JP7455789B2 - Chip removal method and device - Google Patents

Description

The present invention deals with defective or unnecessary chips such as electronic components and micro LEDs held on a substrate through a layer of temporary bonding material such as adhesive or solder (hereinafter referred to as "holding layer"). The present invention relates to a chip removal method and device for removing a chip-shaped member by irradiating it with a laser beam.

Electronic components, micro LEDs, and the like to be mounted on a circuit board are diced into individual pieces after an element structure is built on a relatively large substrate called a wafer.

Then, among the electronic components and micro-LEDs that have been separated into pieces, chips with poor appearance, chips with malfunctions, and members that will become unnecessary in downstream processes (that is, chips to be removed) are inspected and determined. A laser lift-off method is known in which the chip to be removed is then irradiated with a laser beam and separated (also referred to as peeling) from the substrate.

In the laser lift-off method, it is known that the material layer of a gallium nitride (GaN)-based compound semiconductor chip is irradiated with a laser beam to generate nitrogen gas, and the chip is forcefully ejected from the substrate due to the pressure of the gas. At this time, a method has been proposed in which the chip to be removed separated from the substrate is swept away by an air current and collected (for example, Patent Document 1).

Japanese Patent Application Publication No. 2015-199094

The inventor of the present application irradiates a laser beam from the chip side to a chip such as an electronic component or micro LED held on a substrate via a holding layer, and removes the chip from the substrate in the same way as in the conventional laser lift-off method. We have developed a method to remove the chips by forcefully detaching them. On the other hand, it was also confirmed that by appropriately setting the wavelength of the laser beam, irradiation conditions, etc., it is possible to weaken the holding force and facilitate separation without detaching the chip from the substrate.

However, in the method disclosed in Patent Document 1, in which the chip to be removed separated from the substrate is swept away by an air current and collected, the chip to be removed cannot be collected successfully unless the chip to be removed flies up in a place where the air current flows strongly. In other words, even if an attempt was made to remove defective chips using a technique similar to the laser lift-off method, the removed chips were scattered all over the place and difficult to collect because the speed and direction of the chips being removed were irregular. Furthermore, if the chips themselves were small, it was difficult to confirm whether they were recovered.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method and apparatus for a chip to be removed that can be reliably and easily recovered while preventing chips to be removed separated from a substrate from scattering.

In order to solve the above problems, one aspect of the present invention is as follows:
A chip removal method for removing a chip to be removed from among chips held on a substrate via a holding layer, the method comprising:
an adhesive carrier contacting step of bringing an adhesive carrier having an adhesive layer into contact with the chip to be removed;
characterized by comprising a laser irradiation step of irradiating a laser beam toward the chip to be removed so that the holding force between the chip to be removed and the holding layer is weaker than the adhesive force between the chip to be removed and the adhesive carrier. There is.

Moreover, another aspect according to the present invention is
A chip removal device that removes chips to be removed from among chips held on a substrate via a holding layer,
an adhesive carrier contacting part that brings the adhesive carrier into contact with the chip to be removed;
It is characterized by comprising a laser irradiation unit that irradiates a laser beam toward the chip to be removed to weaken the holding force between the chip to be removed and the holding layer than the adhesive force between the chip to be removed and the adhesive carrier. It is said that

Chips to be removed separated from the substrate can be collected reliably and easily while being prevented from scattering.

1 is a schematic diagram showing the overall configuration of an example of a form embodying the present invention. It is a flow diagram in an example of the form which embodies the present invention. FIG. 1 is a sectional view showing a main part of an example of a form embodying the present invention. It is a schematic diagram showing the whole composition of another example of the form which embodies the present invention. It is a schematic diagram showing the principal part of yet another example of the form which embodies the present invention.

EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated using figures.
In the following explanation, the three axes of the orthogonal coordinate system are X, Y, and Z, the horizontal direction is expressed as the X direction and the Y direction, and the direction perpendicular to the XY plane (that is, the direction of gravity) is expressed as the Z direction. do. Further, the X direction is expressed as back/front, and the Y direction is expressed as left/right. Furthermore, in the Z direction, the direction that opposes gravity is expressed as up, and the direction in which gravity acts is expressed as down. Furthermore, the direction of rotation about the X direction as the center axis is defined as the α direction, and the direction of rotation about the Z direction as the center axis is defined as the θ direction.

