第1實施型態的應用例> <Application example of the first embodiment>

在上述構成中,是人員進行對轉寫滾子52之密封基板17的貼附,但亦可以自動方式進行。該情況下,相對於把轉寫滾子52之密封基板17貼合到OLED基板22之貼合位置,在對向於基板22的徑方向之下方側的位置,具備密封基板17之供給手段(未圖示)。但是,接著進行供給手段之說明,但構成要件未圖示。 In the above configuration, the person attaches the sealing substrate 17 to the transfer roller 52, but it can also be performed automatically. In this case, the sealing substrate 17 of the transfer roller 52 is attached to the bonding position of the OLED substrate 22, and the supply means for the sealing substrate 17 is provided at a position on the lower side in the radial direction of the substrate 22 ( Not shown). However, the description of the supply means will be carried out next, but the constituent elements are not shown.

供給手段具備:第1手段,係利用複數的滾子以捲繞方式搬送捲片(roll film),有關該捲片是以上述間隔L1{圖2A}且用比黏著力F2還要弱的黏著力F3貼 附密封基板17到長條狀膜。更進一步,構成具備第2手段,使以第1手段所搬送之捲片上的密封基板17,同步於轉寫滾子52的旋轉而進行搬送,一邊抵接到與轉寫滾子52的貼合位置對向之下方位置的環繞面,一邊使密封基板17從捲片轉寫轉移到轉寫滾子52。 The supply means includes a first means for conveying a roll film by a plurality of rollers by a plurality of rollers, and the sheet is adhered at the interval L1 (Fig. 2A) and weaker than the adhesive force F2. Force F3 stickers A sealing substrate 17 is attached to the elongated film. Further, the second means is provided so that the sealing substrate 17 on the sheet conveyed by the first means is conveyed in synchronization with the rotation of the transfer roller 52, and is brought into contact with the transfer roller 52. The sealing substrate 17 is transferred from the winding sheet to the transfer roller 52 while the circumferential surface at the position opposite to the position is opposed.

根據該構成,可以得到以下的效果。從轉寫滾子52密封基板17被貼合轉寫到OLED基板22的話,轉寫滾子52之已貼附過該密封基板17的部分會變成沒有東西,但轉寫滾子52更進一步旋轉的話,在該沒有任何東西的部分,已第1手段所搬送之捲片上的密封基板17,會以第2手段貼附轉寫到轉寫滾子52。該轉寫動作連續進行的緣故,變成可以連續進行利用轉寫滾子52對OLED基板22之密封基板17的貼合。 According to this configuration, the following effects can be obtained. When the sealing substrate 17 is transferred from the transfer roller 52 to the OLED substrate 22, the portion of the transfer roller 52 that has been attached to the sealing substrate 17 becomes nothing, but the transfer roller 52 is further rotated. In the portion where there is no such thing, the sealing substrate 17 on the sheet which has been transported by the first means is attached to the transfer roller 52 by the second means. This transfer operation is continuously performed, so that the bonding of the transfer substrate 52 to the sealing substrate 17 of the OLED substrate 22 can be continuously performed.

<第2實施型態的構成> <Configuration of Second Embodiment>

圖6為表示從側面方向觀看有關本發明之第2實施型態的有機EL密封裝置60之主要構成之構成圖。但是,於圖6所表示之有機EL密封裝置60中,針對對應到表示於圖1之第1實施型態的有機EL密封裝置10之部分,賦予相同元件符號,並適宜省略其說明。 FIG. 6 is a view showing a configuration of a main configuration of an organic EL sealing device 60 according to a second embodiment of the present invention as seen from the side surface direction. In the organic EL sealing device 60 shown in Fig. 6, the same components are denoted by the same reference numerals as those of the organic EL sealing device 10 of the first embodiment shown in Fig. 1, and the description thereof will be appropriately omitted.

有機EL密封裝置60,為從以箭頭Y1表示般未圖示之前製程,在貼附到以捲繞方式所搬送之圖2A所表示的OLED基材膜21之OLED基板22,經由批次處理貼合密封基板17而密封成如圖2B所示的狀態者。經此, 製作使用在有機EL照明裝置等的電器製品之製品膜24。尚且,有機EL密封裝置60亦可配置在氮氣(N2)環境中。 The organic EL sealing device 60 is attached to the OLED substrate 22 of the OLED base film 21 shown in FIG. 2A conveyed by the winding method, and is processed by a batch process, which is not shown in the figure indicated by the arrow Y1. The substrate 17 is sealed and sealed to a state as shown in FIG. 2B. Thus, a product film 24 of an electrical product used in an organic EL illumination device or the like is produced. Further, the organic EL sealing device 60 may also be disposed in a nitrogen (N 2 ) environment.

但是,密封基板17係利用膜材料或玻璃材等所形成;OLED基板22的表面也利用膜材料或玻璃材等所形成。在本實施型態中,一起以膜材料形成基板17、22的表面。 However, the sealing substrate 17 is formed of a film material, a glass material, or the like; the surface of the OLED substrate 22 is also formed of a film material, a glass material, or the like. In the present embodiment, the surfaces of the substrates 17, 22 are formed together as a film material.

有機EL密封裝置60具備:導引滾子30~35、35a、35b、36、37,其在以箭頭Y1所表示的水平方向搬送OLED基材膜21;浮動滾子38、39;夾持滾子41、43;以及最下游側的膜捲繞部48,其把對密封OLED基板22後的密封基板17進行UV(紫外線)照射而製作出製品膜24予以捲繞成捲筒狀。但是,在圖6中,對硬化後的密封基板17賦予元件符號17a。 The organic EL sealing device 60 includes: guide rollers 30 to 35, 35a, 35b, 36, 37 that convey the OLED base film 21 in a horizontal direction indicated by an arrow Y1; floating rollers 38, 39; The film winding portion 48 on the most downstream side is subjected to UV (ultraviolet) irradiation on the sealing substrate 17 after sealing the OLED substrate 22 to form a product film 24, which is wound into a roll shape. However, in FIG. 6, the component symbol 17a is given to the sealing substrate 17 after hardening.

