TWM647866U - Wafer tape film removing device - Google Patents

Abstract

A wafer adhesive film removal device includes a loading module for carrying a wafer and a tear-off film group that can change the distance from the loading module along a working direction. A tear-off tape passes through the tear-off film group. The displacement of the film set is used to attach or detach the wafer surface, and the peel-off tape also removes a thin film disposed on the wafer surface when the wafer surface is detached.

Description

Wafer film removal device

A device for processing wafers, particularly a wafer adhesive film removal device.

Since the contamination of the wafer surface is an important factor in determining the smoothness of the semiconductor manufacturing process and product yield, the current industry has extremely high requirements for the cleanliness of the wafer surface. Whether it is chemicals used for cleaning, ablation, lithography, deposition, etc. on the wafer surface, or human contact during the manufacturing process, it may be the cause of wafer surface contamination. Therefore, if the contact with reagents or humans during wafer manufacturing can be reduced, the overall process and product yield can be greatly improved.

The main function of wafer polishing tape is to be attached to the front side of the wafer so that the back side of the wafer can protect the front side of the wafer during grinding and prevent the grinding fluid from penetrating into the front side of the wafer and causing contamination. After the wafer grinding is completed, remove the wafer grinding tape to proceed to the next process. However, in the existing technology, most of the wafer grinding tapes are removed manually, which is not only time-consuming and labor-intensive, but also difficult to meet the needs of automated production, and is more likely to cause artificial contamination.

In order to overcome the above-mentioned problems of still manually removing wafer polishing tape, which causes time and labor cost burdens, is difficult to meet the needs of automated production, and is prone to human contamination, the present invention provides a wafer adhesive film removal device. It includes a loading module for carrying a wafer with a film attached to its surface at a glue application position, and an edge-finding device for positioning the wafer so that at least a part of the film corresponds to a working direction; and a sizing module including A gluing device and a gluing device are arranged adjacently. A tear-off tape can be guided between the gluing device and the gluing device. The gluing device can optionally provide the tear-off tape from top to bottom at the gluing position. There is a pressure on the tape, and the clamping device can selectively move toward the gluing device and clamp the adhesive tape, wherein the loading module and/or the gluing module can change the displacement along the working direction. distance so that the gluing device corresponds to above the gluing position.

Wherein, the material placement module includes a receiving platform and a material placing platform disposed on the receiving platform. The material placing platform is circular columnar and can optionally move up and down and rotate relative to the receiving platform. The upper end surface of the loading platform is used to receive the lower surface of the wafer. The loading platform moves up and down relative to the receiving platform to the gluing position before or after the edge finding device positions the wafer.

Among them, a base plate includes a glue rod protruding from one side of the base plate, and a tape reel is set around the outer periphery, and the tape reel is used for the adhesive tape to be surrounded and stacked into a roll; at least one glue guide rod protrudes from the On one side of the substrate, at least a portion of the tear-off tape is guided by a strip to move on the tape reel to the sizing module; and the sizing module is disposed on one side of the substrate, and the sizing device At least a portion protrudes downward from the base plate.

Wherein, a track is used for the displacement of the loading table or the substrate along the working direction.

Wherein, the material table includes an internal material table and an external material table arranged in concentric circles. The end surface of the built-in material table is the upper end surface, and a horizontal position of the end surface of the external material table is the gluing position. , the built-in material table can selectively move upward to protrude the external material table, and the built-in material table can optionally rotate relative to the external material table, and the diameter of the built-in material table is smaller than the diameter of the wafer, and the The diameter of the external material table is larger than the diameter of the wafer

Wherein, when the upper end surface of the built-in material table receives the wafer, the edge-finding device is activated and the built-in material table rotates relative to the external material table, and the edge-finding device detects a cutting position of the wafer, and the edge-finding device detects a cutting position of the wafer. When the cutting position corresponds to a detection area of the edge finding device, the built-in material table stops rotating.

Further, the loading platform includes a vacuum structure to fix the wafer.

Further, the vacuum structure type is a plurality of perforations that are penetrated on the upper end surface.

