JP2011192901A - Substrate treatment method, substrate treatment apparatus, manufacturing method of display element, and manufacturing apparatus of display element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment method capable of improving a yield. <P>SOLUTION: The substrate treatment method includes a first step in which a first substrate FB1 including a first process region T1 is aligned with a second substrate FB2 which includes a second process region T2, and a second step in which the first process region of the first substrate is laminated with the second process region of the second substrate at a position where the first substrate and the second substrate cross each other. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing method, a substrate processing apparatus, a display element manufacturing method, and a display element manufacturing apparatus.

  For example, an organic electroluminescence (organic EL) element is known as a light-emitting element constituting a display element used in a display device or the like. The organic EL element has an anode and a cathode on a substrate and an organic light emitting layer sandwiched between the anode and the cathode. In the organic EL element, holes are injected from an anode into an organic light emitting layer to combine holes and electrons in the organic light emitting layer, and display light can be obtained by emitted light at the time of the combination. In the organic EL element, an electric circuit connected to, for example, an anode and a cathode is formed on a substrate.

  As one of methods for manufacturing a display element, for example, a method called a roll-to-roll method (hereinafter simply referred to as “roll method”) is known (see, for example, Patent Document 1). In the roll method, a single long substrate wound around a roller on the substrate supply side is sent out, the substrate is transported while being wound up by a roller on the substrate recovery side, and wound after the substrate is sent out. In the processing apparatus, a light emitting layer, an anode, a cathode, an electric circuit, and the like constituting an organic EL element are sequentially formed on a substrate in a processing apparatus. In addition, for example, in such a roll system, a technique is disclosed in which a long first film and a long second film are continuously bonded along the conveyance direction of the film (for example, Patent Document 2). reference).

International Publication No. 2006/100868 Pamphlet International Publication No. 2006/103716 Pamphlet

  However, in the bonding technique as described above, for example, even when the first film has a region that affects the display characteristics, the first film and the second film are bonded together. Yield may be reduced.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a substrate processing method, a substrate processing apparatus, a display element manufacturing method, and a display element manufacturing apparatus capable of improving yield.

  According to the first aspect of the present invention, the first step of aligning the first substrate having the first processing region and the second substrate having the second processing region, and the first substrate and the second substrate are mutually There is provided a substrate processing method including a second step of bonding a first processing region of a first substrate and a second processing region of a second substrate at a crossing position.

  According to the second aspect of the present invention, there is provided a display element manufacturing method comprising the substrate processing method according to the first aspect and an element forming step of forming a display element on the first substrate.

  According to the third aspect of the present invention, the alignment apparatus for aligning the first substrate having the first processing region and the second substrate having the second processing region, and the first substrate and the second substrate are mutually There is provided a substrate processing apparatus having a bonding apparatus for bonding a first processing region of a first substrate and a second processing region of a second substrate at a crossing position.

  According to a fourth aspect of the present invention, there is provided a display element manufacturing apparatus including the substrate processing apparatus according to the third aspect and an element forming unit for forming a display element on the first substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the substrate processing method which can improve a yield can be provided.

The figure which shows the structure of the substrate processing apparatus which concerns on this embodiment. 1 is a schematic perspective view showing a configuration of a substrate processing apparatus according to an embodiment. The front view of the adsorption | suction stage 100 and bonding apparatus ST which concern on this embodiment. The top view which looked at bonding apparatus ST in this embodiment from the -Z side. The front view in the bonding position by this embodiment. The figure which shows the structure of the substrate processing apparatus which concerns on 2nd Embodiment.

  Hereinafter, an embodiment of a substrate processing method, a substrate processing apparatus, a display element manufacturing method, and a display element manufacturing apparatus according to the present invention will be described with reference to FIGS.

(First embodiment)
The substrate processing apparatus FPA according to the present embodiment includes a substrate processing apparatus FPA1 that performs a predetermined process to form element portions and the like on the sheet substrate FB as shown in FIG. 1, and a substrate processing apparatus as shown in FIG. Mainly a sheet substrate (first substrate) FB1 subjected to predetermined processing by the apparatus FPA1 and a substrate processing apparatus FPA2 for bonding the sheet substrate (second substrate) FB2 subjected to predetermined processing by the substrate processing apparatus FPA1. It is configured as.

  As shown in FIG. 1, the substrate processing apparatus FPA1 in the substrate processing apparatus FPA is an apparatus that performs processing on the sheet substrate FB while conveying the sheet substrate FB formed in a strip shape in the longitudinal direction. As shown in FIG. 2, the substrate processing apparatus FPA2 in the substrate processing apparatus FPA includes a first processing region T1 in which the first element portion is formed on the sheet substrate FB1 by the substrate processing apparatus FPA1, and a sheet by the substrate processing apparatus FPA1. This is an apparatus for bonding the second processing region T2 in which the second element portion is formed to the substrate FB2. A plurality of element portions (each processing region) are formed at predetermined intervals on the sheet substrates FB1 and FB2.

Then, the first processing region T1 in the sheet substrate FB1 and the second processing region T2 in the sheet substrate FB2 are aligned and bonded in a predetermined positional relationship, thereby displaying a predetermined characteristic (eg, display characteristic). An element is formed.
The substrate processing apparatuses FPA1 and FPA2 are installed and used in a factory, for example.