尚且,把導引滾子30~35、35a、35b、36、37、浮動滾子38、39、夾持滾子41、43,簡稱為滾子30~35、35a、35b、36、37、38、39、41、43。也把OLED基材膜21及製品膜24,簡稱為膜21、24。把密封基板17及OLED基板22簡稱為基板17、22。 Further, the guide rollers 30-35, 35a, 35b, 36, 37, the floating rollers 38, 39, and the pinch rollers 41, 43 are simply referred to as rollers 30-35, 35a, 35b, 36, 37, 38, 39, 41, 43. The OLED base film 21 and the product film 24 are also simply referred to as films 21 and 24. The sealing substrate 17 and the OLED substrate 22 are simply referred to as substrates 17 and 22.

還有,配置在膜21、24的下側之滾子30~35、35a、35b、36、37,做成與表示在圖3之與第1實施型態同樣的滾子30為同一構成。 Further, the rollers 30 to 35, 35a, 35b, 36, and 37 disposed on the lower side of the films 21 and 24 have the same configuration as the roller 30 shown in Fig. 3 and the first embodiment.

更進一步,表示於圖6之有機EL密封裝置10具備:蛇行檢測感測器40,其被配置在夾持滾子41的 下游側;真空壓密封機構62,其被配置在導引滾子33及34間;以及UV照射器71,其被配置在導引滾子35及35a間。 Further, the organic EL sealing device 10 shown in FIG. 6 is provided with a meandering detecting sensor 40 which is disposed on the pinch roller 41 The downstream side; a vacuum pressure sealing mechanism 62 disposed between the guide rollers 33 and 34; and a UV illuminator 71 disposed between the guide rollers 35 and 35a.

蛇行檢測感測器40,是檢測膜21的蛇行,且具備未圖示的蛇行補正部來補正蛇行之蛇行檢測補正手段。 The meandering detection sensor 40 is a meandering detection film 40, and includes a meandering correction unit (not shown) to correct the serpentine detection and correction means of the meandering.

真空壓密封機構62構成具備:下床台部63、上床台部64、分配部65、及攝像部66。 The vacuum pressure sealing mechanism 62 is configured to include a bed bottom portion 63, an upper bed portion 64, a distribution portion 65, and an imaging portion 66.

下床台部63構成具備:底面用四方框圍成之凹狀的外框床台63a、被配置在外框床台63a的凹框內之平板床台63b、內藏在平板床台63b的頂面側之平板狀的加熱器63c、XYZθ移動機構63d。 The bed forming portion 63 is configured to include a frame bed 63a having a concave shape in which the bottom surface is surrounded by a square frame, a flat bed table 63b disposed in a concave frame of the frame bed 63a, and a top portion of the flat bed table 63b. A flat heater 63c and an XYZθ moving mechanism 63d on the surface side.

XYZθ移動機構63d具有XYZθ移動功能,係使外框床台63a自在地移動在相對於水平之垂直的上下方向(雙方向箭頭Y12)之Z方向、沿著膜21的搬送方向Y1的雙方向之X方向、在水平面上與該X方向正交之Y方向,更進一步,把外框床台63a的中心當作軸在水平面上把該外框床台63a予以順時計旋轉或者是逆時針旋轉移動指定角度θ。更進一步,XYZθ移動機構63d具有也讓平板床台63b移動在Z方向之功能。 The XYZθ moving mechanism 63d has an XYZθ moving function, and the outer frame bed 63a is freely moved in the Z direction of the vertical direction (the double direction arrow Y12) perpendicular to the horizontal direction and the double direction of the film 21 in the transport direction Y1. In the X direction, the Y direction orthogonal to the X direction on the horizontal plane, and further, the center of the outer frame bed 63a is used as a shaft to rotate the frame bed 63a clockwise or counterclockwise on the horizontal plane. Specify the angle θ. Further, the XYZθ moving mechanism 63d has a function of also moving the flat bed 63b in the Z direction.

還有,作為使外框床台63a朝向為Y方向之圖面移動到面前方向,從上方看到平板床台63b的狀態,人員把密封基板17設定載置到平板床台63b上。 In the state in which the frame bed 63a is moved in the front direction toward the Y-direction, and the flat bed 63b is seen from above, the person sets the sealing substrate 17 on the flat bed 63b.

上床台部64成為平板形狀,並被配置到挾了OLED基材膜21之外框床台63a的上方,在平板形狀的底面側 (膜21的搬送側)內藏加熱器64a。 The upper bed portion 64 has a flat plate shape and is disposed above the frame bed 63a outside the OLED base film 21, on the bottom surface side of the flat plate shape. The heater 64a is incorporated in the (transport side of the film 21).

分配部65,係被配置在外框床台63a的凹框外,如以水平及垂直方向箭頭Y13所表示,為自在移動在上述XYZ方向者,在被設定在平板床台63b上的密封基板17之上塗布未圖示之UV塗布劑。該塗布,係在於密封基板17上塗成全面一致或者是區劃形狀等之預定的狀態。 The distribution unit 65 is disposed outside the concave frame of the outer frame bed 63a, as indicated by the horizontal and vertical arrow Y13, and is the sealing substrate 17 set on the flat bed table 63b as it is moved in the XYZ direction. A UV coating agent (not shown) is applied thereon. This coating is a predetermined state in which the sealing substrate 17 is coated in a uniform shape or a sectional shape or the like.

攝像部66,係如雙方向箭頭Y14所示般可以自在地移動在膜21的搬送方向及其逆方向,構成具備:在上方的透鏡部66a、在下方的透鏡部66b、及在這些透鏡部66a、66b間的稜鏡等之偏光機構66c。偏光機構66c具有切換拍攝光從上下任一之透鏡部66a或者是66b射入之功能。 The imaging unit 66 is configured to be movable in the transport direction of the film 21 and the reverse direction as shown by the double-directional arrow Y14, and includes the upper lens portion 66a, the lower lens portion 66b, and the lens portion. A polarizing mechanism 66c such as 稜鏡 between 66a and 66b. The polarizing means 66c has a function of switching the incident light from the upper or lower lens portion 66a or 66b.