Further, the vacuum structure is a gap formed between the built-in material table and the external material table.

Further, the gluing device is disposed on the non-adhesive side of the adhesive tape and includes: a gluing roller, a roller end of the gluing roller protrudes from the base plate, and the horizontal height of the lower edge of the roller end corresponds to The gluing position and a gluing cylinder at the other end opposite to the roller end provide the pressure from top to bottom of the gluing roller; the gluing device is disposed on the other side of the adhesive tape application and tear-off tool, and includes a clamping device. The piece provides a pressing force for the displacement of the gluing device through a clamping cylinder, so that the clamping piece and the gluing device jointly clamp the tear-off tape passing through it.

Wherein, the clamping member is formed corresponding to the contour of the gluing device facing the adhesive tape.

Wherein, the lower edge of the clamping member is in a smooth arc shape.

Wherein, the glue setting rod and the glue guiding rod can rotate or displace relative to the substrate as required.

Further, one of the glue guide rods corresponds to the glue application module, so that the tear-off tape is guided from top to bottom and downward to the glue application module.

Further, a cutting device is disposed at the level lower than the gluing position and away from the receiving platform.

Further, the cutting position is a flat angle. When the wafer is positioned, a flat edge formed by the cutting position is perpendicular to the working direction, or the intersection of the flat edge and an arc edge of the wafer is aligned with the working direction. direction.

The wafer film removal device provided by this new model has the following advantages:

1. Through the relative displacement of the loading module and the peel-off film group, ensure that the peel-off tape adheres to the surface of the wafer and the film and effectively removes the film during reset.

2. Through the setting of the edge-finding device, the wafer film removal device can determine the relative position of the cutting position 31 and the working direction according to the shape of the film and the position on the wafer surface.

3. Through the displacement of the gluing module or the clamping device relative to the substrate, the angle of the peel-off tape relative to the wafer surface is changed to facilitate the removal of the peel-off tape and the film.

10: Material placement module

11: base

111:Orbit

12:Taking platform

13: Material table

131: Built-in material table

132: External material table

133:Upper end surface

14: Edge finding device

20:Tear off adhesive film set

21:Substrate

211: Place the glue rod

212:Glue guide rod

213: Glue module

2131: Gluing device

2132: Glue clamping device

2133: Gluing roller

2134: Glue cylinder

2135: Clamping piece

2136: Clamping cylinder

22:Substrate track

23: Cutting device

30:wafer

31: Cutting position

32:Film

A: Robotic arm

B:Tape reel

B1: Apply and tear off tape

Figure 1 is a schematic three-dimensional view of the preferred embodiment of the present invention.

Figure 2A is a schematic diagram of the first action of part of the structure of the preferred embodiment of the present invention.

Figure 2B is a schematic diagram of the second action of part of the structure of the preferred embodiment of the present invention.

Figure 2C is a schematic diagram of the third action of part of the structure of the preferred embodiment of the present invention.

Figure 2D is a schematic diagram of the fourth action of part of the structure of the preferred embodiment of the present invention.

Figure 3A is a schematic diagram of the first action of peeling glue according to the preferred embodiment of the present invention.

Figure 3B is a schematic diagram of the second action of peeling glue according to the preferred embodiment of the present invention.

Figure 3C is a schematic diagram of the third action of peeling glue according to the preferred embodiment of the present invention.

Figure 3D is a schematic diagram of the fourth action of peeling glue according to the preferred embodiment of the present invention.

Please refer to Figure 1, which is a preferred embodiment of a wafer adhesive film removal device provided by the present invention, including a loading module 10 and a peeling adhesive film set 20. The loading module 10 and the peeling adhesive film The groups 20 are arranged adjacently and can be displaced along a working direction to change the distance between them.

The loading module 10 is used to carry a wafer 30 (Wafer). The wafer 30 is a common material in the current semiconductor industry. It is mostly presented in a circular sheet shape. The wafer 30 is also designed in a square sheet shape according to the demand. The size of the wafer is not limited. The wafers of 3 inches, 4 inches, 6 inches, 12 inches or even larger sizes can be suitable for the wafer film removal device provided in this case.