  Hereinafter, in the description of the substrate processing apparatus FPA1, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the XYZ orthogonal coordinate system, the transport direction of the sheet substrate FB (longitudinal direction of the sheet substrate FB) is the X-axis direction, and the direction orthogonal to the transport direction of the sheet substrate FB (short direction of the sheet substrate FB) is the Y-axis direction. A direction orthogonal to each of the X-axis direction and the Y-axis direction is taken as a Z-axis direction. Similarly, in the description of the substrate processing apparatus FPA2, in the XYZ orthogonal coordinate system shown in FIG. 2, the transport direction of the sheet substrate FB1 (longitudinal direction of the sheet substrate FB1) is the X-axis direction, and the transport direction of the sheet substrate FB1 is An orthogonal direction (the short direction of the sheet substrate FB1 and the longitudinal direction of the sheet substrate FB2) is a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction is a Z-axis direction.

  As shown in FIG. 1, the substrate processing apparatus FPA1 includes a substrate supply unit SU that supplies a sheet substrate FB, a substrate processing unit PR (element forming unit) that processes the sheet substrate FB, and a substrate that collects the sheet substrate FB. It has a recovery part CL and a control part CONT that controls these parts.

  In the substrate processing apparatus FPA1, the sheet substrate FB to be processed has a dimension in the Y direction (short direction) of, for example, about 1 m to 2 m, and a dimension in the X direction (longitudinal direction) of, for example, 10 m or more. Yes. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the Y direction of the sheet substrate FB may be 50 cm or less, or 2 m or more. Moreover, the dimension of the X direction of the sheet | seat board | substrate FB may be 10 m or less. Note that the sheet substrates FB1 and FB2 are also similar to the sheet substrate FB, and are labeled according to the apparatus in which processing is performed.

  The substrate supply unit SU sends, for example, the sheet substrate FB wound in a roll shape to the substrate processing unit PR. The substrate supply unit SU is provided with, for example, a shaft around which the sheet substrate FB is wound, a rotation drive source that rotates the shaft, and the like. In addition, for example, a configuration in which a cover portion that covers the sheet substrate FB wound in a roll shape or the like may be provided.

  For example, the substrate collection unit CL collects the sheet substrate FB from the substrate processing unit PR in a roll shape. Similar to the substrate supply unit SU, the substrate recovery unit CL is provided with a shaft portion for winding the sheet substrate FB, a rotational drive source for rotating the shaft portion, a cover portion for covering the recovered sheet substrate FB, and the like. ing. In addition, when the sheet substrate FB is cut into a panel shape, for example, in the substrate processing unit PR, the sheet substrate FB is recovered in a state different from the rolled state, for example, collected in a stacked state. It may be configured to collect.

  The substrate processing unit PR transports the sheet substrate FB supplied from the substrate supply unit SU to the substrate recovery unit CL, and performs processing on the processing surface Fp of the sheet substrate FB in the course of transport (element formation step). The substrate processing unit PR includes a processing device 60, a transfer device 70 (transfer portion), and an alignment device (positioning device) 80.

  The processing device 60 includes various devices for forming, for example, an organic EL element on the processing surface Fp of the sheet substrate FB. As such an apparatus, for example, a partition forming apparatus for forming a partition on the processing surface Fp, a light emitting layer forming apparatus for forming a light emitting element, a semiconductor forming apparatus for forming each part of a transistor element, and electrode formation Examples thereof include a device, an insulating layer forming device, a wiring forming device for forming wiring, and a capacitive element forming device for forming a capacitive element.

  Examples of such a part forming apparatus include film forming apparatuses such as a droplet applying apparatus (for example, an ink jet coating apparatus and a spray coating apparatus), a vapor deposition apparatus, a sputtering apparatus, an exposure apparatus, a developing apparatus, and a surface modification. A device, a cleaning device, or the like is used. Each of these apparatuses is appropriately provided, for example, on the conveyance path of the sheet substrate FB.

  The conveyance device 70 includes a roller device R that conveys, for example, the sheet substrate FB to the substrate recovery unit CL in the substrate processing unit PR. For example, a plurality of roller devices R are provided along the conveyance path of the sheet substrate FB. A drive mechanism (not shown) is attached to at least some of the plurality of roller devices R. By rotating such a roller device R, the sheet substrate FB is conveyed in the X-axis direction. For example, a part of the plurality of roller devices R may be configured to be movable in a direction orthogonal to the transport direction.

  The alignment apparatus 80 performs an alignment operation on the sheet substrate FB. The alignment apparatus 80 includes an alignment camera 81 that detects the position state of the sheet substrate FB, and the sheet substrate FB based on the detection result of the alignment camera 81 in the X direction, Y direction, Z direction, θX direction, θY direction, and θZ direction. And a drive mechanism 82 for fine adjustment. The drive mechanism 82 can be configured to align the sheet substrate FB by adjusting the position of the roller device R, for example. Of course, other configurations may be used.

  The substrate processing apparatus FPA1 configured as described above manufactures element elements by a so-called roll-to-roll method (hereinafter referred to as a roll method) under the control of the control unit CONT.

