TW202025343A - Method and apparatus for joining sheet-shape adhesive material - Google Patents

Method and apparatus for joining sheet-shape adhesive material Download PDF

Info

Publication number
TW202025343A
TW202025343A TW108133184A TW108133184A TW202025343A TW 202025343 A TW202025343 A TW 202025343A TW 108133184 A TW108133184 A TW 108133184A TW 108133184 A TW108133184 A TW 108133184A TW 202025343 A TW202025343 A TW 202025343A
Authority
TW
Taiwan
Prior art keywords
sheet
adhesive material
workpiece
adhesive
shaped
Prior art date
Application number
TW108133184A
Other languages
Chinese (zh)
Inventor
石井直樹
松下孝夫
Original Assignee
日商日東電工股份有限公司
日商日東精機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司, 日商日東精機股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202025343A publication Critical patent/TW202025343A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)

Abstract

The present invention provides a sheet-like adhesive material attaching method and a sheet-like adhesive material attaching device capable of attaching a sheet-like adhesive material cut into a predetermined shape onto a workpiece in high precision. In which, a holding tape F is attached onto a sheet-like adhesive material T cut into a predetermined shape, i.e. adhesive material sheet Tp. The adhesive material sheet Tp is stably held by the holding tape F to maintain a substantially flat shape. An adhesive material attaching mechanism 10 may attach the adhesive material sheet Tp onto the workpiece W while the holding tape F is holding the adhesive material sheet Tp. Because the holding tape F can stably hold the adhesive tape Tp stably, during attaching onto the workpiece W, it may be prevented from occurring deformation of the adhesive material sheet Tp or displacement of the adhesive material sheet Tp due to its own weight. Thus, the present invention may greatly enhance the position precision for attaching the adhesive material sheet Tp onto the workpiece W.

Description

片狀黏著材的貼附方法及片狀黏著材的貼附裝置Method for attaching sheet-shaped adhesive material and device for attaching sheet-shaped adhesive material

本發明係有關一種片狀黏著材的貼附方法及片狀黏著材的貼附裝置，係為了對以半導體晶圓(以下，適當稱為「晶圓」)為例的工件上貼附以黏著帶為例之片狀黏著材所使用。The present invention relates to a method for attaching a sheet-shaped adhesive material and a device for attaching a sheet-shaped adhesive material, in order to attach a semiconductor wafer (hereinafter referred to as "wafer") as an example to a workpiece. Tape is used as an example of sheet adhesive material.

在晶圓的表面形成電路圖案後，利用背面研磨製程磨削晶圓的背面，再利用切割製程將該晶圓分斷成多數個晶片零件。此時，以用於保護晶圓的電路之黏著帶(保護帶)或用於防止分斷的晶片零件飛散的黏著帶(切割帶)為例之片狀黏著材係在各製程中被貼附於晶圓。After the circuit pattern is formed on the surface of the wafer, the back surface of the wafer is ground by a back grinding process, and then the wafer is divided into a plurality of chip parts by a dicing process. At this time, take the adhesive tape (protective tape) used to protect the circuit of the wafer or the adhesive tape (dicing tape) used to prevent the broken chip parts from scattering as an example. The sheet-shaped adhesive material is attached in each process.于wafer.

關於將片狀黏著材貼附於晶圓的方法之一例，想到除了有將帶狀的片狀黏著材貼附於晶圓後再使用切斷機構將片狀黏著材沿著晶圓的形狀切斷之方法外，還有事先將片狀黏著材切斷成晶圓的形狀來作成黏著材片，並將該黏著材片貼附於晶圓之方法。Regarding an example of the method of attaching the sheet-shaped adhesive to the wafer, it is thought that in addition to the tape-shaped sheet-shaped adhesive being attached to the wafer, the cutting mechanism is used to cut the sheet-shaped adhesive along the shape of the wafer. In addition to the cutting method, there is also a method of cutting the sheet-like adhesive material into a wafer shape in advance to make an adhesive material sheet, and attaching the adhesive material sheet to the wafer.

關於用以將黏著材片貼附於晶圓的具體構成，係可例舉如下之構成。首先，藉由使具有環狀切斷刃之切斷輥對添設有載帶之帶狀的片狀黏著材按壓轉動，在載帶上將片狀黏著材切斷成晶圓的形狀以形成黏著材片。 然後，藉由去除黏著材片的周圍的片狀黏著材，於載帶上作成排列配置的黏著材片。接著，以邊緣構件將載帶折回並使之行進，藉此，將黏著材片從載帶逐漸剝離。在邊緣構件的前端，從載帶被剝離而朝前方被推出且移動的黏著材片係被貼附輥按壓而貼附到晶圓(參照專利文獻1)。 [先前技術文獻] [專利文獻]Regarding the specific structure for attaching the adhesive sheet to the wafer, the following structure can be exemplified. First, by pressing and rotating a cutting roller with a ring-shaped cutting blade against a strip-shaped sheet-shaped adhesive material with a carrier tape, the sheet-shaped adhesive material is cut into a wafer shape on the carrier tape to form Adhesive sheet. Then, by removing the sheet-like adhesive material around the adhesive material sheet, the adhesive material sheets arranged in a row are formed on the carrier tape. Next, the carrier tape is folded back with the edge member and moved, thereby gradually peeling the adhesive sheet from the carrier tape. At the front end of the edge member, the adhesive sheet that is peeled from the carrier tape and pushed forward and moved is pressed by the attaching roller and attached to the wafer (see Patent Document 1). [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2014-017357號公報[Patent Document 1] JP 2014-017357 A

[發明欲解決之課題][The problem to be solved by the invention]

然而，在上述的習知裝置中會有如下之問題。However, the above-mentioned conventional device has the following problems.

亦即在習知的構成中，擔心會有黏著材片對晶圓實際貼附的位置與假定的貼附位置之偏移大的問題。因發生貼附位置之偏移而變得難以良好精度將黏著材片貼附於晶圓。That is, in the conventional structure, there is a concern that the position where the adhesive material is actually attached to the wafer and the assumed attachment position are greatly shifted. It is difficult to accurately attach the adhesive material to the wafer due to the deviation of the attaching position.

關於發生此種問題的主要原因，可認為是如下原因。首先，可想到在從載帶剝離黏著材片之際，從載帶剝離的部分之黏著材片由於本身重量而垂下等之原因而從假定的位置往鉛直方向等偏移。經以貼附輥按壓從假定的位置偏移的黏著材片之結果，使貼附於晶圓的黏著材片的位置從假定的位置偏移。Regarding the main reason for this problem, it can be considered as the following reasons. First, it is conceivable that when the adhesive sheet is peeled from the carrier tape, the adhesive sheet of the part peeled from the carrier tape hangs down due to its own weight, and shifts from the assumed position to the vertical direction. As a result of pressing the adhesive sheet shifted from the assumed position with the attaching roller, the position of the adhesive sheet attached to the wafer is shifted from the assumed position.

又，亦可想到在習知的構成中，在黏著材片被從載帶剝離並往前方推出移動之際，呈遊離狀態的黏著材片從理想上的移動軌跡往水平方向等偏移。經將從假定的軌跡偏移的黏著材片貼附於晶圓的結果，使得貼附於晶圓的黏著材片的位置從假定的位置偏移。It is also conceivable that, in the conventional structure, when the adhesive sheet is peeled from the carrier tape and pushed forward, the adhesive sheet in a free state is shifted from the ideal movement track to the horizontal direction. As a result of attaching the adhesive material sheet shifted from the assumed track to the wafer, the position of the adhesive material sheet attached to the wafer is shifted from the assumed position.

又，近年來，除了提出了主要使用圓形晶圓作為貼附片狀黏著材的對象之工件之方法外，還有提出使用矩形半導體基板作為貼附片狀黏著材的對象之工件之方法。再者，近年來，工件有大型化之傾向。在工件為矩形的情況下，在將片狀黏著材貼附於工件後再加以切斷之方法中，由於切斷機構會與工件干涉而在工件發生缺損或變形等疑慮變高，所以一般採用使黏著材片形成後再將該黏著材片貼附於工件之方法。In addition, in recent years, in addition to a method of mainly using a circular wafer as a workpiece to be attached to a sheet-like adhesive material, a method of using a rectangular semiconductor substrate as a workpiece to be attached to the sheet-like adhesive material has also been proposed. Furthermore, in recent years, there has been a tendency for workpieces to become larger. When the workpiece is rectangular, in the method of cutting the sheet after attaching the sheet-like adhesive material to the workpiece, the cutting mechanism will interfere with the workpiece and the workpiece will be damaged or deformed. Therefore, it is generally adopted A method of attaching the adhesive material sheet to the workpiece after forming the adhesive material sheet.

然而，就將更大型且矩形的半導體基板設為工件的方法而言，相較於將晶圓設為工件的習知方法，係被要求非常高的貼附精度。在習知將黏著材片貼附於工件的方法中，針對黏著材片的切斷精度及黏著材片的貼附精度，難以確實地滿足所要求之高的精度。However, the method of using a larger and rectangular semiconductor substrate as a workpiece is required to have a very high attachment accuracy compared to the conventional method of using a wafer as a workpiece. In the conventional method of attaching an adhesive sheet to a workpiece, it is difficult to reliably meet the required high accuracy with regard to the cutting accuracy of the adhesive sheet and the adhesion accuracy of the adhesive sheet.

本發明係有鑑於此種情事而完成者，主要目的在提供一種能夠將切斷成既定的形狀之片狀黏著材以高精度貼附於工件之片狀黏著材的貼附方法及片狀黏著材的貼附裝置。 [用以解決課題之手段]The present invention was completed in view of this situation, and its main purpose is to provide a method of attaching a sheet-shaped adhesive material that can be cut into a predetermined shape to a workpiece with high precision and a sheet-shaped adhesive material. Material attachment device. [Means to solve the problem]

本發明為了達成此種目的，係採用如次之構成。 亦即，一種對工件貼附既定形狀的片狀黏著材之片狀黏著材的貼附方法，其特徵為具備： 貼附過程，在藉由黏著材保持構件保持有前述片狀黏著材的狀態下將前述片狀黏著材貼附於前述工件；及 分離過程，使前述黏著材保持構件從被貼附於前述工件的前述片狀黏著材分離。In order to achieve this objective, the present invention adopts the following configuration. That is, a method for attaching a sheet-like adhesive material of a predetermined shape to a workpiece, which is characterized by having: In the attaching process, attach the sheet-shaped adhesive material to the workpiece in a state where the sheet-shaped adhesive material is held by the adhesive material holding member; and The separation process separates the adhesive holding member from the sheet-shaped adhesive attached to the workpiece.

(作用・效果)根據本構成，在將既定形狀的片狀黏著材藉由黏著材保持構件保持著的狀態下貼附於工件。透過利用黏著材保持構件予以保持，可防止片狀黏著材因本身重量垂下等之理由而變形或變位。亦即，由於在貼附於工件之際可避免片狀黏著材的空間的位置從假定的位置偏移，故可提升要被貼附於工件的片狀黏著材的位置之精度。(Function/Effect) According to this structure, a sheet-shaped adhesive material of a predetermined shape is attached to the workpiece while being held by the adhesive material holding member. By holding it with an adhesive holding member, it is possible to prevent the sheet-shaped adhesive from being deformed or displaced due to its own weight, such as sagging. That is, since the space position of the sheet-shaped adhesive material can be prevented from shifting from the assumed position when it is attached to the workpiece, the accuracy of the position of the sheet-shaped adhesive material to be attached to the workpiece can be improved.

又，較佳為，上述的發明中，前述黏著材保持構件係長形的黏著帶，藉由將前述黏著帶貼附於前述既定形狀的片狀黏著材而保持前述既定形狀的片狀黏著材。Furthermore, preferably, in the above-mentioned invention, the adhesive material holding member is an elongated adhesive tape, and the sheet-shaped adhesive material of the predetermined shape is retained by attaching the adhesive tape to the sheet-shaped adhesive material of the predetermined shape.

(作用・效果)依據本構成，因為黏著材保持構件係長形的黏著帶，故藉其黏著力可將片狀黏著材穩定地保持。又因為長形的黏著帶係可沿著既定的路徑放出移動，所以變得容易將既定形狀的片狀黏著材沿著該路徑正確地搬送。(Function/Effect) According to this structure, since the adhesive holding member is a long adhesive tape, the sheet-like adhesive can be stably held by its adhesive force. Also, because the long adhesive tape can be released and moved along a predetermined path, it becomes easy to accurately convey the predetermined shape of the sheet-shaped adhesive material along the path.

又，較佳為，上述的發明中，前述黏著帶為，至少與前述既定形狀的片狀黏著材的端部相接的部分是由具透光性的材料所構成。Furthermore, it is preferable that, in the above-mentioned invention, the adhesive tape has at least a part in contact with the end of the predetermined-shaped sheet-shaped adhesive material is made of a light-transmitting material.

(作用・效果)依據本構成，保持既定形狀的片狀黏著材之黏著帶係與該片狀黏著材的端部相接的部分為由具透光性的材料所構成。也就是，在黏著材保持構件的黏著帶保持著既定形狀的片狀黏著材之狀態中，透過黏著帶可確認片狀黏著材的位置及形狀等。因此，可一邊避免片狀黏著材的位置偏移，一邊以良好精度進行片狀黏著材的形狀之檢査或調整片狀黏著材與工件之位置的操作。(Function/Effect) According to this structure, the part of the adhesive tape of the sheet-shaped adhesive material that maintains the predetermined shape and the end of the sheet-shaped adhesive material is made of a light-transmitting material. That is, in the state where the adhesive tape of the adhesive material holding member holds the sheet-shaped adhesive material of a predetermined shape, the position and shape of the sheet-shaped adhesive material can be confirmed through the adhesive tape. Therefore, while avoiding the positional deviation of the sheet-shaped adhesive material, the operation of inspecting the shape of the sheet-shaped adhesive material or adjusting the position of the sheet-shaped adhesive material and the workpiece can be performed with good accuracy.

又，較佳為，上述的發明中，前述黏著材保持構件係具有吸附孔的板狀構件，藉由前述板狀構件吸附前述既定形狀的片狀黏著材，以保持前述既定形狀的片狀黏著材。Furthermore, preferably, in the above-mentioned invention, the adhesive holding member is a plate-shaped member having suction holes, and the plate-shaped member absorbs the predetermined-shaped sheet-shaped adhesive to maintain the predetermined-shaped sheet-shaped adhesive material.

(作用・效果)依據本構成，因為黏著材保持構件係具有吸附孔的板狀構件，所以藉其吸附力可將片狀黏著材穩定地保持。又，藉由搬送板狀構件，可將既定形狀的片狀黏著材朝既定的位置正確地搬送。(Function/Effect) According to this structure, since the adhesive holding member is a plate-shaped member with suction holes, the sheet-shaped adhesive can be stably held by its suction force. Furthermore, by conveying the plate-shaped member, the sheet-shaped adhesive material of a predetermined shape can be accurately conveyed to a predetermined position.

又，較佳為，上述的發明中，前述板狀構件為，至少與前述既定形狀的片狀黏著材的端部相接的部分是由具透光性的材料所構成。Furthermore, it is preferable that, in the above-mentioned invention, the plate-shaped member has at least a portion in contact with the end portion of the predetermined-shaped sheet-shaped adhesive material made of a light-transmitting material.

(作用・效果)依據本構成，與既定形狀的片狀黏著材的端部相接的部分的板狀構件係由具透光性的材料所構成。也就是，在板狀構件保持著既定形狀的片狀黏著材之狀態中，透過板狀構件可確認片狀黏著材的位置及形狀等。因此，能一邊避免片狀黏著材的位置偏移，一邊以良好精度進行片狀黏著材的形狀之檢査或調整片狀黏著材與工件之位置的操作。(Function/Effect) According to this structure, the plate-shaped member of the part that is in contact with the end of the sheet-shaped adhesive of a predetermined shape is composed of a light-transmitting material. That is, in a state where the plate-shaped member holds the sheet-shaped adhesive material of a predetermined shape, the position and shape of the sheet-shaped adhesive material can be confirmed through the plate-shaped member. Therefore, while avoiding the positional deviation of the sheet-shaped adhesive material, the operation of inspecting the shape of the sheet-shaped adhesive material or adjusting the position of the sheet-shaped adhesive material and the workpiece can be performed with good accuracy.

又，較佳為，上述的發明中，具備接近過程，該接近過程係使藉由前述黏著材保持構件所保持著的前述片狀黏著材的黏著面與前述工件的貼附面之距離接近成為既定的距離，前述貼附過程，係於藉由前述接近過程使前述片狀黏著材的黏著面與前述工件的貼附面接近到前述既定的距離後再進行。Furthermore, it is preferable that the above-mentioned invention includes an approaching process that brings the distance between the adhesive surface of the sheet-shaped adhesive material held by the adhesive material holding member and the adhesive surface of the workpiece close to For the predetermined distance, the attachment process is performed after the adhesive surface of the sheet-shaped adhesive material and the attachment surface of the workpiece are approached to the predetermined distance through the approach process.

(作用・效果)依據本構成，係在藉由接近過程使前述片狀黏著材的黏著面與前述工件的貼附面接近到前述既定的距離後再進行貼附過程。亦即，在將片狀黏著材充分接近工件後使按壓力等之力作用於片狀黏著材或工件並將片狀黏著材貼附於工件。因此，在工件上貼附既定形狀的片狀黏著材之際，可將有必要作用於該片狀黏著材的力的大小抑制成較低。因此，能避免因對片狀黏著材作用過剩的大力量而發生之片狀黏著材的變形及位置偏移，故能更加提升對工件貼附片狀黏著材的位置之精度。(Function/Effect) According to this structure, the attachment process is performed after the adhesive surface of the sheet-like adhesive material and the attachment surface of the workpiece are approached to the predetermined distance through the approach process. That is, after the sheet-like adhesive material is sufficiently close to the workpiece, a force such as a pressing force is applied to the sheet-like adhesive material or the workpiece, and the sheet-like adhesive material is attached to the workpiece. Therefore, when a sheet-shaped adhesive material of a predetermined shape is attached to a workpiece, the magnitude of the force that must be applied to the sheet-shaped adhesive material can be suppressed to be low. Therefore, it is possible to avoid the deformation and position shift of the sheet-shaped adhesive material due to the excessive force acting on the sheet-shaped adhesive material, so that the accuracy of the position where the sheet-shaped adhesive material is attached to the workpiece can be further improved.

又，較佳為，上述的發明中，於前述接近過程，氣體供給機構對前述工件與前述片狀黏著材之間供給氣體，防止前述工件與前述片狀黏著材接觸。Furthermore, preferably, in the above-mentioned invention, during the approaching process, a gas supply mechanism supplies gas between the workpiece and the sheet-shaped adhesive material to prevent the workpiece from contacting the sheet-shaped adhesive material.

(作用・效果)依據本構成，在接近過程中，藉由氣體供給機構可防止工件與片狀黏著材接觸。亦即，可防止在開始貼附過程前工件與片狀黏著材接觸而使片狀黏著材黏著並貼附在不同於假定的位置之位置上的事態。(Function and effect) According to this structure, the gas supply mechanism can prevent the workpiece from contacting the sheet-shaped adhesive material during the approaching process. That is, it is possible to prevent a situation in which the work piece contacts the sheet-like adhesive material before the attaching process is started, and the sheet-like adhesive material is stuck and attached to a position different from the assumed position.

本發明為了達成此種目的，亦可採用如次之構成。 亦即一種片狀黏著材的貼附裝置，係對工件貼附既定形狀的片狀黏著材，其特徵為具備︰ 黏著材保持機構，藉由黏著材保持構件保持前述片狀黏著材； 貼附機構，在藉由黏著材保持構件保持有前述片狀黏著材的狀態下將前述片狀黏著材貼附於前述工件；及 分離機構，使前述黏著材保持構件從被貼附於前述工件的前述片狀黏著材分離。In order to achieve this objective, the present invention may also adopt the following configurations. That is, a sheet-shaped adhesive material attaching device, which attaches a sheet-shaped adhesive material of a predetermined shape to a workpiece, and is characterized by: Adhesive material holding mechanism, which holds the aforementioned sheet-shaped adhesive material through the adhesive material holding member; An attaching mechanism for attaching the sheet-shaped adhesive material to the workpiece in a state where the sheet-shaped adhesive material is held by the adhesive material holding member; and The separating mechanism separates the adhesive holding member from the sheet-like adhesive attached to the workpiece.

(作用・效果)依據本構成，係一種片狀黏著材的貼附裝置，為對工件貼附既定形狀的片狀黏著材，其具備︰著材保持機構，藉由黏著材保持構件保持前述片狀黏著材；貼附機構，在藉由黏著材保持構件保持有前述片狀黏著材的狀態下將前述片狀黏著材貼附於前述工件；及分離機構，使前述黏著材保持構件從被貼附於前述工件的前述片狀黏著材分離。此時，由於在藉由黏著材保持構件保持著前述片狀黏著材的狀態下將前述片狀黏著材貼附於前述工件，故可適當地實施上述方法。(Function/Effect) According to this structure, a sheet-like adhesive material sticking device is used to stick a sheet-like adhesive material of a predetermined shape to a workpiece. It is equipped with: an adhesive material holding mechanism that holds the aforementioned sheet by the adhesive material holding member Adhesive material; an attaching mechanism for attaching the sheet-shaped adhesive material to the workpiece in a state where the sheet-shaped adhesive material is held by the adhesive material holding member; and a separation mechanism to make the adhesive material holding member from being attached The sheet-like adhesive material attached to the workpiece is separated. At this time, since the sheet-shaped adhesive material is attached to the workpiece in a state where the sheet-shaped adhesive material is held by the adhesive material holding member, the above method can be appropriately implemented.

又，較佳為，上述的發明中，前述黏著材保持構件係長形的黏著帶，藉由將前述黏著帶貼附於前述既定形狀的片狀黏著材而保持前述既定形狀的片狀黏著材。Furthermore, preferably, in the above-mentioned invention, the adhesive material holding member is an elongated adhesive tape, and the sheet-shaped adhesive material of the predetermined shape is retained by attaching the adhesive tape to the sheet-shaped adhesive material of the predetermined shape.

(作用・效果)依據本構成，因為黏著材保持構件係長形的黏著帶，故藉其黏著力可將片狀黏著材穩定地保持。又因為長形的黏著帶係可沿著既定的路徑放出移動，所以變得容易將既定形狀的片狀黏著材沿著該路徑正確地搬送。(Function/Effect) According to this structure, since the adhesive holding member is a long adhesive tape, the sheet-like adhesive can be stably held by its adhesive force. Also, because the long adhesive tape can be released and moved along a predetermined path, it becomes easy to accurately convey the predetermined shape of the sheet-shaped adhesive material along the path.

又，較佳為，上述的發明中，前述黏著帶為，至少與前述既定形狀的片狀黏著材的端部相接的部分是由具透光性的材料所構成。Furthermore, it is preferable that, in the above-mentioned invention, the adhesive tape has at least a part in contact with the end of the predetermined-shaped sheet-shaped adhesive material is made of a light-transmitting material.

(作用・效果)依據本構成，保持既定形狀的片狀黏著材之黏著帶係與該片狀黏著材的端部相接的部分為由具透光性的材料所構成。也就是，在黏著材保持構件的黏著帶保持著既定形狀的片狀黏著材之狀態，透過黏著帶可確認片狀黏著材的位置及形狀等。因此，可一邊避免片狀黏著材的位置偏移，一邊能以進行良好精度進行片狀黏著材的形狀之檢査或調整片狀黏著材與工件之位置的操作。(Function/Effect) According to this structure, the part of the adhesive tape of the sheet-shaped adhesive material that maintains the predetermined shape and the end of the sheet-shaped adhesive material is made of a light-transmitting material. That is, in the state where the adhesive tape of the adhesive material holding member holds a sheet-shaped adhesive material of a predetermined shape, the position and shape of the sheet-shaped adhesive material can be confirmed through the adhesive tape. Therefore, while avoiding the positional deviation of the sheet-like adhesive material, the operation of inspecting the shape of the sheet-like adhesive material or adjusting the position of the sheet-like adhesive material and the workpiece can be performed with good accuracy.

又，較佳為，上述的發明中，前述黏著材保持構件係具有吸附孔的板狀構件，且藉由前述板狀構件吸附前述既定形狀的片狀黏著材而保持前述既定形狀的片狀黏著材。Also, preferably, in the above-mentioned invention, the adhesive holding member is a plate-shaped member having suction holes, and the plate-shaped member sucks the predetermined-shaped sheet-shaped adhesive to hold the predetermined-shaped sheet-shaped adhesive material.

(作用・效果)依據本構成，因為黏著材保持構件係具有吸附孔的板狀構件，所以藉其吸附力可將片狀黏著材穩定地保持。又，藉由搬送板狀構件，可將既定形狀的片狀黏著材朝既定的位置正確地搬送。(Function/Effect) According to this structure, since the adhesive holding member is a plate-shaped member with suction holes, the sheet-shaped adhesive can be stably held by its suction force. Furthermore, by conveying the plate-shaped member, the sheet-shaped adhesive material of a predetermined shape can be accurately conveyed to a predetermined position.

又，上述的發明中，較佳為前述板狀構件為，至少與前述既定形狀的片狀黏著材的端部相接的部分是由具透光性的材料所構成。Furthermore, in the above-mentioned invention, it is preferable that the plate-shaped member has at least a portion in contact with the end of the predetermined-shaped sheet-shaped adhesive material made of a light-transmitting material.

(作用・效果)依據本構成，與既定形狀的片狀黏著材的端部相接的部分的板狀構件係由具透光性的材料所構成。也就是，在板狀構件保持著既定形狀的片狀黏著材之狀態中，透過板狀構件可確認片狀黏著材的位置及形狀等。因此，能一邊避免片狀黏著材的位置偏移，一邊以良好精度進行片狀黏著材的形狀之檢査或調整片狀黏著材與工件之位置的操作。(Function/Effect) According to this structure, the plate-shaped member of the part that is in contact with the end of the sheet-shaped adhesive of a predetermined shape is composed of a light-transmitting material. That is, in a state where the plate-shaped member holds the sheet-shaped adhesive material of a predetermined shape, the position and shape of the sheet-shaped adhesive material can be confirmed through the plate-shaped member. Therefore, while avoiding the positional deviation of the sheet-shaped adhesive material, the operation of inspecting the shape of the sheet-shaped adhesive material or adjusting the position of the sheet-shaped adhesive material and the workpiece can be performed with good accuracy.

又，較佳為，上述的發明中，具備接近機構，該接近機構使被前述黏著材保持構件所保持的前述片狀黏著材的黏著面與前述工件的貼附面之距離接近到既定的距離，前述貼附機構係在藉由前述接近機構使前述片狀黏著材的黏著面與前述工件的貼附面接近到前述既定的距離後，將前述片狀黏著材貼附於前述工件。Furthermore, it is preferable that the above-mentioned invention includes a proximity mechanism that brings the distance between the adhesive surface of the sheet-shaped adhesive material held by the adhesive material holding member and the attachment surface of the workpiece close to a predetermined distance The attaching mechanism attaches the sheet-shaped adhesive material to the workpiece after the adhesive surface of the sheet-shaped adhesive material and the attaching surface of the workpiece are approached to the predetermined distance by the approach mechanism.