The wafer 30 includes a cutting position 31 and a film 32 attached to the surface. The cutting position 31 can be a flat angle (Flat) or a U-shaped notch (about 10 mm) in size formed after cutting. Notch), so that the directionality of the wafer 30 can be positioned during fabrication through the cutting position 31 . The film 32 is attached to the surface of the wafer. It can cover the wafer surface in a layer to protect it from contamination, or it can be attached to the wafer in a strip shape for positioning purposes. The peeling film set 20 is used to remove the film 32 .

The material placement module 10 includes a base 11 , a receiving platform 12 , a material placement platform 13 and an edge finding device 14 . A track 111 is provided on the surface of the base 11 along the working direction, so that the receiving platform 12 can be displaced along the working direction above the base 11 to approach or move away from the adhesive film set 20 . The material placing platform 13 is arranged in a circular columnar shape on the receiving platform 12, and the material placing platform 13 can move up and down relative to the receiving platform 12 and/or rotate relative to the receiving platform 12 as required. The upper end surface 133 of 13 is used to receive the lower surface of the wafer 30 . At this time, the film 32 is disposed on the upper surface of the wafer 30 .

The edge-finding device 14 is disposed adjacent to the loading table 13 and forms a detection area when activated. The edge-finding device 14 is used to detect the cutting position 31 of the wafer 30 to determine the pair of cutting positions 31 The area should be detected so that the wafer 30 can be correctly positioned and at least a portion of a film 32 corresponds to the working direction or the peel film set 20 . Furthermore, the loading platform 13 can be moved up and down relative to the receiving platform 12 to a gluing position before or after the edge finding device 14 is positioned, so as to facilitate the subsequent positioning of the peeling film set 20 to the wafer 30 Execute the job.

When the cutting position 31 of the wafer 30 is a U-shaped notch, the edge finding device 14 can be an image vision lens (CCD lens) or an infrared detection device to accurately confirm the wafer. This cutting position 31 of the circle 30.

Please refer to FIGS. 2A and 2B to illustrate a preferred embodiment of the loading module 10 carrying the wafer 30 . In this embodiment, the material setting platform 13 includes a built-in material platform 131 arranged in concentric circles and a External material table 132, wherein the end surface of the built-in material table 131 is the upper end surface 133, and a horizontal position of the end surface of the external material table 132 is the gluing position. The built-in material table 131 can protrude from the external material table 132 according to the required upward displacement, and the upper end surface 133 of the built-in material table 131 can receive the wafer 30 . The diameter of the built-in material table 131 is smaller than the diameter of the wafer 30 , and the diameter of the external material table 132 is larger than the diameter of the wafer 30 .

A robot arm A moves the wafer 30 to a position corresponding to the upper end surface 133 of the built-in material table 131, and any part of the robot arm A is in contact with the upper end surface 133 and/or the built-in material table 131. The staggering in the lower direction does not overlap. Preferably, the wafer 30 and the built-in material table 131 are coaxially corresponding.

When the robot arm A moves downward to a horizontal position lower than the upper end surface 133 , at least a part of the lower surface of the wafer 30 contacts the upper end surface 133 , that is, the wafer 30 is placed on the built-in material. On stage 131. Alternatively, when the built-in material table 131 is displaced upward until the horizontal position of the upper end surface 133 is higher than the robot arm A, the effect of receiving the wafer 30 can also be achieved.

Next, please refer to FIGS. 2C to 2D to describe a preferred embodiment of the loading module 10 for positioning the wafer 30 . When the wafer 30 is placed on the upper end surface 133 , the built-in material table 131 rotates relative to the external material table 132 , and the rotation can be clockwise or counterclockwise and is not limited here. At this time, the edge-finding device 14 starts detection. When the cutting position 31 corresponds to the detection area of the edge-finding device 14 , the built-in material table 131 stops rotating to position the wafer 30 .