  The substrate processing apparatus FPA2 includes a substrate supply unit SU1 that supplies a sheet substrate FB1 that has been subjected to a predetermined process in the substrate processing apparatus FPA1, a substrate recovery unit CL1 that recovers the sheet substrate FB1, and a predetermined process that is performed in the substrate processing apparatus FPA1. The substrate supply unit SU2 that supplies the sheet substrate FB2, the substrate recovery unit CL2 that collects the sheet substrate FB2, and the sheet substrate FB1 and the sheet substrate FB2 at a position where the sheet substrate FB1 and the sheet substrate FB2 cross each other (bonding position). To the bonding apparatus ST and the bonding apparatus ST for bonding the first processing region T1 of the sheet substrate FB1 and the second processing region T2 of the sheet substrate FB2 to and from the suction stage 100 at the bonding position. Defects with respect to the first processing region T1 of the sheet substrate FB1 being conveyed The second processing region T2 of the sheet substrate FB2 conveyed to the defect inspection apparatus E1 and the bonding apparatus ST for inspecting the area (for example, a defect that affects display characteristics or a candidate area thereof) by image detection, for example. Defect inspection apparatus E2 (see FIG. 5), substrate supply unit SU2, and substrate recovery unit CL2 for inspecting defect candidate regions (eg, defects that affect display characteristics and regions that are candidates) for image detection, for example The conveyance unit 110 conveys the sheet substrate FB2 while adjusting the stretched state of the sheet substrate FB2 between them.

  The substrate processing apparatus FPA2 includes a gas supply apparatus (gas supply apparatus) 111 that supplies an inert gas such as nitrogen gas between the adsorption stage 100 and the bonding apparatus ST, and a sheet substrate held by the adsorption stage 100. An adhesive supply unit 112 (see FIG. 5) that supplies an adhesive to the bonding position of the sheet substrate FB2 with respect to the FB1. Although it does not specifically limit as a kind of adhesive agent, A thermosetting type adhesive agent and a photocurable adhesive agent can be used, and the ultraviolet curable adhesive agent is used in this embodiment.

  The sheet substrates FB1 and FB2 may have a pressure-bonding property without using an adhesive, and may be bonded by pressurization using a pressurizer 122 described later. The supply position of the adhesive layer may be either the case of only the peripheral portion of the first processing region T1, or the entire surface adhesion applied over the entire surface. For example, when a liquid crystal layer is formed in the first and second processing regions, an adhesive layer is partially provided. When an organic EL layer is formed in the first and second processing regions, a partial structure is provided. In addition, any configuration of the adhesive layer or the entire adhesive layer may be used.

  The substrate supply unit SU1 sends, for example, the sheet substrate FB1 wound in a roll shape to the bonding apparatus ST. The substrate supply unit SU1 is provided with, for example, a shaft around which the sheet substrate FB is wound, a rotation drive source that rotates the shaft, and the like. Similarly, the substrate supply unit SU2 supplies the sheet substrate FB2 wound in a roll shape, for example, to the bonding apparatus ST. The substrate supply unit SU2 is provided with, for example, a shaft around which the sheet substrate FB is wound, a rotation drive source that rotates the shaft, and the like.

  The substrate recovery unit CL1 recovers the sheet substrate FB1 that has been subjected to the bonding process by the bonding apparatus ST, for example, in a roll shape. Similarly to the substrate supply unit SU1, the substrate recovery unit CL1 is provided with a shaft portion for winding the sheet substrate FB1, a rotational drive source that rotates the shaft portion, a cover portion that covers the recovered sheet substrate FB, and the like. ing. Similarly, the substrate recovery unit CL2 recovers the sheet substrate FB2 that has been subjected to the bonding process by the bonding apparatus ST, for example, in a roll shape. Similar to the substrate supply unit SU2, the substrate recovery unit CL2 is provided with a shaft portion for winding the sheet substrate FB2, a rotational drive source that rotates the shaft portion, a cover portion that covers the recovered sheet substrate FB, and the like. ing. In the bonding apparatus ST, when the sheet substrates FB1 and FB2 are cut into a panel shape, for example, the sheet substrates FB1 and FB2 are collected in a stacked state. The configuration may be such that the sheet substrate FB is collected.

FIG. 3 is a front view of the suction stage 100 and the bonding apparatus ST, and FIG. 4 is a plan view of the bonding apparatus ST viewed from the sheet substrates FB1 and FB2 side (−Z side).
The suction stage 100 sucks and holds the back surface of the sheet substrate FB1 having the first processing region T1, and is formed of a porous material such as porous ceramic whose surface (polished surface) is polished. A negative pressure suction device 101 is connected to the suction stage 100. The suction stage 100 sucks and holds the sheet substrate FB1 by a negative pressure supplied from the negative pressure suction device 101 through a hole opening in the polishing surface.

  Further, the suction stage 100 is provided with an ultraviolet irradiation device 102 that irradiates the adhesive supplied on the sheet substrate FB1 with ultraviolet rays and cures the adhesive.

  The bonding apparatus ST includes a suction device 121 provided to face the sheet substrate FB2, a pressure device 122 that supports the suction device 121 and pressurizes the sheet substrate FB2 through the suction device 121, the suction device 121, and the pressure device. An X stage 123 for driving 122 in the X axis direction, a Y stage 124 for driving the X stage 123 in the Y axis direction, a rotary stage 125 for driving the Y stage 124 in the θZ direction (rotation direction around the Z axis), and the sheet substrate FB1. , A sheet cutting device 126 that cuts at least one of FB2, and an alignment system 127 that measures marks formed on the sheet substrates FB1 and FB2. Note that the bonding device ST can also be moved in the Z direction by a Z driving device (not shown).