FIG. 1 is a schematic diagram showing the overall configuration of an example of a form embodying the present invention. FIG. 1 shows a schematic diagram of a chip removal device 1 according to the invention.

The chip removal apparatus 1 removes a chip Cb to be removed from among chips C held on a substrate W via a holding layer H.

A circuit pattern (not shown) is formed on the surface of the substrate W, and a plurality of chips C are held at predetermined positions via a holding layer H (see the cross-sectional view shown in the circle with two-dot chain lines). ). Note that the holding layer H is composed of a layer of adhesive resin material containing conductive metal particles, carbon materials, etc., and a layer of solder, etc., so that the electrodes of the chip C and the circuit pattern on the substrate are connected to each other. While electrically conductive, they are held (also called temporary bonding) with a holding force that does not easily separate due to vibrations, external forces, etc. applied during the manufacturing process or under normal use environments.

Specifically, the chip removing apparatus 1 includes a substrate holding table 2, an adhesive carrier 3, an adhesive carrier contacting section 4, a laser irradiation section 5, a control section 9, and the like.

The substrate holding table 2 holds the substrate W in a predetermined posture.
Specifically, the substrate holding stand 2 supports the lower surface of the substrate W and holds it in a horizontal state.
More specifically, the substrate holding stand 2 is composed of a plate-like member with a flat holding surface (that is, the side in contact with the lower surface of the substrate W, also referred to as the upper surface), and the holding surface has pores and grooves. is formed. These pores and grooves are connected to a negative pressure suction means via a switching valve, etc., and when the negative pressure suction means is operated with the substrate W placed on the holding surface, these pores and grooves are connected to the substrate. Attraction force is generated in the space formed by W. Therefore, the substrate W is attracted to and held by the holding surface.

The adhesive carrier 3 is for collecting the chips Cb to be removed.
Specifically, the adhesive carrier 3 is used to attach the chip to be removed Cb separated from the substrate W and discharged to the outside.
More specifically, in the adhesive carrier 3, an adhesive layer S is formed on the surface of the base substrate K (the side facing the chip C; the lower surface side in the figure).

The base substrate K has a predetermined area and is composed of a flat plate material having a predetermined thickness. Specifically, the base substrate K is made of a material that efficiently transmits the wavelength of the laser beam L irradiated from the laser irradiation section 5, and a transparent glass plate is exemplified here.

The adhesive layer S contacts and holds the chip Cb to be removed in close contact with the chip Cb to be removed.

Specifically, the adhesive layer S is made of a material (such as silicone resin) that efficiently transmits the laser beam L, has high heat resistance, and does not easily lose adhesive strength. Note that the adhesive force of the adhesive layer S to the chip C is set to be weaker than the holding force of the holding layer H to the chip C.

The adhesive carrier contact portion 4 is for bringing the adhesive carrier 3 into contact with the chip Cb to be removed.
Specifically, the adhesive carrier abutting section 4 brings the adhesive carrier 3 close to the upper surface of the chip Cb to be removed and brings it into contact therewith.
More specifically, the adhesive carrier contact section 4 includes a carrier holding section 41 and a transfer robot 42, and is driven and controlled based on a control signal output from the control section 9.

The carrier holding part 41 holds the outer edge and outer peripheral part of the adhesive carrier 3.
Specifically, the carrier holding part 41 exemplifies a configuration in which a plurality of locations on the outer periphery of the adhesive carrier 3 (in the figure, the right back is exemplified) are held between the upper and lower surfaces.

The transport robot 42 moves the carrier holding section 41 in a predetermined direction and stops it at a predetermined position.
Specifically, the transfer robot 42 is composed of a multi-axis actuator, and is configured to move the carrier holding section 41 in the XYθ directions, raise and lower it in the Z direction, and keep it stationary at a predetermined position. There is.