上方的透鏡部66a,係拍攝暫且停止在上床台67的下方指定位置之膜21的OLED基板22的對位用的標記;下方的透鏡部66b,係拍攝被設定在平板床台63b之密封基板17的對位用的標記。亦即,在以透鏡部66a拍攝上方的OLED基板22的標記後,用偏光機構66c切換到下方的透鏡部66b,以該透鏡部66b拍攝下方的密封基板17的標記。但是,各標記亦可位在沿著各基板22、17的搬送方向之兩側邊緣。 The upper lens portion 66a captures a mark for alignment of the OLED substrate 22 of the film 21 at a predetermined position below the upper bed 67, and the lower lens portion 66b captures a sealed substrate set on the flat bed 63b. The mark used for the alignment of 17. In other words, after the mark of the upper OLED substrate 22 is imaged by the lens portion 66a, the polarizing means 66c is switched to the lower lens portion 66b, and the lower portion of the sealing substrate 17 is photographed by the lens portion 66b. However, each of the marks may be located on both side edges along the conveyance direction of each of the substrates 22 and 17.

利用該拍攝,OLED基板22及密封基板17之雙方的標記為不一致的情況下,利用XYZθ移動機構63d使載置了密封基板17的外框床台63a做XYZθ移動,使 雙方的標記一致。一致後,攝像部66朝外框床台63a的框外移動。 When the markings of both the OLED substrate 22 and the sealing substrate 17 do not match, the outer frame bed 63a on which the sealing substrate 17 is placed is moved by XYZθ by the XYZθ moving mechanism 63d. The markings of both parties are the same. After the matching, the imaging unit 66 moves to the outside of the frame of the outer frame bed 63a.

還有,XYZθ移動機構63d,係在雙方的標記一致後,使外框床台63a朝上方向移動,如圖6中以破斷線框所表示,收容OLED基板22到外框床台63a的凹框內後使凹框上端抵接到上床台部64的底面而沒有隙縫,形成密閉空間。之後,以真空壓密封機構62之未圖示的真空泵,抽出該密閉空間的空氣(氮氣)成為真空狀態。在該成為真空狀態的密閉空間中,移動平板床台63b到上方,把密封基板17的UV塗布劑的塗布面抵接到OLED基板22。 Further, the XYZθ moving mechanism 63d moves the outer frame bed 63a upward in accordance with the matching of the two marks, and the OLED substrate 22 is housed in the outer frame bed 63a as shown by the broken wire frame in Fig. 6 . After the inside of the concave frame, the upper end of the concave frame is abutted against the bottom surface of the upper bed portion 64 without a slit to form a sealed space. Thereafter, the air (nitrogen gas) in the sealed space is evacuated by a vacuum pump (not shown) of the vacuum pressure sealing mechanism 62 to be in a vacuum state. In the sealed space in a vacuum state, the flat bed table 63b is moved upward, and the coated surface of the UV coating agent of the sealing substrate 17 is brought into contact with the OLED substrate 22.

還有,在使密封基板17抵接到OLED基板22的情況下,不要讓UV塗布劑從該已抵接之各基板17、22溢出。亦即,在對密封基板17之UV塗布劑的塗布厚度維持在預定地厚度的狀態下,把密封基板17抵接到OLED基板22。順便說明,UV塗布劑量多容易溢出,太少的話塗布厚度變薄而無法適當進行利用後述的UV照射所致的UV塗布劑的硬化而成之密封。在此,達成可以以適當的硬化強度進行密封之塗布厚度。 Further, in the case where the sealing substrate 17 is brought into contact with the OLED substrate 22, the UV coating agent is not allowed to overflow from the substrates 17 and 22 that have been abutted. That is, the sealing substrate 17 is abutted against the OLED substrate 22 in a state where the coating thickness of the UV coating agent for the sealing substrate 17 is maintained at a predetermined thickness. By the way, the UV coating amount is likely to overflow, and if the coating amount is too small, the coating thickness is reduced, and the sealing by the curing of the UV coating agent by UV irradiation described later cannot be appropriately performed. Here, a coating thickness which can be sealed with an appropriate hardening strength is achieved.

該抵接後,用上下的加熱器63c、64加熱OLED基板22;及密封基板17到指定溫度使雙方的基板22、17更密著。 After the contact, the OLED substrate 22 is heated by the upper and lower heaters 63c and 64; and the sealing substrate 17 is brought to a predetermined temperature to make the substrates 22 and 17 of the both substrates closer together.

UV照射器71,為如上述般照射UV到挾著UV塗布劑並密著的OLED基板22與密封基板17,使UV 塗布劑硬化,讓OLED基板22更強硬地密封在密封基板17a。但是,上述的硬化,是具有可撓性的硬化。 The UV illuminator 71 is an OLED substrate 22 and a sealing substrate 17 which are irradiated with UV to the UV coating agent and sealed as described above to make UV The coating agent is hardened to seal the OLED substrate 22 more strongly to the sealing substrate 17a. However, the above hardening is hardening with flexibility.

但是,各膜21、24的搬送動作、以蛇行檢測感測器40蛇行檢測所為之蛇行補正動作、XYZθ移動機構63d的外框床台63a及平板床台63b的移動動作、分配部65的塗布動作、攝像部66的攝影動作、對OLED基板22之密封基板17的對位動作、真空壓密封機構62的真空處理動作、加熱器63c、64a的加熱動作、UV照射器71所致的UV照射作動等之有關有機EL密封裝置60的動作控制,係藉由圖4所表示的控制裝置101來進行。 However, the conveyance operation of each of the films 21 and 24, the meandering correction operation by the meandering detection sensor 40, the movement operation of the outer frame bed 63a and the flat bed 63b of the XYZθ moving mechanism 63d, and the application of the distribution unit 65 are performed. Operation, imaging operation of the imaging unit 66, alignment operation of the sealing substrate 17 of the OLED substrate 22, vacuum processing operation of the vacuum pressure sealing mechanism 62, heating operation of the heaters 63c and 64a, and UV irradiation by the UV irradiator 71 The operation control of the organic EL sealing device 60, such as actuation, is performed by the control device 101 shown in FIG.