  Similar to the suction stage 100, the suction device 121 sucks and holds the back surface of the sheet substrate FB2 having the second processing region T2, and is porous such as porous ceramics whose surface (polishing surface) is polished. Made of material. Negative pressure is supplied to the suction device 121 from the utility supply unit 128, and the suction device 121 sucks and holds the sheet substrate FB2 through a hole opening in the polishing surface.

  The pressurizing device 122 has a pressure pressurizing chamber (not shown) formed by a balloon or the like to which air is supplied from the utility supply unit 128. The pressure pressurizing chamber has elasticity, and expands to the −Z side toward the sheet substrate FB2 according to the amount of air supplied to move the suction device 121 in the Z direction. A transparent rectangular tube-shaped holding frame 129 projects from the X stage 123 around the suction device 121 and the pressure device 122. The adsorption device 121 and the pressure device 122 move in the holding frame 129 in the Z direction.

The cutting device 126 is provided around the holding frame 129, and the tip thereof is disposed at a position that is substantially flush with the surfaces of the holding frame 129 and the suction mechanism 121.
A plurality of alignment systems 127 (three in FIG. 4) are provided outside the first and second processing regions and spaced apart from each other in the X direction and the Y direction. Are formed on the sheet substrates FB1 and FB2 by an independent driving mechanism (not shown) that is finely driven in the X, Y, and θZ directions independently of the suction device 121 and the pressure device 122. Can be measured. The measurement result by the alignment system 127 is output to the control unit CONT.

  As shown in FIG. 5, the conveying unit 110 is disposed on both sides in the Y direction across the bonding position of the sheet substrates FB1 and FB2, and adjusts the extending position of the sheet substrate FB2 at the bonding position; Roller portion that is provided at a position farther from the bonding position than the roller portion R1, and forms a slack as an extra length in the sheet substrate FB2 by moving in the Z direction, for example, as indicated by a two-dot chain line in FIG. And R2. The driving of the roller unit R2 is controlled by the control unit CONT.

  The substrate processing apparatus FPA configured as described above manufactures a display element (element substrate) by a so-called roll-to-roll method (hereinafter referred to as a roll method) under the control of the control unit CONT. Hereinafter, a process of manufacturing a display element using the substrate processing apparatus FPA having the above configuration will be described.

  First, in the substrate processing apparatus FPA1, the belt-shaped sheet substrate FB is wound around a roller provided in the substrate supply unit SU. In this wound state, the control unit CONT sends out the sheet substrate FB from the substrate supply unit SU, winds up the fed sheet substrate FB with a roller of the substrate collection unit CL, and conveys the sheet substrate FB.

  The control unit CONT uses the processing device 60 to appropriately transport the sheet substrate FB within the substrate processing unit PR by the transport device 70 of the substrate processing unit PR between the time when the sheet substrate FB is sent and the time when the sheet substrate FB is wound. The constituent elements of the display element are sequentially formed on the sheet substrate FB. When the processing by the processing device 60 is performed, the control unit CONT causes the alignment device 80 to align the sheet substrate FB.

  As described above, the sheet substrate FB on which the first element unit is formed in the first processing region by the processing apparatus 60 is set as the sheet substrate FB1 in the substrate supply unit SU1 in the substrate processing apparatus FPA2 after various inspection processes. Similarly, the sheet substrate FB on which the second element unit is formed in the second processing region by the processing apparatus 60 is set as the sheet substrate FB2 in the substrate supply unit SU2 in the substrate processing apparatus FPA2 after various inspection processes.

Next, the bonding process in the substrate processing apparatus FPA2 will be described.
Here, for the sheet substrates FB1 and FB2, it is assumed that processes other than the process related to bonding, including various inspection processes, have been completed. Further, in the inspection process, information on whether or not the film can be bonded in advance by inspecting the film formation defect and the patterning defect in the first processing region T1 and the second processing region T2 and the like. Information) is held in the control unit CONT together with position information (for example, positions of defect candidate areas) of the first processing area T1 and the second processing area T2 in the sheet substrates FB1 and FB2.

  When the bonding process is started, the suction stage 100 holds the back surface of the first processing region T1 to be bonded to the sheet substrate FB1. At this time, when there is a defect candidate region as described above on the sheet substrate FB1 (eg, the first element portion of the first processing region T1 at the bonding position is a preliminary inspection, process progress, defect information, pass / fail judgment, When the processing state such as the partition wall or pattern formation state is found to be defective, or when the defect inspection apparatus E1 detects that the sheet substrate FB1 itself or the first processing region T1 is defective) The sheet substrate FB1 is sent in the transport direction, the first processing region T1 having no defect (defect candidate region) is moved to the bonding position, and the back surface of the sheet substrate FB1 is sucked and held by the suction stage 100 in a smooth state.

  The delivery to the bonding position of the first processing region T1 is determined by the control unit CONT according to the rotation amount in the substrate recovery unit CL1, or the alignment system 127 measures the mark formed on the sheet substrate FB1. Any of the configurations determined by the control unit CONT according to the result may be used.