The laser irradiation unit 5 irradiates a laser beam L toward the holding layer H to weaken the holding force between the chip to be removed Cb and the holding layer H to be weaker than the adhesive force between the chip to be removed Cb and the adhesive carrier 3. be.
Specifically, the laser irradiation unit 5 irradiates the chip to be removed Cb with a laser beam L, and uses the energy transmitted through the chip to be removed Cb to ablate the surface of the underlying holding layer H, thereby removing the interface E1. This reduces the holding force exerted on the material.
More specifically, the laser irradiation section 5 includes a laser oscillator 51, a beam scanning section 52, and the like.

The laser oscillator 51 outputs a laser beam L.
Specifically, in the laser oscillator 51, the power and irradiation ON/OFF of the laser beam L are controlled based on a control signal from the control unit 9.
More specifically, the laser oscillator 51 may be one that outputs a laser beam L that is the second harmonic (wavelength 532 nm) of a YAG laser (referred to as a green laser). If the chip Cb to be removed is a thin semiconductor material, the wavelength of the laser beam L can transmit energy, ablate the surface of the holding layer H, and generate plasma or gas at the interface E1. By doing so, a force acts to force the chip to be removed Cb to jump out from the substrate W, and the holding force acting on the interface E1 between the chip to be removed Cb and the holding layer H is reduced.

The beam scanning section 52 changes the irradiation position of the laser beam L. Specifically, the beam scanning section 52 may include a mirror 52M and a mechanism called a galvano scanner 52S that changes the rotation angle of the mirror 52M. More specifically, two sets of beam scanning units 52 are provided so as to cover the range where the chips Cb to be removed are arranged among the plurality of chips C held on the substrate W (in the figure, one The irradiation position of the laser beam L can be changed in the X and Y directions.

The control section 9 controls each section of the chip removal device 1.
Specifically, the control unit 9 has the following functions.
- Acquire the placement information J of the chip Cb to be removed directly from an inspection device in an upstream process or via a host computer.
- Control the switching valve of the substrate holding section 2 to hold or release the holding of the substrate W.
- Control the carrier holding part 41 of the adhesive carrier contact part 4 to grip or release the adhesive carrier 3.
- Controls the transport robot 42 of the adhesive carrier contacting section 4 to transport and discharge the adhesive carrier 2, and adjusts the gap G between the adhesive carrier 2 and the substrate W.
- Calculate which position on the substrate W should be irradiated with the laser beam L based on the arrangement information J and the image including the alignment mark M acquired from the imaging camera 43.
- Outputs a control signal to the beam scanning section 52 of the laser irradiation section 5 to determine/change the irradiation direction of the laser beam L.
- Outputs a control signal for irradiating the laser beam L to the laser oscillator 51 of the laser irradiation unit 5.
More specifically, the control unit 9 is composed of a computer and its execution program.

[Operation flow]
Below, a detailed procedure will be explained while illustrating an operation flow regarding a chip removal method for removing a chip Cb to be removed from a substrate W using the above-described chip removal apparatus 1.

FIG. 2 is a flow diagram in an example of a form embodying the present invention.

FIG. 3 is a schematic diagram showing a main part of an example of a form embodying the present invention. FIGS. 3(a) to 3(d) show step-by-step how the chip Cb to be removed is removed using the chip removing apparatus 1 according to the present invention.

First, placement information J indicating where the removal target chip Cb is placed among the chips C held on the substrate W via the holding layer H is acquired (step s1).

Subsequently, the substrate W is placed and held on the substrate holding stand 2 (step s2).

Then, the alignment mark M placed on the substrate W is read, and the substrate W is aligned so that the adhesive carrier 3 and the chip to be removed Cb are placed facing each other with a predetermined gap G in between (step s3: FIG. a)).

Then, the lifting mechanism of the adhesive carrier abutting section 4 is controlled to bring the adhesive carrier 3 into contact with the chip to be removed Cb (step s4: see FIG. 3(b)).
Thereafter, a laser beam L is irradiated toward the holding layer H to increase the holding force between the chip Cb to be removed and the holding layer H (that is, the bonding force acting on the interface E1) between the chip Cb to be removed and the adhesive carrier 3. The adhesive force is weakened (step s5: see FIG. 3(c)). At this time, the position on the substrate W to be irradiated with the laser beam L is calculated based on the placement information J.