(作用・效果)依據本構成，係在藉由接近過程使前述片狀黏著材的黏著面與前述工件的貼附面接近到前述既定的距離後再將片狀黏著材貼附於工件。亦即，在將片狀黏著材充分接近工件後使按壓力等之力作用於片狀黏著材或工件並將片狀黏著材貼附於工件。因此，在工件上貼附既定形狀的片狀黏著材之際，可將有必要作用於該片狀黏著材的力的大小抑制成較低。因此，能避免因對片狀黏著材作用過剩的大力量而發生之片狀黏著材的變形及位置偏移，故能更加提升對工件貼附片狀黏著材的位置之精度。(Function/Effect) According to this structure, the adhesive surface of the sheet-like adhesive material and the attachment surface of the workpiece are approached to the predetermined distance through the approaching process, and then the sheet-like adhesive material is attached to the workpiece. That is, after the sheet-like adhesive material is sufficiently close to the workpiece, a force such as a pressing force is applied to the sheet-like adhesive material or the workpiece, and the sheet-like adhesive material is attached to the workpiece. Therefore, when a sheet-shaped adhesive material of a predetermined shape is attached to a workpiece, the magnitude of the force that must be applied to the sheet-shaped adhesive material can be suppressed to be low. Therefore, it is possible to avoid the deformation and position shift of the sheet-shaped adhesive material due to the excessive force acting on the sheet-shaped adhesive material, so that the accuracy of the position where the sheet-shaped adhesive material is attached to the workpiece can be further improved.

又，較佳為，上述的發明中，具備氣體供給機構，該氣體供給機構係於前述接近機構使前述片狀黏著材與前述工件接近之際，對前述工件與前述片狀黏著材之間供給氣體，以防止前述工件與前述片狀黏著材接觸。Furthermore, preferably, in the above-mentioned invention, a gas supply mechanism is provided for supplying between the workpiece and the sheet adhesive when the approach mechanism brings the sheet-shaped adhesive material close to the workpiece. Gas to prevent the aforementioned workpiece from contacting the aforementioned sheet-shaped adhesive material.

(作用・效果)依據本構成，在接近機構使片狀黏著材的黏著面與工件的貼附面接近之際，氣體供給機構係防止工件與片狀黏著材接觸。亦即，防止在利用貼附機構開始工件與片狀黏著材之貼附動作前，工件與片狀黏著材接觸而片狀黏著材被黏著並貼附在不同於假定的位置的位置上之事態。 [發明之效果](Function and effect) According to this structure, when the approach mechanism brings the adhesive surface of the sheet-shaped adhesive material close to the attachment surface of the workpiece, the gas supply mechanism prevents the workpiece from contacting the sheet-shaped adhesive material. In other words, it prevents the work piece from contacting the sheet-like adhesive material and the sheet-like adhesive material is stuck and attached to a position different from the assumed position before the work piece and the sheet-like adhesive material are attached by the sticking mechanism. . [Effects of Invention]

依據本發明的片狀黏著材的貼附方法及片狀黏著材的貼附裝置，在將既定形狀的片狀黏著材藉由黏著材保持構件保持著的狀態下將該片狀黏著材貼附於工件。因此，可藉由黏著材保持構件防止在將片狀黏著材貼附於工件之際發生片狀黏著材的位置偏移的事態。因此，可精度良好地將既定形狀的片狀黏著材貼附於工件上的假定的位置。According to the method of sticking a sheet-like adhesive material and the device for sticking a sheet-like adhesive material of the present invention, the sheet-like adhesive material of a predetermined shape is stuck in a state where the sheet-like adhesive material is held by the adhesive material holding member于Works. Therefore, the position of the sheet-shaped adhesive material can be prevented from shifting when the sheet-shaped adhesive material is attached to the workpiece by the adhesive material holding member. Therefore, the sheet-shaped adhesive material of the predetermined shape can be accurately attached to the assumed position on the workpiece.

以下，參照圖式，說明本發明的實施例。圖1至圖3係顯示實施例之片狀黏著材的貼附裝置1之基本構成。此外，在顯示片狀黏著材的貼附裝置1之各圖中，關於支持各種構成的支持手段、及驅動各種構成的驅動手段等，則適當地省略圖示。Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figures 1 to 3 show the basic structure of the sheet-shaped adhesive material attaching device 1 of the embodiment. In addition, in each figure showing the sticking device 1 of the sheet-like adhesive material, the supporting means for supporting various configurations, the driving means for driving the various configurations, etc. are appropriately omitted from the illustration.

在本實施例之片狀黏著材的貼附裝置中，係使用電路保護用黏著帶作為片狀黏著材T。使用矩形的半導體基板，作為屬於貼附片狀黏著材T的對象之工件W。In the sticking device of the sheet-like adhesive material of this embodiment, the circuit protection adhesive tape is used as the sheet-like adhesive material T. A rectangular semiconductor substrate is used as the workpiece W to which the sheet-like adhesive material T is attached.

使用於本實施例的片狀黏著材T係如圖4(b)所示，具備積層有非黏著性基材Ta、和具有黏著性的黏著材Tb之構造。在黏著材Tb添設有分離片(separator)S。亦即，在片狀黏著材T的黏著面添設有分離片S，藉由將分離片S從片狀黏著材T剝離而使片狀黏著材T的黏著面露出。關於分離片S的例子，係可例舉長形的紙材、塑膠等。As shown in FIG. 4(b), the sheet-shaped adhesive material T used in this embodiment has a structure in which a non-adhesive base material Ta and an adhesive material Tb are laminated. Separator S is added to the adhesive material Tb. That is, a release sheet S is added to the adhesive surface of the sheet-shaped adhesive material T, and the adhesive surface of the sheet-shaped adhesive material T is exposed by peeling the separator S from the sheet-shaped adhesive material T. As for the example of the separator S, a long paper, plastic, etc. can be cited.

本實施例中，「上游」及「下游」係定義為沿著片狀黏著材T的放出方向。亦即，「上游」意味：在片狀黏著材T的放出方向上，接近後述的黏著材供給機構2之側。本實施例中，片狀黏著材T係如圖1等所示，朝向符號Ln所示的方向被放出。此外，放出方向Ln係與x方向平行。In the present embodiment, "upstream" and "downstream" are defined as along the direction in which the sheet-shaped adhesive material T is released. That is, "upstream" means: in the direction of releasing the sheet-shaped adhesive material T, it is close to the side of the adhesive material supply mechanism 2 described later. In this embodiment, the sheet-shaped adhesive material T is discharged toward the direction indicated by the symbol Ln, as shown in FIG. 1 etc. In addition, the discharge direction Ln is parallel to the x direction.

＜整體構成的說明＞ 片狀黏著材的貼附裝置1具備有黏著材供給機構2、黏著材切斷機構3、黏著材回收機構4、黏著材保持機構5、分離片回收機構6、工件收納部7、工件保持台8、工件搬送機構9、黏著材貼附機構10、保持構件分離機構11及保持構件回收機構12。＜Description of the overall structure＞ The sheet-shaped adhesive material attaching device 1 is equipped with an adhesive material supply mechanism 2, an adhesive material cutting mechanism 3, an adhesive material recovery mechanism 4, an adhesive material holding mechanism 5, a separator recovery mechanism 6, a workpiece storage part 7, and a workpiece holding table 8. Workpiece conveying mechanism 9, adhesive material attaching mechanism 10, holding member separation mechanism 11, and holding member recovery mechanism 12.

黏著材供給機構2具備有：裝設原帶卷2a的筒管。原帶卷2a係構成為捲繞有添設有分離片S之長形的片狀黏著材T。片狀黏著材T係在添設有分離片S的狀態下從黏著材供給機構2被放出並供給，經由黏著材切斷機構3等朝黏著材貼附機構10被引導。從原帶卷2a放出的片狀黏著材T，係藉由未圖示的導輥等在放出方向賦予張力(tension)，並調整成不會產生皺褶。The adhesive supply mechanism 2 includes a bobbin on which the original tape roll 2a is installed. The original tape roll 2a is configured by winding a long sheet-like adhesive material T with a separator S added thereto. The sheet-shaped adhesive material T is discharged and supplied from the adhesive material supply mechanism 2 in a state where the separation sheet S is added, and is guided to the adhesive material attaching mechanism 10 via the adhesive material cutting mechanism 3 and the like. The sheet-like adhesive material T discharged from the original tape roll 2a is adjusted so as not to generate wrinkles by applying tension in the discharge direction by a guide roller (not shown) or the like.

黏著材切斷機構3係如圖5(a)所示，具備有下板13、支柱14、切斷單元15、上部固定板16。下板13係以水平地承接從黏著材供給機構2被放出並供給的片狀黏著材T之方式配設。支柱14係直立設置在下板13，且貫通切斷單元15。上部固定板16係橫向架設於支柱14，在上部固定板16的上面配設有馬達16a。As shown in FIG. 5( a ), the adhesive material cutting mechanism 3 includes a lower plate 13, a support column 14, a cutting unit 15, and an upper fixing plate 16. The lower plate 13 is arranged to horizontally receive the sheet-shaped adhesive material T discharged and supplied from the adhesive material supply mechanism 2. The support column 14 is installed upright on the lower plate 13 and penetrates the cutting unit 15. The upper fixing plate 16 is horizontally erected on the pillar 14, and a motor 16 a is arranged on the upper surface of the upper fixing plate 16.

切斷單元15係如圖5(b)所示，具備有可動台17和切斷刃19。可動台17為平坦的板狀構件，且橫向架設於支柱15。可動台17係構成為在上部固定板16與下板13之間，可沿著支柱14朝上下方向(z方向)往復移動。亦即，可動台17係藉由使馬達16a正反旋轉驅動，而沿著支柱14進行螺桿進給升降。黏著材切斷機構3只要具備使可動台17上下移動的構成即可，亦可採用以缸體(cylinder)為例的其他驅動機構來取代馬達16a。The cutting unit 15 is provided with a movable table 17 and a cutting blade 19 as shown in FIG. 5(b). The movable table 17 is a flat plate-shaped member, and is horizontally erected on the pillar 15. The movable table 17 is configured to be able to reciprocate in the vertical direction (z direction) along the pillar 14 between the upper fixed plate 16 and the lower plate 13. In other words, the movable table 17 is driven by the motor 16a to rotate forward and backward to feed and raise the screw along the pillar 14. The adhesive material cutting mechanism 3 only needs to have a structure for moving the movable table 17 up and down, and another drive mechanism using a cylinder as an example may be used instead of the motor 16a.

切斷刃19係如圖5(b)所示配置在可動台17的下面，與可動台17一起升降移動。藉由可動台17下降，切斷單元15會朝切斷片狀黏著材T的切斷位置移動。切斷單元15相當於本發明的切斷機構。The cutting blade 19 is arranged under the movable table 17 as shown in FIG. 5(b), and moves up and down together with the movable table 17. When the movable table 17 is lowered, the cutting unit 15 moves toward the cutting position where the sheet-shaped adhesive material T is cut. The cutting unit 15 corresponds to the cutting mechanism of the present invention.

在下板13的既定位置，直立設置有承接銷18。承接銷18係藉由承接可動台17的下面，而防止切斷單元15下降到超過所需之程度。承接銷18的高度係依據切斷刃19的長度來設定。亦即，如圖8(d)所示，設定成在承接銷18承接可動台17的狀態下，切斷刃19確實地將片狀黏著材T完全地切斷，且沒有將分離片S完全地切斷。藉由承接銷18，可防止切斷刃19將片狀黏著材T及分離片S兩者朝厚度方向完全切斷之事態。At a predetermined position of the lower board 13, a receiving pin 18 is erected. The receiving pin 18 receives the lower surface of the movable table 17 to prevent the cutting unit 15 from descending to a level more than necessary. The height of the receiving pin 18 is set according to the length of the cutting edge 19. That is, as shown in FIG. 8(d), in a state where the receiving pin 18 receives the movable table 17, the cutting blade 19 surely cuts the sheet-shaped adhesive material T completely, and does not completely cut the separator S To cut off. The receiving pin 18 prevents the cutting blade 19 from completely cutting both the sheet-shaped adhesive material T and the release sheet S in the thickness direction.

切斷刃19係如圖5(c)所示由環狀刃所構成。切斷刃19係如圖1等所示，沿著環狀的切斷軌跡K切斷片狀黏著材T，而形成與切斷軌跡K對應之形狀的黏著材片Tp。切斷刃19的形狀係可依據工件W的形狀適當地變更，在本實施例中，係成為矩形的環狀刃，具體言之係成為長方形的環狀刃。在可動基台17的兩端設有供支柱14貫通之貫通孔H。黏著材片Tp相當於本發明中之既定形狀的片狀黏著材。The cutting blade 19 is composed of a ring-shaped blade as shown in FIG. 5(c). As shown in FIG. 1 etc., the cutting blade 19 cuts the sheet-shaped adhesive material T along the circular cutting track K, and forms the adhesive material sheet Tp of the shape corresponding to the cutting track K. The shape of the cutting edge 19 can be appropriately changed according to the shape of the workpiece W. In this embodiment, it is a rectangular ring-shaped blade, specifically, a rectangular ring-shaped blade. At both ends of the movable base 17 are provided through holes H through which the pillar 14 penetrates. The adhesive material sheet Tp corresponds to a sheet-like adhesive material of a predetermined shape in the present invention.

此外，本發明中，「環狀」係定義為：一端與另一端相接，且整體而言係包含所有封閉的線狀者。舉一例來說，除了矩形、圓形(圓環狀)、多角形之外，亦包含至少局部具有波形之波形狀、大致圓形等。關於大致圓形的一例，可例舉：沿著設有凹口(notch)或定向平面(orientation flat)之基板的外形之形狀，亦即，圓的一部分包含凹部或直線之形狀。又，在切斷軌跡K為矩形或多角形的情況，角部的角度亦可適當變更，角部亦可帶有圓弧。In addition, in the present invention, "loop" is defined as: one end is connected to the other end, and as a whole, it includes all closed linear shapes. For example, in addition to rectangular, circular (circular), and polygonal shapes, it also includes a wave shape having at least a partial wave shape, a substantially circular shape, and the like. An example of a substantially circular shape may be a shape along the outer shape of a substrate provided with a notch or an orientation flat, that is, a shape in which a part of the circle includes a concave portion or a straight line. In addition, when the cutting trajectory K is rectangular or polygonal, the angle of the corner may be appropriately changed, and the corner may have an arc.

實施例中，如圖5(b)所示，可動台17與切斷刃19係一體形成。藉由一體形成，可更確實地維持可動台17與切斷刃19之相對的位置關係。亦即，與可動台17和切斷刃19為個別的構件的情況相比，在切斷單元16按壓片狀黏著材T並切斷之際，可確實地防止切斷刃19的位置相對於可動台17偏移。其結果，可避免因切斷刃19相對於可動台17的偏移而導致黏著材片Tp的形狀與假定的形狀不同之情況。關於能夠將切斷刃19與可動台17一體形成，且能夠提升切斷軌跡K的精度方面，作為切斷刃19的較佳構成，係可例舉PINNACLE刃(註冊商標)。In the embodiment, as shown in FIG. 5(b), the movable table 17 and the cutting blade 19 are integrally formed. By integrally forming, the relative positional relationship between the movable table 17 and the cutting blade 19 can be maintained more reliably. That is, compared with the case where the movable table 17 and the cutting blade 19 are separate members, when the cutting unit 16 presses the sheet-shaped adhesive T and cuts it, the position of the cutting blade 19 can be reliably prevented from The movable table 17 is offset. As a result, it can be avoided that the shape of the adhesive sheet Tp is different from the assumed shape due to the deviation of the cutting blade 19 with respect to the movable table 17. Regarding the fact that the cutting blade 19 can be integrally formed with the movable table 17 and the accuracy of the cutting trajectory K can be improved, a preferred configuration of the cutting blade 19 is a PINNACLE blade (registered trademark).

黏著材回收機構4係將殘留在被切斷成切斷軌跡K的形狀之黏著材片Tp周圍的片狀黏著材T、亦即剩餘黏著材Tn加以回收。剩餘黏著材Tn係如圖1等所示，從黏著材切斷機構3被朝下游運送後，從分離片S被剝離。被剝離的剩餘黏著材Tn係藉由未圖示的導輥朝回收筒管21引導。The adhesive material recovery mechanism 4 collects the sheet-shaped adhesive material T remaining around the adhesive material sheet Tp cut into the shape of the cut trajectory K, that is, the remaining adhesive material Tn. The remaining adhesive material Tn is as shown in FIG. 1 etc., after being conveyed downstream from the adhesive material cutting mechanism 3, it is peeled from the separator S. The surplus adhesive material Tn peeled off is guided to the recovery bobbin 21 by a guide roller (not shown).

回收筒管21係將自分離片S剝離的剩餘黏著材Tn捲取回收。捲取回收之結果，分離片S及黏著材片Tp朝黏著材保持機構5被引導。The recovery bobbin 21 winds up and recovers the excess adhesive material Tn peeled from the separator S. As a result of the winding and recycling, the separator S and the adhesive sheet Tp are guided toward the adhesive holding mechanism 5.

在黏著材切斷機構3與黏著材回收機構4之間，設有未圖示的張力調節輥(dancer roller)。黏著材切斷機構3中之片材黏著材T的張力大小與在比黏著材回收機構4更下游之片材黏著材T的張力大小的差，係藉該張力調節輥吸收。Between the adhesive material cutting mechanism 3 and the adhesive material recovery mechanism 4, a dancer roller (not shown) is provided. The difference between the tension of the sheet adhesive T in the adhesive cutting mechanism 3 and the tension of the sheet adhesive T downstream of the adhesive recovery mechanism 4 is absorbed by the tension adjusting roller.

因此，在比黏著材回收機構4更下游處，可對片狀黏著材T確實地賦予不會產生皺褶的張力，可較大幅地調整片狀黏著材T的張力。另一方面，在黏著材切斷機構3中，能以不會在片狀黏著材T發生鬆弛且也不會發生因過度的賦予張力而導致片狀黏著材T伸展之程度，較小幅地調整片狀黏著材T的張力。Therefore, further downstream than the adhesive material recovery mechanism 4, the sheet-shaped adhesive material T can be surely given tension without causing wrinkles, and the tension of the sheet-shaped adhesive material T can be adjusted relatively greatly. On the other hand, in the adhesive material cutting mechanism 3, the sheet-shaped adhesive material T will not be loosened and the sheet-shaped adhesive material T will not be stretched due to excessive tension. The tension of the sheet-like adhesive material T.

黏著材保持機構5係藉由保持構件保持黏著材片Tp者。本實施例中，係使用具黏著性的保持帶F作為保持構件。亦即，藉由將保持帶F貼附於黏著材片Tp，可穩定地保持黏著材片Tp。保持帶F較佳係由以透明材料為例之具透光性的材料構成。本實施例中，保持帶F相當於本發明的黏著材保持構件。The adhesive material holding mechanism 5 holds the adhesive material sheet Tp by a holding member. In this embodiment, an adhesive holding tape F is used as the holding member. That is, by attaching the holding tape F to the adhesive material sheet Tp, the adhesive material sheet Tp can be stably held. The holding belt F is preferably made of a transparent material such as a transparent material. In this embodiment, the holding tape F corresponds to the adhesive holding member of the present invention.

本實施例中，黏著材保持機構5具備有供給筒管23、支持台24和貼附單元25。供給筒管23係成為捲繞有長形的保持帶F之構成。保持帶F係從供給筒管23被放出並供給，朝向從黏著材回收機構4向下游供給的黏著材片Tp被引導。支持台24係以將從黏著材回收機構4向下游供給的黏著材片Tp及分離片S水平地承接之方式配設。In this embodiment, the adhesive holding mechanism 5 includes a supply bobbin 23, a support stand 24, and an attaching unit 25. The supply bobbin 23 has a structure in which a long holding tape F is wound. The holding tape F is discharged from the supply bobbin 23 and supplied, and is guided toward the adhesive material sheet Tp supplied downstream from the adhesive material recovery mechanism 4. The support table 24 is arranged so as to receive the adhesive material sheet Tp and the separator S supplied downstream from the adhesive material recovery mechanism 4 horizontally.

貼附單元25具備有貼附輥27和驅動缸29。貼附單元25係構成為沿著圖3所示的導軌30於支持台24的上方往復移動。貼附輥27係構成為可藉由驅動缸29升降。亦即，從供給筒管23被引導而至的保持帶F，係藉由貼附輥27從上方被按壓，而貼附於被支持台24承接的黏著材片Tp。The attaching unit 25 includes an attaching roller 27 and a driving cylinder 29. The attaching unit 25 is configured to reciprocate above the support table 24 along the guide rail 30 shown in FIG. 3. The sticking roller 27 is configured to be liftable by a driving cylinder 29. That is, the holding belt F guided from the supply bobbin 23 is pressed from above by the attaching roller 27 and attached to the adhesive sheet Tp received by the support table 24.

分離片回收機構6具備有導輥31、饋送輥32、和回收筒管33。貼附有保持帶F的黏著材片Tp及分離片S，係藉導輥34剝離成附帶有保持帶F的黏著材片Tp和分離片S。被剝離的分離片S，係經由饋送輥32被捲取回收到回收筒管33。The separator recovery mechanism 6 includes a guide roller 31, a feed roller 32, and a recovery bobbin 33. The adhesive sheet Tp to which the holding tape F is attached and the separator S are peeled off by the guide roller 34 into the adhesive sheet Tp and the separator S to which the holding tape F is attached. The separated sheet S that has been peeled off is wound up and recovered to the recovery bobbin 33 via the feed roller 32.

工件收納部7，舉一例來說具備有收納工件W之匣(magazine)C1及匣C2。多數片工件W係以水平姿勢多層地插入收納於匣C1。貼附有既定形狀的片狀黏著材T之工件W，能以水平姿勢多層地插入收納於匣C2。The workpiece storage section 7 is provided with a magazine C1 and a magazine C2 for storing the workpiece W, for example. A large number of workpieces W are inserted and stored in the cassette C1 in multiple layers in a horizontal posture. The work W to which the sheet-like adhesive material T of a predetermined shape is attached can be inserted and stored in the cassette C2 in multiple layers in a horizontal posture.

工件保持台8係如圖6所示，具備有可動台35、升降台36、工件載置部37和氣體供給噴嘴Nz。可動台35具備有前後可動台35a、左右可動台35b和旋轉可動台35c。前後可動台35a係構成為沿著引導軌道R1朝前後方向(圖中為y方向)水平移動。藉由前後可動台35a的水平移動，工件保持台8係可在圖3中實線所示的待機區域P和圖3中虛線所示的貼附區域Q之間往復移動。As shown in FIG. 6, the workpiece holding table 8 is provided with a movable table 35, an elevating table 36, a workpiece mounting portion 37 and a gas supply nozzle Nz. The movable table 35 includes a front and rear movable table 35a, a left and right movable table 35b, and a rotary movable table 35c. The front-rear movable table 35a is configured to move horizontally in the front-rear direction (y direction in the figure) along the guide rail R1. By horizontal movement of the front and rear movable table 35a, the workpiece holding table 8 can reciprocate between the standby area P shown by the solid line in FIG. 3 and the attachment area Q shown by the broken line in FIG. 3.

左右可動台35b係構成為可沿著固定於前後可動台35a上的引導軌道R2朝左右方向(圖中為x方向)水平移動。旋轉可動台35c係設置在左右可動台35b的上方，構成為可朝向繞著z軸的旋轉方向θ旋轉。升降台36係直立設置在可動台35，工件載置部37係配設在升降台36的上端。升降台36構成為可藉由未圖示的馬達等，朝z方向升降移動。The left-right movable table 35b is configured to be horizontally movable in the left-right direction (x direction in the figure) along the guide rail R2 fixed to the front-rear movable table 35a. The rotating movable table 35c is provided above the left and right movable tables 35b, and is configured to be rotatable in the rotation direction θ around the z-axis. The elevating table 36 is installed upright on the movable table 35, and the work placement portion 37 is arranged on the upper end of the elevating table 36. The elevating table 36 is configured to be movable up and down in the z direction by a motor or the like not shown.

工件載置部37係具有平坦的載置面，將工件W以水平狀態保持。工件載置部37具備有吸附墊38和定位構件39。吸附墊38係藉由驅動缸40而在工件載置部37所內建的待機位置與從工件載置部37的載置面突出的接收位置之間升降移動。圖6中，以兩點鏈線例示吸附墊38移動的接收位置。The workpiece mounting portion 37 has a flat mounting surface, and holds the workpiece W in a horizontal state. The workpiece mounting portion 37 includes an adsorption pad 38 and a positioning member 39. The suction pad 38 is moved up and down by the drive cylinder 40 between a standby position built in the workpiece placement portion 37 and a receiving position protruding from the placement surface of the workpiece placement portion 37. In FIG. 6, the receiving position where the suction pad 38 moves is illustrated by a two-dot chain line.

定位構件39係設置在工件載置部37之前後左右的四處。定位構件39係構成為藉由未圖示的缸體朝向工件載置部37的中心進退移動。構成為：利用定位構件39朝向工件載置部37的中心從四周對載置於工件載置部37之工件W的外周進行按壓，藉以使工件W被定位在工件載置部37的中心上。配設於工件載置部37之定位構件39的數量及位置，只要是可定位工件W的構成即可，亦可適當地變更。此外，工件載置部37係以藉由設於內部之未圖示的吸引機構等，吸附保持工件W較佳。The positioning members 39 are provided at four places on the left, right, and front of the workpiece mounting portion 37. The positioning member 39 is configured to advance and retreat toward the center of the workpiece mounting portion 37 by a cylinder not shown. It is configured that the positioning member 39 presses the outer periphery of the workpiece W placed on the workpiece placing portion 37 from all around toward the center of the workpiece placing portion 37 so that the workpiece W is positioned on the center of the workpiece placing portion 37. The number and positions of the positioning members 39 arranged in the workpiece mounting portion 37 may be appropriately changed as long as they have a configuration capable of positioning the workpiece W. In addition, the workpiece mounting portion 37 is preferably provided in the interior by a suction mechanism (not shown) or the like, so that the workpiece W can be sucked and held.

再者，構成為至少在工件保持台8朝貼附區域Q移動的狀態下，工件保持台8可將工件W朝x、y、z及θ的各方向位移。本實施例中，構成為藉由前後可動台35a及左右可動台35b的水平移動、旋轉可動台35c的旋轉移動、及升降台36的升降移動，可將朝貼附區域Q被搬送之工件W的位置朝各方向適當地調整。In addition, the workpiece holding table 8 is configured to be able to displace the workpiece W in the directions of x, y, z, and θ at least when the workpiece holding table 8 moves toward the attaching area Q. In this embodiment, the horizontal movement of the front-rear movable table 35a and the left-right movable table 35b, the rotational movement of the rotary movable table 35c, and the up-and-down movement of the lift table 36 are configured to allow the workpiece W to be transported to the attaching area Q Adjust the position appropriately in all directions.