  Similarly, with respect to the sheet substrate FB2, the second processing region T2 to be bonded is sent to the bonding position, but the second element portion of the second processing region T2 at the bonding position is subjected to a preliminary inspection. When there is a defect candidate area as described above in FB2 (for example, when it is known that the processing state such as process progress, defect information, pass / fail judgment, partition wall or pattern formation state is defective, or defect inspection apparatus E2 If the sheet substrate FB2 itself or the second processing region T2 is detected to be defective), the sheet substrate FB2 is sent in the transport direction, and the second processing region T2 having no defect (defect candidate region) is bonded. Move to position.

The delivery to the bonding position of the second processing region T2 is determined by the control unit CONT according to the rotation amount in the substrate recovery unit CL2, or the alignment system 127 measures the mark formed on the sheet substrate FB2. Any of the configurations determined by the control unit CONT according to the result may be used.
Moreover, the time concerning conveyance can be shortened by performing the movement to the bonding position of these 1st process area | region T1 and 2nd process area | region T2 simultaneously.

  When the second processing region T2 is sent to the bonding position, the bonding apparatus ST is lowered, so that the back surface of the sheet substrate FB2 is sucked by the suction device 121 and held in a smooth state.

  When the sheet substrates FB1 and FB2 are sucked and held, the alignment system 127 simultaneously detects the marks on the sheet substrates FB1 and FB2, and the amount of displacement of the sheet substrates FB1 and FB2, that is, the first processing region T1 and the second processing. The amount of positional deviation between the areas T2 is measured. The control measure CONT calculates the movement amounts of the second processing region T2 in the X direction, the Y direction, and the θZ direction in order to correct the measured displacement amount.

Here, the control device CONT drives the roller portion R2 to generate a slack in the vicinity of the bonding position that does not hinder the movement of the second processing region T2.
In addition, you may select the location which forms slack according to the moving direction (or moving amount) of 2nd process area | region T2 calculated. For example, in FIG. 5, when the second processing region T2 is moved in the + Y direction, a slack (first extra length portion) is formed only on the −Y side, and the second processing region T2 is moved in the −Y direction. In some cases, a slack (second extra length portion) may be formed only on the + Y side, or a slack may be formed on both sides in the Y direction.

  Then, the control device CONT appropriately drives the X stage 123, the Y stage 124, and the rotary stage 125 to move the second processing region T2 by the calculated movement amount in each direction. Thereby, the first processing region T1 and the second processing region T2 are aligned on the XY plane.

  During the movement of the second processing region T2 in the alignment, an adhesive (photo-curable adhesive) is applied around the first processing region T1 from the adhesive supply unit 112 to the sheet substrate FB1 on the suction stage 100. Supplied. In this manner, supplying the adhesive while the second processing region T2 is being aligned can contribute to shortening the manufacturing time.

  When the alignment in the XY plane of the second processing region T2 and the supply of the adhesive to the sheet substrate FB1 are completed, the gas between the sheet substrates FB1 and FB2 at the bonding position is removed as shown in FIG. While supplying nitrogen gas by the supply device 111, air is supplied to the pressure pressurizing chamber in the pressurizing device 122 to increase the internal pressure. As a result, the pressure pressurizing chamber expands to move the suction device 121 along the holding frame 129 in the direction (−Z direction) toward the first processing region T1 of the sheet substrate FB1, and the sheet held by the suction device 121. The substrate FB2 is pressed against the sheet substrate FB1 held on the suction stage 100.

  Then, in a state where the sheet substrates FB1 and FB2 are pressurized, the adhesive is cured by irradiating the ultraviolet irradiation device 102 with ultraviolet rays. Thereby, the first processing region T1 and the second processing region T2 are bonded together. After that, the substrate having the second processing region T2 separated by cutting the periphery of the region bonded to the sheet substrate FB2 with the adhesive with the sheet cutting device 126 (hereinafter, the second processing region is appropriately used). The substrate T2) is transferred to the sheet substrate FB1. The cutting of the second processing region T2 is not limited to after being bonded to the first processing region T1, but the first processing region after being cut from the sheet substrate FB2 while being sucked and held by the suction device 121 before bonding. You may stick together with T1.

  Thereafter, the sheet substrate FB1 to which the second processing region substrate T2 is bonded is wound around the substrate recovery unit CL1, and is cut in substantially the same size as the second processing region substrate T2 in a subsequent process, whereby the display element is formed. It is formed. In addition, it is good also as a structure which cuts both the 1st process area | region T1 and the 2nd process area | region board | substrate T2 with the sheet cutting device 126 in the said bonding position, and carries it out with the conveying apparatus which is not shown in figure. Further, the sheet substrate FB2 in which the second processing region substrate T2 is cut and the frame portion remains is wound around the substrate recovery unit CL2.

  As described above, according to the present embodiment, since defects (defect candidate areas) can be processed without being bonded, the yield can be improved. In the present embodiment, since the first processing region T1 and the second processing region T2 are bonded after being aligned, the relative positional relationship between the first processing region T1 and the second processing region T2 is ensured. Thus, predetermined element characteristics (for example, display characteristics) expressed by the first element section and the second element section in cooperation can be obtained with certainty.