Specifically, the chip to be removed Cb held on the substrate W via the holding layer H is irradiated with a laser beam L having a wavelength that ablates the interface E1 between the chip to be removed Cb and the holding layer H. At this time, the holding force acting on the interface E1 between the chip Cb to be removed and the holding layer H is greater than the adhesive force acting on the interface E2 between the chip Cb to be removed and the adhesive carrier 3 (more specifically, the adhesive layer S). be weakened. Note that the adhesive layer S is made of a material (such as silicone resin) that is highly heat resistant and does not easily lose its adhesive strength while efficiently transmitting the laser beam L. Even if the laser beam L is irradiated under conditions that weaken the holding force, the adhesive force between the chip Cb to be removed and the adhesive layer S is maintained.

Thereafter, the adhesive carrier 3 is moved away from the substrate W by the carrier transport section 4 (step s6: see FIG. 3(d)). At this time, the chip Cb to be removed that has been irradiated with the laser beam L is separated at the interface E1 with the holding layer H, and is transported while being stuck to the lower surface of the adhesive carrier 3 (specifically, the adhesive layer S). On the other hand, since the chip C which is not irradiated with the laser beam L has a strong holding force with the holding layer H, it separates at the interface E2 with the adhesive layer S and remains on the substrate W.

Thereafter, the adhesive carrier 3 to which the chip Cb to be removed is stuck is collected (step s7).

Then, it is determined whether to process another area (step s8), and if the area is to be processed, steps s3 to s7 described above are repeated. On the other hand, if another area is not to be processed, the substrate W is carried out (step s9) and the series of steps is ended.

With such a configuration, the chip removal apparatus 1 and the chip removal method according to the present invention can reliably and easily remove the chips Cb to be removed while preventing the chips Cb to be removed separated from the substrate W from scattering. It can be recovered.

[Modified example]
[About the adhesive carrier 3 and the adhesive carrier contact portion 4]
In addition, in the above description, the structure in which the adhesive layer S made of silicone resin is formed on the surface of the transparent glass plate K (the side facing the chip C) as the adhesive carrier 3 in the chip removing device 1 is illustrated. Further, as the adhesive carrier contacting part 4, a configuration including a carrier holding part 41 that holds the outer edge or outer peripheral part of the adhesive carrier 3 and a transfer robot 42 is illustrated.
However, in embodying the present invention, the adhesive carrier 3 and the adhesive carrier contact portion 4 are not limited to such a configuration, and various modifications may be selected. For example, the chip removing device 1B may have a configuration as described below.

FIG. 4 is a schematic diagram showing the overall configuration of another example of the embodiment of the present invention. FIG. 4 shows a schematic diagram of a chip removal device 1B according to the present invention.

Specifically, the chip removing apparatus 1B is configured to include a substrate holding table 2, an adhesive carrier 3B, an adhesive carrier abutting section 4B, a laser irradiation section 5, a sheet conveyance section 6, a control section 9B, and the like.
Note that the substrate holding table 2 and the laser irradiation section 5 have substantially the same configuration as those provided in the above-mentioned chip removal apparatus 1, so detailed description thereof will be omitted.

The adhesive carrier 3B, like the adhesive carrier 3, collects the chips Cb to be removed.
Specifically, the adhesive carrier 3B is used to attach the chip to be removed Cb separated from the substrate W and discharged to the outside.
More specifically, the adhesive carrier 3B includes a flexible sheet-like adhesive sheet F, and an adhesive layer S (silicon resin, etc.) is coated on the surface of the adhesive sheet F (the side facing the chip C). ) is formed.

The sheet conveying section 6 conveys the sheet-like adhesive carrier 3B above the chip Cb to be removed.
Specifically, the sheet conveying unit 6 unwinds (also referred to as ejecting) the adhesive sheet F to which the chip Cb to be removed is stuck, and moves the adhesive sheet F to which the chip Cb to be removed is not stuck above the substrate W. It is something that is placed (also called supply).
More specifically, the sheet conveying section 6 includes an unwinding roll 61, an unwinding driving section 62, a guide roller 63, a winding roll 66, a winding driving section 67, a guide roller 68, and the like.

The unwinding roll 61 has the adhesive carrier 3B wound around it, and unwinds and supplies the adhesive carrier 3B while rotating.