<第2實施型態的動作> <Operation of Second Embodiment>

接著,參閱圖7及圖8所表示的流程,說明利用圖6所表示的有機EL密封裝置60以密封基板17密封OLED基板22之動作。尚且,說明中之各動作控制,是以控制裝置101來進行。 Next, an operation of sealing the OLED substrate 22 with the sealing substrate 17 by the organic EL sealing device 60 shown in FIG. 6 will be described with reference to the flow shown in FIGS. 7 and 8. Further, each of the operation control in the description is performed by the control device 101.

在圖7所表示的步驟S11中,經由人員使密封基板17設定到圖6所表示之平板床台63b之上的話,平板床台63b回到用以進行貼合密封基板17之指定位置,利用分配部65使UV塗布劑塗布到密封基板17的頂面。 In the step S11 shown in FIG. 7, when the sealing substrate 17 is set on the flat bed table 63b shown in FIG. 6, the flat bed table 63b is returned to the designated position for bonding the sealing substrate 17, and the use is made. The dispensing portion 65 applies a UV coating agent to the top surface of the sealing substrate 17.

另一方面,在步驟S12中,從如在圖6以箭頭Y1所表示般未圖示之前製程開始,以捲繞方式所搬送著的OLED基材膜21,乃是通過各滾子30~35、35a、 36、37、38、39、41、43,以最下游段的膜捲繞部48一邊被捲繞一邊被搬送。此時,對膜21,利用浮動滾子38、39施加張力而不會產生鬆弛,更進一步,以蛇行檢測感測器40進行蛇行補正,來適當地進行搬送。 On the other hand, in step S12, the OLED base film 21 conveyed in a winding manner from the start of the process as indicated by an arrow Y1 in Fig. 6 is passed through the rollers 30 to 35. 35a, 36, 37, 38, 39, 41, and 43 are conveyed while the film winding portion 48 of the most downstream portion is wound. At this time, tension is applied to the film 21 by the floating rollers 38 and 39 without slack, and further, the meandering detection sensor 40 performs meandering correction to appropriately perform the conveyance.

接著,在步驟S13中,被貼附到所搬送的OLED基材膜21之OLED基板22,到達上床台部64之底面側的指定位置的話,暫且停止並保持在指定位置。 Then, in step S13, the OLED substrate 22 attached to the transported OLED substrate film 21 reaches a predetermined position on the bottom surface side of the upper bed portion 64, and is temporarily stopped and held at a predetermined position.

該保持後,在步驟S14中,利用攝像部66拍攝上下之OLED基板22及密封基板17之雙方的標記。 After the hold, in step S14, the imaging unit 66 captures the marks of both the upper and lower OLED substrates 22 and the sealing substrate 17.

在步驟S15中,判斷該拍攝到之雙方的標記是否一致。其結果,被判斷成不一致(No)的情況下,在步驟S16中,利用XYZθ移動機構63d,XYZθ移動密封基板17設定到平板床台63b之外框床台63a,讓雙方的標記一致。該移動後,以上述步驟S14再度進行拍攝,以步驟S15的判斷判斷成一致(Yes)的話,以步驟S17,利用XYZθ移動機構63d外框床台63a朝上方移動。 In step S15, it is determined whether or not the marks of both of the captured images are identical. As a result, when it is judged that it is inconsistent (No), in step S16, the XYZθ moving mechanism 63d is used, and the XYZθ moving sealing substrate 17 is set to the frame bed 63a outside the flat bed table 63b, and the two marks are aligned. After the movement, the image is again taken in the above-described step S14, and if it is determined to be "Yes" by the determination in the step S15, the outer frame bed 63a is moved upward by the XYZθ moving mechanism 63d in the step S17.

經由該移動,外框床台63a,如圖6中以破斷線框所表示,收容OLED基板22到外框床台63a的凹框內後凹框的上端被抵接到上床台部64的底面而沒有隙縫,形成密閉空間。 Through the movement, the outer frame bed 63a, as shown by the broken wire frame in FIG. 6, receives the OLED substrate 22 into the concave frame of the outer frame bed 63a, and the upper end of the concave frame is abutted to the upper bed portion 64. The bottom surface has no slits to form a closed space.

之後,在圖8所表示的步驟S18中,以真空壓密封機構62之真空泵(未圖示),抽出該密閉空間的空氣(氮氣),成為真空狀態。 Thereafter, in step S18 shown in FIG. 8, the air (nitrogen) in the sealed space is evacuated by a vacuum pump (not shown) of the vacuum pressure sealing mechanism 62, and the vacuum state is obtained.

接著,在步驟S19,在成為該真空狀態之密閉空間 中,平板床台63b被移動到上方,密封基板17的UV塗布劑的塗布面被抵接到OLED基板22保持成指定狀態。 Next, in step S19, in the closed space that becomes the vacuum state In the middle, the flat bed 63b is moved upward, and the coated surface of the UV coating agent of the sealing substrate 17 is held in contact with the OLED substrate 22 in a specified state.

該抵接後,在步驟S20中,以上下的加熱器63c、64a,OLED基板22及密封基板17被加熱到指定溫度,雙方之基板22、17密著。 After the contact, in step S20, the upper and lower heaters 63c and 64a, the OLED substrate 22, and the sealing substrate 17 are heated to a predetermined temperature, and the substrates 22 and 17 are adhered to each other.

之後,在步驟S21中,解除真空狀態同時使平板床台63b下降,更進一步使外框床台63a下降,回到對平板床台63b之密封基板17的設定位置。 Thereafter, in step S21, the vacuum state is released and the flat bed table 63b is lowered, and the outer frame bed 63a is further lowered to return to the set position of the sealing substrate 17 of the flat bed 63b.

還有,外框床台63a下降後,在步驟S22中,OLED基材膜21從停止狀態成為搬送狀態,到達UV照射器71的話再度成為停止狀態。 When the outer frame bed 63a is lowered, in step S22, the OLED base film 21 is brought into a transport state from the stopped state, and when it reaches the UV irradiator 71, it is again in a stopped state.