  In the present embodiment, the first processing region T1 and the second processing region T2 are bonded together while supplying an inert gas nitrogen gas between the first processing region T1 and the second processing region T2. Therefore, it is possible to exclude gas such as oxygen enclosed between the first processing region T1 and the second processing region T2, and the electrode forming the element portion is oxidized to generate device characteristics (eg, display characteristics). ) Can be suppressed. In this embodiment, since a porous material is used for the suction stage 100 and the suction device 121, the sheet substrates FB1 and FB2 are placed in the through holes at the time of suction as in the case where suction is performed using the through holes. Inconveniences such as suction and deformation can be avoided.

  The alignment with the first processing region T1 described above may be a procedure for adjusting the conveyance speed of the sheet substrate FB1 in addition to the driving of the X stage 123, the Y stage 124, and the rotary stage 125.

(Second Embodiment)
Next, a second embodiment of the substrate processing apparatus FPA will be described with reference to FIG.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, the description thereof is omitted, or apparatuses A and B for conveying the sheet substrate FB1 are omitted. The description will be simplified with the symbol.

  Since the second embodiment is different from the first embodiment in that a plurality of conveyance paths for the first sheet substrate FB1 are provided in parallel, this point will be mainly described below.

  As shown in FIG. 6, in the substrate processing apparatus FPA2 in the present embodiment, two conveyance paths for the sheet substrates FB1A and FB1B extending in the X direction are provided in parallel at intervals in the Y direction. The conveyance path of the sheet substrate FB2 is provided to extend in the Y direction so as to straddle the two conveyance paths of the sheet substrates FB1A and FB1B.

  Then, at the position (bonding position) where the transport path of the sheet substrates FB1A and FB1B and the transport path of the sheet substrate FB2 intersect, the suction stages 100A and 100B that suck and hold the sheet substrates FB1A and FB1B, and the bonding apparatus STA. And STB are provided (in FIG. 6, the bonding apparatuses STA and STB are simply illustrated). Further, gas supply devices 111A and 111B for supplying an inert gas between the sheet substrates FB1A and FB1B and the sheet substrate FB2 are provided in the vicinity of the suction stages 100A and 100B, respectively.

  Further, the transport unit 110 in the substrate processing apparatus FPA2 of the present embodiment includes a surplus length forming unit 115 that adjusts the surplus length of the sheet substrate FB2 between the bonding apparatuses STA and STB. The extra length forming unit 115 is disposed between the roller units R2 and R2 between the bonding apparatuses STA and STB, for example, and moves in the Z direction, for example, to form a slack as an extra length on the sheet substrate FB2. It consists of part R3.

  In the bonding step in the substrate processing apparatus FPA2 having the above configuration, the back surfaces of the first processing region T1 to be bonded are sucked and held by the suction stages 100A and 100B with respect to the sheet substrates FB1A and FB1B, respectively. At this time, when the first element portion of the first processing region T1 at the bonding position is a preliminary inspection and the sheet substrate FB2 has the above-described defect candidate regions (eg, process progress, defect information, pass / fail judgment, When the processing state such as the partition wall or pattern formation state is known to be defective, or the defect inspection apparatus E detects that the sheet substrate FB1A, FB1B itself or the first processing region T1 in each substrate is defective. In the case), the sheet substrates FB1A and FB1B are respectively sent in the transport direction, the first processing region T1 having no defect (defect candidate region) is moved to the bonding position, and suction is performed in a smooth state by the suction stages 100A and 100B. Hold.

  As for the sheet substrate FB2, the second processing region T2 to be bonded is sent to the first bonding position by the bonding apparatus STA and the second bonding position by the bonding apparatus STB, but at each bonding position. When the second element portion of the second processing region T2 is inspected in advance and the sheet substrate FB2 has the defect candidate regions as described above (eg, process progress, defect information, pass / fail judgment, partition wall and pattern formation state, etc. When the processing state is known to be defective, or when the defect inspection apparatus E2 detects that the sheet substrate FB2 itself or the second processing region T2 is defective), the sheet substrate FB2 is sent in the transport direction. Then, the second processing region T2 having no defect (defect candidate region) is moved to the bonding position.

  At this time, the defect-free second processing region T2 located on the front side in the conveyance direction is sent to the second bonding position, and the defect-free second processing region T2 located on the rear side in the conveyance direction is sent to the first bonding position. However, when there is a second processing region T2 having a defect between the second processing regions T2 having no defect, the roll portion R3 is moved to the −Z side to ensure a large extra length. Thereby, the second processing region T2 having no defect can be sent to the first and second bonding positions, respectively.

  In this way, at the first and second bonding positions, the conveyance of the sheet substrate FB2 can be temporarily stopped and bonded individually, but as described above, between the first and second bonding positions. By providing the surplus length forming portion 115 in the first processing region, even if there is a second processing region T2 having a defect between the second processing regions T2 having no defect, the first and second bonding positions can be simultaneously performed at the first. It becomes possible to paste the processing region T1 and the second processing region T2.

  Note that the bonding process between the first processing region T1 and the second processing region T2 at each bonding position is the same as in the first embodiment, and by adjusting the driving of the roller unit R2 in the transport unit 110. The slack amount (extra length) at the time of aligning the sheet substrate FB2 with respect to the second processing region T2 by the bonding apparatuses STA and STB can be adjusted.