氣體供給噴嘴Nz係與未圖示之氣體供給源連接，在使工件W的貼附面與黏著材片Tp的黏著面接近既定的微小距離Da之狀態下，亦即在接近狀態下將氣體供給到工件W與黏著材片Tp的間隙。藉由供給該氣體，得以防止在接近狀態下工件W與黏著材片Tp接觸。The gas supply nozzle Nz is connected to a gas supply source not shown, and supplies the gas in a state where the sticking surface of the workpiece W and the sticking surface of the adhesive sheet Tp are close to a predetermined minute distance Da, that is, in the close state To the gap between the workpiece W and the adhesive sheet Tp. By supplying this gas, it is possible to prevent the workpiece W from contacting the adhesive sheet Tp in the approaching state.

工件搬送機構9具備有搬送臂9a，構成為藉由未圖示的驅動機構可進行水平進退、迴旋及升降。在搬送臂9a的前端，例如設有馬蹄型的工件保持部9b。搬送臂9a係構成為工件保持部9b可在多層地收納於工件收納部7之工件W彼此的間隙進退。在工件保持部9b設有吸附孔，構成為將工件W真空吸附並保持。The workpiece conveying mechanism 9 is provided with a conveying arm 9a, and is configured to be capable of horizontally advancing and retreating, turning, and lifting by a drive mechanism not shown. At the tip of the transfer arm 9a, for example, a horseshoe-shaped workpiece holding portion 9b is provided. The transfer arm 9a is configured such that the workpiece holding portion 9b can advance and retreat in the gap between the workpieces W stored in the workpiece storage portion 7 in multiple layers. The workpiece holding portion 9b is provided with suction holes, and is configured to vacuum suction and hold the workpiece W.

黏著材貼附機構10係將黏著材片Tp貼附於工件W者，具備有貼附輥41和驅動缸43。黏著材貼附機構10係構成為沿著圖3所示的導軌30在於貼附區域Q的上方往復移動。貼附輥41係構成為可藉由驅動缸43而升降。亦即，貼附有保持帶F的黏著材片Tp係藉貼附輥41從上方被按壓，對被工件保持台8所保持的工件W貼附黏著材片Tp。The adhesive material attaching mechanism 10 attaches the adhesive material sheet Tp to the workpiece W, and includes an attaching roller 41 and a driving cylinder 43. The adhesive material attaching mechanism 10 is configured to reciprocate above the attaching area Q along the guide rail 30 shown in FIG. 3. The sticking roller 41 is configured to be movable up and down by the driving cylinder 43. That is, the adhesive sheet Tp to which the holding tape F is attached is pressed from above by the attaching roller 41, and the adhesive sheet Tp is attached to the workpiece W held by the workpiece holding table 8.

保持構件分離機構11係使保持帶F從貼附於工件W的黏著材片Tp分離。保持構件分離機構11具備有：維持保持帶F的張力之導輥56；和軋輥(nip roller)57。軋輥57係由可進行升降移動的壓輥(pinch roller)57a和藉馬達驅動的饋送輥(feeding roller)57b所構成。保持構件分離機構11係構成為可沿著未圖示的軌道在左右水平往復移動。The holding member separation mechanism 11 separates the holding tape F from the adhesive sheet Tp attached to the workpiece W. The holding member separating mechanism 11 includes a guide roller 56 that maintains the tension of the holding belt F; and a nip roller 57. The roller 57 is composed of a pinch roller 57a that can move up and down and a feeding roller 57b that is driven by a motor. The holding member separation mechanism 11 is configured to be horizontally reciprocating left and right along a rail (not shown).

保持構件回收機構12係配設在帶剝離單元11的下游，構成為將自黏著材片Tp分離的保持帶F捲取之回收筒管係朝捲取方向被旋轉驅動。The holding member recovery mechanism 12 is arranged downstream of the tape peeling unit 11, and is configured such that the recovery bobbin for winding the holding tape F separated from the adhesive sheet Tp is driven to rotate in the winding direction.

片狀黏著材的貼附裝置1進一步具備有控制部44、輸入部45、黏著材位置辨識機構47、工件位置辨識機構48、切斷檢查機構49、貼附檢查機構50、位置判定部51、切斷判定部52、貼附判定部53、記憶部54、和通報部55。The sheet-shaped adhesive material sticking device 1 further includes a control unit 44, an input unit 45, an adhesive material position recognition mechanism 47, a workpiece position recognition mechanism 48, a cutting inspection mechanism 49, an attachment inspection mechanism 50, and a position determination unit 51, The cutting determination unit 52, the sticking determination unit 53, the storage unit 54, and the notification unit 55.

控制部44具備有CPU(中央處理單元)等，針對設置於片狀黏著材的貼附裝置1之構成的每一者，總括控制各種動作等。關於輸入部45的例子，係可例舉操縱板(console panel)、鍵盤等，操作者(operator)係使用輸入部45輸入各種指示。如圖2所示，輸入輸入部45的指示內容係被傳送到控制部44，控制部44係可依據該指示進行各種控制。The control unit 44 includes a CPU (Central Processing Unit) and the like, and collectively controls various operations and the like for each of the configurations of the sticking device 1 provided on the sheet-like adhesive material. As an example of the input unit 45, a console panel, a keyboard, etc. can be cited, and an operator uses the input unit 45 to input various instructions. As shown in FIG. 2, the instruction content of the input unit 45 is sent to the control unit 44, and the control unit 44 can perform various controls in accordance with the instruction.

又，操作者等藉由操作輸入部45，可事先輸入關於黏著材片Tp的尺寸的基準、黏著材片Tp的形狀的基準，在工件W上貼附黏著材片Tp之位置的基準及與該基準的差之容許值等各種資訊。記憶部54係記憶被輸入的各種資訊。In addition, by operating the input unit 45, the operator can input in advance the reference of the size of the adhesive sheet Tp, the reference of the shape of the adhesive sheet Tp, and the reference of the position of the adhesive sheet Tp on the workpiece W and the Various information such as the allowable value of the difference of the standard. The storage unit 54 stores various inputted information.

黏著材位置辨識機構47係在黏著材片Tp貼附於工件W前的既定時點，藉由拍攝黏著材片Tp而取得關於黏著材片Tp的詳細位置之資訊。本實施例中，黏著材位置辨識機構47具備有配設於貼附區域Q的上方之一對黏著材位置辨識相機47a及47b。黏著材位置辨識機構47所取得之黏著材片Tp的位置資訊係被傳送到位置判定部51。The adhesive material position identification mechanism 47 is at a predetermined time point before the adhesive material piece Tp is attached to the workpiece W, and obtains information about the detailed position of the adhesive material piece Tp by photographing the adhesive material piece Tp. In this embodiment, the adhesive material position recognition mechanism 47 is provided with a pair of adhesive material position recognition cameras 47a and 47b arranged above the attaching area Q. The position information of the adhesive material piece Tp obtained by the adhesive material position recognition mechanism 47 is sent to the position determination unit 51.

工件位置辨識機構48係在黏著材片Tp貼附於工件W前的既定時點，藉由拍攝工件W而取得關於工件W的詳細位置之資訊。本實施例中，工件位置辨識機構48具備有配設於待機區域P的上方之一對工件位置辨識相機48a及48b。工件位置辨識機構48所取得之工件W的位置資訊係被傳送到位置判定部51。The workpiece position identification mechanism 48 is at a predetermined time point before the adhesive sheet Tp is attached to the workpiece W, and obtains information on the detailed position of the workpiece W by photographing the workpiece W. In this embodiment, the workpiece position recognizing mechanism 48 is provided with a pair of workpiece position recognizing cameras 48a and 48b arranged above the standby area P. The position information of the workpiece W acquired by the workpiece position recognizing mechanism 48 is sent to the position determining unit 51.

切斷檢查機構49係配設在黏著材切斷機構3的下游之既定位置，檢查黏著材片Tp的切斷是否正常地進行。本實施例中，切斷檢查機構49具備有配設於支持台24的上方之一對切斷檢查相機49a及49b。切斷檢查機構49係拍攝沿著切斷軌跡K被切斷的黏著材片Tp，藉由以光學方式辨識黏著材片Tp而取得關於黏著材片Tp的資訊。關於藉由切斷檢查機構49所取得之資訊的例子，係可例舉黏著材片Tp的尺寸及形狀。切斷檢查機構49所取得的資訊被傳送到切斷判定部52。本發明中，「以光學方式辨識」意指：使用以相機或光學感測器為例之具有光學系的光學手段，來識別對象。The cutting inspection mechanism 49 is arranged at a predetermined position downstream of the adhesive material cutting mechanism 3 to inspect whether the cutting of the adhesive material sheet Tp is performed normally. In this embodiment, the cutting inspection mechanism 49 is provided with a pair of cutting inspection cameras 49a and 49b arranged above the support table 24. The cutting inspection mechanism 49 photographs the adhesive sheet Tp cut along the cutting trajectory K, and obtains information about the adhesive sheet Tp by optically identifying the adhesive sheet Tp. As an example of the information obtained by the cutting inspection mechanism 49, the size and shape of the adhesive sheet Tp can be cited. The information acquired by the disconnection inspection mechanism 49 is sent to the disconnection determination unit 52. In the present invention, "recognizing optically" means: using an optical means with an optical system such as a camera or an optical sensor to recognize an object.

貼附檢查機構50係在黏著材片Tp貼附於工件W後的既定時點，檢查黏著材片Tp是否正常地貼附於工件W。本實施例中，貼附檢查機構50係具備有配設於待機區域P的上方之一對貼附檢查相機50a及50b。貼附檢查機構50係拍攝貼附於工件W的黏著材片Tp和工件W，藉由以光學方式辨識工件W而取得關於工件W的資訊。以藉由貼附檢查機構50所取得之資訊的例子而言，可舉出例如：關於對工件W貼附有黏著材片Tp的位置之資訊。貼附檢查機構50所取得的資訊係被傳送到貼附判定部53。The attachment inspection mechanism 50 checks whether the adhesive sheet Tp is attached to the workpiece W normally at a predetermined point after the adhesive sheet Tp is attached to the workpiece W. In this embodiment, the sticking inspection mechanism 50 is equipped with a pair of sticking inspection cameras 50a and 50b arranged above the standby area P. The attachment inspection mechanism 50 photographs the adhesive sheet Tp attached to the workpiece W and the workpiece W, and obtains information about the workpiece W by optically identifying the workpiece W. Taking an example of the information obtained by the attaching inspection mechanism 50, for example, information about the position where the adhesive sheet Tp is attached to the workpiece W can be cited. The information obtained by the attaching inspection mechanism 50 is sent to the attaching determination unit 53.

位置判定部51係如圖12(b)所示設置於控制部44的上游，使用黏著材位置辨識機構47所取得的資訊和工件位置辨識機構48所取得的資訊，算出黏著構件Tp相對於工件W的相對位置。工件位置判定部52係將所算出之相對位置的資訊傳送到控制部44。控制部44係藉由使工件保持台8朝貼附區域Q移動的位置適當地移動，而在黏著材貼附機構10中調整工件W相對於黏著構件Tp的位置。The position determination unit 51 is installed upstream of the control unit 44 as shown in FIG. 12(b), and uses the information obtained by the adhesive material position identification mechanism 47 and the information obtained by the workpiece position identification mechanism 48 to calculate the adhesive member Tp relative to the workpiece The relative position of W. The workpiece position determination unit 52 transmits the information of the calculated relative position to the control unit 44. The control unit 44 adjusts the position of the workpiece W with respect to the adhesive member Tp in the adhesive material application mechanism 10 by appropriately moving the workpiece holding table 8 toward the position where the application area Q is moved.

切斷判定部52係如圖10(b)所示設置於控制部44的上游，使用切斷檢查機構49所檢測到的資訊進行各種演算，針對藉黏著材切斷機構3所形成之黏著材片Tp的每一者，算出尺寸及形狀。接著，對所算出之黏著材片Tp的尺寸及形狀的資訊與關於事先記憶於記憶部54之黏著材片Tp的尺寸及形狀的基準之資訊進行比較，判定實際形成之黏著材片Tp的尺寸及形狀與每一者的基準值之差是否在容許值的範圍內。關於黏著材片Tp的尺寸及形狀，當與基準值的差是在容許值的範圍內時，則判定黏著材片Tp是可使用的。The cutting judging unit 52 is installed upstream of the control unit 44 as shown in FIG. 10(b), and uses the information detected by the cutting inspection mechanism 49 to perform various calculations for the adhesive material formed by the adhesive material cutting mechanism 3 Calculate the size and shape of each piece Tp. Next, compare the calculated size and shape information of the adhesive material sheet Tp with the information about the size and shape of the adhesive material sheet Tp previously stored in the memory 54 to determine the size of the adhesive material sheet Tp actually formed And whether the difference between the shape and the reference value of each is within the allowable value range. Regarding the size and shape of the adhesive material sheet Tp, when the difference from the reference value is within the allowable value range, it is determined that the adhesive material sheet Tp is usable.

貼附判定部53係如圖17(b)所示貼附於控制部44的上游，使用貼附檢查機構50所檢測到的影像資訊來進行各種演算，算出黏著材片Tp藉由黏著材貼附機構10實際被貼附的位置。貼附判定部53係將所算出之位置的資訊，與事先記憶於記憶部54之作為基準的貼附位置進行比較。接著，貼附判定部53判定黏著材片Tp實際被貼附於工件W的位置與基準位置之差是否在容許範圍內。在貼附有黏著材片Tp的位置是在容許範圍內的情況下，判定黏著材片Tp的貼附製程正常地進行，並且該判定結果的資訊會被傳送到控制部44。The sticking judging unit 53 is attached to the upstream of the control unit 44 as shown in FIG. 17(b), and uses the image information detected by the sticking inspection mechanism 50 to perform various calculations to calculate the adhesive material Tp by the adhesive material. The position where the attachment mechanism 10 is actually attached. The sticking determination unit 53 compares the calculated position information with the sticking position stored in the memory unit 54 in advance as a reference. Next, the sticking determination unit 53 determines whether the difference between the position where the adhesive material piece Tp is actually stuck to the workpiece W and the reference position is within the allowable range. In a case where the position where the adhesive material sheet Tp is attached is within the allowable range, it is determined that the attaching process of the adhesive material sheet Tp is normally performed, and the information of the determination result is transmitted to the control unit 44.

當依據切斷判定部52或貼附判定部53所判定的結果，黏著材片Tp的尺寸、形狀或貼附位置是在容許範圍外時，通報部55會通報片狀黏著材T的切斷製程或黏著材片Tp的貼附製程發生了錯誤。關於通報部55的構成，係可例舉點亮燈泡或警報音產生裝置等。When the size, shape, or attachment position of the adhesive material sheet Tp is out of the allowable range based on the result determined by the cutting judging unit 52 or the sticking judging unit 53, the notification unit 55 notifies the cut of the sheet-like adhesive material T An error occurred in the manufacturing process or the attaching process of the adhesive sheet Tp. Regarding the configuration of the notification unit 55, a lighting bulb or an alarm sound generating device can be exemplified.

＜帶貼附動作的概要＞ 在此，說明實施例之片狀黏著材的貼附裝置1的基本動作。圖4(a)係說明使用片狀黏著材的貼附裝置1，對工件W貼附黏著材片Tp的製程之流程圖。＜Outline of tape sticking action＞ Here, the basic operation of the sticking device 1 of the sheet-shaped adhesive material of the embodiment will be described. FIG. 4(a) is a flowchart illustrating the process of attaching the adhesive material sheet Tp to the workpiece W using the attaching device 1 of the sheet-shaped adhesive material.

步驟S1(工件的供給) 貼附指令一發出，工件保持台8便朝待機區域P移動，並且吸附墊38的前端從工件載置部37的載置面突出而朝接收位置上升。接著，工件搬送機構9的搬送臂9a插入工件收納部7的匣C1。搬送臂9a的工件保持部9b將既定的工件W從背面側吸附保持並取出，朝工件保持台8上搬送。Step S1 (supply of workpiece) When the attaching command is issued, the workpiece holding table 8 moves toward the standby area P, and the tip of the suction pad 38 protrudes from the placement surface of the workpiece placement portion 37 and rises toward the receiving position. Next, the transport arm 9a of the workpiece transport mechanism 9 is inserted into the cassette C1 of the workpiece storage section 7. The workpiece holding portion 9b of the transport arm 9a suction-holds and takes out the predetermined workpiece W from the back side, and transports it onto the workpiece holding table 8.

背面被工件保持部9b吸附的工件W係如圖7(a)所示，被載置於從工件載置部37突出的吸附墊38。其後，如圖7(b)所示，吸附墊38下降，工件W被載置於工件載置部37的上面。As shown in FIG. 7( a ), the workpiece W whose back surface is sucked by the workpiece holding portion 9 b is placed on the suction pad 38 protruding from the workpiece placing portion 37. After that, as shown in FIG. 7( b ), the suction pad 38 is lowered, and the workpiece W is placed on the upper surface of the workpiece mounting portion 37.

工件W一被載置於工件載置部37時，四周的定位構件39就分別朝工件載置部37的中心側進出，工件W被定位在工件載置部37的中心上。在已定位的狀態下未圖示的真空裝置作動，工件W被吸附保持在工件載置部37。When the workpiece W is placed on the workpiece placing portion 37, the positioning members 39 around each move in and out of the center of the workpiece placing portion 37, and the workpiece W is positioned on the center of the workpiece placing portion 37. In the positioned state, a vacuum device (not shown) is operated, and the workpiece W is sucked and held on the workpiece mounting portion 37.

步驟S2(片狀黏著材的切斷) 另一方面，從黏著材供給機構2被放出並供給的片狀黏著材T係如圖8(a)所示，在黏著材切斷機構3的下板13上暫時地停止行進。接著，如圖8(b)所示，藉由使下板13的位置上升，來調整下板13的上方之片狀黏著材T的張力。具體言之，調整成片狀黏著材T不會發生鬆弛，且片狀黏著材T不會伸展之程度的張力。Step S2 (cutting of sheet adhesive) On the other hand, as shown in FIG. 8( a ), the sheet-shaped adhesive material T discharged from the adhesive material supply mechanism 2 is temporarily stopped on the lower plate 13 of the adhesive material cutting mechanism 3. Next, as shown in FIG. 8(b), by raising the position of the lower plate 13, the tension of the sheet-shaped adhesive material T above the lower plate 13 is adjusted. Specifically, it is adjusted so that the sheet-like adhesive material T does not slack and the sheet-like adhesive material T does not stretch to such a degree of tension.

片狀黏著材T的張力經調整後，如圖8(c)所示使切斷單元15下降以切斷片狀黏著材T。亦即，藉由馬達16a，可動台17從虛線所示的初始位置下降並朝切斷位置移動。藉由朝切斷位置移動，切斷刃19對在下板13的上方停止行進的片狀黏著材T從上方進行按壓，使片狀黏著材T逐漸被環狀的切斷刃19切斷。其結果，如圖1等所示，片狀黏著材T沿著環狀的切斷軌跡K被切斷，形成與切斷軌跡K對應之既定形狀的黏著材片Tp。After the tension of the sheet-shaped adhesive material T is adjusted, as shown in FIG. 8(c), the cutting unit 15 is lowered to cut the sheet-shaped adhesive material T. That is, by the motor 16a, the movable table 17 descends from the initial position indicated by the broken line and moves to the cutting position. By moving to the cutting position, the cutting blade 19 presses the sheet-shaped adhesive material T stopped above the lower plate 13 from above, so that the sheet-shaped adhesive material T is gradually cut by the ring-shaped cutting blade 19. As a result, as shown in FIG. 1 etc., the sheet-shaped adhesive material T is cut along the circular cutting track K, and the adhesive material sheet Tp of a predetermined shape corresponding to the cutting track K is formed.

此外，朝下方移動的可動台17係被承接銷18承接。承接銷18在既定的高度承接可動台17，藉此可避免已將片狀黏著材T的層完全地切斷的切斷刃19進一步連分離片S的層亦完全地切斷之情事。完成由切斷單元15所進行之片狀黏著材T的切斷，切斷單元15上升並返回初始位置，藉此完成了步驟S2的製程。In addition, the movable table 17 moving downward is received by the receiving pin 18. The receiving pin 18 receives the movable table 17 at a predetermined height, thereby preventing the cutting blade 19 that has completely cut the layer of the sheet-like adhesive material T from further cutting the layer of the separation sheet S completely. The cutting of the sheet-shaped adhesive material T by the cutting unit 15 is completed, and the cutting unit 15 rises and returns to the initial position, thereby completing the process of step S2.

步驟S3(黏著材片的分離) 當藉由黏著材切斷機構3形成黏著材片Tp時，片狀黏著材T再度開始行進，片狀黏著材T進一步被朝下游運送。然後，一邊將片狀黏著材T朝下游運送，一邊在黏著材分離機構4中使黏著材片Tp從黏著材片Tp以外的部分之片狀黏著材T分離。Step S3 (Separation of adhesive sheet) When the adhesive material sheet Tp is formed by the adhesive material cutting mechanism 3, the sheet-shaped adhesive material T starts to travel again, and the sheet-shaped adhesive material T is further conveyed downstream. Then, while conveying the sheet-shaped adhesive material T downstream, the adhesive material sheet Tp is separated from the sheet-shaped adhesive material T in the part other than the adhesive material sheet Tp in the adhesive material separation mechanism 4.

亦即，黏著材分離機構4係如圖9(a)及圖9(b)所示，一邊將片狀黏著材T沿著放出方向Ln朝左方運送，一邊將殘留於黏著材片Tp周圍的剩餘黏著材Tn捲起，藉此將該剩餘黏著材Tn從分離片S剝離。已剝離的剩餘黏著材Tn係被捲取回收於回收筒管21。藉由將剩餘黏著材Tn捲取回收，黏著材片Tp從黏著材片Tp以外的部分之片狀黏著材T被分離，如圖9(c)所示，成為在分離片S上殘留有黏著材片Tp的狀態。而在黏著材片Tp的上游，片狀黏著材T被黏著材切斷機構3切斷而形成新的黏著材片Tp(圖9(d))。That is, as shown in Figures 9(a) and 9(b), the adhesive material separation mechanism 4 conveys the sheet-shaped adhesive material T to the left in the discharge direction Ln while leaving the adhesive material sheet Tp The remaining adhesive material Tn is rolled up, thereby peeling the remaining adhesive material Tn from the separator S. The remaining adhesive material Tn that has been peeled off is taken up and collected in the recovery tube 21. By winding and recovering the remaining adhesive material Tn, the adhesive material sheet Tp is separated from the sheet-like adhesive material T other than the adhesive material sheet Tp. As shown in FIG. 9(c), the adhesive remains on the separator S The state of the sheet Tp. On the upstream of the adhesive material sheet Tp, the sheet-shaped adhesive material T is cut by the adhesive material cutting mechanism 3 to form a new adhesive material sheet Tp (FIG. 9(d)).

步驟S4(切斷狀態的檢查) 黏著材片Tp的分離一完成，該黏著材片Tp便連同分離片S一起被送往黏著材保持機構5，在支持台24上暫時停止行進。支持台24係將黏著材片Tp連同分離片S一起吸附保持。然後，藉由配設於支持台24的上方之切斷檢查機構49，檢查黏著材片Tp的切斷狀態。Step S4 (Checking the cut-off state) Once the separation of the adhesive material sheet Tp is completed, the adhesive material sheet Tp is sent to the adhesive material holding mechanism 5 together with the separation sheet S, and the traveling on the support table 24 is temporarily stopped. The support table 24 sucks and holds the adhesive sheet Tp together with the separator S. Then, the cutting state of the adhesive sheet Tp is inspected by the cutting inspection mechanism 49 arranged above the support table 24.

切斷檢查機構49係如圖10(a)所示，使用一對切斷檢查相機49a及49b拍攝黏著材片Tp，而取得關於黏著材片Tp的尺寸及形狀之資訊。本實施例中，切斷檢查相機49a及49b係對矩形黏著材片Tp所具有的四個角部中之對向的兩個角部分別進行拍攝。藉由切斷檢查相機49a及49b所取得之黏著材片Tp的影像資訊，係如圖10(b)所示被傳送到切斷判定部52。As shown in FIG. 10(a), the cutting inspection mechanism 49 uses a pair of cutting inspection cameras 49a and 49b to photograph the adhesive sheet Tp to obtain information about the size and shape of the adhesive sheet Tp. In this embodiment, the cut-off inspection cameras 49a and 49b respectively photograph two opposite corners of the four corners of the rectangular adhesive sheet Tp. The image information of the adhesive sheet Tp acquired by the cutting inspection cameras 49a and 49b is sent to the cutting determination unit 52 as shown in FIG. 10(b).

切斷判定部52係使用藉由切斷檢查機構49所得到的資訊進行演算，而算出黏著材片Tp的正確尺寸及形狀。在此，就算出黏著材片Tp的尺寸及形狀之方法的一例進行說明。圖10(c)係表示藉由切斷檢查相機49a所得到的影像資訊。在切斷檢查相機49a的拍攝區域L1，拍出黏著材片Tp的角部J1中的兩個邊M1及M2。The cutting determination unit 52 performs calculations using the information obtained by the cutting inspection mechanism 49 to calculate the correct size and shape of the adhesive sheet Tp. Here, an example of a method of calculating the size and shape of the adhesive sheet Tp will be described. FIG. 10(c) shows the image information obtained by cutting off the inspection camera 49a. In the imaging area L1 of the cutting inspection camera 49a, two edges M1 and M2 in the corner J1 of the adhesive sheet Tp are captured.

由於預先得到關於切斷檢查相機49a的位置及拍攝方向之資訊，所以可算出邊M1相對於x方向的角度D1、及邊M2相對於x方向的角度D2之資訊。亦即，藉由切斷檢查相機49a的影像資訊，可正確地算出邊M1延伸的方向JT1及邊M2延伸的方向JT2之每一者。Since the information on the position and shooting direction of the cutting inspection camera 49a is obtained in advance, the information on the angle D1 of the side M1 with respect to the x direction and the angle D2 of the side M2 with respect to the x direction can be calculated. That is, by cutting off the image information of the inspection camera 49a, each of the extending direction JT1 of the side M1 and the extending direction JT2 of the side M2 can be accurately calculated.

切斷檢查相機49b係拍攝與角部J1對向的角部J2。因此，在切斷檢查相機49b的拍攝區域L2，拍出黏著材片Tp的角部J2中的兩個邊M3及M4。因此，藉由拍攝區域L2的影像資訊，可正確地算出邊M3及邊M4各自延伸的方向。The cutting inspection camera 49b images the corner portion J2 facing the corner portion J1. Therefore, in the imaging area L2 of the cutting inspection camera 49b, the two sides M3 and M4 in the corner J2 of the adhesive sheet Tp are captured. Therefore, based on the image information of the shooting area L2, the directions in which the sides M3 and M4 extend can be accurately calculated.