此時,在上床台部64之指定位置,下一個的OLED基板22到達並成為停止保持狀態,針對該OLED基板22,進行與上述步驟S11~S20同樣的處理。 At this time, at the designated position of the upper bed portion 64, the next OLED substrate 22 arrives and is stopped, and the same processing as the above-described steps S11 to S20 is performed on the OLED substrate 22.

接著,在步驟S23中,利用UV照射器71,照射UV到挾著UV塗布劑並已密著之OLED基板22與密封基板17。藉此,硬化UV塗布劑,成為以密封基板17a穩固地密封OLED基板22之狀態。經此製作製品膜24。該製品膜24,係在步驟S24中,以膜捲繞部48被捲繞成捲筒狀。 Next, in step S23, UV is applied to the OLED substrate 22 and the sealing substrate 17 which are adhered to the UV coating agent by the UV irradiator 71. Thereby, the UV coating agent is hardened to be in a state in which the OLED substrate 22 is firmly sealed by the sealing substrate 17a. The product film 24 is thus produced. The product film 24 is wound into a roll shape in the film winding portion 48 in step S24.

<第2實施型態的效果> <Effects of the second embodiment>

根據本實施型態的圖6所示的有機EL密封裝置60,可以得到如下的效果。 According to the organic EL sealing device 60 shown in Fig. 6 of the present embodiment, the following effects can be obtained.

有機EL密封裝置60具備:搬送手段,係把以在搬送方向上預定的間隔貼附複數個OLED基板22到長條狀的基板膜21a而成之OLED基材膜21,使用複數個滾子以捲繞方式做搬送;上床台部64,係被配置到OLED基材膜21的上方;下床台部63,係被配置到介隔了OLED基材膜21之上床台部64的下方對向位置,載置利用膜材料或者是玻璃材所成之密封基板17(載置到為下床台部63的構成要件之平板床台63b);XYZθ移動機構63d,係作為讓下床台部63自在地移動在為上下前後左右及旋轉方向之XYZθ方向之移動手段;分配部65,係作為塗布UV塗布劑之塗布手段,該UV塗布劑在被載置到上床台部64之密封基板17上且因紫外線而硬化;以及UV照射器71,係作為照射紫外線(UV)之UV照射手段。 The organic EL sealing device 60 includes a transporting means for attaching a plurality of OLED substrates 22 to a long substrate film 21a at a predetermined interval in the transport direction, and using a plurality of rollers. The winding method is carried out; the upper bed portion 64 is disposed above the OLED substrate film 21; and the lower bed portion 63 is disposed below the bed portion 64 of the OLED substrate film 21 At a position, a sealing substrate 17 made of a film material or a glass material (a flat bed table 63b placed on a constituent element of the lower bed portion 63) is placed; the XYZθ moving mechanism 63d serves as a lower bed portion 63. The moving means is moved in the XYZθ direction which is the up, down, left, right, left, and right directions of rotation, and the distribution part 65 is a coating means for applying a UV coating agent which is placed on the sealing substrate 17 of the upper bed portion 64. Further, it is hardened by ultraviolet rays; and the UV irradiator 71 is a UV irradiation means for irradiating ultraviolet rays (UV).

搬送手段,係使用各導引滾子30~35、35a、35b、36、37、浮動滾子38、39、夾持滾子41、43、膜捲繞部48之各滾子而構成。 The transport means is constituted by the respective rollers of the guide rollers 30 to 35, 35a, 35b, 36, 37, the floating rollers 38, 39, the pinch rollers 41, 43, and the film winding portion 48.

接著,搬送手段係停止所被搬送之OLED基材膜21在上床台部64的下方之預定的位置來得以配置OLED基板22;XYZθ移動機構63d構成:握持住把載置了密封基板17之下床台部63朝上方向移動,在該下床台部63與上床台部64之間,密封基板17介隔著UV塗布劑抵接到上述已停止之OLED基板22,用UV照射器71照射UV到該已抵接的OLED基板22及密封基板17間的UV塗布劑。 Next, the transport means stops the predetermined position of the OLED substrate film 21 to be conveyed below the upper bed portion 64 to arrange the OLED substrate 22; the XYZθ moving mechanism 63d is configured to hold the sealed substrate 17 The lower bed portion 63 moves upward, and between the lower bed portion 63 and the upper bed portion 64, the sealing substrate 17 is in contact with the stopped OLED substrate 22 via the UV coating agent, and the UV illuminator 71 is used. UV is applied to the UV coating agent between the abutted OLED substrate 22 and the sealing substrate 17.

根據該構成,可以把貼合密封基板17到OLED基板22而密封的製造作業,於以捲繞方式所搬送的OLED基材膜21之各OLED基板22,把被載置到下床台部63之密封基板17移動到上方抵接到OLED基板22,握持在與上床台部64之間並貼合。從而,用批次處理,可以進行對OLED基板22的密封基板17的密封作業,所以可以進行高效率製造作業。 According to this configuration, the manufacturing operation of sealing the sealing substrate 17 to the OLED substrate 22 can be performed on the OLED substrate 22 of the OLED substrate film 21 that is transported by the winding method, and placed on the lower bed portion 63. The sealing substrate 17 is moved upward to abut against the OLED substrate 22, and is held between and attached to the upper bed portion 64. Therefore, the sealing operation of the sealing substrate 17 of the OLED substrate 22 can be performed by batch processing, so that a high-efficiency manufacturing operation can be performed.

還有,更進一步具備把下床台部63及上床台部64的對向空間成為真空狀態之真空手段的真空泵(未圖示),在下床台部63與上床台部64之間,在密封基板17及OLED基板22被握持成抵接狀態之前,利用真空泵把上述的對向空間成為真空狀態,構成在該真空狀態中進行該握持。 Further, a vacuum pump (not shown) that is a vacuum means for bringing the opposing space of the bed bottom portion 63 and the upper bed portion 64 into a vacuum state is provided, and is sealed between the lower bed portion 63 and the upper bed portion 64. Before the substrate 17 and the OLED substrate 22 are held in contact with each other, the above-described opposing space is brought into a vacuum state by a vacuum pump, and the holding is performed in the vacuum state.