  As described above, in this embodiment, in addition to obtaining the same operation and effect as those of the first embodiment, it is possible to improve the throughput by reducing the installation area, and to improve the first element portion and the second element. It is possible to minimize the residence time until the bonding process of the first element part or the second element part due to the time difference required for forming the part.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the second embodiment, two rows of conveyance paths for the sheet substrate FB1 are provided in parallel. However, the present invention is not limited to this, and a configuration in which three or more rows are provided may be used. Moreover, the structure which provides two or more conveyance paths of sheet | seat board | substrate FB2 may be sufficient. Even in this case, an extra length forming portion of the sheet substrate FB1 may be provided between the conveyance paths of the sheet substrate FB2. Further, the crossing angle of the conveyance paths of the sheet substrates FB1 and FB2 is not limited to a right angle, and for example, a parallelogram (rhombus) element substrate may be formed by crossing in an oblique direction.

  In the above embodiment, the mark formed on the sheet substrates FB1 and FB2 and measured by the alignment system 127 includes the positional information of the sheet substrates FB1 and FB2 and the first and second processing regions T1 and T2. However, the present invention is not limited to this. In addition to the mark, for example, specification information on the specification values of the sheet substrates FB, FB1, and FB2, process information based on the specification information, the sheet substrates FB, FB1, An IC chip having information such as identification information for identifying FB2 (eg, a type that can only be read, a type that can be read and written), and a one-dimensional or two-dimensional barcode formed from the above information A seal may be used, and the above-described extra length may be adjusted or the second processing region may be aligned based on at least one of these pieces of information.Examples of such a configuration include a configuration in which a one-dimensional or two-dimensional barcode is formed on the sheet substrates FB, FB1, and FB2, and a configuration in which an IC tag is embedded in the sheet substrates FB, FB1, and FB2. .

  The specification information includes, for example, the materials of the sheet substrates FB, FB1, and FB2, flexibility, heat resistance, wear resistance, thickness, friction coefficient, tension resistance, stretchability, tension, and expansion coefficient. . The stretchability may be a value for heat or tension applied to the sheet substrates FB, FB1, and FB2, or may be a value for heat and tension. In addition, the specification values include lyophilicity with a predetermined liquid attached to the sheet substrate FB, drying properties of the predetermined liquid on the sheet substrates FB, FB1, and FB2. The predetermined liquid includes, for example, liquid droplets ejected from the liquid droplet applying device, metal ink, electrically insulating ink, and a solution discharged from the liquid droplet applying device. The specification information also includes preprocessing information related to preprocessing performed on the sheet substrates FB, FB1, and FB2. This is information on processing performed on the sheet substrates FB, FB1, and FB2. Examples of such pretreatment include modification treatment (liquid repellent treatment, lyophilic treatment, etc.) for the sheet substrates FB, FB1, and FB2 and surface protection film formation treatment. Examples of the lyophilic process include a lyophilic process for ink ejected from the droplet applying apparatus.

  The process information is information related to processing performed on the sheet substrates FB, FB1, and FB2, and is information including a process ID and a process name corresponding to the specification information. The process performed on the sheet substrates FB, FB1, and FB2 includes at least one unit process corresponding to the specification information of the sheet substrates FB, FB1, and FB2. In the present embodiment, for example, processing by each component of the substrate processing apparatus FPA corresponds to the unit processing. Such processing includes each processing performed on the substrate, for example, heating processing, cooling processing, transport processing, press processing, coating processing, vapor deposition processing, sputtering processing, light irradiation processing, electron beam irradiation processing. , Exposure processing, development processing, immersion processing, drying processing, physical processing processing (cutting, partial removal, etc.), chemical processing processing (dissolution processing, etc.), bonding processing with other substrates, detection processing, alignment processing, A deformation process, a modification process, a partition wall formation process, and the like are included.

  Further, the various apparatuses included in the substrate processing unit PR are merely examples, and other apparatuses may be appropriately modified or added as long as they perform predetermined processing on the sheet substrate FB. . Moreover, in the said embodiment, although the organic EL display element which has an organic light emitting layer was mentioned and demonstrated as an example of a display element, it is not restricted to this, For example, to inorganic EL, a liquid crystal display element, electronic paper, etc. The present invention can also be applied to other display elements such as electrophoretic elements used. In the present embodiment, a display device such as an organic EL display can be configured using the display element.

  In the present embodiment, the element forming process and the bonding process can be performed in series on the sheet substrate FB1 by connecting the substrate processing apparatus FPA1 and the substrate processing apparatus FPA2.

  80 ... alignment device (positioning device), 111 ... gas supply device (gas supply device), FB ... sheet substrate (substrate), FB1 ... sheet substrate (first substrate), FB2 ... sheet substrate (second substrate), ST ... Laminating apparatus, T1 ... first processing area, T2 ... second processing area

Claims (30)