The unwinding drive unit 62 rotates the unwinding roll 61 at a predetermined rotational speed to unwind the adhesive carrier 3B in the α direction, and includes a rotating motor, a clutch, and the like.

The guide roller 33 changes the conveyance direction of the adhesive carrier 3B supplied from the unwinding roll 61, and maintains a constant distance between the substrate W and the adhesive carrier 3B passing over it.

The winding roll 66 winds up the adhesive carrier 3B while rotating, and collects the stuck chips Cb to be removed.

The take-up drive unit 67 rotates the take-up roll 66 in the α direction at a predetermined rotational speed, and includes a rotary motor, a clutch, and the like.

The guide roller 68 changes the direction of the adhesive carrier 3B wound around the take-up roll 66 while keeping the distance between the substrate W and the adhesive carrier 3B passing over it constant.

The adhesive carrier abutting section 4B, like the adhesive carrier abutting section 4, brings the adhesive carrier 3B into contact with the chip Cb to be removed.
Specifically, the adhesive sheet abutting section 4B brings the adhesive carrier 3B supplied by the sheet conveyance section 6 close to the chip to be removed Cb and brings it into contact with the upper surface thereof.
More specifically, the adhesive sheet contact portion 4B includes a lifting mechanism that moves the guide rollers 63 and 68 in the Z direction.

The elevating mechanism moves both ends of the rotating shafts of the guide rollers 63 and 68 in the Z direction and stops them at a predetermined height. Specifically, the elevating mechanism includes an electric actuator that combines a ball screw and a rotary motor, an air cylinder that reciprocates using air pressure, etc., and operates based on a control signal output from the control unit 9B. It is driven by

The control section 9B controls each section of the chip removing device 1B.
Specifically, the control section 9B has the following functions in addition to the functions similar to those of the control section 9 described above.
- Control the adhesive carrier contact portion 4B to move the guide rollers 63, 68 in the Z direction.
- Control the sheet conveying section 6 to convey and keep the adhesive carrier 3B stationary.

Note that when the lifting mechanism of the adhesive carrier contact portion 4B is in the raised position, there is a predetermined gap between the adhesive carrier 3B and the chip C or the chip Cb to be removed. On the other hand, when the elevating mechanism of the adhesive carrier contact portion 4B is in the lowered position, the adhesive layer S of the adhesive carrier 3B comes into contact with the chip C and the chip Cb to be removed, and adhesive force is exerted.

[Modified example of adhesive carrier contact part]
In the above description, the adhesive carrier abutting section 4B includes a lifting mechanism that moves the guide rollers 33 and 38 disposed on the conveyance path of the adhesive carrier 3B in the Z direction, and brings the adhesive carrier 3B into contact with the chip Cb to be removed. The configuration is illustrated.

However, in embodying the present invention, the mechanism for moving the film-like adhesive carrier 3B in the Z direction is not limited to this configuration, and various modifications may be adopted. For example, a chip removing device 1C having the configuration as described below may be used.

FIG. 5 is a schematic diagram showing the main parts of yet another example of the embodiment of the present invention.
FIG. 5(a) shows a state in which the adhesive carrier 3B has been moved to the raised position.
FIG. 5B shows a state where the laser beam L is irradiated onto the chip Cb to be removed after the adhesive carrier 3B has been moved to the lowered position.

Specifically, the chip removing apparatus 1C includes a substrate holding table 2, an adhesive carrier 3B, an adhesive carrier contacting section 4C, a laser irradiation section 5, a sheet conveyance section 6, a control section 9C, and the like.
Note that the substrate holding table 2, the adhesive carrier 3B, the laser irradiation section 5, and the sheet conveyance section 6 have almost the same configuration as the chip removal apparatus 1B described above, so a detailed description thereof will be omitted.

The adhesive carrier abutting section 4C, like the adhesive carrier abutting section 4B, brings the adhesive carrier 3B into contact with the chip Cb to be removed.
Specifically, the adhesive sheet abutting section 4C brings the adhesive carrier 3B supplied by the sheet conveying section 6 close to the chip Cb to be removed and brings it into contact with the upper surface thereof.
More specifically, the adhesive sheet contact portion 4C connects a plate-like member 45 disposed above the adhesive carrier 3B (that is, on the opposite side to the substrate W), and a plate-like member 45 arranged below (that is, on the side opposite to the adhesive carrier 3B). It is equipped with an elevating mechanism 46 that moves it to the side).