邊M1～M4各自延伸的方向一被算出時，如圖10(d)所示，從與拍攝區域L1及L2實際相稱的邊M1～M4，作成以虛線表示之邊M1～M4的延長線。其結果，邊M1～M4的延長線交叉的部分係被算出為剩餘兩個角部J3及J4的正確位置。且由連結角部J1～J4的每一者的直線所包圍之區域V的尺寸及形狀，係相當於藉由黏著材切斷機構3實際形成之黏著材片Tp的尺寸及形狀。When the direction in which each of the sides M1 to M4 extend is calculated, as shown in FIG. 10(d), from the sides M1 to M4 actually commensurate with the imaging regions L1 and L2, the extended lines of the sides M1 to M4 shown by dotted lines are created. As a result, the part where the extension lines of the sides M1 to M4 intersect is calculated as the correct position of the remaining two corners J3 and J4. And the size and shape of the area V surrounded by the straight line connecting each of the corners J1 to J4 are equivalent to the size and shape of the adhesive sheet Tp actually formed by the adhesive cutting mechanism 3.

以在檢查黏著材片Tp的尺寸時作為判定對象的參數而言，可例舉黏著材片Tp之邊M1～M4的長度等。在檢查黏著材片Tp的形狀時，可例舉以邊M1～M4有無變形、或角部J1～J4中之角度的大小等作為判定對象。As the parameter to be determined when inspecting the size of the adhesive material sheet Tp, the length of the sides M1 to M4 of the adhesive material sheet Tp, etc., can be exemplified. When inspecting the shape of the adhesive material sheet Tp, the presence or absence of deformation of the sides M1 to M4, the size of the angle in the corners J1 to J4, etc. can be exemplified as the judgment target.

如此，藉由拍攝角部J1及角部J2，可算出邊M1～M4的長度與相對於x方向的傾斜，所以可正確地算出實際形成之黏著材片Tp的尺寸及形狀。亦即，藉由使用與對向之角部J1及角部J2的部分相當之黏著材片Tp的影像資訊來進行演算，可重現黏著材片Tp的整體影像。In this way, by photographing the corner J1 and the corner J2, the length of the sides M1 to M4 and the inclination with respect to the x direction can be calculated, so the size and shape of the adhesive sheet Tp actually formed can be accurately calculated. That is, by using the image information of the adhesive material Tp corresponding to the opposite corners J1 and J2 to perform calculations, the overall image of the adhesive material Tp can be reproduced.

從記憶部54對切斷判定部52，傳送被預先記憶為理想的黏著材片Tp的尺寸及形狀(黏著材片Tp的基準尺寸及基準形狀)之資訊。切斷判定部52係在算出實際所作成之黏著材片Tp的正確尺寸及形狀後，與黏著材片Tp的基準尺寸及基準形狀之資訊相比較。藉由該比較，可算出實際所形成之黏著材片Tp的尺寸與基準尺寸之差S1、以及實際所形成之黏著材片Tp的形狀與基準形狀之差S2。The information of the size and shape (reference size and reference shape of the adhesive sheet Tp) of the adhesive sheet Tp (the reference size and reference shape of the adhesive sheet Tp) stored in advance as the ideal is transmitted from the memory portion 54 to the cutting determination portion 52. The cutting judging unit 52 calculates the correct size and shape of the adhesive material sheet Tp that is actually produced, and compares it with the information of the reference size and reference shape of the adhesive material sheet Tp. By this comparison, the difference S1 between the size of the actually formed adhesive sheet Tp and the reference size can be calculated, and the difference S2 between the shape of the actually formed adhesive sheet Tp and the reference shape can be calculated.

在差S1及差S2均為預定的容許值以下時，判定實際形成的黏著材片Tp為可使用於對工件W貼附之合格品。另一方面，在差S1及差S2當中至少一者為容許值以上時，則判定實際形成的黏著材片Tp為不合格品。關於所形成的黏著材片Tp是否為合格品的資訊，從切斷判定部52被傳送到控制部44。When the difference S1 and the difference S2 are both equal to or less than the predetermined allowable value, it is determined that the actually formed adhesive sheet Tp is a qualified product that can be used for attaching to the workpiece W. On the other hand, when at least one of the difference S1 and the difference S2 is greater than or equal to the allowable value, it is determined that the adhesive sheet Tp actually formed is a defective product. The information about whether the formed adhesive sheet Tp is a good product is sent from the cutting determination unit 52 to the control unit 44.

控制部44係在接收到所形成的黏著材片Tp為合格品的資訊之情況下，持續進行黏著材片Tp的貼附製程。此時，係使用為合格品的黏著材片Tp，進行下一個步驟S5的製程。When the control unit 44 receives the information that the formed adhesive material sheet Tp is a qualified product, it continues the attaching process of the adhesive material sheet Tp. At this time, the adhesive material sheet Tp that is a qualified product is used to proceed to the next step S5.

另一方面，當接收到所形成的黏著材片Tp為不合格品的資訊時，舉例來說，控制部44係控制通報部55並將發生不合格品之主旨的資訊通報操作者，並控制貼附裝置1的各構成以使運轉暫時停止。操作者係可利用由通報部55所通報的資訊確認不合格品的產生，將不合格品的黏著材片Tp從分離片S去掉。不合格品的黏著材片Tp被去除後，解除暫時停止行進的狀態。然後，下一個形成的黏著材片Tp被運送到支持台24，對該黏著材片Tp進行切斷檢查的製程。On the other hand, when receiving information that the formed adhesive sheet Tp is a defective product, for example, the control unit 44 controls the notification unit 55 and informs the operator of the information about the occurrence of the defective product, and controls Each configuration of the sticking device 1 temporarily stops the operation. The operator can use the information notified by the notification unit 55 to confirm the occurrence of the defective product, and remove the adhesive sheet Tp of the defective product from the separator S. After the adhesive sheet Tp of the defective product is removed, the temporarily stopped state is released. Then, the next formed adhesive material sheet Tp is transported to the support table 24, and a cutting inspection process is performed on the adhesive material sheet Tp.

步驟S5(黏著材片的保持) 切斷檢查的結果，判定黏著材片Tp為合格品時，接著執行保持黏著材片的製程。亦即，對被吸附保持於支持台24的黏著材片Tp，貼附保持帶F。在貼附保持帶F的動作開始的時點，保持帶F係如圖11(a)所示，從供給筒管23被放出供給並朝支持台24的上方引導。Step S5 (holding of adhesive sheet) When the result of the cutting inspection determines that the adhesive sheet Tp is a good product, the process of holding the adhesive sheet is then performed. That is, the holding tape F is attached to the adhesive sheet Tp sucked and held on the support table 24. At the time when the operation of attaching the holding tape F starts, the holding tape F is drawn out and supplied from the supply bobbin 23, as shown in FIG. 11(a), and guided toward the upper side of the support table 24.

步驟S5之黏著材片的保持製程一開始，便如圖11(b)所示，貼附單元25的貼附輥27藉由驅動缸29下降，將保持帶F推抵到黏著材片Tp的上面的一端側。接著，如圖11(c)所示，貼附輥27係一邊將保持帶F朝下方按壓，一邊從支持台24的一端側朝另一端側轉動，往實線所示的終端位置移動。藉此，保持帶F被貼附到黏著材片Tp的上面整體。As soon as the holding process of the adhesive sheet of step S5 is started, as shown in FIG. 11(b), the attaching roller 27 of the attaching unit 25 is lowered by the driving cylinder 29 to push the holding tape F against the adhesive sheet Tp. The upper end side. Next, as shown in FIG. 11(c), the sticking roller 27 rotates from one end to the other end of the support table 24 while pressing the holding tape F downward, and moves to the end position shown by the solid line. Thereby, the holding tape F is stuck to the whole upper surface of the adhesive material sheet Tp.

藉由貼附保持帶F，黏著材片Tp係透過朝上方之黏著材片Tp的非黏著面而被保持帶F穩定地保持。當保持帶F貼附於黏著材片Tp的上面整體時，貼附單元25就會上升，從終端位置返回初始位置。接著，解除由支持台24所進行的吸附保持，黏著材片Tp係與分離片S及保持帶F一起被送往下游。By attaching the holding tape F, the adhesive sheet Tp is stably held by the holding tape F through the non-adhesive surface of the adhesive sheet Tp facing upward. When the holding tape F is attached to the entire upper surface of the adhesive sheet Tp, the attaching unit 25 rises and returns to the initial position from the terminal position. Next, the suction holding by the support table 24 is released, and the adhesive sheet Tp is sent downstream along with the separator S and the holding belt F.

步驟S6(分離片的回收) 一邊將黏著材片Tp送往下游，一邊在分離片回收機構6中使分離片S從黏著材片Tp分離。如圖2所示，貼附有保持帶F的黏著材片Tp及分離片S，係藉由導輥31被剝離成附有保持帶F的黏著材片Tp和分離片S。被剝離的分離片S係經由饋送輥32被捲取回收到回收筒管33。Step S6 (Recovery of Separator) While sending the adhesive material sheet Tp downstream, the separator sheet S is separated from the adhesive material sheet Tp in the separator collecting mechanism 6. As shown in FIG. 2, the adhesive sheet Tp with the holding tape F and the separation sheet S are peeled off by the guide roller 31 into the adhesive sheet Tp with the holding tape F and the separation sheet S. The separated sheet S that has been peeled off is wound up and recovered to the recovery bobbin 33 via the feed roller 32.

藉由分離片S被剝離，黏著材片Tp的黏著面會露出。此時，黏著材片Tp已貼附有長形的保持帶F。因此，即便在分離片S從黏著材片Tp剝離後，黏著材片Tp也可在不會變形下被保持帶F穩定地保持。亦即，藉由在黏著材片Tp中之與黏著面相反的面貼附保持帶F，即便在分離片S剝離後，也能夠將黏著材片Tp維持平坦的狀態。在分離片S已被剝離之狀態下的黏著材片Tp係與保持帶F一起被送往下游。When the separator S is peeled off, the adhesive surface of the adhesive sheet Tp is exposed. At this time, the long holding tape F has been attached to the adhesive material sheet Tp. Therefore, even after the separation sheet S is peeled from the adhesive sheet Tp, the adhesive sheet Tp can be stably held by the holding tape F without being deformed. That is, by attaching the holding tape F to the surface opposite to the adhesive surface of the adhesive sheet Tp, even after the release sheet S is peeled off, the adhesive sheet Tp can be maintained in a flat state. The adhesive material sheet Tp in the state where the separator S has been peeled off is sent downstream together with the holding tape F.

步驟S7(黏著材片與工件的位置調整) 在進行將黏著材片Tp貼附於工件W的製程之前，先進行調整黏著材片Tp與工件W的位置之製程。藉保持帶F保持的黏著材片Tp，係在貼附區域Q暫時停止行進。並且，藉由配設在貼附區域Q的上方之黏著材位置辨識機構47，檢測黏著材片Tp的正確位置。Step S7 (Adjust the position of the adhesive sheet and the workpiece) Before the process of attaching the adhesive material sheet Tp to the workpiece W, a process of adjusting the positions of the adhesive material sheet Tp and the workpiece W is performed. The adhesive sheet Tp held by the holding tape F is tied to the attaching area Q and temporarily stops traveling. In addition, the correct position of the adhesive material piece Tp is detected by the adhesive material position recognition mechanism 47 disposed above the application area Q.

黏著材位置辨識機構47係如圖13(a)所示，使用一對黏著材位置辨識相機47a及47b拍攝黏著材片Tp，並取得黏著材片Tp的影像資訊。黏著材位置辨識相機47a及47b係與切斷檢查機構49同樣，分別對被保持帶F所保持的黏著材片T中之對向的兩個角部J1及J2的部分進行拍攝。配設在貼附區域Q的上方之黏著材位置辨識機構47，係隔著保持帶F拍攝黏著材片Tp的影像。The adhesive material position recognition mechanism 47 is shown in FIG. 13(a), using a pair of adhesive material position recognition cameras 47a and 47b to photograph the adhesive material sheet Tp, and obtain the image information of the adhesive material sheet Tp. Adhesive material position recognition cameras 47a and 47b are similar to the cutting inspection mechanism 49, and respectively photograph the parts of the two opposite corners J1 and J2 of the adhesive material sheet T held by the holding tape F. The adhesive material position recognition mechanism 47 arranged above the application area Q captures an image of the adhesive material sheet Tp through the holding tape F.

黏著材位置辨識相機47a及47b係拍攝角部J1及J2、亦即黏著材片Tp的一部分。一般在拍攝廣範圍的情況下，與映在中央部的影像相較之下，映在拍攝範圍的周邊部之影像的變形會變大，所以關於映在周邊部的影像之位置資訊的精度會變低。且拍攝範圍越廣，周邊部的該變形會變越大。另一方面，由於本實施例的黏著材位置辨識相機47a及47b係限定於窄範圍來進行拍攝，所以藉拍攝得到的影像係涵蓋整體變形少之易取得正確資訊的影像。The adhesive material position recognition cameras 47a and 47b photograph the corners J1 and J2, that is, a part of the adhesive material sheet Tp. Generally, in the case of shooting a wide range, the distortion of the image projected on the periphery of the shooting range will be greater than that of the image projected on the center. Therefore, the accuracy of the positional information of the image projected on the periphery will be increased. Go low. And the wider the shooting range, the greater the deformation of the peripheral part. On the other hand, since the adhesive position recognition cameras 47a and 47b of this embodiment are limited to a narrow range for shooting, the images obtained by shooting cover images with little overall deformation and easy to obtain correct information.

配設在貼附區域Q上方的黏著材位置辨識機構47，係隔著保持帶F拍攝黏著材片Tp的影像。由於保持帶F係以具透光性的材料構成，所以即便在從黏著材片Tp的上方隔著保持帶F拍攝黏著材片Tp的情況，也可取得清楚的黏著材片Tp的影像資訊。又，在貼附裝置1中，與黏著材片Tp的下方相比，黏著材片Tp的上方因空間上的裕度較廣，所以可容易地配設黏著材位置辨識機構47。又，也能夠更確實地避免所配設的黏著材位置辨識機構47干涉貼附裝置1的其他構成之情況。藉由黏著材位置辨識機構47獲得的黏著材片Tp的影像資訊係如圖13(b)所示，被傳送到位置判定部51。The adhesive material position recognition mechanism 47 arranged above the application area Q captures an image of the adhesive material sheet Tp through the holding tape F. Since the holding tape F is made of a light-transmitting material, even if the adhesive sheet Tp is photographed from above the adhesive sheet Tp through the holding tape F, clear image information of the adhesive sheet Tp can be obtained. In addition, in the sticking device 1, the upper part of the adhesive material sheet Tp has a wider space than the lower part of the adhesive material sheet Tp, so that the adhesive material position recognition mechanism 47 can be easily arranged. In addition, it is also possible to more reliably avoid the situation where the disposed adhesive material position recognition mechanism 47 interferes with other configurations of the sticking device 1. The image information of the adhesive material sheet Tp obtained by the adhesive material position recognition mechanism 47 is transmitted to the position determination unit 51 as shown in FIG. 13(b).

另一方面，亦針對工件保持台8所保持的工件W，進行正確的位置之檢測。亦即，對配置在待機位置P的工件W，藉由配設在待機位置P的上方之工件位置辨識機構48，取得工件W的影像資訊。On the other hand, the correct position of the workpiece W held by the workpiece holding table 8 is also detected. That is, for the workpiece W arranged in the standby position P, the image information of the workpiece W is obtained by the workpiece position recognition mechanism 48 arranged above the standby position P.

工件位置辨識機構48係如圖12(a)所示，使用一對工件位置辨識相機48a及48b拍攝工件W，取得工件W的影像資訊。工件位置辨識相機48a及48b係對工件W中之對向的兩個角部E1及E2分別從上方進行拍攝。藉由工件位置辨識機構48得到的工件W的影像資訊係如圖12(b)所示，被傳送到位置判定部51。The workpiece position recognition mechanism 48 is shown in FIG. 12(a), and uses a pair of workpiece position recognition cameras 48a and 48b to photograph the workpiece W, and obtain image information of the workpiece W. The workpiece position recognition cameras 48a and 48b respectively photograph the two opposite corners E1 and E2 of the workpiece W from above. The image information of the workpiece W obtained by the workpiece position recognizing mechanism 48 is transmitted to the position determining unit 51 as shown in FIG. 12(b).

位置判定部51係使用藉由黏著材位置辨識機構47及工件位置辨識機構48得到的影像資訊進行演算，算出黏著材片Tp相對於工件W的相對位置。算出黏著材片Tp相對於工件W的相對位置之方法，係與切斷判定部52所進行的算出方法同樣。The position determination unit 51 uses the image information obtained by the adhesive material position identification mechanism 47 and the workpiece position identification mechanism 48 to perform calculations to calculate the relative position of the adhesive material piece Tp with respect to the workpiece W. The method of calculating the relative position of the adhesive material piece Tp with respect to the workpiece W is the same as the calculation method performed by the cutting determination unit 52.

首先，使用藉由黏著材位置辨識機構47所得到之與對向的角部J1及角部J2的部分相當之黏著材片Tp的影像資訊來進行演算，藉此重現黏著材片Tp的整體影像。使用黏著材位置辨識相機47a所拍攝的影像，可得到邊M1及M2延伸之方向的資訊。使用黏著材位置辨識相機47b所拍攝到的影像，可得到邊M3及M4延伸之方向的資訊。因此，能以被M1～M4包圍的區域重現黏著材片Tp的整體影像。First, use the image information of the adhesive sheet Tp that is equivalent to the opposite corner J1 and the corner J2 obtained by the adhesive position recognition mechanism 47 to perform calculations, thereby reproducing the entire adhesive sheet Tp image. Using the position of the adhesive material to identify the image taken by the camera 47a, information about the direction in which the edges M1 and M2 extend can be obtained. Using the position of the adhesive material to identify the image captured by the camera 47b, information about the direction in which the edges M3 and M4 extend can be obtained. Therefore, the entire image of the adhesive sheet Tp can be reproduced in the area surrounded by M1 to M4.

藉由事先取得黏著材位置辨識機構47的位置資訊，也能算出已重現之黏著材邊Tp的整體影像的位置。藉此，位置判定部51係可使用黏著材位置辨識機構47的影像資訊來算出黏著材片Tp整體的正確位置。同樣地，位置判定部51係使用呈現角部E1的影像資訊和呈現角部E2的影像資訊，重現工件W的整體影像。且，藉由使用事先得到的工件位置辨識機構48的位置資訊，算出工件W整體的正確位置。By obtaining the position information of the adhesive material position identification mechanism 47 in advance, the position of the reproduced whole image of the adhesive material edge Tp can also be calculated. Thereby, the position determining unit 51 can use the image information of the adhesive material position recognition mechanism 47 to calculate the correct position of the entire adhesive material sheet Tp. Similarly, the position determining unit 51 uses the image information representing the corner E1 and the image information representing the corner E2 to reproduce the entire image of the workpiece W. Furthermore, by using the position information of the workpiece position identification mechanism 48 obtained in advance, the correct position of the entire workpiece W is calculated.

黏著材位置辨識機構47係藉由僅拍攝黏著材片Tp的一部分，取得變形少之正確的影像資訊。工件位置辨識機構48係藉由僅拍攝工件W的一部分，取得變形少之正確的影像資訊。另一方面，位置判定部51係使用呈現黏著材片Tp的一部分之影像資訊與呈現工件W的一部分之影像資訊，算出黏著材片Tp的整體影像的資訊與工件W的整體影像的資訊。位置判定部51進一步算出關於工件W與黏著材片Tp之相對的位置關係之資訊。The adhesive material position recognition mechanism 47 obtains accurate image information with little deformation by capturing only a part of the adhesive material sheet Tp. The workpiece position recognition mechanism 48 captures only a part of the workpiece W to obtain accurate image information with little distortion. On the other hand, the position determination unit 51 uses the image information showing a part of the adhesive sheet Tp and the image information showing a part of the workpiece W to calculate the information of the entire image of the adhesive sheet Tp and the information of the entire image of the workpiece W. The position determining unit 51 further calculates information about the relative positional relationship between the workpiece W and the adhesive sheet Tp.

算出關於該相對的位置關係的資訊時，針對工件W及黏著材片Tp，可正確地算出獲得更廣範圍的資訊者。亦即，藉由採用一邊拍攝限定於工件W等的一部分之窄範圍，一邊使用藉該拍攝所得到的影像來算出工件W等的整體影像之方法，可實現使影像的資訊的精度提升之效果和使關於工件W與黏著材片Tp的相對位置關係之資訊的精度提升之效果兩者。When calculating the information about the relative positional relationship, it is possible to accurately calculate the person who has obtained a wider range of information for the workpiece W and the adhesive material sheet Tp. That is, by adopting a method of capturing a narrow range limited to a part of the workpiece W, etc., while using the image obtained by the shooting to calculate the overall image of the workpiece W, etc., the effect of improving the accuracy of the image information can be achieved. And the effect of improving the accuracy of the information about the relative positional relationship between the workpiece W and the adhesive sheet Tp.

位置判定部51係藉由比較所算出之黏著材片Tp的位置資訊與工件W的位置資訊，算出黏著材片Tp相對於工件W之相對位置。關於關於相對位置的資訊，係舉出關於在x方向及y方向之工件W與黏著材片Tp的距離、及在θ方向之工件W與黏著材片Tp的角度之差之資訊為例。The position determining unit 51 compares the calculated position information of the adhesive sheet Tp with the position information of the workpiece W to calculate the relative position of the adhesive sheet Tp with respect to the workpiece W. Regarding the information about the relative position, for example, the information about the distance between the workpiece W and the adhesive sheet Tp in the x direction and the y direction, and the angle difference between the workpiece W and the adhesive sheet Tp in the θ direction.

藉由位置判定部51所算出之關於黏著材片Tp與工件W的相對位置的資訊係被傳送到控制部44。控制部44係依據該相對位置資訊控制可動台35，藉此調整工件W相對於黏著材片Tp的位置。首先，如圖12(c)所示，依據控制部44的控制信號，前後可動台35a係沿著引導軌道R1從待機位置P朝貼附區域Q在y方向上水平移動。The information about the relative position of the adhesive sheet Tp and the workpiece W calculated by the position determining unit 51 is sent to the control unit 44. The control unit 44 controls the movable table 35 according to the relative position information, thereby adjusting the position of the workpiece W relative to the adhesive sheet Tp. First, as shown in FIG. 12(c), in accordance with the control signal of the control unit 44, the front and rear movable table 35a moves horizontally in the y direction from the standby position P to the attaching area Q along the guide rail R1.

在移動至貼附區域Q移動的時點，如圖13(b)所示，在俯視下之工件W的位置與黏著材片Tp的位置之間，關於x、y、θ的各方向會發生偏移。關於發生此種偏移的原因，認為係在將工件W搬送及載置於工件保持台8時產生之機械的晃動等。When moving to the time when the attachment area Q is moved, as shown in FIG. 13(b), between the position of the workpiece W and the position of the adhesive sheet Tp in a plan view, deviations occur in the directions of x, y, and θ. shift. Regarding the cause of the occurrence of such a shift, it is considered that mechanical vibrations and the like generated when the workpiece W is transported and placed on the workpiece holding table 8.

其次，如圖13(a)所示，控制部44係藉由控制前後可動台35a、左右可動台35b及旋轉可動台35c的每一者，將移動至貼附區域Q之工件W的位置，針對x方向、y方向及θ方向等各方向作調整。藉由位置判定部51算出關於工件W與黏著材片Tp之相對位置的正確資訊。因此，藉由使用位置判定部51所算出的資訊來調整可動台35，如圖13(c)所示，可使工件W的中心的位置與黏著材片Tp的中心的位置正確地一致。Next, as shown in FIG. 13(a), the control unit 44 controls each of the front and rear movable table 35a, the left and right movable table 35b, and the rotary movable table 35c to move to the position of the workpiece W in the attaching area Q, Adjust for each direction such as x direction, y direction and theta direction. The position determining unit 51 calculates accurate information about the relative position of the workpiece W and the adhesive sheet Tp. Therefore, by adjusting the movable table 35 using the information calculated by the position determining unit 51, as shown in FIG. 13(c), the position of the center of the workpiece W can be accurately matched with the position of the center of the adhesive sheet Tp.

步驟S8(使黏著材片與工件接近) 調整黏著材片Tp與工件W的位置後，使工件W與黏著材片Tp接近。亦即，控制部44係控制升降台36的升降移動以使工件載置部37上升。藉由工件載置部37上升，工件W係在圖14中朝實線所示的接近位置移動，工件W與黏著材片Tp成為接近的狀態。Step S8 (Bring the adhesive sheet closer to the workpiece) After adjusting the positions of the adhesive material piece Tp and the work piece W, the work piece W and the adhesive material piece Tp are brought close. That is, the control unit 44 controls the up-and-down movement of the elevator platform 36 to raise the workpiece placing portion 37. As the workpiece mounting portion 37 rises, the workpiece W moves toward the approaching position shown by the solid line in FIG. 14, and the workpiece W and the adhesive sheet Tp are brought into a close state.

藉由該接近移動，工件W的貼附面與黏著材片Tp的黏著面的距離，係從較大的距離Db變成微小距離Da。在工件W移動到接近位置的狀態下之工件W與黏著材片Tp的距離Da之大小，較佳為0.3mm以上3mm以下，更佳為0.5mm以上1.5mm以下。With this approach movement, the distance between the adhesion surface of the workpiece W and the adhesion surface of the adhesive sheet Tp changes from a large distance Db to a small distance Da. The size of the distance Da between the workpiece W and the adhesive sheet Tp when the workpiece W is moved to the close position is preferably 0.3 mm or more and 3 mm or less, and more preferably 0.5 mm or more and 1.5 mm or less.

在使工件W與黏著材片Tp成為接近的狀態之後，氣體供給噴嘴Nz係將氣體Ga供給到工件W與黏著材片Tp的間隙。藉由供給該氣體Ga，可防止在步驟S9的貼附製程開始前，工件W與黏著材片Tp接觸。亦即，可避免因工件W與黏著材片Tp接觸，而導致發生黏著材片Tp黏著在工件W之假定外的位置之情事。After bringing the work W and the adhesive sheet Tp into a close state, the gas supply nozzle Nz supplies gas Ga to the gap between the work W and the adhesive sheet Tp. By supplying the gas Ga, it is possible to prevent the workpiece W from contacting the adhesive material sheet Tp before the attaching process of step S9 starts. That is, it is possible to avoid the occurrence of the adhesion of the adhesive material sheet Tp at a position outside the assumption of the workpiece W due to the contact between the workpiece W and the adhesive material sheet Tp.