A first step of aligning a first substrate having a first processing region and a second substrate having a second processing region;
A second step of bonding the first processing region of the first substrate and the second processing region of the second substrate at a position where the first substrate and the second substrate intersect with each other;
A substrate processing method comprising: The substrate processing method according to claim 1,
The first process includes aligning using at least one of the first extra length of the first substrate and the second extra length of the second substrate. . The substrate processing method according to claim 2,
The first step uses at least one of the specification information about the specification value of the first substrate and the specification information about the specification value of the second substrate, and uses the first extra length portion of the first substrate. The substrate processing method characterized by including adjusting. In the substrate processing method of Claim 2 or 3,
The first step uses at least one of the specification information on the specification value of the first substrate and the specification information on the specification value of the second substrate, and uses the second surplus portion of the second substrate. The substrate processing method characterized by including adjusting. The substrate processing method according to claim 1,
The first step includes alignment using at least one of specification information relating to the specification value of the first substrate and specification information relating to the specification value of the second substrate. Substrate processing method. In the substrate processing method as described in any one of Claim 3 to 5,
The first step includes alignment using at least one of first process information based on the specification information of the first substrate and second process information based on the specification information of the second substrate. And a substrate processing method. In the substrate processing method as described in any one of Claim 3 to 6,
The specification values of the first and second substrates are the material of the first and second substrates, flexibility, heat resistance, abrasion, stretchability, thickness, expansion coefficient, friction coefficient, and tension resistance. A substrate processing method comprising at least one of each. In the substrate processing method as described in any one of Claim 1 to 7,
The second step includes supplying an inert gas between the first substrate and the second substrate when the first substrate and the second substrate are bonded together. Processing method. In the substrate processing method as described in any one of Claim 1 to 8,
The second step includes holding the first substrate and the second substrate by negative pressure suction when bonding the first substrate and the second substrate together. In the substrate processing method as described in any one of Claim 1 to 9,
The substrate processing method is characterized in that the second step includes selective bonding based on a processing state of the first substrate. In the substrate processing method as described in any one of Claim 1 to 10,
A plurality of transport paths for the first substrate are provided in parallel,
The substrate processing method is characterized in that the second step includes bonding a plurality of the first processing regions and a plurality of the second processing regions. The substrate processing method according to claim 11, wherein
A substrate processing method comprising forming a first extra length portion of the first substrate between the plurality of first processing regions. In the substrate processing method as described in any one of Claim 1 to 12,
A plurality of transport paths for the second substrate are provided in parallel,
The substrate processing method is characterized in that the second step includes bonding a plurality of the first processing regions and a plurality of the second processing regions. The substrate processing method according to claim 13,
A substrate processing method comprising: forming a second extra length portion of the second substrate between the plurality of second processing regions. The substrate processing method according to any one of claims 1 to 14,
An element forming step of forming a display element on the first substrate;
A method for manufacturing a display element, comprising: An alignment device for aligning a first substrate having a first processing region and a second substrate having a second processing region;
A bonding apparatus for bonding the first processing region of the first substrate and the second processing region of the second substrate at a position where the first substrate and the second substrate intersect with each other;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 16, wherein
The said alignment apparatus aligns using at least one among the 1st surplus length part of the said 1st substrate, and the 2nd surplus length part of the said 2nd substrate, The substrate processing apparatus characterized by the above-mentioned. The substrate processing apparatus according to claim 17, wherein
A surplus length adjustment for adjusting the first surplus length portion of the first substrate using at least one of the spec information regarding the spec value of the first substrate and the spec information regarding the spec value of the second substrate. A substrate processing apparatus comprising the apparatus. The substrate processing apparatus according to claim 17 or 18,
A second remainder for adjusting the second extra length portion of the second substrate by using at least one of the specification information on the specification value of the first substrate and the specification information on the specification value of the second substrate. A substrate processing apparatus having a length adjusting device. The substrate processing apparatus according to claim 16, wherein
The alignment apparatus performs alignment using at least one of specification information relating to the specification value of the first substrate and specification information relating to the specification value of the second substrate. apparatus. In the substrate processing apparatus according to any one of claims 18 to 20,
The alignment apparatus performs alignment using at least one of first process information based on the specification information of the first substrate and second process information based on the specification information of the second substrate. A substrate processing apparatus. In the substrate processing apparatus according to any one of claims 18 to 21,
The specification values of the first and second substrates are the material of the first and second substrates, flexibility, heat resistance, abrasion, stretchability, thickness, expansion coefficient, friction coefficient, and tension resistance. A substrate processing apparatus comprising at least one of each. The substrate processing apparatus according to any one of claims 16 to 22,
A substrate processing apparatus, comprising: a gas supply device that supplies an inert gas between the first substrate and the second substrate when the first substrate and the second substrate are bonded together. The substrate processing apparatus according to any one of claims 16 to 23,
A substrate processing apparatus, comprising: a holding device that holds the first substrate and the second substrate by negative pressure suction when the first substrate and the second substrate are bonded together. The substrate processing apparatus according to any one of claims 16 to 24,
The substrate processing apparatus includes selectively bonding based on a processing state of the first substrate. In the substrate processing apparatus according to any one of claims 16 to 25,
A plurality of transport paths for the first substrate are provided in parallel,
The substrate processing apparatus, wherein the bonding apparatus is provided at each of a plurality of bonding positions of the first processing region and the second processing region. The substrate processing apparatus according to claim 26, wherein
A substrate processing apparatus, wherein a first extra length portion of the first substrate is formed between the plurality of first processing regions. In the substrate processing apparatus according to any one of claims 16 to 27,
A plurality of transport paths for the second substrate are provided in parallel.
The substrate processing apparatus, wherein the bonding apparatus is provided at each of a plurality of bonding positions of the first processing region and the second processing region. The substrate processing apparatus according to claim 28, wherein
A substrate processing apparatus, wherein a second extra length portion of the second substrate is formed between the plurality of second processing regions. A substrate processing apparatus according to any one of claims 16 and 29;
An element forming portion for forming a display element on the first substrate;
A device for manufacturing a display element, comprising:

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