The plate-like member 45 moves the film-shaped adhesive carrier 3B in the Z direction while transmitting the energy of the laser beam L.
Specifically, the plate member 45 has a predetermined thickness, has a flat lower surface (the side facing the adhesive carrier 3B), and is made of transparent glass, sapphire, or the like.

The elevating mechanism 46 moves the adhesive carrier 3B from a raised position to a lowered position. Specifically, the elevating mechanism 46 receives a control signal output from the control section 9 or the like, and moves the movable section to which the plate-like member 45 is attached up and down via a connecting fitting or the like.
More specifically, the elevating mechanism 46 is composed of a uniaxial actuator, and examples thereof include a combination of a ball screw and a rotary motor, an air cylinder, and the like.

The control section 9C controls each section of the chip removal device 1C.
Specifically, the control section 9C has the following functions in addition to the same functions as the control section 9B described above.
- Control the adhesive carrier contact portion 4C to move the plate member 45 in the Z direction.

When the lifting mechanism 46 is in the raised position, the adhesive carrier contact portion 4C has a predetermined gap G1 between the plate-like member 45 and the adhesive carrier 3B, and a predetermined gap G2 between the adhesive carrier 3B and the chip C or the chip Cb to be removed. On the other hand, when the lifting mechanism 46 is in the lowered position, the adhesive layer S of the adhesive carrier 3B contacts the chip C or the chip Cb to be removed, and exerts an adhesive force.
[Regarding Adhesive Carrier 3]
In the above description, the adhesive carriers 3, 3B are arranged above the removal target chips Cb such that the alignment marks M on the substrate W are exposed.
However, if the adhesive carriers 3, 3B are made of a transparent and thin material, for example, and do not affect the identification and position detection of the alignment mark M, the adhesive carriers 3, 3B may be disposed on the alignment mark M.

[About the adhesive carrier contact portion 4]
In addition, in the above description, a configuration is exemplified in which the adhesive carrier contacting part 4 includes a carrier holding part 41 that holds the outer edge or peripheral part of the adhesive carrier 3, and a transport robot 42.
However, the adhesive carrier contact portion 4 is not limited to such a configuration, and various modifications may be adopted. For example, the carrier holding section 41 may have a configuration in which a plurality of locations on the outer periphery of the adhesive carrier 3 are held between the top and bottom surfaces, a configuration in which the top surface of the substrate is suctioned and conveyed, a configuration in which the carrier holding section 41 is conveyed by a roller conveyor, Shuttle conveyance using a moving beam or the like may be used, and any structure provided with a mechanism for supplying and discharging the adhesive carrier 3 in the horizontal direction or raising and lowering it in the Z direction may be used.

[About the laser irradiation section 5]
In the above description, a green laser that outputs the second harmonic of a YAG laser was used as an example of the laser irradiation section 5, and a configuration that outputs a laser beam L having a wavelength of 532 nm was exemplified. A laser beam L having a wavelength of 532 nm efficiently transmits through the glass substrate K of the adhesive carrier 3 and the silicon of the adhesive layer S, while exhibiting high absorption characteristics for the holding layer H made of conductive resin. In other words, the surface of the holding layer H is ablated, and the holding force acting on the interface E1 between the chip Cb to be removed and the holding layer H is significantly reduced, while the adhesive acting on the interface E2 between the chip Cb to be removed and the adhesive carrier 3 is Since the force is maintained, it becomes easy to separate and recover the chip Cb to be removed, which is preferable.