再者，藉由氣體Ga的供給，可在也沒有對工件W及黏著材片Tp的任一者進行機械式接觸的情況下，防止工件W與黏著材片Tp的接觸。因此，在防止工件W與黏著材片Tp的接觸之製程時，可防止發生工件W及黏著材片Tp變形之情事以及黏著材片Tp的貼附位置偏移之情事。Furthermore, by the supply of the gas Ga, it is possible to prevent the workpiece W from contacting the adhesive material sheet Tp without mechanically contacting either the workpiece W and the adhesive material sheet Tp. Therefore, in the process of preventing the contact between the workpiece W and the adhesive sheet Tp, it is possible to prevent the deformation of the workpiece W and the adhesive sheet Tp and the deviation of the attachment position of the adhesive sheet Tp from occurring.

步驟S9(黏著材片的貼附) 使工件W與黏著材片Tp接近後，黏著材貼附機構10的貼附輥41係藉由驅動缸43下降，將黏著材片Tp推抵到工件W的上面的一端側。接著，如圖15(b)所示，貼附輥41係一邊將黏著材片Tp朝下方按壓，一邊在保持帶F上從工件保持台8的一端側朝另一端側轉動，朝實線所示的終端位置移動。藉由貼附輥41的轉動，黏著材片Tp會被貼附於工件W的表面。Step S9 (attachment of adhesive sheet) After the work W and the adhesive material sheet Tp are brought close, the application roller 41 of the adhesive material application mechanism 10 is lowered by the driving cylinder 43 to push the adhesive material sheet Tp to one end side of the upper surface of the work W. Next, as shown in FIG. 15(b), the sticking roller 41 presses the adhesive sheet Tp downward while rotating on the holding belt F from one end side to the other end side of the workpiece holding table 8, toward the solid line. The indicated terminal position moves. By the rotation of the attaching roller 41, the adhesive sheet Tp is attached to the surface of the workpiece W.

本實施例中，係在黏著材貼附機構10作動前，事先進行工件W與黏著材片Tp的位置調整。因此，可在黏著材片Tp相對於工件W的位置偏移確實地被解除的狀態下開始進行將黏著材片Tp貼附於工件W的製程。因此，可提升黏著材片Tp貼附於工件W的位置精度。In this embodiment, the position adjustment of the workpiece W and the adhesive material sheet Tp is carried out in advance before the adhesive material attaching mechanism 10 is activated. Therefore, the process of sticking the adhesive sheet Tp to the workpiece W can be started in a state where the positional deviation of the adhesive sheet Tp with respect to the workpiece W is surely released. Therefore, the accuracy of the position where the adhesive material sheet Tp is attached to the workpiece W can be improved.

再者，本實施例中，係在事先使工件W與黏著材片Tp成為接近的狀態後，再使黏著材貼附機構10作動。亦即，在將z方向上之工件W的貼附面與黏著材片Tp的黏著面的距離從比較大的距離Db朝既定的微小距離Da接近的狀態下，貼附輥41係按壓黏著材片Tp而貼附於工件W。因此，與在工件W和黏著材片Tp的距離為Db的狀態下開始進行將黏著材片Tp貼附於工件W的操作之習知構成相較下，可減少黏著材片Tp朝下方按壓時所發生之黏著材片Tp朝x方向或y方向之位置偏移的大小。Furthermore, in this embodiment, after the workpiece W and the adhesive material sheet Tp are brought into a close state in advance, the adhesive material attaching mechanism 10 is operated. That is, in a state where the distance between the sticking surface of the workpiece W and the sticking surface of the adhesive sheet Tp in the z direction approaches from a relatively large distance Db to a predetermined minute distance Da, the sticking roller 41 presses the adhesive material The sheet Tp is attached to the workpiece W. Therefore, compared with the conventional configuration in which the operation of attaching the adhesive sheet Tp to the workpiece W is started when the distance between the workpiece W and the adhesive sheet Tp is Db, it is possible to reduce the time when the adhesive sheet Tp is pressed downward. The magnitude of the positional deviation of the resulting adhesive sheet Tp in the x-direction or y-direction.

又，在朝微小距離Da接近後再開始進行貼附製程的本發明中，即使貼附輥41的按壓力小，也可將黏著材片Tp貼附於工件W。當輥41的按壓力小時，可防止因該按壓力所致之黏著材片Tp或工件W的變形。因此，藉由在事先使工件W接近黏著材片Tp的狀態下開始進行將黏著材片Tp貼附於工件W的動作，可進一步提升黏著材片Tp相對於工件W之貼附位置的精度。Furthermore, in the present invention that starts the attaching process after approaching the minute distance Da, even if the pressing force of the attaching roller 41 is small, the adhesive sheet Tp can be attached to the workpiece W. When the pressing force of the roller 41 is small, the deformation of the adhesive sheet Tp or the workpiece W due to the pressing force can be prevented. Therefore, by starting the operation of attaching the adhesive sheet Tp to the work W in a state where the work W is close to the adhesive sheet Tp in advance, the accuracy of the attachment position of the adhesive sheet Tp with respect to the work W can be further improved.

步驟S10(保持構件的分離) 黏著材片Tp一被貼附於工件W時，黏著材貼附機構10便從終端位置返回初始位置。黏著材貼附機構10返回初始位置，且保持構件分離機構11從圖16(a)所示的初始位置朝圖16(b)所示的終端位置往右方移動。保持構件分離機構11一邊朝終端位置移動，一邊將保持帶F捲起。Step S10 (separation of holding member) When the adhesive material sheet Tp is attached to the workpiece W, the adhesive material attaching mechanism 10 returns to the initial position from the terminal position. The adhesive material attaching mechanism 10 returns to the initial position, and the holding member separation mechanism 11 moves to the right from the initial position shown in FIG. 16(a) toward the end position shown in FIG. 16(b). The holding member separating mechanism 11 winds up the holding tape F while moving to the terminal position.

藉由捲起保持帶F，保持帶F會從黏著材片Tp分離。由於構成為保持帶F的黏著力係比黏著材片Tp與工件W的黏著力小，所以可防止捲起保持帶F時黏著材片Tp與保持帶F一起被捲起之情事。被捲起的保持帶F係被保持構件回收機構12的回收筒管捲取回收。藉由將保持帶F分離，貼附有黏著材片Tp的工件W留在工件保持台8上。By rolling up the holding tape F, the holding tape F separates from the adhesive sheet Tp. Since the adhesive force of the holding tape F is configured to be smaller than the adhesive force of the adhesive material sheet Tp and the workpiece W, it is possible to prevent the adhesive material sheet Tp from being rolled up together with the holding tape F when the holding tape F is rolled up. The wound holding tape F is wound and recovered by the recovery bobbin of the holding member recovery mechanism 12. By separating the holding tape F, the work W to which the adhesive sheet Tp is attached remains on the work holding table 8.

步驟S11(貼附狀態的檢查) 將保持帶F從黏著材片Tp剝離之後，工件保持台8係一邊保持貼附有黏著材片Tp的工件W，一邊沿著引導軌道R1從貼附區域Q朝待機位置P移動。並且，藉由配設於待機位置P的上方之貼附檢查機構50，檢查黏著材片Tp的貼附狀態。Step S11 (Checking the attachment state) After peeling the holding tape F from the adhesive sheet Tp, the workpiece holding table 8 moves from the attachment area Q to the standby position P along the guide rail R1 while holding the workpiece W to which the adhesive sheet Tp is attached. In addition, the attachment inspection mechanism 50 arranged above the standby position P inspects the attachment state of the adhesive sheet Tp.

貼附檢查機構50係如圖17(a)所示，使用一對貼附檢查相機50a及50b，拍攝貼附有黏著材片Tp的工件W，取得貼附有黏著材片Tp之工件W的影像資訊。本實施例中，貼附檢查相機50a及50b係分別拍攝工件W的角部中之對向的兩個角部E1及E2。藉由貼附檢查相機50a及50b所取得之工件W及黏著材片Tp的影像資訊，係如圖17(b)所示被傳送到貼附判定部53。The attaching inspection mechanism 50 is shown in FIG. 17(a), using a pair of attaching inspection cameras 50a and 50b to photograph the workpiece W to which the adhesive sheet Tp is attached, and obtain the workpiece W to which the adhesive sheet Tp is attached Image information. In this embodiment, the attachment inspection cameras 50a and 50b respectively photograph the two opposite corners E1 and E2 of the corners of the workpiece W. The image information of the workpiece W and the adhesive sheet Tp acquired by the attaching inspection cameras 50a and 50b is sent to the attaching determination unit 53 as shown in FIG. 17(b).

貼附判定部53係使用藉由貼附檢查機構50獲得的資訊進行演算，算出工件W上貼附有黏著材片Tp之位置的資訊。如圖17(c)所示，在貼附檢查相機50a的拍攝區域N1中，拍出黏著材片Tp的角部J1與工件W的角部E1。貼附判定部53係依據工件W及黏著材片Tp的顏色或光反射率的差異等，識別工件保持台8、工件W與黏著材片Tp。The sticking determination unit 53 uses the information obtained by the sticking inspection mechanism 50 to perform calculations to calculate the information on the position where the sticky sheet Tp is stuck on the workpiece W. As shown in FIG. 17(c), in the imaging area N1 of the sticking inspection camera 50a, the corner J1 of the adhesive sheet Tp and the corner E1 of the workpiece W are photographed. The sticking determination unit 53 recognizes the workpiece holding table 8, the workpiece W, and the adhesive material piece Tp based on the difference in color or light reflectance of the workpiece W and the adhesive material sheet Tp.

貼附判定部53係利用與位置判定部51及切斷判定部52同樣的演算，算出貼附於工件W之黏著材片Tp的位置。亦即，從映在貼附檢查相機50a的拍攝區域N1之工件W的角部E1的映像，算出工件W的兩個邊所延伸的方向ET1及ET2。接著，從貼附檢查相機50b所拍攝的影像資訊，亦可算出工件W的剩餘兩個邊延伸的方向。藉此，能以被四個邊所包圍的區域之形式重現工件W的整體影像。The sticking determination unit 53 calculates the position of the adhesive sheet Tp sticking to the work W by the same calculation as the position determination unit 51 and the cutting determination unit 52. That is, from the image of the corner E1 of the workpiece W projected on the imaging area N1 of the attachment inspection camera 50a, the directions ET1 and ET2 in which the two sides of the workpiece W extend are calculated. Then, from the image information taken by the attaching inspection camera 50b, the direction in which the remaining two sides of the workpiece W extend can also be calculated. Thereby, the entire image of the workpiece W can be reproduced in the form of an area surrounded by four sides.

貼附判定部53係進一步使用貼附檢查相機50a所拍出之黏著材片Tp的角部J1的影像資訊，算出黏著材片Tp的兩個邊延伸的方向JT1及JT2。貼附判定部53從貼附檢查相機50b所拍攝的影像資訊，亦算出黏著材片Tp的剩餘兩個邊延伸的方向，以被四個邊包圍的區域之形式重現黏著材片Tp的整體影像。藉由重現工件W與黏著材片Tp的整體影像，貼附於工件W之黏著材片Tp的端部與工件W的端部之距離RS係涵蓋工件的外周整體而算出。The sticking determination unit 53 further uses the image information of the corner J1 of the adhesive sheet Tp captured by the sticking inspection camera 50a to calculate the directions JT1 and JT2 in which the two edges of the adhesive sheet Tp extend. The sticking determination unit 53 also calculates the direction in which the remaining two sides of the sticky sheet Tp extend from the image information taken by the sticking inspection camera 50b, and reproduces the whole sticky sheet Tp as an area surrounded by the four sides image. By reproducing the entire image of the workpiece W and the adhesive sheet Tp, the distance RS between the end of the adhesive sheet Tp attached to the workpiece W and the end of the workpiece W is calculated to cover the entire outer circumference of the workpiece.

貼附判定部53係在算出黏著材片Tp的端部與工件W的端部之距離RS後，與事先記憶於記憶部54的基準值SV作比較。基準值SV係指，黏著材片Tp相對於工件W貼附於理想的位置時之距離RS的值，即距離RS的基準值。舉例來說，在工件W的尺寸及形狀與黏著材片Tp的尺寸及形狀構成為一致的情況下，基準值SV為零。The attachment determination unit 53 calculates the distance RS between the end of the adhesive sheet Tp and the end of the workpiece W, and compares it with the reference value SV stored in the memory 54 in advance. The reference value SV refers to the value of the distance RS when the adhesive sheet Tp is attached to the workpiece W at an ideal position, that is, the reference value of the distance RS. For example, when the size and shape of the workpiece W are consistent with the size and shape of the adhesive sheet Tp, the reference value SV is zero.

當距離RS與基準值SV的差涵蓋工件W的外周整體在容許值的範圍內時，判定黏著材片Tp相對於工件W的貼附製程已正常地執行。亦即，判定貼附有黏著材片Tp的工件W為合格品。When the difference between the distance RS and the reference value SV covers that the entire outer circumference of the workpiece W is within the allowable value range, it is determined that the attaching process of the adhesive sheet Tp to the workpiece W has been normally performed. That is, it is determined that the workpiece W to which the adhesive sheet Tp is attached is a qualified product.

另一方面，在有距離RS與基準值SV的差在容許值的範圍外之部分時，判定貼附有黏著材片Tp的工件W為不合格品。關於貼附有黏著材片Tp的工件W是否為合格品的資訊，係從貼附判定部53被傳送到控制部44。On the other hand, when there is a part where the difference between the distance RS and the reference value SV is outside the allowable value range, it is determined that the work W to which the adhesive sheet Tp is attached is a defective product. Information about whether the work W to which the adhesive sheet Tp is attached is a good product is sent from the attachment determination unit 53 to the control unit 44.

控制部44係在接收到工件W為合格品的資訊時，執行下一個步驟S12之製程並回收合格品的工件W。另一方面，在接收到工件W為不合格品的資訊時，舉例來說，控制部44係控制通報部55並將產生不合格品的主旨之資訊通報操作者，並控制貼附裝置1的各構成以使運轉暫時地停止。操作者透過由通報部55所通報的資訊，確認不合格品的產生，去除不合格品的工件W。去除後，藉由控制部44的自動控制或利用輸入部45的操作等，再度開始片狀黏著材的貼附裝置1之運轉。When the control unit 44 receives the information that the workpiece W is a qualified product, it executes the next step S12 process and collects the workpiece W as a qualified product. On the other hand, when receiving the information that the workpiece W is a defective product, for example, the control unit 44 controls the notification unit 55 and notifies the operator of the information on the origin of the defective product, and controls the attachment device 1 Each is configured to temporarily stop the operation. The operator confirms the occurrence of the defective product through the information notified by the notification unit 55, and removes the workpiece W of the defective product. After the removal, the operation of the sticking device 1 of the sheet-shaped adhesive material is restarted by the automatic control of the control unit 44 or the operation of the input unit 45.

步驟S12(工件的回收) 關於貼附有黏著材片Tp的工件W，在判定該工件W為合格品的情況下，將貼附有黏著材片Tp的工件W回收。亦即，吸附墊38一邊從工件載置部37的內部上升到接收位置，一邊將工件W吸附保持。被吸附保持的工件W係抬升到接收位置。接著，工件搬送機構9的搬送臂9a係將工件W從背面側吸附保持，將工件W從工件保持台8朝工件收納部7搬出。搬送臂9a係將貼附有黏著材片Tp的工件W插入收納於工件收納部7的匣C2。Step S12 (recycling of workpieces) Regarding the work W to which the adhesive sheet Tp is attached, when it is determined that the work W is a qualified product, the work W to which the adhesive sheet Tp is attached is collected. That is, the suction pad 38 sucks and holds the workpiece W while ascending from the inside of the workpiece mounting portion 37 to the receiving position. The sucked and held work W is lifted to the receiving position. Next, the transfer arm 9 a of the workpiece transfer mechanism 9 sucks and holds the workpiece W from the back side, and carries the workpiece W from the workpiece holding table 8 toward the workpiece storage portion 7. The transport arm 9a inserts the work W to which the adhesive sheet Tp is attached into the cassette C2 stored in the work storage section 7.

以上，結束一輪的動作，之後，依序反覆進行步驟S1至步驟S12的動作。Above, one round of actions is completed, and then steps S1 to S12 are repeated in sequence.

依據上述實施例的裝置，在對工件W貼附既定形狀的黏著材片Tp之製程中，可提升貼附黏著材片Tp的位置之精度。亦即，在藉由保持帶F保持著黏著材片Tp的狀態下將該黏著材片Tp貼附於工件W。According to the device of the above-mentioned embodiment, in the process of attaching the adhesive material sheet Tp of a predetermined shape to the workpiece W, the accuracy of the position where the adhesive material sheet Tp is attached can be improved. That is, the adhesive sheet Tp is attached to the work W in a state where the adhesive sheet Tp is held by the holding tape F.

就本發明的構成而言，在將黏著材片Tp貼附於工件W之際，黏著材片Tp係被保持帶F以大致平坦的狀態保持。因此，可避免在使黏著面露出之際，因黏著材片Tp本身重量而垂下等主要原因使得黏著材片Tp從假定的位置變位的事態。因此，藉由在該變位的狀態下因黏著材片Tp被貼附於工件W使得黏著材片Tp的貼附位置偏移之事態，係藉由保持帶F而確實地避免。又，亦可確實地避免在將黏著材片Tp按壓並貼附於工件之際，因該按壓力而使黏著材片Tp變形或變位的事態。因此，可精度良好地將黏著材片Tp貼附於工件W。With regard to the configuration of the present invention, when the adhesive material sheet Tp is attached to the work W, the adhesive material sheet Tp is held by the holding tape F in a substantially flat state. Therefore, it is possible to avoid a situation in which the adhesive material sheet Tp is displaced from the assumed position due to factors such as the weight of the adhesive material sheet Tp hanging down when the adhesive surface is exposed. Therefore, a situation in which the sticking position of the sticking sheet Tp is shifted due to the sticking of the sticking sheet Tp on the workpiece W in this displaced state is surely avoided by the holding tape F. In addition, when the adhesive material sheet Tp is pressed and attached to the workpiece, it can be reliably avoided that the adhesive material sheet Tp is deformed or displaced due to the pressing force. Therefore, the adhesive sheet Tp can be attached to the workpiece W with high accuracy.

本發明並不限定於上述實施形態，亦能以如下方式變形實施。The present invention is not limited to the above-mentioned embodiment, and can be modified and implemented as follows.

(1)本實施例中，關於片狀黏著材T的例子，係舉保護工件W之保護用黏著帶(保護帶)為例來說明，但片狀黏著材T並不限定於此。除了保護帶之外，亦可採用使用於將晶圓W涵蓋環框(ring frame)f支持之支持用黏著帶(切割帶)等其他用途之材料。(1) In this embodiment, the example of the sheet-shaped adhesive material T is described by taking the protective adhesive tape (protective tape) for protecting the workpiece W as an example, but the sheet-shaped adhesive material T is not limited to this. In addition to the protective tape, materials for other purposes such as supporting adhesive tapes (dicing tapes) used to cover the wafer W with a ring frame f support can also be used.

再者，在本發明中，關於片狀黏著材T，可適用具有黏著材或接著材之薄片、帶或薄膜等。關於片狀黏著材T的形態，除了捲狀(roll shape)之外，亦可為單片狀等其他的形態，亦可具有事先與工件W的形狀對應之既定的形狀。關於片狀黏著材T的構造，除了黏著材或接著材與基材的積層構造之外，也可例舉不具有基材之黏著材或接著材的單層構造。又，本實施例中，雖例示在片狀黏著材T添設有分離片S的構成，惟亦可因應貼附裝置1或片狀黏著材T等的構造，省略分離片S。此時，藉由在下板13及支持台24等各種機構實施離型處理，可更佳地對片狀黏著材T執行各製程。Furthermore, in the present invention, as for the sheet-like adhesive material T, a sheet, tape, film, etc. having an adhesive material or an adhesive material can be applied. Regarding the form of the sheet-like adhesive material T, in addition to a roll shape, other forms such as a single sheet form may be used, and may have a predetermined shape corresponding to the shape of the workpiece W in advance. Regarding the structure of the sheet-like adhesive material T, in addition to a laminated structure of an adhesive material or an adhesive material and a base material, a single-layer structure of an adhesive material or an adhesive material that does not have a base material may be exemplified. In addition, in this embodiment, although the configuration in which the separator S is added to the sheet-shaped adhesive material T is illustrated, the separator S may be omitted in accordance with the structure of the sticking device 1 or the sheet-shaped adhesive material T. At this time, by performing release processing on various mechanisms such as the lower plate 13 and the supporting table 24, various processes can be performed on the sheet-shaped adhesive material T better.

(2)本實施例中，雖例示矩形的半導體基板作為工件W，惟工件W的形狀及材料並不限於此。本實施例的構成，係可適用基板、面板、晶圓等各種半導體用構件作為工件W。又，以工件W的形狀而言，除了矩形之外，亦可為圓形、多角形、大致圓形等。(2) In this embodiment, although a rectangular semiconductor substrate is exemplified as the workpiece W, the shape and material of the workpiece W are not limited to this. The structure of this embodiment is applicable to various semiconductor members such as substrates, panels, and wafers as the workpiece W. In addition, in terms of the shape of the workpiece W, in addition to a rectangular shape, a circular shape, a polygonal shape, a substantially circular shape, or the like may be used.

(3)本實施例中，只要可達成發明的目的，則各機構及各製程可適當變更或省略。舉例來說，步驟S1的製程並不限於在步驟S2之前進行的構成，亦可在執行步驟S2等的製程之間進行。(3) In this embodiment, as long as the purpose of the invention can be achieved, each mechanism and each manufacturing process can be appropriately changed or omitted. For example, the process of step S1 is not limited to the configuration performed before step S2, and can also be performed between processes such as step S2.

再者，在本發明中，黏著材保持機構5的構成不限定於上述實施形態，關於其他例子，可如下述(A1)～(A3)所示般地變形實施。In addition, in the present invention, the configuration of the adhesive holding mechanism 5 is not limited to the above-mentioned embodiment, and other examples can be modified and implemented as shown in the following (A1) to (A3).

(A1)本實施例中，顯示黏著材保持機構5使用具黏著性的長形保持帶F來保持黏著材片Tp之構成為例，惟保持黏著材片Tp的構成不限定於此。關於在保持有黏著材片Tp的狀態下用以將該黏著材片Tp貼附於工件W的其他變形例，可舉出使用如圖18所示的板狀構件來保持黏著材片Tp之構成。以下，就變形例進行說明。此外，關於與實施例共通的構成，係標註相同符號並省略詳細說明。(A1) In this embodiment, an example is shown in which the adhesive holding mechanism 5 uses an adhesive long holding tape F to hold the adhesive sheet Tp, but the structure for holding the adhesive sheet Tp is not limited to this. Regarding other modified examples for attaching the adhesive material sheet Tp to the workpiece W while holding the adhesive material sheet Tp, there can be mentioned a structure in which a plate-shaped member as shown in FIG. 18 is used to hold the adhesive material sheet Tp . Hereinafter, a modification example will be described. In addition, with regard to the configuration common to the embodiment, the same reference numerals are assigned and detailed descriptions are omitted.

在(A1)的變形例之片狀黏著材的貼附裝置1A中，黏著材保持機構5A係如圖18所示具備有支持台24和搬送機構60。搬送機構60具備有搬送臂61。搬送臂61係構成為藉由未圖示的驅動機構而可水平進退、迴旋及升降。搬送臂61的前端設有保持板63。In the sheet-like adhesive material sticking device 1A of the modification of (A1), the adhesive material holding mechanism 5A is provided with a support table 24 and a conveying mechanism 60 as shown in FIG. 18. The transport mechanism 60 includes a transport arm 61. The conveying arm 61 is configured to be capable of horizontally advancing and retreating, turning, and raising and lowering by a drive mechanism not shown. A holding plate 63 is provided at the front end of the transfer arm 61.

保持板63係板狀的構件，由具有剛性的材料所構成。在保持板63的下面設有吸附孔，構成為將黏著材片Tp真空吸附並保持。在使用添設有分離片S的片狀黏著材T之情況，保持板63的吸附力係以變得比黏著材片Tp與分離片S的黏著力大之方式調整。The holding plate 63 is a plate-shaped member and is made of a rigid material. A suction hole is provided on the lower surface of the holding plate 63 and is configured to vacuum suck and hold the adhesive material sheet Tp. In the case of using the sheet-shaped adhesive T with the separator S added, the adsorption force of the holding plate 63 is adjusted so as to become larger than the adhesive force of the adhesive sheet Tp and the separator S.

保持板63係由中央部63a及外周部63b所構成。中央部63a係吸附保持黏著材片Tp的中央部分，外周部63b係吸附保持黏著材片Tp的外周部分。外周部63b係以例如玻璃或丙烯酸樹脂等之具透光性的材料所構成。亦即，可從外周部63b的上方拍攝黏著材片Tp，針對黏著材片Tp的外周部分取得清晰的影像資訊。The holding plate 63 is composed of a central portion 63a and an outer peripheral portion 63b. The central portion 63a is the central portion of the adhesive sheet Tp that is sucked and held, and the outer peripheral portion 63b is the outer circumferential portion of the adhesive sheet Tp that is sucked and held. The outer peripheral portion 63b is made of a translucent material such as glass or acrylic resin. That is, the adhesive material sheet Tp can be photographed from above the outer peripheral portion 63b, and clear image information can be obtained for the outer peripheral part of the adhesive material sheet Tp.

黏著材保持機構5A係構成為以板狀的保持板63吸附保持黏著材片Tp，並將所吸附保持的黏著材片Tp朝貼附區域Q搬送。亦即，在變形例的片狀黏著材的貼附裝置1A中，由於不需要長形的保持帶F，所以至少可省略供給筒管23、保持構件回收機構11及保持構件回收機構12。因此，亦可省略用以捲繞引導長形的保持帶F的空間，所以貼附裝置1A的成本降低及小型化變容易。The adhesive material holding mechanism 5A is configured to suck and hold the adhesive material sheet Tp by a plate-shaped holding plate 63 and to transport the sucked and held adhesive material sheet Tp toward the application area Q. That is, in the sheet-like adhesive material sticking device 1A of the modified example, since the long holding tape F is not required, at least the supply bobbin 23, the holding member recovery mechanism 11, and the holding member recovery mechanism 12 can be omitted. Therefore, the space for winding and guiding the elongated holding tape F can be omitted, so that the cost reduction and downsizing of the sticking device 1A can be facilitated.

在此，說明關於變形例之片狀黏著材的貼附裝置1A的基本動作。貼附裝置1A之流程圖的概要，係與圖4所示的實施例之貼附裝置1的流程圖相同，惟步驟S5以後的動作相異。因此，關於共通的步驟S1～S4的製程，係省略說明，針對步驟S5之後的貼附裝置1A的動作進行說明。Here, the basic operation of the sheet-shaped adhesive material sticking device 1A of the modified example will be described. The outline of the flowchart of the sticking device 1A is the same as the flowchart of the sticking device 1 of the embodiment shown in FIG. 4, except that the operations after step S5 are different. Therefore, the description of the common steps S1 to S4 is omitted, and the operation of the sticking device 1A after step S5 will be described.