根據該構成,可以在真空中貼合密封基板17到OLED基板22的緣故,在雙方的基板17、22間不會介隔有氣泡,可以把雙方貼合成密著狀態。 According to this configuration, the sealing substrate 17 can be bonded to the OLED substrate 22 in a vacuum, and bubbles are not interposed between the substrates 17 and 22, and both of them can be bonded to each other.

還有,介隔有對OLED基板22的UV塗布劑之密封基板17的抵接,係構成維持UV塗布劑的塗布厚度在預定厚度以上。 Further, the contact with the sealing substrate 17 of the UV coating agent for the OLED substrate 22 is configured to maintain the coating thickness of the UV coating agent at a predetermined thickness or more.

根據該構成,在OLED基板22與密封基板17之間介隔有指定厚度以上的UV塗布劑的緣故,在以UV照射硬化了UV塗布劑之際,可以在使密封基板17平坦地貼合到OLED基板22的狀態下硬化。 According to this configuration, a UV coating agent having a predetermined thickness or more is interposed between the OLED substrate 22 and the sealing substrate 17, and when the UV coating agent is cured by UV irradiation, the sealing substrate 17 can be flatly bonded to The OLED substrate 22 is hardened in the state.

還有,更進一步具備作為拍攝附在OLED基 板22之對位用的標記、及附在密封基板17之對位用的標記之雙方的拍攝手段之攝像部66;構成在OLED基板22及密封基板17之雙方握持成抵接狀態之前,以XYZθ移動機構63d,使載置了密封基板17之下床台部63移動,使得以前述攝像部66而被拍攝之雙方的標記一致成在預定的對向狀態。 Also, it is further equipped as a film attached to the OLED base. The imaging unit 66 for the alignment of the plate 22 and the imaging means attached to both of the alignment marks of the sealing substrate 17; before the OLED substrate 22 and the sealing substrate 17 are held in contact with each other, The bed portion 63 below the sealing substrate 17 is moved by the XYZθ moving mechanism 63d so that the marks of both of the images captured by the imaging unit 66 are aligned in a predetermined opposite state.

根據該結構,可以使OLED基材膜21上的OLED基板22、與被載置到下床台部63之密封基板17之雙方,一致成指定的對向狀態。 According to this configuration, both of the OLED substrate 22 on the OLED base film 21 and the sealing substrate 17 placed on the lower bed portion 63 can be aligned in a predetermined opposite state.

還有,OLED基板22與密封基板17的形狀,如上述,密封基板17方為較大之相似形狀。 Further, the shape of the OLED substrate 22 and the sealing substrate 17 is as large as the sealing substrate 17 as described above.

藉此,在使OLED基板22與密封基板17之雙方對向之際,雙方為相似形狀的緣故,對合雙方的中心的話可以進行高精度對位。 As a result, when both the OLED substrate 22 and the sealing substrate 17 are opposed to each other, the two sides have a similar shape, and the center of both sides can be aligned with high precision.

還有,構成更進一步具備:作為檢測用搬送手段所搬送的OLED基材膜21的蛇行並進行蛇行補正之蛇行檢測補正手段之蛇行檢測感測器40。 In addition, the configuration further includes a meandering detecting sensor 40 that is a serpentine detecting and correcting means for performing serpentine correction of the OLED base film 21 conveyed by the detecting transport means.

根據該構成,可以以直線狀態搬送OLED基材膜21的緣故,可以在適當的位置進行膜21上的OLED基板22的停止等。 According to this configuration, the OLED base film 21 can be conveyed in a linear state, and the OLED substrate 22 on the film 21 can be stopped at an appropriate position.

尚且,本發明並不限定於上述的實施型態,包含有各式各樣的變形例。例如,上述的實施型態係為了容易理解地說明本發明而詳細說明,未必會限定在具備已說明之全部的構成。又,可以把某一實施型態的構成的一 部分置換到另一實施型態的構成,還有,亦可在某一實施型態的構成加上另一實施型態的構成。又,有關各實施型態的構成的一部分,是可以追加、刪除、置換其他的構成。 Furthermore, the present invention is not limited to the above-described embodiments, and various modifications are included. For example, the above-described embodiments are described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to having all of the configurations described above. Also, one of the constitutions of a certain implementation type can be The configuration may be partially replaced with another embodiment, and a configuration of another embodiment may be added to the configuration of one embodiment. Further, a part of the configuration of each embodiment may be added, deleted, or replaced with another configuration.

還有,上述之各個構成、功能、處理部(控制部)、處理手段等,係亦可把這些的一部分或者是全部,經由以例如積體電路來設計等以硬體來實現。還有,上述之各個構成、功能等,係亦可經由處理器把實現各個功能之程式予以解析執行的方式,用軟體來實現。實現各功能之程式、表格、檔案等之資訊,可以放置在記憶體、硬碟、或SSD(固態裝置)等之記錄裝置,或者是,IC(積體電路)卡、SD(數位安全記憶體)卡、DVD(數位多功能光碟)等之記錄媒體。 Further, each of the above-described configurations, functions, processing units (control units), processing means, and the like may be realized by hardware or a part or all of them, for example, by designing an integrated circuit or the like. Further, each of the above-described configurations, functions, and the like may be realized by software by means of a processor that analyzes and executes a program for realizing each function. Information on programs, tables, files, etc. for each function can be placed in a recording device such as a memory, a hard disk, or an SSD (Solid State Device), or an IC (Integrated Circuit) card or SD (digital security memory) ) Recording media such as cards and DVDs (digital versatile discs).

還有,控制線或資訊線係示出考慮到說明上必要者,但製品上未必要示出全部的控制線或資訊線。實際上亦可考慮到相互連接幾乎全部的構成者。 Also, the control line or the information line shows that it is necessary to take into account the description, but it is not necessary to show all the control lines or information lines on the product. In fact, it is also possible to consider the fact that almost all of the constituents are connected to each other.

更進一步,亦可為密封基板17貼附到OLED基材膜21,OLED基板22被設定到轉寫滾子52或者是外框床台63a之構成者。 Further, the sealing substrate 17 may be attached to the OLED substrate film 21, and the OLED substrate 22 is set to the composition of the transfer roller 52 or the frame bed 63a.