However, in embodying the present invention, the wavelength of the laser beam L is not limited to a wavelength that ablates the surface of the holding layer H below the chip Cb to be removed and generates plasma or gas at the interface E1. , it may be a wavelength that impacts the interface E1. For example, the energy of the laser beam L is absorbed on the surface or inside of the chip Cb to be removed, and the chip Cb to be removed is suddenly vibrated, thereby applying a shock to the interface E1. By doing so, the holding force acting on the interface E1 is reduced, the transfer carrier 3 is separated from the substrate W, and the chip Cb to be removed can be separated from the holding layer H1. With this method, even if it is difficult for the energy of the laser beam L to pass through the chip Cb to be removed, it is possible to separate the chip Cb to be removed. Note that if the materials constituting the glass substrate K of the adhesive carrier 3 and the adhesive layer S of the adhesive sheet F are different, the wavelength of the laser beam L may be changed depending on the light transmission characteristics and heat resistance temperature of these materials.

Note that in the above description, the beam scanning section 52 of the laser irradiation section 5 is provided with a galvano scanner 52S. However, the beam scanning section 52 is not limited to such a configuration, and may have a configuration including a polygon mirror, an acousto-optic modulator, or the like. Alternatively, instead of the beam scanning unit 52, a mechanism for moving the substrate holding table 2 in the XY directions may be provided.

[About the chip inspection section 7]
Note that the chip removal apparatuses 1, 1B, and 1C described above may have a configuration including a chip inspection section 7 in addition to the configuration described above.

The chip inspection unit 7 inspects whether the laser-irradiated chip Cb to be removed is separated from the substrate W and stuck to the adhesive carrier 3.
Specifically, the chip inspection section 7 counts the number of chips Cb to be removed stuck to the adhesive carrier 3 and detects their positions.
More specifically, the chip inspection section 7 includes a recovered chip detection section, an inspection section, etc., and is arranged, for example, at a position indicated by a broken line in FIGS. 1 and 4.

The carrier collecting section collects the adhesive carrier 3 that has been irradiated with the laser beam L and has the chip Cb to be removed stuck thereon.
Specifically, the carrier recovery unit moves the adhesive carrier 3 away from the substrate W and moves it to another location (for example, a disposal location, a conveyor for carrying out, etc.).
More specifically, the carrier collecting section also serves as the transport robot 42 of the adhesive carrier contact section 4 in the chip removing device 1 and the sheet transporting section 6 in the chip removing device 1B.

The recovered chip detection unit detects the presence and/or position of the removal target chip Cb on the adhesive carrier 3.
Specifically, the collected chip detection section includes a bar illumination that emits a band-shaped light having a predetermined length in the X direction, and a line sensor in which a large number of light receiving elements are arranged in the X direction.

The inspection section inspects whether or not the number and/or position of the chips to be removed Cb detected by the recovered chip detection section match those irradiated with the laser beam L by the laser irradiation section 5.
Specifically, the inspection unit compares the number and/or position of the chips Cb to be removed detected by the recovered chip detection unit with the arrangement information J, and determines whether the chips Cb to be removed on the substrate W are correctly separated and adhered. Inspect whether the image is transferred to the carriers 3 and 3B.
More specifically, the inspection section is composed of a computer and its execution program, and is incorporated into a part of the control section 9.

If the chip removal apparatuses 1, 1B, and 1C according to the present invention are equipped with the chip inspection section 7 having such a configuration, the chip removal apparatuses 1, 1B, and 1C can check whether or not the chips Cb to be removed have been reliably collected while the adhesive carrier 3 is being transported. This is preferable because it allows inspection (so-called in-line inspection).

In addition, in the above description, the collected chip detection unit has been exemplified as having a configuration including a bar illumination and a line sensor. The illumination and sensor may be of a transmissive type arranged separately on the upper and lower surfaces so as to sandwich the adhesive carrier 3, or may be of a reflective type arranged on one side.

Such a configuration is preferable because the bar-shaped illumination and sensor can be arranged in the narrow gap through which the transport carrier 3 passes, so that the apparatus can save space.
However, the collected chip detection section is not limited to the bar illumination and line sensor, and may also use an area camera. Further, the lighting and the sensor may be configured to be placed in a waiting area, a transport route, etc. when transporting the transport carrier 3 out of the apparatus for inspection.

[Regarding collection of chip Cb to be removed]
Note that the above-mentioned collection of the chips Cb to be removed may be carried out by carrying them out of the device with the chips Cb stuck to the adhesive carrier 3 and discarding them, or by using a film-like adhesive to which the chips Cb to be removed are stuck. You can wind the carrier 3B around the take-up roll 26 and discard it after the roll is full, or you can scrape off the chips Cb to be removed with a spatula-like member (scraper) while the adhesive carriers 3, 3B are being transported, and remove the chips Cb from the adhesive carrier. 3, 3B may be reused.