步驟S5(黏著材片的保持) 切斷檢查的結果，在判定黏著材片Tp為合格品的情況，藉由保持板63開始進行保持黏著材片Tp的動作。亦即，黏著材保持機構5A的搬送機構60作動，如圖20(a)所示，設置於搬送臂61的前端之保持板63朝支持台24的上方移動。接著，以保持板63之外周部63b的整體確實地抵接於黏著材片Tp的外周部分的整體之方式，將保持板3的位置朝x方向及y方向適當地調節。Step S5 (holding of adhesive sheet) As a result of the cutting inspection, when it is determined that the adhesive sheet Tp is a good product, the holding plate 63 starts to hold the adhesive sheet Tp. That is, the conveying mechanism 60 of the adhesive holding mechanism 5A is operated, and as shown in FIG. 20(a), the holding plate 63 provided at the front end of the conveying arm 61 moves to the upper side of the support table 24. Next, the position of the holding plate 3 is appropriately adjusted in the x-direction and the y-direction so that the entire outer peripheral portion 63b of the holding plate 63 reliably abuts the entire outer peripheral portion of the adhesive sheet Tp.

此外，在開始下降之前使用步驟S4中所使用的切斷檢查機構49等，從保持板63的上方取得保持板63及黏著材片Tp的影像資訊，藉此可適當且迅速地執行保持板63與黏著材片Tp的對位。In addition, the cutting inspection mechanism 49 used in step S4 is used to obtain the image information of the holding plate 63 and the adhesive sheet Tp from the upper side of the holding plate 63 before starting the descent, so that the holding plate 63 can be executed appropriately and quickly. Alignment with the adhesive sheet Tp.

在配合黏著材片Tp的位置調節保持板63的位置之後，如圖20(b)所示，保持板63從支持台24的上方下降，抵接於被吸附保持於支持台24的黏著材片Tp。抵接後，黏著材保持機構5A係使未圖示的真空裝置作動，透過設置於保持板63的吸附孔來吸附保持黏著材片Tp。After adjusting the position of the holding plate 63 in accordance with the position of the adhesive sheet Tp, as shown in FIG. 20(b), the holding plate 63 descends from above the support table 24 and abuts against the adhesive sheet held by the support table 24 by suction Tp. After the abutment, the adhesive holding mechanism 5A operates a vacuum device (not shown) to suck and hold the adhesive sheet Tp through the suction holes provided in the holding plate 63.

當黏著材片Tp藉保持板63吸附保持時，如圖20(c)所示，保持板63係一邊將黏著材片Tp保持大致平坦一邊上升，並朝支持台24的上方移動。藉由保持板63的吸附力，黏著材片Tp從分離片S分離。從分離片S分離的黏著材片Tp係在使朝下的黏著面露出的狀態下與保持板63一起上升。搬送機構60係在以保持板63保持有黏著材片Tp的狀態下將黏著材片Tp朝貼附區域Q搬送。黏著材片Tp係在貼附區域Q中被供給到步驟S7的製程。When the adhesive material sheet Tp is sucked and held by the holding plate 63, as shown in FIG. 20(c), the holding plate 63 rises while maintaining the adhesive material sheet Tp substantially flat, and moves to the upper side of the support table 24. The adhesive material sheet Tp is separated from the separation sheet S by the adsorption force of the holding plate 63. The adhesive sheet Tp separated from the separator S rises together with the holding plate 63 in a state where the downward adhesive surface is exposed. The conveying mechanism 60 conveys the adhesive sheet Tp toward the application area Q in a state where the holding plate 63 holds the adhesive sheet Tp. The adhesive material sheet Tp is supplied to the process of step S7 in the application area Q.

步驟S6(分離片的分離) 另一方面，從黏著材片Tp分離的分離片S，係經由饋送輥32被回收筒管33捲取回收。Step S6 (Separation of Separator) On the other hand, the separator S separated from the adhesive material sheet Tp is wound and recovered by the recovery bobbin 33 via the feed roller 32.

步驟S7(黏著材片與工件的位置調整) 在進行將黏著材片Tp貼附於工件W的製程之前，先進行調整黏著材片Tp與工件W的位置之製程。亦即，如圖21所示，藉由配設於待機區域P的上方之工件位置辨識機構48，取得被保持於工件保持台8之工件W的影像資訊。接著，藉由配設於貼附區域Q的上方之黏著材位置辨識機構47，取得被搬送到貼附區域Q之黏著材片Tp的影像資訊。Step S7 (Adjust the position of the adhesive sheet and the workpiece) Before the process of attaching the adhesive material sheet Tp to the workpiece W, a process of adjusting the positions of the adhesive material sheet Tp and the workpiece W is performed. That is, as shown in FIG. 21, the image information of the workpiece W held on the workpiece holding table 8 is obtained by the workpiece position recognizing mechanism 48 disposed above the standby area P. Then, the image information of the adhesive material sheet Tp conveyed to the application area Q is obtained by the adhesive material position identification mechanism 47 arranged above the application area Q.

此時，黏著材片Tp的外周部分的上面均被具透光性的外周部63b抵接。因此，黏著材位置辨識相機47a及47b係可通過具透光性的外周部63b，取得關於黏著材片Tp的外周部分之清晰的影像資訊。At this time, all the upper surfaces of the outer peripheral portion of the adhesive sheet Tp are contacted by the translucent outer peripheral portion 63b. Therefore, the adhesive material position recognition cameras 47a and 47b can obtain clear image information about the outer peripheral portion of the adhesive material sheet Tp through the light-transmitting outer peripheral portion 63b.

各影像資訊被傳送到位置判定部51，位置判定部51係使用該影像資訊，算出關於黏著材片Tp與工件W的相對位置之資訊。由於算出黏著材片Tp及工件W的相對位置之方法係與實施例相同，故省略說明。控制部44係藉由依據該相對位置資訊控制可動台35，使工件支持台8的位置適當地朝x、y、θ等的各方向移動，來調整工件W相對於黏著材片Tp的位置。進行位置調整之結果，如圖13(c)所示，在俯視下，工件W的中心的位置與黏著材片Tp的中心的位置係正確地一致。Each image information is sent to the position determination unit 51, and the position determination unit 51 uses the image information to calculate the information about the relative position of the adhesive sheet Tp and the workpiece W. Since the method of calculating the relative position of the adhesive material sheet Tp and the workpiece W is the same as in the embodiment, the description is omitted. The control unit 44 controls the movable table 35 based on the relative position information to appropriately move the position of the workpiece support table 8 in the directions of x, y, θ, etc., to adjust the position of the workpiece W with respect to the adhesive sheet Tp. As a result of the position adjustment, as shown in FIG. 13(c), in a plan view, the position of the center of the workpiece W and the position of the center of the adhesive material sheet Tp exactly coincide.

步驟S8(使黏著材片與工件接近) 調整黏著材片Tp與工件W的位置之後，使工件W與黏著材片Tp接近。亦即，如圖22所示，控制部44係控制升降台36的升降移動以使工件載置部37上升，而使工件W與黏著材片Tp接近。此時，亦可藉由使保持有黏著材片Tp的保持板63下降，來使工件W與黏著材片Tp接近。亦可藉由使保持板63及工件載置部37兩者移動，來使工件W與黏著材片Tp接近。Step S8 (Bring the adhesive sheet closer to the workpiece) After adjusting the positions of the adhesive material piece Tp and the work piece W, the work piece W and the adhesive material piece Tp are brought close. That is, as shown in FIG. 22, the control part 44 controls the up-and-down movement of the elevator platform 36 so that the workpiece|work mounting part 37 will rise, and the workpiece|work W and the adhesive sheet Tp will be approached. At this time, by lowering the holding plate 63 holding the adhesive sheet Tp, the workpiece W and the adhesive sheet Tp may be brought close. It is also possible to bring the workpiece W and the adhesive sheet Tp closer to each other by moving both the holding plate 63 and the workpiece placing portion 37.

亦可使黏著材片Tp與工件W接近以將兩者設成接近的狀態，藉此與實施例同樣地，工件W與黏著材片Tp的距離係成為既定的小的值Da。藉由在將黏著材片Tp與工件W設成接近的狀態後再將黏著材片Tp貼附於工件W，可減少在貼附動作中所發生之黏著材片Tp的位置偏移之大小。The adhesive material sheet Tp and the work piece W may be brought close to each other so as to be close to each other, whereby the distance between the work piece W and the adhesive material sheet Tp becomes a predetermined small value Da as in the embodiment. By attaching the adhesive material sheet Tp to the workpiece W after setting the adhesive material sheet Tp and the workpiece W close to each other, the size of the positional deviation of the adhesive material sheet Tp that occurs during the attaching operation can be reduced.

步驟S9(黏著材片的貼附) 使工件W與黏著材片Tp接近後，搬送機構60係使搬送臂61下降。藉由使搬送臂61下降，如圖23所示，保持板63係在保持著黏著材片Tp的狀態下降。藉由將保持板63在保持著與工件W平行的狀態下降，黏著材片Tp會遍及朝上之工件W的貼附面整體而接觸。如此，藉由使搬送臂61下降，黏著材片Tp可被貼附於工件W的表面。亦即，本變形例中省略了貼附輥41，搬送機構60兼具黏著材貼附機構10的功能。Step S9 (attachment of adhesive sheet) After the workpiece W and the adhesive sheet Tp are brought close, the transport mechanism 60 lowers the transport arm 61. By lowering the transport arm 61, as shown in FIG. 23, the holding plate 63 is lowered while holding the adhesive sheet Tp. By lowering the holding plate 63 while maintaining the parallel with the workpiece W, the adhesive sheet Tp is brought into contact over the entire attachment surface of the workpiece W facing upward. In this way, by lowering the transport arm 61, the adhesive sheet Tp can be attached to the surface of the workpiece W. That is, in this modification, the sticking roller 41 is omitted, and the conveying mechanism 60 also has the function of the sticking material sticking mechanism 10.

步驟S10(保持構件的分離) 當黏著材片Tp被貼附於工件W時，黏著材貼附機構10係從終端位置返回初始位置。黏著材貼附機構10返回初始位置，並且黏著材保持機構5A使真空裝置的作動停止，解除由保持板63所進行之黏著材片Tp的吸附保持。其後，如圖24所示，藉由使保持板63上升，保持板63會從黏著材片Tp分離。搬送機構60係使搬送臂61適當驅動，以使保持板63返回初始位置。藉由將保持板63分離，貼附有黏著材片Tp的工件W會留在工件保持台8上。Step S10 (separation of holding member) When the adhesive material sheet Tp is attached to the workpiece W, the adhesive material attaching mechanism 10 returns to the initial position from the terminal position. The adhesive material attaching mechanism 10 returns to the initial position, and the adhesive material holding mechanism 5A stops the operation of the vacuum device and releases the suction holding of the adhesive material sheet Tp by the holding plate 63. Thereafter, as shown in FIG. 24, by raising the holding plate 63, the holding plate 63 is separated from the adhesive sheet Tp. The transport mechanism 60 appropriately drives the transport arm 61 to return the holding plate 63 to the initial position. By separating the holding plate 63, the work W to which the adhesive sheet Tp is attached remains on the work holding table 8.

步驟S11(貼附狀態的檢查) 使保持板63從黏著材片Tp分離後，工件保持台8係一邊保持貼附有黏著材片Tp的工件W，一邊沿著引導軌道R1從貼附區域Q朝待機位置P移動。接著，藉由配置在待機位置P的上方之貼附檢查機構50，檢查黏著材片Tp的貼附狀態。檢查黏著材片Tp的貼附狀態之製程係與實施例同樣。Step S11 (Checking the attachment state) After the holding plate 63 is separated from the adhesive sheet Tp, the workpiece holding table 8 moves from the attachment area Q to the standby position P along the guide rail R1 while holding the workpiece W to which the adhesive sheet Tp is attached. Next, by the sticking inspection mechanism 50 arranged above the standby position P, the sticking state of the adhesive sheet Tp is checked. The process of checking the attachment state of the adhesive sheet Tp is the same as the embodiment.

步驟S12(工件的回收) 在判定貼附有黏著材片Tp的工件W為合格品的情況下，將貼附有黏著材片Tp的工件W回收。使吸附墊38從工件載置部的載置面突出以使工件W朝接收位置抬升，藉由工件搬送機構9將工件W從工件保持台8朝工件收納部7搬出。搬送臂9a係將貼附有黏著材片Tp的工件W插入收納於工件收納部7的匣C2。Step S12 (recycling of workpieces) When it is determined that the work W to which the adhesive sheet Tp is attached is a good product, the work W to which the adhesive sheet Tp is attached is collected. The suction pad 38 is protruded from the placement surface of the workpiece placement portion to lift the workpiece W toward the receiving position, and the workpiece W is carried out from the workpiece holding table 8 toward the workpiece storage portion 7 by the workpiece transport mechanism 9. The transport arm 9a inserts the work W to which the adhesive sheet Tp is attached into the cassette C2 stored in the work storage section 7.

如此，不限於保持帶F，即使像保持板63這樣的構件，也能夠將黏著材片Tp保持大致平坦。藉由在保持有黏著材片Tp的狀態下將黏著材片Tp貼附於工件W，可防止露出有黏著面的黏著材片Tp在貼附製程發生變形或位移，所以可使貼附有黏著材片Tp之位置的精度提升。In this way, it is not limited to the holding tape F, and even a member such as the holding plate 63 can hold the adhesive sheet Tp substantially flat. By attaching the adhesive material sheet Tp to the workpiece W while maintaining the adhesive material sheet Tp, the adhesive material sheet Tp with the exposed adhesive surface can be prevented from being deformed or displaced during the attaching process, so that the adhesive can be attached The accuracy of the position of the sheet Tp is improved.

(A2)上述的實施例中，只要是可保持黏著材片Tp的構成即可，保持帶F不限於長形的帶，亦可為單片狀等其他的形狀。又，在不限於從保持帶F的上方通過保持帶F來拍攝黏著材片Tp的構成之情況，亦可使用不具透光性的材料來作為保持帶F。(A2) In the above-mentioned embodiment, as long as the structure can hold the adhesive material sheet Tp, the holding tape F is not limited to a long tape, and may have other shapes such as a single sheet. In addition, it is not limited to the case where the structure of the adhesive material sheet Tp is photographed from above the holding belt F through the holding belt F, and a material that does not have light-transmitting properties may be used as the holding belt F.

(A3)上述的變形例(A1)中，保持板63的形狀不限於矩形，亦可為圓形或多角形等其他的形狀。又，保持板63不限於具備中央部63a與外周部63b之構成，也可為以具透光性的材料一體形成之板狀構件。再者，在不限於從保持板63的上方拍攝黏著材片Tp之構成的情況，亦可使用以具透光性的材料一體形成之板狀構件來作為保持板63。(A3) In the above-mentioned modification (A1), the shape of the holding plate 63 is not limited to a rectangle, and may be another shape such as a circle or a polygon. In addition, the holding plate 63 is not limited to the configuration having the central portion 63a and the outer peripheral portion 63b, and may be a plate-shaped member integrally formed with a translucent material. In addition, it is not limited to the case where the structure of the adhesive sheet Tp is photographed from above the holding plate 63, and a plate-shaped member integrally formed with a translucent material may be used as the holding plate 63.

再者，本發明中，黏著材切斷機構5的構成不限於上述實施形態，關於其他例子，可如下之(B1)～(B5)所示般地變形實施。In addition, in the present invention, the configuration of the adhesive material cutting mechanism 5 is not limited to the above-mentioned embodiment, and other examples can be modified and implemented as shown in (B1) to (B5) below.

(B1)在實施例及各變形例中，對於被下板13所承接之片狀黏著材T的張力進行調節的構成，並不限於使下板13升降之構成。關於調節片狀黏著材T的張力之其他構成的例子，可舉出：藉由調節張力調節輥或導輥等，在片狀黏著材T的放出方向調節張力之構成。(B1) In the embodiment and each modification, the configuration for adjusting the tension of the sheet-shaped adhesive T received by the lower plate 13 is not limited to the configuration for raising and lowering the lower plate 13. Regarding an example of another configuration for adjusting the tension of the sheet-shaped adhesive material T, a configuration in which the tension of the sheet-shaped adhesive material T is adjusted by adjusting a tension roller or a guide roller or the like can be mentioned.

又，如圖25(a)所示，亦可將片狀黏著材T的長度方向的兩端分別以一對把持構件65把持，使各把持構件65朝相互分離的方向V1移動。如圖25(b)所示，亦可在被下板13所承接的片狀黏著材T上使整平輥67轉動，亦可將以上所舉出的構成適當地組合。Furthermore, as shown in FIG. 25(a), both ends in the longitudinal direction of the sheet-shaped adhesive material T may be respectively gripped by a pair of gripping members 65, and the gripping members 65 may be moved in a mutually separated direction V1. As shown in FIG. 25(b), the leveling roller 67 may be rotated on the sheet-shaped adhesive material T received by the lower plate 13, and the above-mentioned structure may be combined suitably.

(B2)在實施例及各變形例中，係例示出藉由將下降的切斷單元15以承接銷18承接，來對切斷單元15完成片狀黏著材T的切斷之切斷完成位置的高度進行調整之構成。然而，調整切斷完成位置的高度之高度調整機構的構成，除了使用利用以承接銷18為例之物理的構件來進行承接之構成外，也可使用藉由馬達等的驅動機構來調整切斷單元15下降之位置的下限之構成等。此外，以承接銷18為例的高度調整機構不是必須的構成，係為了避免藉由切斷單元15所致之過度切斷而任意配設的構成。(B2) In the embodiment and each modification, the cutting unit 15 is received by the receiving pin 18 to receive the cutting unit 15 to complete the cutting of the sheet-shaped adhesive material T. The height of the structure is adjusted. However, the structure of the height adjustment mechanism that adjusts the height of the cutting completion position can be adjusted by using a drive mechanism such as a motor, in addition to the use of a physical member such as the receiving pin 18 for receiving. The structure of the lower limit of the position where the unit 15 descends, etc. In addition, the height adjustment mechanism using the receiving pin 18 as an example is not an essential configuration, and is a configuration that is arbitrarily arranged to avoid excessive cutting by the cutting unit 15.

(B3)在實施例及各變形例中，切斷刃19的長度及角度也可以不是在涵蓋切斷軌跡K的範圍中都一樣。舉例來說，如圖26(a)所示，切斷刃19亦可具備刃的長度比較長的突出刃部19a、和刃的長度較短的一般刃部19b。突出刃部19a係構成環狀切斷刃19的一部分，一般刃部19b相當於切斷刃19中之突出刃部19a以外的部分。(B3) In the embodiment and each modification, the length and angle of the cutting blade 19 may not be the same in the range covering the cutting trajectory K. For example, as shown in FIG. 26(a), the cutting blade 19 may include a protruding blade portion 19a having a relatively long blade length and a general blade portion 19b having a relatively short blade length. The protruding blade portion 19a constitutes a part of the ring-shaped cutting blade 19, and the blade portion 19b generally corresponds to the portion of the cutting blade 19 other than the protruding blade portion 19a.

如圖26(b)所示，構成為在片狀黏著材T的厚度方向，突出刃部19a的長度G2比一般刃部19b的長度G1還長。亦即，當切斷刃19切斷片狀黏著材T時，突出刃部19a係比一般刃部19b將片狀黏著材T切斷得更深。As shown in FIG. 26(b), in the thickness direction of the sheet-like adhesive material T, the length G2 of the protruding blade portion 19a is longer than the length G1 of the general blade portion 19b. That is, when the cutting blade 19 cuts the sheet-shaped adhesive material T, the protruding blade portion 19a cuts the sheet-shaped adhesive material T deeper than the general blade portion 19b.

其結果，如圖26(c)所示，在切斷刃19切斷黏著帶T的環狀切斷軌跡K中，突出刃部19a係切斷以粗實線所示之第1區域K1，一般刃部19b係切斷以細實線所示之第2區域K2。在此，第1區域K1係以成為包含分離開始部位Sd的區域之方式，調整切斷刃13中之突出刃部13a的配設位置。As a result, as shown in FIG. 26(c), in the annular cutting locus K where the cutting blade 19 cuts the adhesive tape T, the protruding blade portion 19a cuts the first region K1 shown by the thick solid line. Generally, the blade 19b cuts the second area K2 shown by a thin solid line. Here, the first region K1 adjusts the arrangement position of the protruding blade portion 13a in the cutting blade 13 so as to become a region including the separation start portion Sd.

本發明中，分離開始部位Sd意指：切斷軌跡K中，黏著材片Tp以外的部分之片狀黏著材T與黏著材片Tp開始分離處。如實施例等所示，在黏著材回收機構4的回收筒管21配設成與放出方向x正交之情況下，分離開始部位Sd係相當於黏著材片Tp中位於最下游的直線部分。分離開始部位Sd在圖26(c)中係被顯示為以虛線所包圍的部分。In the present invention, the separation start portion Sd means the position where the sheet-shaped adhesive T and the adhesive sheet Tp start to separate in the part other than the adhesive sheet Tp in the cut trajectory K. As shown in the embodiment and the like, when the recovery bobbin 21 of the adhesive recovery mechanism 4 is arranged orthogonal to the discharge direction x, the separation start portion Sd corresponds to the straightest downstream portion of the adhesive material sheet Tp. The separation start part Sd is shown as a part surrounded by a broken line in FIG. 26(c).

切斷單元15的切斷完成位置、突出刃部19a的長度G2、及一般刃部19b的長度G1，係依據片狀黏著材T的厚度、分離片S的厚度、及片狀黏著材T的層與分離片S的層之界面Ps的變形容易度等參數而制定。The cutting completion position of the cutting unit 15, the length G2 of the protruding blade portion 19a, and the length G1 of the general blade portion 19b are based on the thickness of the sheet-like adhesive material T, the thickness of the separation sheet S, and the sheet-like adhesive material T The interface Ps between the layer and the separator S is determined by parameters such as the ease of deformation.

具體言之，在切斷單元15移動到切斷位置的情況下，係以一般刃部19b沒有將分離片S的層完全地切斷，且突出刃部19a確實地將片狀黏著材T的層完全地切斷之方式，預先調整切斷完成位置的高度和長度G1和長度Q2。其結果，如圖27(a)所示，即便在藉由切斷刃19將片狀黏著材T從上方按壓而使界面Ps變形成朝下方沉下的情況，切斷刃19中至少突出刃部19a也可確實地將片狀黏著材T的層完全地切斷。Specifically, when the cutting unit 15 is moved to the cutting position, the general blade portion 19b does not completely cut the layer of the separation sheet S, and the protruding blade portion 19a reliably cuts the sheet-like adhesive T In the way that the layer is completely cut, the height and length G1 and length Q2 of the cut complete position are adjusted in advance. As a result, as shown in FIG. 27(a), even when the sheet-like adhesive material T is pressed from above by the cutting blade 19 and the interface Ps is deformed and sinks downward, at least the cutting blade 19 protrudes The portion 19a can surely cut the layer of the sheet-like adhesive T completely.

藉由突出刃部19a將片狀黏著材T完全地切斷，至少在分離開始部位Sd，不會有在片狀黏著材T的層發生未切斷的情況。因此，在步驟S4中，首先，在分離開始部位Sd，黏著材片Tp從剩餘黏著材Tn確實地分離，接著，在切斷區域K1也是，黏著材片Tp從剩餘黏著材Tn確實地分離。即便在切斷區域K2發生未切斷的情況，藉由已從黏著材片Tp分離之剩餘黏著材Tn的部分被捲起而發生的強剪切力會作用在該未切斷的部分。依此，未切斷的部分中之片狀黏著材T的層係藉該剪切力完全地切斷。The sheet-like adhesive material T is completely cut by the protruding blade portion 19a, and at least at the separation start portion Sd, the layer of the sheet-like adhesive material T will not be uncut. Therefore, in step S4, first, at the separation start site Sd, the adhesive material sheet Tp is reliably separated from the remaining adhesive material Tn, and then, also in the cut area K1, the adhesive material sheet Tp is reliably separated from the remaining adhesive material Tn. Even if uncut occurs in the cutting area K2, a strong shearing force generated by the part of the remaining adhesive Tn separated from the adhesive sheet Tp being rolled up will act on the uncut part. Accordingly, the layer of the sheet-like adhesive material T in the uncut portion is completely cut by the shearing force.

因此，即便在因片狀黏著材T或分離片S以軟質材料構成等的因素而使界面N容易變形的情況下，也可涵蓋切斷軌跡K的整體使黏著材片Tp從剩餘黏著材Tn確實地分離。因此，可確實地防止無法將黏著材片Tp從位於黏著材片Tp周圍之剩餘黏著材Tn分離，而發生捲起剩餘黏著材Tn時黏著材片Tp也連同剩餘黏著材Tn一起被捲起之情事。Therefore, even when the interface N is easily deformed due to factors such as the sheet-like adhesive T or the release sheet S being made of a soft material, the entire cutting track K can be covered so that the adhesive sheet Tp is removed from the remaining adhesive material Tn. Separately. Therefore, it can be reliably prevented that the adhesive material sheet Tp cannot be separated from the remaining adhesive material Tn located around the adhesive material sheet Tp, and when the remaining adhesive material Tn is rolled up, the adhesive material sheet Tp is also rolled up together with the remaining adhesive material Tn. Love affairs.

此外，關於將切斷刃19的一部分加長的構成，並不限於圖26(a)所示之構成，如圖27(b)所示可舉出將切斷刃19中之角部設為突出刃部19a的構成作為較佳例。在相對於片狀黏著材T的放出方向Ln呈平行的方向上將剩餘黏著材Tn捲起時，如圖27(c)所示至少在分離開始部位Sd的一部分含有作為第1區域K1的角部。In addition, the configuration in which a part of the cutting blade 19 is lengthened is not limited to the configuration shown in FIG. 26(a). As shown in FIG. 27(b), the corners of the cutting blade 19 may be projected. The configuration of the blade 19a is a preferable example. When the remaining adhesive material Tn is rolled up in a direction parallel to the release direction Ln of the sheet-shaped adhesive material T, as shown in FIG. 27(c), at least a part of the separation start portion Sd contains a corner as the first region K1 unit.

依此，藉由將角部設為突出刃部19a，在分離開始部位Sd中於突出刃部19a所切斷之第1區域K1的部分，片狀黏著材T確實完全地被切斷，將剩餘黏著材Tn捲起回收時，在突出刃部19a所切斷的部分，黏著材片T與剩餘黏著材Tn分離而產生剪切力。且，該剪切力亦作用在分離開始部位Sd中成為第2區域K2的部分及分離開始部位Sd以外的切斷軌跡K，可涵蓋切斷軌跡K的整體使黏著材片T與剩餘黏著材Tn確實地分離。Accordingly, by setting the corner portion as the protruding blade portion 19a, the sheet-shaped adhesive T is surely and completely cut at the portion of the first region K1 cut by the protruding blade portion 19a in the separation start portion Sd, and When the surplus adhesive material Tn is rolled up and collected, the adhesive material sheet T is separated from the surplus adhesive material Tn at the portion cut by the protruding blade portion 19a to generate a shearing force. Moreover, this shearing force also acts on the part of the separation start part Sd that becomes the second region K2 and the cutting trajectory K other than the separation start part Sd, and can cover the entire cutting trajectory K so that the adhesive sheet T and the remaining adhesive material Tn is definitely separated.