10‧‧‧有機EL密封裝置 10‧‧‧Organic EL Sealing Device

17、17a‧‧‧密封基板 17, 17a‧‧‧ sealing substrate

21‧‧‧OLED基材膜 21‧‧‧OLED substrate film

22‧‧‧OLED基板(第1基板) 22‧‧‧OLED substrate (first substrate)

24‧‧‧製品膜 24‧‧‧Product film

48‧‧‧膜捲繞部 48‧‧‧ Film winding department

30、31、32、33、34、35、36、37‧‧‧導引滾子(搬送手段) 30, 31, 32, 33, 34, 35, 36, 37‧‧‧ guide rollers (transport means)

39‧‧‧浮動滾子(搬送手段) 39‧‧‧Floating roller (transport means)

41~43‧‧‧夾持滾子(搬送手段) 41~43‧‧‧Clamping roller (transport means)

45a、45b‧‧‧加熱滾子(加熱手段) 45a, 45b‧‧‧heating rollers (heating means)

52‧‧‧轉寫滾子 52‧‧‧Transfer roller

40‧‧‧蛇行檢測感測器(蛇行補正手段) 40‧‧‧Snake detection sensor (snake correction method)

51‧‧‧密封基板貼附機構(旋轉移動手段) 51‧‧‧Seal substrate attachment mechanism (rotary movement means)

53‧‧‧支撐部(旋轉移動手段) 53‧‧‧Support (rotary movement means)

54‧‧‧旋轉軸 54‧‧‧Rotary axis

Claims (10)