1, 1B, 1C Chip removal device 2 Substrate holding stand 3, 3B Adhesive carrier 4, 4B, 4C Adhesive carrier contact section 5 Laser irradiation section 6 Sheet transport section 7 Chip inspection section 9, 9B, 9C Control section 41 Carrier holding section 42 Transfer robot 45 Plate member 46 Lifting mechanism 51 Laser oscillator 52 Beam scanning unit 52M Mirror 52S scanner 61 Unwinding roll 62 Unwinding drive unit 63 Guide roller 66 Winding roll 67 Winding drive unit 68 Guide roller W Substrate C Chip Cb Chip to be removed H Holding layer (substrate side: conductive resin, solder, etc.)
S Adhesive layer (adhesive carrier side)
K Glass substrate G Gap J Placement information of chip to be removed L Laser beam E1 Interface (substrate side)
E2 interface (adhesive carrier side)

Claims (10)

A chip removal method for removing a chip to be removed from among chips held on a substrate via a holding layer, the method comprising:
an adhesive carrier contacting step of bringing an adhesive carrier having an adhesive layer into contact with the chip to be removed;
a laser irradiation step of irradiating a laser beam toward the chip to be removed so that the holding force between the chip to be removed and the holding layer is weaker than the adhesive force between the chip to be removed and the adhesive carrier; A chip removal method characterized by: In the adhesive carrier contacting step, the adhesive carrier is brought into contact with a plurality of chips including the chip to be removed;
2. The chip removal method according to claim 1, wherein in the laser irradiation step, the laser beam is selectively irradiated to the chip to be removed. The laser beam is
The chip removal according to claim 1 or 2, characterized in that the chip removal has a wavelength that generates plasma or gas at the interface between the chip to be removed and the holding layer, or a wavelength that impacts the interface. Method. 4. The chip removal method according to claim 1, wherein in the laser irradiation step, the laser beam is irradiated onto the chip to be removed through the adhesive carrier. a carrier recovery step of recovering the adhesive carrier to which the chip to be removed is attached after being irradiated with the laser beam;
a recovered chip detection step of detecting the presence or absence and/or position of the chip to be removed on the adhesive carrier recovered in the carrier recovery step;
The present invention is characterized by comprising an inspection step of inspecting whether or not the number and/or position of the chips to be removed detected by the recovered chip detection section match those irradiated with the laser beam by the laser irradiation section. The chip removal method according to any one of claims 1 to 4. A chip removal device that removes chips to be removed from among chips held on a substrate via a holding layer,
an adhesive carrier contacting part that brings an adhesive carrier into contact with the chip to be removed;
a laser irradiation unit that irradiates a laser beam toward the chip to be removed to weaken the holding force between the chip to be removed and the holding layer than the adhesive force between the chip to be removed and the adhesive carrier; A chip removal device characterized by: The adhesive carrier abutting section brings the adhesive carrier into contact with a plurality of chips including the chip to be removed,
The chip removal apparatus according to claim 6, wherein the laser irradiation unit selectively irradiates the laser beam to the chip to be removed. The laser beam is
The chip removal according to claim 6 or 7, characterized in that the chip removal has a wavelength that generates plasma or gas at the interface between the chip to be removed and the holding layer, or a wavelength that impacts the interface. Device. 9. The chip removal apparatus according to claim 6, wherein the laser irradiation unit irradiates the laser beam onto the chip to be removed through the adhesive carrier. a carrier recovery unit that recovers the adhesive carrier to which the chip to be removed is attached after being irradiated with the laser beam;
a collected chip detection unit that detects the presence or absence and/or position of the chip to be removed on the adhesive carrier collected in the carrier collection step;
The present invention is characterized by comprising an inspection section that inspects the chips to be removed detected by the recovered chip detection section to see if they match the number and/or position of the chips irradiated with the laser beam by the laser irradiation section. The chip removal device according to any one of claims 6 to 9.

Images