如此，不限於圖26(a)所示之分離開始部位Sd的整體包含於第1區域K1的構成，藉由如圖27(b)所示以至少分離開始部位Sd的一部包含於第1區域K1的方式調整切斷刃19的一部分的長度或角度，可確實地避免黏著材片T與剩餘黏著材Tn一起被回收到黏著材回收機構4的情事。In this way, it is not limited to the configuration in which the entire separation start site Sd shown in FIG. 26(a) is included in the first region K1, and at least a part of the separation start site Sd is included in the first region K1 as shown in FIG. 27(b) By adjusting the length or angle of a part of the cutting blade 19 in the area K1, it is possible to surely prevent the adhesive material sheet T from being collected by the adhesive material collecting mechanism 4 together with the remaining adhesive material Tn.

此外，如圖27(b)所示，將切斷刃19中的角部設為突出刃部19a之構成，在將黏著材回收機構4的回收筒管21以相對於片狀黏著材T的放出方向Ln傾斜的方式配設的情況下是更佳的。亦即，在回收筒管21相對於放出方向Ln傾斜時，由於剩餘黏著材Tn係在沿著相對於x方向呈傾斜的方向被捲起，所以分離開始部位Sd相當於黏著材片Tp的角部。此外，俯視下，將剩餘黏著材Tn中捲起的部分所行進之方向的一例，在圖27(c)或(d)中以符號Lf顯示。In addition, as shown in FIG. 27(b), the corner portion of the cutting blade 19 is configured as a protruding blade portion 19a, and the recovery tube 21 of the adhesive material recovery mechanism 4 is opposite to the sheet-shaped adhesive material T It is more preferable to arrange it in a way that the discharge direction Ln is inclined. That is, when the recovery bobbin 21 is inclined with respect to the discharge direction Ln, since the remaining adhesive Tn is rolled up in a direction inclined with respect to the x direction, the separation start portion Sd corresponds to the corner of the adhesive sheet Tp unit. In addition, in a plan view, an example of the direction in which the rolled up portion of the remaining adhesive material Tn travels is shown by the symbol Lf in FIG. 27(c) or (d).

亦即，如圖27(d)所示，由於在矩形的切斷軌跡K之中角部會成為第1區域K1，所以在屬於分離開始部位Sd的角部中可確實地將片狀黏著材T的層完全地切斷。亦即，由於在分離開始部位Sd不會發生片狀黏著材T未切斷的情況，故剪切力會以分離開始部位Sd為起點作用於切斷軌跡K的整體。因此，黏著材片Tp確實地從剩餘黏著材Tn被分離，僅剩餘黏著材Tn被回收於黏著材回收機構4。That is, as shown in FIG. 27(d), since the corner portion of the rectangular cutting track K becomes the first area K1, the sheet-shaped adhesive material can be reliably formed in the corner portion belonging to the separation start site Sd The layer of T is completely cut off. That is, since the sheet-like adhesive material T is not cut at the separation start site Sd, the shear force acts on the entire cutting track K starting from the separation start site Sd. Therefore, the adhesive material sheet Tp is surely separated from the remaining adhesive material Tn, and only the remaining adhesive material Tn is collected in the adhesive material recovery mechanism 4.

(B4)黏著材切斷機構3亦可具備複數個環狀切斷刃19。將具備複數個切斷刃19之黏著材切斷機構3的一例顯示於圖28(a)。本變形例中，係以三個切斷刃19排列於片狀黏著材T的放出方向之構成為例來作說明。(B4) The adhesive material cutting mechanism 3 may include a plurality of ring-shaped cutting blades 19. An example of the adhesive material cutting mechanism 3 provided with a plurality of cutting blades 19 is shown in FIG. 28(a). In this modification example, a configuration in which three cutting blades 19 are arranged in the release direction of the sheet-shaped adhesive material T will be described as an example.

本變形例中，藉由在步驟S2中各切斷刃19切斷由下板13所承接的片狀黏著材T，如圖28(b)所示形成三個黏著材片Tp、即黏著材片TpA～TpC。在步驟S3中使此等三個黏著材片TpA～TpC依序分離。藉由從下游朝上游將剩餘黏著材Tn逐漸捲起，首先，如圖28(c)所示，位於最下游的黏著材片TpA從黏著材片TpA以外之部分的片狀黏著材T分離。亦即，黏著材片TpA係從由黏著材片TpB、黏著材片TpC及剩餘黏著材Tn所構成之部分的片狀黏著材T分離。In this modification, in step S2, each cutting blade 19 cuts the sheet-shaped adhesive material T received by the lower plate 13, and as shown in FIG. 28(b), three adhesive material sheets Tp, namely, adhesive material are formed Slices TpA～TpC. In step S3, these three adhesive material sheets TpA to TpC are sequentially separated. By gradually winding up the remaining adhesive material Tn from downstream to upstream, first, as shown in FIG. 28(c), the adhesive material sheet TpA located at the most downstream is separated from the sheet-shaped adhesive material T in the part other than the adhesive material sheet TpA. That is, the adhesive material sheet TpA is separated from the sheet-shaped adhesive material T of the part composed of the adhesive material sheet TpB, the adhesive material sheet TpC, and the remaining adhesive material Tn.

然後，藉由一邊將片狀黏著材T輸送到下游一邊將剩餘黏著材Tn逐漸捲起，接著，黏著材片TpB從黏著材片TpB以外的部分之片狀黏著材T被分離。亦即，黏著材片TpB從由黏著材片TpC及剩餘黏著材Tn所構成之部分的片狀黏著材T被分離。藉由黏著材片TpC從黏著材片TpC以外的部分之片狀黏著材T分離，會成為黏著材片TpA～TpC的每一者殘留在分離片S上，剩餘黏著材Tn被捲起且分離的狀態。其後，藉由步驟S4以後的各製程，黏著材片TpA～TpC分別被貼附於其他的工件W。Then, the remaining adhesive material Tn is gradually rolled up while conveying the sheet-shaped adhesive material T downstream, and then the adhesive material sheet TpB is separated from the sheet-shaped adhesive material T of the part other than the adhesive material sheet TpB. That is, the adhesive material sheet TpB is separated from the sheet-shaped adhesive material T of the part composed of the adhesive material sheet TpC and the remaining adhesive material Tn. When the adhesive material sheet TpC is separated from the sheet-like adhesive material T other than the adhesive material sheet TpC, each of the adhesive material sheets TpA to TpC remains on the separator S, and the remaining adhesive material Tn is rolled up and separated status. After that, the adhesive material sheets TpA to TpC are attached to other workpieces W through the processes after step S4.

(B5)利用黏著材切斷機構3所進行之片狀黏著材T的切斷，並不限於使片狀黏著材T的放出行進暫時停止後再進行之構成。亦即，只要是在放出方向之黏著材切斷機構3及片狀黏著材T的相對位置可一邊保持在相同位置一邊切斷片狀黏著材T之構成即可，也可一邊使片狀黏著材T朝x方向放出行進，一邊進行利用黏著材切斷機構3之切斷。(B5) The cutting of the sheet-like adhesive material T by the adhesive-material cutting mechanism 3 is not limited to a configuration in which the feeding and traveling of the sheet-like adhesive material T is temporarily stopped. That is, as long as the relative position of the adhesive material cutting mechanism 3 and the sheet-shaped adhesive material T in the release direction can be cut while keeping the same position, the sheet-shaped adhesive material T may be cut, or the sheet-shaped adhesive material T may be adhered at the same time. The material T is released and travels in the x direction, while cutting by the adhesive material cutting mechanism 3 is performed.

關於該變形例的具體例，可舉出︰一邊使片狀黏著材T及黏著材切斷機構3以相同速度朝x方向移動，一邊執行藉由黏著材切斷機構3所致之片狀黏著材T的切斷之構成。由於黏著材切斷機構3及片狀黏著材T的相對位置為相同位置，所以可避免黏著材片Tp的切斷軌跡K的位置從假定的位置偏移。又，由於不需要使片狀黏著材T的放出並行進之動作停止，所以可提升片狀黏著材的貼附裝置1的作業效率。As for a specific example of this modification, there can be mentioned: While the sheet-like adhesive material T and the adhesive material cutting mechanism 3 are moved in the x direction at the same speed, the sheet-like adhesion by the adhesive material cutting mechanism 3 is performed. The structure of cutting the material T. Since the relative positions of the adhesive material cutting mechanism 3 and the sheet-shaped adhesive material T are the same position, it is possible to prevent the position of the cutting trajectory K of the adhesive material sheet Tp from shifting from the assumed position. In addition, since it is not necessary to stop the operation of releasing and advancing the sheet-shaped adhesive material T, the work efficiency of the sheet-shaped adhesive material sticking device 1 can be improved.

再者，本發明中，黏著材位置辨識機構47及工件位置辨識機構48等在步驟S7中調整黏著材片與工件的位置之構成並不限於上述實施形態。關於調整黏著材片與工件的位置之構成的其他例，可如以下(C1)～(C6)所示地變形實施。In addition, in the present invention, the structure of adjusting the positions of the adhesive material sheet and the workpiece in step S7, such as the adhesive material position recognizing mechanism 47, the workpiece position identifying mechanism 48, etc., is not limited to the above-mentioned embodiment. Regarding other examples of the configuration of adjusting the positions of the adhesive sheet and the workpiece, it can be modified as shown in the following (C1) to (C6).

(C1)黏著材位置辨識機構47並不限於如圖12(a)等所示從黏著材片Tp的上方通過保持帶F拍攝黏著材片Tp，並使用所取得的黏著材片Tp的影像資訊來辨識黏著材片Tp的位置之構成。亦即，如圖29(a)所示，亦可從黏著材片Tp的下方、亦即從與黏著材片Tp對向之側，來辨識黏著材片Tp的位置，亦可從其他方向來辨識。(C1) Adhesive material position recognition mechanism 47 is not limited to photographing the adhesive material sheet Tp from above the adhesive material sheet Tp through the holding tape F as shown in FIG. 12(a), and uses the obtained image information of the adhesive material sheet Tp To identify the composition of the position of the adhesive sheet Tp. That is, as shown in Figure 29(a), the position of the adhesive material sheet Tp can also be recognized from below the adhesive material sheet Tp, that is, from the side opposite to the adhesive material sheet Tp, or from other directions Identify.

在黏著材位置辨識機構47從黏著材片Tp的下方取得黏著材片Tp的影像資訊之情況，可避免被保持帶F等的保持構件遮住。因此，即便在沒有使用具透光性的材料作為保持帶F等的保持構件之情況，也可取得高精度之黏著材片Tp的影像資訊。又，關於工件位置辨識機構48也是，不限於從工件W的上方辨識工件W的位置之構成，亦可從其他方向辨識工件W的位置。When the adhesive material position recognition mechanism 47 obtains the image information of the adhesive material sheet Tp from below the adhesive material sheet Tp, it is possible to avoid being hidden by the holding member such as the holding tape F. Therefore, even when no light-transmitting material is used as a holding member such as the holding tape F, high-precision image information of the adhesive sheet Tp can be obtained. In addition, the work position recognition mechanism 48 is not limited to the configuration that recognizes the position of the work W from above the work W, and the position of the work W may be recognized from other directions.

(C2)黏著材位置辨識機構47及工件位置辨識機構48的每一者被配設的位置並不限於實施例的構成，亦可適當地變更。舉一例，亦可將工件位置辨識機構48配設在貼附區域Q的上方。此外，黏著材位置辨識機構47及工件位置辨識機構48的每一者較佳為在固定的狀態配設。藉由設成將黏著材位置辨識機構47及工件位置辨識機構48的位置固定以免發生該機構的位置偏移之構成，可防止工件W及黏著材片Tp的位置辨識精度之降低。(C2) The position where each of the adhesive material position recognition mechanism 47 and the workpiece position recognition mechanism 48 is arranged is not limited to the configuration of the embodiment, and may be changed as appropriate. For example, the workpiece position recognition mechanism 48 may also be arranged above the attaching area Q. In addition, each of the adhesive material position identification mechanism 47 and the workpiece position identification mechanism 48 is preferably arranged in a fixed state. By setting the positions of the adhesive material position identifying mechanism 47 and the workpiece position identifying mechanism 48 to be fixed so as not to cause positional deviation of the mechanism, it is possible to prevent the reduction of the position identification accuracy of the workpiece W and the adhesive material sheet Tp.

(C3)黏著材位置辨識機構47及工件位置辨識機構48並不限於個別的構成，也可為共通的構成。亦即，如圖29(b)所示，位置辨識相機71a及71b係取得工件W的影像資訊來辨識工件W的位置，並取得黏著材片Tp的影像資訊來辨識黏著材片Tp的位置。此時，具備位置辨識相機71a及71b的位置辨識機構71係相當於第1辨識機構及第2辨識機構。(C3) The adhesive material position recognition mechanism 47 and the workpiece position recognition mechanism 48 are not limited to individual configurations, and may have a common configuration. That is, as shown in FIG. 29(b), the position recognition cameras 71a and 71b obtain the image information of the workpiece W to recognize the position of the workpiece W, and obtain the image information of the adhesive sheet Tp to identify the position of the adhesive sheet Tp. At this time, the position recognition mechanism 71 provided with the position recognition cameras 71a and 71b corresponds to the first recognition mechanism and the second recognition mechanism.

又，在(C3)的變形例中，位置辨識機構71的每一者不限於同時辨識工件W及黏著材片Tp兩者的位置之構成，亦可在辨識一者的位置後再辨識另一者的位置。舉一例，可舉出：在貼附區域Q的上方，位置辨識機構71先辨識黏著材片Tp的位置，在使保持有工件W的狀態之工件保持台8從待機區域P朝貼附區域Q移動後，位置辨識機構71再辨識工件W的位置之構成。In addition, in the modified example of (C3), each of the position recognition mechanisms 71 is not limited to a configuration that recognizes both the positions of the workpiece W and the adhesive sheet Tp at the same time, and may also recognize the position of one after the other. Location. As an example, the position recognition mechanism 71 first recognizes the position of the adhesive sheet Tp above the attachment area Q, and moves the workpiece holding table 8 holding the workpiece W from the standby area P toward the attachment area Q After the movement, the position recognition mechanism 71 recognizes the structure of the position of the workpiece W again.

(C4)辨識工件W及黏著材片Tp的位置之構成，並不限於以如黏著材位置辨識相機47a之類的相機進行拍攝之構成。關於其他例子，可舉出：使用以光學感測器，超音波感測器等為例之各種感測器來辨識工件W及黏著材片Tp的位置之構成。再者，關於光學感測器的例子，除了如相機般可取得影像之構成外，可舉出使用雷射等來檢測工件W或黏著材片Tp的端部之構成。然而，關於可容易地辨識工件W及黏著材片Tp的詳細位置之構成，較佳為使用光學感測器來取得工件W或黏著材片Tp的光學資訊。(C4) The configuration for recognizing the position of the workpiece W and the adhesive material piece Tp is not limited to the configuration for shooting with a camera such as the adhesive material position recognition camera 47a. Regarding other examples, there may be a configuration in which various sensors such as optical sensors and ultrasonic sensors are used to recognize the position of the workpiece W and the adhesive sheet Tp. Furthermore, as an example of an optical sensor, in addition to a configuration that can obtain images like a camera, a configuration that uses a laser or the like to detect the end of the workpiece W or the adhesive sheet Tp can be cited. However, with regard to the structure that can easily identify the detailed position of the workpiece W and the adhesive material sheet Tp, it is preferable to use an optical sensor to obtain optical information of the workpiece W or the adhesive material sheet Tp.

(C5)黏著材位置辨識機構47及工件位置辨識機構48，並不限於辨識如實施例之黏著材片Tp或工件W之對向的兩個角部之構成。亦即，黏著材位置辨識機構47及工件位置辨識機構48辨識對象的位置及數量亦可適當變更。舉一例，在工件W或黏著材片Tp具有特定之標的部位時，黏著材位置辨識機構47及工件位置辨識機構48藉由辨識該標的部位，可辨識工件W或黏著材片Tp的位置。關於標的部位之例子，除了如圖29(c)所示之凹口部分Nc及標記Mc外，也可舉出定向平面等。(C5) The adhesive material position identification mechanism 47 and the workpiece position identification mechanism 48 are not limited to the configuration of identifying the two opposite corners of the adhesive material sheet Tp or the workpiece W as in the embodiment. That is, the positions and the number of objects to be recognized by the adhesive material position recognition mechanism 47 and the workpiece position recognition mechanism 48 can also be appropriately changed. For example, when the workpiece W or the adhesive material sheet Tp has a specific target position, the adhesive material position identification mechanism 47 and the workpiece position identification mechanism 48 can identify the position of the workpiece W or the adhesive material sheet Tp by identifying the target position. Regarding examples of the target portion, in addition to the notch portion Nc and the mark Mc as shown in FIG. 29(c), an orientation plane and the like can also be cited.

(C6)執行調整黏著材片Tp與工件W的位置之製程的時間點並不限於實施例，只要是在將黏著材片Tp貼附於工件W前，亦可適當變更。(C6) The time point for performing the process of adjusting the positions of the adhesive material sheet Tp and the workpiece W is not limited to the embodiment, as long as it is before the adhesive material sheet Tp is attached to the workpiece W, it can be changed appropriately.

再者，本發明中，切斷檢查機構49及貼附檢查機構50等進行黏著材片Tp及工件W的檢查之構成並不限於上述實施形態。關於進行檢查的構成之其他例，亦可如以下(D1)～(D6)所示地變形實施。In addition, in the present invention, the cutting inspection mechanism 49, the sticking inspection mechanism 50, etc., perform inspections of the adhesive material sheet Tp and the workpiece W are not limited to the above-mentioned embodiment. Regarding other examples of the inspection structure, it can be modified and implemented as shown in the following (D1) to (D6).

(D1)片狀黏著材的貼附裝置1並不限於具備切斷檢查機構49及貼附檢查機構50兩者之構成，亦可僅具備一者。又，切斷檢查機構49檢查黏著材片Tp的時間點亦可適當變更。關於貼附檢查機構50檢查貼附於工件W的黏著材片Tp之時間點，也可適當變更。(D1) The sticking device 1 of the sheet-shaped adhesive material is not limited to the configuration having both the cutting inspection mechanism 49 and the sticking inspection mechanism 50, and may be provided with only one. In addition, the time point at which the cutting inspection mechanism 49 inspects the adhesive sheet Tp may be appropriately changed. The timing at which the attachment inspection mechanism 50 inspects the adhesive sheet Tp attached to the workpiece W can also be appropriately changed.

(D2)切斷檢查機構49並不限於藉由以如切斷檢查相機49a之類的相機進行拍攝，來檢查黏著材片Tp之構成。關於其他例，可舉出：使用以光學感測器、超音波感測器等為例的各種感測器來辨識黏著材片Tp的尺寸及形狀之構成。舉一例，藉由各種感測器將黏著材片Tp的端部的位置涵蓋整體進行檢測，可檢測黏著材片Tp的尺寸及形狀。又，關於貼附檢查機構50也是，不限於使用如貼附檢查相機50a之類的相機之構成，亦可採用將貼附於工件W的黏著材片Tp藉由各種感測器進行檢測之構成。(D2) The cutting inspection mechanism 49 is not limited to the configuration of inspecting the adhesive sheet Tp by shooting with a camera such as the cutting inspection camera 49a. As for other examples, it is possible to cite a configuration in which various sensors such as optical sensors and ultrasonic sensors are used to recognize the size and shape of the adhesive sheet Tp. For example, by detecting the position of the end of the adhesive material sheet Tp covering the whole by various sensors, the size and shape of the adhesive material sheet Tp can be detected. Also, regarding the sticking inspection mechanism 50, it is not limited to the configuration using cameras such as the sticking inspection camera 50a, and a configuration in which the sticky sheet Tp attached to the workpiece W is detected by various sensors can also be adopted. .

(D3)檢查的結果，在判定黏著材片Tp的切斷或貼附沒有正常地進行時，也可將附帶黏著材片Tp之工件W的不合格品、或黏著材片Tp的不合格品自動除去。此時，片狀黏著材的貼附裝置1進一步具備具有搬送臂等的搬送手段之不合格品除去機構。(D3) As a result of the inspection, when it is determined that the cutting or sticking of the adhesive material sheet Tp has not been performed normally, the defective product of the workpiece W with the adhesive material sheet Tp or the defective product of the adhesive material sheet Tp Removed automatically. At this time, the sticking device 1 of the sheet-shaped adhesive material further includes a defective product removing mechanism having a conveying means such as a conveying arm.

當控制部44從切斷判定部52或貼附判定部53接收到顯示不合格品產生的信號時，控制部44係藉由控制不良品除去機構，來將工件W的不合格品或黏著材片Tp的不合格品從線上(line)除去，並朝向收納不合格品的不合格品回收部搬送。藉由將不合格品的除去及回收自動化，可提升貼附裝置1的作業效率，並可減輕操作者的負擔。When the control unit 44 receives a signal indicating defective products from the cut determination unit 52 or the attachment determination unit 53, the control unit 44 controls the defective product removal mechanism to remove the defective product or the adhesive material of the workpiece W. The defective products of the sheet Tp are removed from the line, and are transported toward the defective product collection section in which defective products are stored. By automating the removal and recovery of defective products, the working efficiency of the sticking device 1 can be improved, and the burden on the operator can be reduced.

(D4)切斷檢查機構49並不限於檢查黏著材片Tp的尺寸及形狀兩者來比較基準尺寸的資訊及基準形狀的資訊之構成，亦可為檢查黏著材片Tp的尺寸及形狀中的一者之構成。(D4) The cutting inspection mechanism 49 is not limited to inspecting both the size and shape of the adhesive material sheet Tp to compare the information of the reference size and the information of the reference shape, and may also be used to inspect the size and shape of the adhesive material sheet Tp. The composition of one.

(D5)切斷檢查相機49a及49b並不限於拍攝黏著材片Tp的一部分之構成，亦可藉由使用廣角透鏡等來拍攝黏著材片Tp的整體。此時，由於黏著材片Tp的整體影像的資訊係藉由切斷檢查機構49獲得，所以切斷判定部52不需要進行重現黏著材片Tp的整體影像之演算。因此，可將由切斷判定部52所進行的演算處理單純化。同樣地，關於貼附檢查相機50a及50b，也可採用拍攝工件W及黏著材片Tp的整體之構成。(D5) The cut-off inspection cameras 49a and 49b are not limited to the configuration of photographing a part of the adhesive sheet Tp, and the entire adhesive sheet Tp may be photographed by using a wide-angle lens or the like. At this time, since the information of the entire image of the adhesive sheet Tp is obtained by the cutting inspection mechanism 49, the cut determination unit 52 does not need to perform calculations to reproduce the entire image of the adhesive sheet Tp. Therefore, the arithmetic processing performed by the cut determination unit 52 can be simplified. Similarly, with regard to the attachment inspection cameras 50a and 50b, it is also possible to adopt a configuration that photographs the entire workpiece W and the adhesive sheet Tp.

(D6)亦可為在藉貼附判定部53判定出黏著材片Tp相對於工件W的貼附未正常地進行時，將貼附有黏著材片Tp之工件W的不合格品再利用之構成。本變形例中，片狀黏著材的貼附裝置1具備有黏著材剝離機構80。(D6) When the sticking judging unit 53 determines that the sticking of the sticking sheet Tp to the workpiece W is not normally performed, it can also be used as a reusable product of the workpiece W to which the sticking sheet Tp is stuck. constitute. In this modification example, the sheet-shaped adhesive material sticking device 1 is provided with an adhesive material peeling mechanism 80.

黏著材剝離機構80係在工件保持台8位於待機位置P的情況下，配置在工件保持台8的上方，將貼附於工件W中之不適當位置的黏著材片Tp從工件W剝離並回收。黏著材剝離機構80係如圖30(a)所示，具備有：引導捲繞的剝離帶Ha之導輥83；刀口狀的剝離構件85；和回收剝離帶Ha之捲取軸87。The adhesive material peeling mechanism 80 is arranged above the workpiece holding table 8 when the workpiece holding table 8 is in the standby position P, and peels and recovers the adhesive material sheet Tp attached to the inappropriate position in the workpiece W. . As shown in FIG. 30(a), the adhesive peeling mechanism 80 is provided with: a guide roller 83 for guiding the wound peeling tape Ha; a knife-edge peeling member 85; and a winding shaft 87 for recovering the peeling tape Ha.

剝離帶Ha係藉導輥83朝剝離構件85被引導，在剝離構件85中折回並反轉後，藉由捲取軸87捲取回收。亦即，如圖30(b)所示，在貼附於工件W的表面之黏著材片Tp上貼附有剝離帶Ha的狀態下，使工件保持台8或黏著材剝離機構80移動，藉此黏著材片Tp可與剝離帶Ha成為一體而從工件W的表面被剝離。The peeling tape Ha is guided toward the peeling member 85 by the guide roller 83, and after being folded back in the peeling member 85 and reversed, it is wound up and collected by the winding shaft 87. That is, as shown in FIG. 30(b), with the peeling tape Ha attached to the adhesive sheet Tp attached to the surface of the workpiece W, the workpiece holding table 8 or the adhesive peeling mechanism 80 is moved, whereby This adhesive sheet Tp can be integrated with the peeling tape Ha and peeled from the surface of the workpiece W.

與剝離帶Ha成為一體而被剝離的黏著材片Tp，係與剝離帶Ha一起被回收到捲取軸87。留在工件保持台8上的工件W，係藉由工件搬送機構9收納於工件收納部7的匣C1。所收納的該工件W係可再利用，所以即便在未適當地進行黏著材片Tp對工件W貼附的製程之情況，也可有效地利用工件W。The adhesive sheet Tp that is integrated with the peeling tape Ha and peeled off is collected to the take-up shaft 87 together with the peeling tape Ha. The workpiece W left on the workpiece holding table 8 is stored in the cassette C1 of the workpiece storage portion 7 by the workpiece transport mechanism 9. The stored work W is reusable, so even when the process of attaching the adhesive sheet Tp to the work W is not performed properly, the work W can be effectively used.