一種有機EL密封裝置,係具備:搬送手段,係把以在搬送方向上預定的間隔貼附複數個有機EL元件製作用的第1基板到長條狀的膜而成之基材膜,以捲繞方式做搬送;轉寫滾子,係在滾子環繞方向以與前述間隔同間隔貼附利用膜材料所製成之複數個有機EL元件製作用的第2基板;以及旋轉移動手段,係使前述轉寫滾子自在地旋轉驅動且移動在與前述搬送方向垂直的上下方向;利用前述旋轉移動手段,移動前述轉寫滾子,把被貼附到該轉寫滾子之第2基板抵接到被貼附到前述基材膜之第1基板,使該旋轉移動手段所致之該轉寫滾子的旋轉動作、與前述搬送手段所致之該基材膜的搬送動作同步,把該第2基板貼合到該第1基板,藉由另一方密封其中一方。 An organic EL sealing device is provided with a substrate which is formed by attaching a plurality of first substrates for producing an organic EL element to a long film at a predetermined interval in the transport direction. The transfer method is a transfer of a roller, and a second substrate for producing a plurality of organic EL elements produced by using a film material is attached to the roller circumferential direction at the same interval as the gap; and a rotary moving means is used. The transfer roller is rotatably driven and moved in a vertical direction perpendicular to the conveyance direction; the transfer roller is moved by the rotation moving means to abut the second substrate attached to the transfer roller The first substrate to be attached to the base film, the rotation operation of the transfer roller by the rotational movement means, and the transfer operation of the base film by the transfer means are synchronized 2 The substrate is bonded to the first substrate, and the other is sealed by the other. 如請求項1之有機EL密封裝置,其中,前述第1基板為OLED基板,前述第2基板為密封基板。 The organic EL sealing device of claim 1, wherein the first substrate is an OLED substrate, and the second substrate is a sealing substrate. 如請求項2之有機EL密封裝置,其中,前述旋轉移動手段,係構成:移動前述轉寫滾子,把貼附在該轉寫滾子的密封基板的端抵接到前述OLED基板的端,以轉寫滾子的旋轉動作從該已抵接的該OLED基板之其中一端朝向另一端貼合該密封基板。 The organic EL sealing device according to claim 2, wherein the rotary moving means is configured to move the transfer roller to abut the end of the sealing substrate attached to the transfer roller to the end of the OLED substrate, The sealing substrate is bonded to the other end from the one end of the OLED substrate that has been abutted by the rotation of the transfer roller. 如請求項2或3之有機EL密封裝置,其中,使用在前述搬送手段之滾子,係在以前述密封基板密封了貼附到前述基材膜之OLED基板的狀態下,構成具有在前述搬送方向可以通過從該基材膜突出成凸狀的OLED基板及密封基板之凹部。 The organic EL sealing device according to claim 2 or 3, wherein the roller used in the conveying means is configured to have the OLED substrate adhered to the base film by the sealing substrate The direction may be formed by projecting a convex OLED substrate and a concave portion of the sealing substrate from the base film. 如請求項2或3之有機EL密封裝置,其中,構成貼合前述密封基板到前述OLED基板的力,比貼附該密封基板到前述轉寫滾子的力還要強。 The organic EL sealing device according to claim 2 or 3, wherein a force constituting the sealing substrate to the OLED substrate is stronger than a force for attaching the sealing substrate to the transfer roller. 如請求項2或3之有機EL密封裝置,其中更具備:在前述密封基板貼合到已貼附在前述基材膜之OLED基板之密封狀態下,加熱該密封基板使其硬化之加熱手段。 The organic EL sealing device according to claim 2 or 3, further comprising: a heating means for heating the sealing substrate to be cured in a sealed state in which the sealing substrate is bonded to an OLED substrate adhered to the substrate film. 一種有機EL密封裝置,係具備:搬送手段,係把以在搬送方向上預定的間隔貼附複數個有機EL元件製作用的第1基板到長條狀的膜而成之基材膜,以捲繞方式做搬送;上床台部,係被配置到前述基材膜的上方;下床台部,係被配置到介隔有前述基材膜之前述上床台部的下方對向位置,載置有機EL元件製作的第2基板;移動手段,係把前述下床台部自在地移動在上下前後左右及旋轉方向;塗布手段,係塗布UV塗布劑,該UV塗布劑在被載 置到前述下床台部之密封基板上且因紫外線而硬化;以及UV照射手段,係照射紫外線;前述搬送手段係停止所被搬送之前述基材膜在前述上床台部的下方之預定的位置來得以配置前述第1基板;前述移動手段構成:握持住把載置了前述第2基板之下床台部朝上方向移動,在該下床台部與前述上床台部之間,前述第2基板介隔著前述UV塗布劑抵接到前述已停止之第1基板,用前述UV照射手段照射紫外線到該已抵接的第1基板及第2基板間的UV塗布劑;前述第1基板為OLED基板,前述第2基板為密封基板;該有機EL密封裝置更具備:拍攝手段,係拍攝附在前述OLED基板之對位用的標記、及附在前述密封基板之對位用的標記之雙方;構成在前述OLED基板及前述密封基板之雙方握持成抵接狀態之前,以前述移動手段,使載置了該密封基板之前述下床台部移動,使得以前述拍攝手段而被拍攝之雙方的標記一致成在預定的對向狀態。 An organic EL sealing device is provided with a substrate which is formed by attaching a plurality of first substrates for producing an organic EL element to a long film at a predetermined interval in the transport direction. The upper bed portion is disposed above the base film; the lower bed portion is disposed at a position opposite to the upper bed portion of the base film interposed therebetween, and the organic portion is placed The second substrate produced by the EL element; the moving means is to move the lower bed portion freely in the up, down, left, right, left, and right directions, and in the direction of rotation; and the coating means applies a UV coating agent, and the UV coating agent is loaded. And the ultraviolet irradiation means is applied to the sealing substrate of the lower bed portion; and the UV irradiation means irradiates the ultraviolet rays; and the conveying means stops the predetermined position of the substrate film to be conveyed below the upper bed portion. The first substrate is disposed, and the moving means is configured to move the bed portion below the second substrate and move upward, and between the lower bed portion and the upper bed portion, the (2) the substrate is adhered to the first substrate that has been stopped via the UV coating agent, and the UV coating agent is irradiated to the UV coating agent between the first substrate and the second substrate by the UV irradiation means; the first substrate In the OLED substrate, the second substrate is a sealing substrate, and the organic EL sealing device further includes an imaging means for capturing a mark for alignment of the OLED substrate and a mark for alignment of the sealing substrate. Before both the OLED substrate and the sealing substrate are held in contact with each other, the moving bed means moves the lower bed portion on which the sealing substrate is placed, so that the photographing is performed Section being taken by both parties agreed to a predetermined mark on the state. 如請求項7之有機EL密封裝置,其中,更具備:真空手段,係把前述下床台部及前述上床台部的對向空間做成真空狀態;在前述下床台部與前述上床台部之間,在前述密封基板及前述OLED基板被握持成抵接狀態之前,利用前述真空手段把前述對向空間成為真空狀態,構成在該真空狀態 中進行該握持。 The organic EL sealing device according to claim 7, further comprising: a vacuum means for forming a vacuum state of the opposing space of the lower bed portion and the upper bed portion; and the lower bed portion and the upper bed portion Before the sealing substrate and the OLED substrate are held in contact with each other, the opposing space is brought into a vacuum state by the vacuum means, and the vacuum state is formed. This grip is made in the middle. 如請求項1之有機EL密封裝置,其中更具備:蛇行檢測補正手段,係檢測以前述搬送手段所搬送的前述基材膜的蛇行並進行蛇行補正。 The organic EL sealing device according to claim 1, further comprising: a meandering detection correcting means for detecting a meandering of the base film conveyed by the conveying means and performing meandering correction. 一種有機EL密封裝置,係具備:搬送手段,係把以在搬送方向上預定的間隔貼附複數個有機EL元件製作用的第1基板到長條狀的膜而成之基材膜,以捲繞方式做搬送;上床台部,係被配置到前述基材膜的上方;下床台部,係被配置到介隔有前述基材膜之前述上床台部的下方對向位置,載置有機EL元件製作的第2基板;移動手段,係把前述下床台部自在地移動在上下前後左右及旋轉方向;塗布手段,係塗布UV塗布劑,該UV塗布劑在被載置到前述下床台部之密封基板上且因紫外線而硬化;以及UV照射手段,係照射紫外線;前述搬送手段係停止所被搬送之前述基材膜在前述上床台部的下方之預定的位置來得以配置前述第1基板;前述移動手段構成:握持住把載置了前述第2基板之下床台部朝上方向移動,在該下床台部與前述上床台部之間,前述第2基板介隔著前述UV塗布劑抵接到前述已停止之第1基板,用前述UV照射手段照射紫外線到該已抵接的第1基板及第2基板間的UV塗布劑; 該有機EL密封裝置更具備:蛇行檢測補正手段,係檢測以前述搬送手段所搬送的前述基材膜的蛇行並進行蛇行補正。 An organic EL sealing device is provided with a substrate which is formed by attaching a plurality of first substrates for producing an organic EL element to a long film at a predetermined interval in the transport direction. The upper bed portion is disposed above the base film; the lower bed portion is disposed at a position opposite to the upper bed portion of the base film interposed therebetween, and the organic portion is placed a second substrate produced by the EL element; the moving means is to move the lower bed portion freely in the up, down, left, right, left, and right directions, and in the direction of rotation; and the coating means applies a UV coating agent, and the UV coating agent is placed on the bed The sealing substrate of the table portion is cured by ultraviolet rays; and the UV irradiation means irradiates the ultraviolet rays; and the conveying means stops the predetermined position of the substrate film to be conveyed below the upper bed portion. a substrate, wherein the moving means is configured to move the bed portion below the second substrate and move upward, and between the lower bed portion and the upper bed portion, the second substrate is interposed The aforementioned UV The coating agent abuts against the first substrate that has been stopped, and irradiates ultraviolet rays to the UV coating agent between the first substrate and the second substrate that have been contacted by the UV irradiation means; The organic EL sealing device further includes a meandering detection correcting means for detecting a meandering of the base film conveyed by the conveying means and performing meandering correction.
TW102143642A 2012-12-06 2013-11-29 Organic electroluminescent light sealing device TWI539638B (en)

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CN103855328B (en) 2016-08-17
CN103855328A (en) 2014-06-11

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