1:片狀黏著材的貼附裝置 2:黏著材供給機構 3:黏著材切斷機構 4:黏著材回收機構 5:黏著材保持機構 6:分離片回收機構 7:工件收納部 8:工件保持台 9:工件搬送機構 10:黏著材貼附機構 11:保持構件分離機構 12:保持構件回收機構 13:下板 15:切斷單元 16:上部固定板 17:可動台 18:承接銷 19:切斷刃 21:回收筒管 23:供給筒管 24:支持台 25:貼附單元 27:貼附輥 29:驅動缸 30:導軌 35:可動台 35a:前後可動台 35b:左右可動台 35c:旋轉可動台 36:可動台 37:工件載置部 38:吸附墊 39:定位構件 41:貼附輥 44:控制部 45:輸入部 47:黏著材位置辨識機構 48:工件位置辨識機構 49:切斷檢查機構 50:貼附檢查機構 51:位置判定部 52:切斷判定部 53:貼附判定部 54:記憶部 55:通報部 80:黏著材剝離機構1: Attaching device for sheet adhesive material 2: Adhesive material supply mechanism 3: Adhesive material cutting mechanism 4: Adhesive material recycling mechanism 5: Adhesive material holding mechanism 6: Separation piece recovery mechanism 7: Work storage department 8: Workpiece holding table 9: Workpiece transport mechanism 10: Adhesive material attaching mechanism 11: Keep component separation mechanism 12: Keep component recycling mechanism 13: Lower board 15: Cut off the unit 16: Upper fixing plate 17: movable table 18: Undertake sales 19: Cutting edge 21: recycling bobbin 23: supply bobbin 24: support desk 25: attaching unit 27: sticking roller 29: drive cylinder 30: Rail 35: movable table 35a: Front and rear movable platform 35b: Left and right movable platform 35c: Rotating movable table 36: movable table 37: Workpiece placement section 38: Adsorption pad 39: Positioning member 41: attaching roller 44: Control Department 45: Input section 47: Adhesive material position identification mechanism 48: Workpiece position identification mechanism 49: Cut off the inspection agency 50: Attach inspection agency 51: Location Judgment Department 52: Cut-off determination section 53: Attach Judgment Department 54: Memory Department 55: Notification Department 80: Adhesive material peeling mechanism

圖1係顯示實施例之片狀黏著材的貼附裝置的基本構成之立體圖。 圖2係顯示實施例之片狀黏著材的貼附裝置的基本構成之前視圖。 圖3係顯示實施例之片狀黏著材的貼附裝置的基本構成之俯視圖。 圖4係說明實施例之片狀黏著材的貼附裝置之圖；(a)係顯示實施例之片狀黏著材的貼附裝置的動作之流程圖，(b)係說明使用於實施例之片狀黏著材的構成之縱剖面圖。 圖5係顯示實施例之黏著材切斷機構的構成之圖；(a)係黏著材切斷機構的立體圖，(b)係黏著材切斷機構的縱剖面圖，(c)係顯示黏著材切斷機構的要部之底面立體圖。 圖6係顯示實施例之工件保持台的構成之圖。 圖7係說明實施例的步驟S1之圖；(a)係顯示吸附墊接收工件的狀態之圖，(b)係顯示使工件載置於工件載置部的載置面的狀態之圖。 圖8係說明實施例的步驟S2之圖；(a)係顯示黏著材切斷機構調整片狀黏著材的張力之前的狀態之圖，(b)係顯示黏著材切斷機構正在調整片狀黏著材的張力的狀態之圖，(c)係顯示切斷單元下降並開始進行片狀黏著材的切斷之狀態之圖。 圖9係說明實施例的步驟S3之圖；(a)係顯示黏著材片被分離前的狀態之俯視圖(上)及前視圖(下)，(b)係顯示黏著材片以外的部分之片狀黏著材與黏著材片正被分離的狀態之俯視圖(上)及前視圖(下)，(c)係顯示黏著材片以外的部分的片狀黏著材與黏著材片已被分離的狀態之俯視圖(上)及前視圖(下)，(d)係顯示在黏著材片的上游，新形成有黏著材片的狀態之俯視圖(上)及前視圖(下)。 圖10係說明實施例的步驟S4之圖；(a)係顯示切斷檢查機構拍攝黏著材片的動作之前視圖，(b)係顯示步驟S4的構成之功能方塊圖，(c)係說明藉由切斷檢查機構得到的資訊之概略圖，(d)係說明切斷判定部算出黏著材片的整體影像的構成之圖。 圖11係說明實施例的步驟S5之前視圖；(a)係顯示保持帶的貼附開始前的狀態之圖，(b)係顯示保持帶貼附於黏著材片的一端的狀態之圖，(c)係顯示保持帶從黏著材片的一端遍及另一端而貼附的狀態之圖。 圖12係說明實施例的步驟S7之前視圖；(a)係顯示拍攝黏著材片及工件的動作之圖，(b)係顯示步驟S7的構成之功能方塊圖，(c)係顯示工件保持台朝貼附區域移動的狀態之圖。 圖13係說明實施例的步驟S7之前視圖；(a)係顯示在貼附區域正在調整工件與黏著材片的位置關係之狀態之圖，(b)係例示剛移動到貼附區域後之工件與黏著材片的位置關係之俯視圖，(c) 係例示調整了工件與黏著材片的位置關係後之工件與黏著材片的位置關係之俯視圖。 圖14係說明實施例的步驟S8的動作之前視圖。 圖15係說明實施例的步驟S9之前視圖；(a)係顯示黏著材片貼附於工件的一端之狀態之圖，(b)係顯示黏著材片從工件的一端遍及另一端而貼附的狀態之圖。 圖16係說明實施例的步驟S10之前視圖；(a)係顯示保持帶從黏著材片分離前的狀態之圖，(b)係顯示保持帶從黏著材片分離後的狀態之圖。 圖17係說明實施例的步驟S11之前視圖；(a)係顯示拍攝黏著材片及工件的動作之圖，(b)係顯示步驟S7的構成之功能方塊圖，(c)係說明藉由貼附檢查機構得到的資訊之圖。 圖18係顯示變形例之片狀黏著材的貼附裝置的基本構成之立體圖。 圖19係顯示變形例之片狀黏著材的貼附裝置的基本構成之前視圖。 圖20係說明變形例的步驟S5的動作之圖；(a)係顯示保持板朝黏著材片的上方被搬送的狀態之圖，(b)係顯示保持板保持黏著材片的狀態之圖，(c)係顯示保持板一邊保持黏著材片一邊進行搬送的狀態之圖。 圖21係說明變形例的步驟S7的動作之圖。 圖22係說明變形例的步驟S8的動作之圖。 圖23係說明變形例的步驟S9的動作之圖。 圖24係說明變形例的步驟S10的動作之圖。 圖25係說明調整片狀黏著材的張力之構成的變形例之圖；(a)係顯示藉由把持構件調整寬度方向之片狀黏著材的張力之構成之圖，(b)係顯示藉由輥的轉動調整片狀黏著材的張力之構成之圖。 圖26係說明變形例的黏著材切斷機構的構成之圖；(a)係顯示黏著材切斷機構的要部之底面立體圖，(b)係黏著材切斷機構的縱剖面圖，(c)係顯示由切斷刃所產生的切斷軌跡之俯視圖。 圖27係說明變形例的黏著材切斷機構的構成之圖；(a)係顯示變形例之切斷刃的效果之縱剖面圖，(b)係顯示黏著材切斷機構的要部之底面立體圖，(c)係顯示將剩餘黏著材朝向與放出方向平行的方向剝離時由切斷刃所產生的切斷軌跡與剝離開始處的位置之俯視圖，(d)係顯示將剩餘黏著材朝向與放出方向傾斜的方向剝離時由切斷刃產生的切斷軌跡與剝離開始處的位置之俯視圖。 圖28係說明變形例之黏著材切斷機構的構成之圖；(a)係顯示黏著材切斷機構的要部之底面立體圖，(b)係顯示形成有黏著材片的狀態之俯視圖，(c)係顯示所選擇的一個黏著材片與所選擇的該黏著材片以外的部分之片狀黏著材已被分離的狀態之俯視圖(上)及前視圖(下)。 圖29係說明變形例之工件位置辨識機構及黏著材位置辨識機構的構成之圖；(a)係顯示供黏著材位置辨識機構配設的位置的變形例之側視圖，(b)係顯示藉由共通的位置辨識機構檢測工件及黏著材片的變形例之側視圖，(c)係顯示檢測工件或黏著材片之對象的變形例之俯視圖。 圖30係說明具備黏著材剝離機構的變形例之圖；(a)係說明黏著材剝離機構的構成之側視圖，(b)係說明將被不適當地貼附之黏著材片從工件剝離的狀態之立體圖。Fig. 1 is a perspective view showing the basic structure of the sheet-shaped adhesive material attaching device of the embodiment. Fig. 2 is a front view showing the basic structure of the sheet-shaped adhesive material attaching device of the embodiment. Fig. 3 is a plan view showing the basic structure of the sheet-shaped adhesive material attaching device of the embodiment. Fig. 4 is a diagram illustrating the sticking device of the sheet-like adhesive material of the embodiment; (a) is a flow chart showing the action of the sheet-like adhesive material sticking device of the embodiment, and (b) is a diagram illustrating the application used in the embodiment A longitudinal section view of the composition of the sheet-like adhesive material. Figure 5 is a diagram showing the structure of the adhesive material cutting mechanism of the embodiment; (a) is a perspective view of the adhesive material cutting mechanism, (b) is a longitudinal sectional view of the adhesive material cutting mechanism, and (c) is showing the adhesive material The bottom perspective view of the main part of the cutting mechanism. Fig. 6 is a diagram showing the structure of the workpiece holding table of the embodiment. FIG. 7 is a diagram illustrating step S1 of the embodiment; (a) is a diagram showing a state in which the suction pad receives a workpiece, and (b) is a diagram showing a state in which the workpiece is placed on the placement surface of the workpiece placement portion. Figure 8 is a diagram illustrating step S2 of the embodiment; (a) is a diagram showing the state before the adhesive material cutting mechanism adjusts the tension of the sheet-shaped adhesive material, (b) is a diagram showing the adhesive material cutting mechanism is adjusting the sheet-shaped adhesive The diagram of the state of the tension of the material, (c) is a diagram showing the state where the cutting unit descends and the cutting of the sheet-shaped adhesive material is started. Figure 9 is a diagram illustrating step S3 of the embodiment; (a) is a plan view (top) and a front view (bottom) showing the state before the adhesive material sheet is separated, (b) is a sheet showing parts other than the adhesive material sheet The top view (top) and the front view (bottom) of the state where the adhesive material and the adhesive sheet are being separated, (c) shows the state where the sheet-shaped adhesive material and the adhesive sheet are separated from the part other than the adhesive material sheet The top view (top) and the front view (bottom), (d) is the top view (top) and the front view (bottom) showing the state where the adhesive sheet is newly formed upstream of the adhesive sheet. Fig. 10 is a diagram illustrating step S4 of the embodiment; (a) is a front view showing the action of the cutting inspection mechanism to photograph the adhesive sheet, (b) is a functional block diagram showing the composition of step S4, (c) is an explanation borrowed The schematic diagram of the information obtained by the cutting inspection mechanism, (d) is a diagram illustrating the structure of the overall image of the adhesive sheet calculated by the cutting determination unit. Fig. 11 is a front view illustrating step S5 of the embodiment; (a) is a diagram showing the state before the attachment of the holding tape starts, (b) is a diagram showing the state of the holding tape attached to one end of the adhesive sheet, ( c) A diagram showing the state where the holding tape is attached from one end to the other end of the adhesive sheet. Fig. 12 is a front view of step S7 illustrating the embodiment; (a) is a diagram showing the action of photographing the adhesive sheet and the workpiece, (b) is a functional block diagram showing the composition of step S7, and (c) is a workpiece holding table A diagram showing the state of moving toward the attachment area. Fig. 13 is a front view illustrating step S7 of the embodiment; (a) is a diagram showing the state of adjusting the positional relationship between the workpiece and the adhesive sheet in the attachment area, and (b) is an example of the workpiece just after moving to the attachment area The top view of the positional relationship with the adhesive sheet, (c) is a plan view illustrating the positional relationship between the workpiece and the adhesive sheet after adjusting the positional relationship between the workpiece and the adhesive sheet. Fig. 14 is a front view illustrating the operation of step S8 in the embodiment. Figure 15 is a front view illustrating step S9 of the embodiment; (a) is a diagram showing the state of the adhesive sheet attached to one end of the workpiece, (b) is showing the adhesive sheet is attached from one end to the other end of the workpiece State diagram. 16 is a front view illustrating step S10 of the embodiment; (a) is a diagram showing the state before the holding tape is separated from the adhesive sheet, (b) is a diagram showing the state after the holding tape is separated from the adhesive sheet. Fig. 17 is a front view illustrating step S11 of the embodiment; (a) is a diagram showing the action of photographing the adhesive material and the workpiece, (b) is a functional block diagram showing the composition of step S7, and (c) is a diagram showing how to paste Attached is a map of the information obtained by the inspection agency. Fig. 18 is a perspective view showing the basic structure of a sheet-shaped adhesive material sticking device according to a modification. Fig. 19 is a front view showing the basic configuration of a sheet-shaped adhesive material attaching device according to a modification. FIG. 20 is a diagram illustrating the operation of step S5 of the modified example; (a) is a diagram showing a state where the holding plate is conveyed above the adhesive sheet, (b) is a diagram showing the state where the holding plate holds the adhesive sheet, (c) is a diagram showing a state where the holding plate is conveying while holding the adhesive sheet. FIG. 21 is a diagram illustrating the operation of step S7 in the modification example. FIG. 22 is a diagram illustrating the operation of step S8 in the modification example. FIG. 23 is a diagram illustrating the operation of step S9 in the modification example. FIG. 24 is a diagram illustrating the operation of step S10 in the modification example. Figure 25 is a diagram illustrating a modified example of the configuration of adjusting the tension of the sheet-shaped adhesive; (a) is a diagram showing the configuration of adjusting the tension of the sheet-shaped adhesive in the width direction by a holding member, and (b) is a diagram showing A diagram of the composition of the roll rotation to adjust the tension of the sheet-shaped adhesive material. Fig. 26 is a diagram illustrating the structure of the adhesive material cutting mechanism of a modification; (a) is a bottom perspective view showing the main parts of the adhesive material cutting mechanism, (b) is a longitudinal sectional view of the adhesive material cutting mechanism, (c ) Is a top view showing the cutting trajectory produced by the cutting blade. Fig. 27 is a diagram illustrating the structure of the adhesive material cutting mechanism of the modification; (a) is a longitudinal sectional view showing the effect of the cutting blade of the modification, (b) is the bottom surface of the main part of the adhesive material cutting mechanism The perspective view, (c) is a plan view showing the cutting trajectory generated by the cutting blade and the position where the peeling starts when the remaining adhesive material is peeled in a direction parallel to the release direction, and (d) is a plan view showing the remaining adhesive material facing and A plan view of the cutting trajectory generated by the cutting blade and the position where the peeling starts when peeling off in an inclined direction of the release direction. Fig. 28 is a diagram illustrating the configuration of the adhesive material cutting mechanism of the modification; (a) is a bottom perspective view showing the main part of the adhesive material cutting mechanism, (b) is a plan view showing the state where the adhesive material sheet is formed, ( c) A top view (top) and a front view (bottom) showing the state where the selected one of the adhesive material sheets and the sheet-like adhesive material of the part other than the selected adhesive material sheet have been separated. Figure 29 is a diagram illustrating the composition of the workpiece position recognition mechanism and the adhesive material position recognition mechanism of the modified example; (a) is a side view showing a modified example of the position for the adhesive material position recognition mechanism, and (b) shows the A side view of a modification of a workpiece and an adhesive sheet detected by a common position recognition mechanism, (c) is a plan view showing a modification of the object of detecting the workpiece or an adhesive sheet. Figure 30 is a diagram illustrating a modified example with an adhesive peeling mechanism; (a) is a side view illustrating the structure of the adhesive peeling mechanism, and (b) is a diagram illustrating the peeling of an improperly attached adhesive sheet from the workpiece Three-dimensional view of the state.

8:工件保持台 8: Workpiece holding table

10:黏著材貼附機構 10: Adhesive material attaching mechanism

36:升降台 36: Lifting table

37:工件載置部 37: Workpiece placement section

41:貼附輥 41: attaching roller

43:驅動缸 43: drive cylinder

Tp:黏著材片 Tp: Adhesive sheet

W:工件 W: Workpiece

F:保持帶 F: Holding belt

Da:距離 Da: distance

Claims (14)

一種片狀黏著材的貼附方法，係對工件貼附既定形狀的片狀黏著材，其特徵為具備： 貼附過程，在藉由黏著材保持構件保持有前述片狀黏著材的狀態下將前述片狀黏著材貼附於前述工件；及 分離過程，使前述黏著材保持構件從被貼附於前述工件的前述片狀黏著材分離。A method for attaching a sheet-shaped adhesive material is to attach a sheet-shaped adhesive material of a predetermined shape to a workpiece, which is characterized by: In the attaching process, attach the sheet-shaped adhesive material to the workpiece in a state where the sheet-shaped adhesive material is held by the adhesive material holding member; and The separation process separates the adhesive holding member from the sheet-shaped adhesive attached to the workpiece. 如請求項1之片狀黏著材的貼附方法，其中 前述黏著材保持構件係長形的黏著帶，藉由將前述黏著帶貼附於前述既定形狀的片狀黏著材而保持前述既定形狀的片狀黏著材。Such as the attachment method of the sheet adhesive material of claim 1, where The adhesive material holding member is an elongated adhesive tape, and the sheet-shaped adhesive material of the predetermined shape is held by attaching the adhesive tape to the sheet-shaped adhesive material of the predetermined shape. 如請求項2之片狀黏著材的貼附方法，其中 前述黏著帶的至少與前述既定形狀的片狀黏著材的端部相接的部分是由具透光性的材料所構成。Such as the attachment method of the sheet adhesive material of claim 2, where At least the portion of the adhesive tape that is in contact with the end of the sheet-shaped adhesive material of the predetermined shape is made of a light-transmitting material. 如請求項1之片狀黏著材的貼附方法，其中 前述黏著材保持構件係具有吸附孔之板狀構件，藉由前述板狀構件吸附前述既定形狀的片狀黏著材而保持前述既定形狀的片狀黏著材。Such as the attachment method of the sheet adhesive material of claim 1, where The adhesive material holding member is a plate-shaped member having suction holes, and the sheet-shaped adhesive material of the predetermined shape is held by the plate-shaped member to adsorb the sheet-shaped adhesive material of the predetermined shape. 如請求項4之片狀黏著材的貼附方法，其中 前述板狀構件的至少與前述既定形狀的片狀黏著材的端部相接的部分是由具透光性的材料所構成。Such as the attachment method of the sheet adhesive material in claim 4, where At least the portion of the plate-shaped member that is in contact with the end of the sheet-shaped adhesive material of the predetermined shape is made of a light-transmitting material. 如請求項1至5中任一項之片狀黏著材的貼附方法，其中 具備接近過程，該接近過程係使藉由前述黏著材保持構件所保持著的前述片狀黏著材的黏著面與前述工件的貼附面之距離接近成為既定的距離， 前述貼附過程，係於藉由前述接近過程使前述片狀黏著材的黏著面與前述工件的貼附面接近到前述既定的距離後再進行。Such as the attachment method of the sheet-shaped adhesive material of any one of claims 1 to 5, wherein Equipped with an approaching process that makes the distance between the adhesive surface of the sheet-shaped adhesive material held by the adhesive material holding member and the attachment surface of the workpiece close to a predetermined distance, The attaching process is performed after the adhesive surface of the sheet-shaped adhesive material and the attaching surface of the workpiece are approached to the predetermined distance through the approaching process. 如請求項6之片狀黏著材的貼附方法，其中 於前述接近過程，氣體供給機構對前述工件與前述片狀黏著材之間供給氣體，防止前述工件與前述片狀黏著材接觸。Such as the attachment method of the sheet adhesive material of claim 6, where During the aforementioned approaching process, the gas supply mechanism supplies gas between the workpiece and the sheet-shaped adhesive material to prevent the workpiece from contacting the sheet-shaped adhesive material. 一種片狀黏著材的貼附裝置，係對工件貼附既定形狀的片狀黏著材，其特徵為具備︰ 黏著材保持機構，藉由黏著材保持構件保持前述片狀黏著材； 貼附機構，在藉由黏著材保持構件保持有前述片狀黏著材的狀態下將前述片狀黏著材貼附於前述工件；及 分離機構，使前述黏著材保持構件從被貼附於前述工件的前述片狀黏著材分離。A sheet-shaped adhesive material attaching device is used to attach a sheet-shaped adhesive material of a predetermined shape to a workpiece, and is characterized by: Adhesive material holding mechanism, which holds the aforementioned sheet-shaped adhesive material through the adhesive material holding member; An attaching mechanism for attaching the sheet-shaped adhesive material to the workpiece in a state where the sheet-shaped adhesive material is held by the adhesive material holding member; and The separating mechanism separates the adhesive holding member from the sheet-like adhesive attached to the workpiece. 如請求項8之片狀黏著材的貼附裝置，其中 前述黏著材保持構件係長形的黏著帶，藉由將前述黏著帶貼附於前述既定形狀的片狀黏著材而保持前述既定形狀的片狀黏著材。Such as the attaching device of the sheet-shaped adhesive material of claim 8, wherein The adhesive material holding member is an elongated adhesive tape, and the sheet-shaped adhesive material of the predetermined shape is held by attaching the adhesive tape to the sheet-shaped adhesive material of the predetermined shape. 如請求項9之片狀黏著材的貼附裝置，其中 前述黏著帶的至少與前述既定形狀的片狀黏著材的端部相接的部分是由具透光性的材料所構成。Such as the attaching device of the sheet-shaped adhesive material of claim 9, wherein At least the portion of the adhesive tape that is in contact with the end of the sheet-shaped adhesive material of the predetermined shape is made of a light-transmitting material. 如請求項8之片狀黏著材的貼附裝置，其中 前述黏著材保持構件係具有吸附孔的板狀構件，藉由前述板狀構件吸附前述既定形狀的片狀黏著材而保持前述既定形狀的片狀黏著材。Such as the attaching device of the sheet-shaped adhesive material of claim 8, wherein The adhesive material holding member is a plate-shaped member having suction holes, and the sheet-shaped adhesive material of the predetermined shape is held by the plate-shaped member sucking the sheet-shaped adhesive material of the predetermined shape. 如請求項11之片狀黏著材的貼附裝置，其中 前述板狀構件的至少與前述既定形狀的片狀黏著材的端部相接的部分是由具透光性的材料所構成。Such as the attachment device of the sheet-shaped adhesive material of claim 11, wherein At least the portion of the plate-shaped member that is in contact with the end of the sheet-shaped adhesive material of the predetermined shape is made of a light-transmitting material. 如請求項8至12中任一項之片狀黏著材的貼附裝置，其中具備接近機構，該接近機構使被前述黏著材保持構件所保持的前述片狀黏著材的黏著面與前述工件的貼附面之距離接近到既定的距離， 前述貼附機構係在藉由前述接近機構使前述片狀黏著材的黏著面與前述工件的貼附面接近到前述既定的距離後，將前述片狀黏著材貼附於前述工件。The device for attaching a sheet-shaped adhesive material according to any one of claims 8 to 12, which is provided with an approach mechanism that causes the adhesive surface of the sheet-shaped adhesive material held by the adhesive material holding member to contact the workpiece The distance of the sticking surface is close to the established distance, The attaching mechanism attaches the sheet-shaped adhesive material to the workpiece after the adhesive surface of the sheet-shaped adhesive material and the attaching surface of the workpiece are brought close to the predetermined distance by the approach mechanism. 如請求項13之片狀黏著材的貼附裝置，其中 具備氣體供給機構，該氣體供給機構係於前述接近機構使前述片狀黏著材與前述工件接近之際，對前述工件與前述片狀黏著材之間供給氣體，以防止前述工件與前述片狀黏著材接觸。Such as the attaching device of the sheet-shaped adhesive material of claim 13, wherein Equipped with a gas supply mechanism that supplies gas between the workpiece and the sheet adhesive when the approach mechanism brings the sheet-shaped adhesive material close to the workpiece to prevent the workpiece from adhering to the sheet-shaped adhesive material材contact.
TW108133184A 2018-12-27 2019-09-16 Method and apparatus for joining sheet-shape adhesive material TW202025343A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018245304A JP2020107739A (en) 2018-12-27 2018-12-27 Sheet-like adhesive material attaching method and sheet-like adhesive material attaching device
JP2018-245304 2018-12-27

Publications (1)

Publication Number Publication Date
TW202025343A true TW202025343A (en) 2020-07-01

Family

ID=71221329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108133184A TW202025343A (en) 2018-12-27 2019-09-16 Method and apparatus for joining sheet-shape adhesive material

Country Status (4)

Country Link
JP (1) JP2020107739A (en)
KR (1) KR20200081219A (en)
CN (1) CN111383983A (en)
TW (1) TW202025343A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112061829B (en) * 2020-08-31 2022-04-01 苏州天立达精密科技股份有限公司 Full-automatic AOI circular knife sheet material detection machine

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014017357A (en) 2012-07-09 2014-01-30 Nitto Denko Corp Adhesive tape, pasting method of adhesive tape and pasting device of adhesive tape

Also Published As

Publication number Publication date
JP2020107739A (en) 2020-07-09
CN111383983A (en) 2020-07-07
KR20200081219A (en) 2020-07-07

Similar Documents

Publication Publication Date Title
TWI408740B (en) Method for separating protective tape, and apparatus using the same
KR101458216B1 (en) Method for separating protective tape and apparatus using the same
JP2012084688A (en) Method of pasting double-sided adhesive tape, and device of pasting double-sided adhesive tape
TW200527526A (en) Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same
TW200919573A (en) Protective tape separation method and protective tape separation apparatus
TWI649820B (en) Semiconductor manufacturing device and method for manufacturing semiconductor device
TWI464793B (en) Method and apparatus for joining adhesive tape
TWI661943B (en) Adhering device,adhering method, production device of optical display device, and production method of thereof
JP4407933B2 (en) Adhesive tape attaching method and apparatus using the same
KR20170028321A (en) Bonding apparatus, bonding method, system for manufacturing optical display devices, and method for manufacturing optical display device
KR20170029492A (en) Bonding apparatus, bonding method, optical-display-device production system, and optical-display-device production method
TWI818979B (en) Application apparatus and application method for applying protective tape to a semiconductor wafer
JP6694778B2 (en) Screen printer
TW202025343A (en) Method and apparatus for joining sheet-shape adhesive material
JP5702983B2 (en) Double-sided adhesive tape application method and double-sided adhesive tape application device
TW201448007A (en) Method and apparatus for cutting sealing sheet
TW202025266A (en) Method and apparatus for joining sheet-shape adhesive material
TW202029308A (en) Method and apparatus for cutting sheet-shape adhesive material
TW202112993A (en) Method and apparatus for joining sheet-shape adhesive material
TW202318546A (en) Processing apparatus
KR20170026455A (en) Bonding device, bonding method, production system for optical display device, and production method for optical display device
KR101318179B1 (en) Apparatus and method for attaching polarizing film
CN220509974U (en) Wafer film removing device
TWM647866U (en) Wafer tape film removing device
JP2010076864A (en) Film peeling device and film peeling method