Then, the built-in material table 131 is moved downward until the wafer 30 contacts the end surface of the external material table 132 , so that the wafer 30 is placed in the gluing position. In this embodiment, the built-in material table 131 is displaced downward until the upper end surface 133 is aligned with the end surface of the external material table 132. At this time, the wafer 30 is completely in contact with the external material table 132 and the built-in material table 131. plane together. Through the concentric relationship between the external material table 132 and the internal material table 131 and the definition of the glue position, there is no need to repeatedly correct the horizontal position of the wafer 30 in the material loading module 10 and the wafer When position 30 is at the gluing position, is it Maintain the level, or correspond to the accuracy of the peel-off film set 20, effectively eliminating the labor and time costs incurred during correction.

Preferably, the loading table 13 includes a vacuum structure for connecting a vacuum device to fix the wafer 30 to prevent the wafer 30 from being displaced relative to the upper end surface 133 . The type of the vacuum structure is not limited, and can be a plurality of perforations passing through the upper end surface 133. When the upper end surface 133 receives the wafer 30, the vacuum structure can exhibit a force that attracts the lower surface of the wafer 30. effect. The vacuum structure can also be a gap formed between the built-in material table 131 and the external material table 132 , so that the lower surface of the wafer 30 can receive the material table 13 and provide uniform adsorption force to prevent the wafer 30 from The uneven force on the circle 30 may lead to problems such as poor fixing effect or even damage.

Preferably, the vacuum force provided by the vacuum structure to attract the wafer 30 can be adjusted according to the thickness of the wafer 30, so as to avoid that if the vacuum force is too low, it will easily cause problems when the film 32 is subsequently removed. The wafer 30 may be displaced or even damaged, and the excessive vacuum force may directly cause the wafer 30 to break.

Furthermore, in addition to positioning the wafer 30 with the edge-finding device 14 before moving to the gluing position, the edge-finding device 14 can also be executed again after the wafer 30 moves to the gluing position, showing that The effect of secondary positioning ensures that the wafer 30 is in the correct position.

Referring to FIG. 1 and FIGS. 3A to 2D , the peel-off film set 20 includes a substrate 21 , a substrate track 22 disposed along the working direction, and a cutting device 23 . One side of a substrate 21 is disposed on the substrate track 22 , and the substrate 21 can be displaced along the working direction according to the substrate track 22 to approach or move away from the adhesive film set 20 .

The other side of the substrate 21 relative to the substrate track 22 includes a glue rod 211 , at least one glue guide rod 212 and a glue application module 213 . A tape reel is installed around the outer periphery of the glue rod 211. The surface of the tape reel B is surrounded by a tear-off tape B1 and laminated into a roll. At least one of the glue guide rods 212 is used to guide at least a part of the tear-off tape B1 from the tape reel B to the glue application module 213 in a strip shape.

The glue setting rod 211 and the glue guide rod 212 can rotate relative to the substrate as required to help guide the displacement of the adhesive tape B1.

Among them, the glue rod 211 and the glue guide rod 212 can determine the tension of the adhesive tape B1 according to the required displacement relative to the substrate, thereby affecting the subsequent removal of the film 32 . In this embodiment, two glue guide rods 212 are included. The two glue guide rods 212 can be displaced relative to the substrate to determine the guiding direction of the adhesive tape B1 and the direction of the adhesive tape B1 along the glue guide rod 212. Then the tension showed.

Further, one of the glue guide rods 212 corresponds to the glue application module 213, and allows the tear-off tape B1 to be guided from top to bottom to the glue application module 213. The horizontal position of the gluing module 213 corresponds to the gluing position and includes a gluing device 2131 and a gluing device 2132. The gluing device 2131 and the gluing device 2132 are arranged adjacent to each other along the working direction and the tear tape is attached. B1 can be guided between the two.

The gluing device 2131 is disposed on the non-adhesive side of the adhesive tape B1 and includes a gluing roller 2133 and a gluing cylinder 2134. A roller end of the gluing roller 2133 protrudes from the base plate 21 and the horizontal height of the lower edge of the roller end corresponds to the gluing position. The gluing cylinder 2134 provides a pressure from top to bottom to the gluing roller 2133 at the other end relative to the roller end, so that the gluing roller 2133 can reach the adhesive-free side of the adhesive tape B1 and use the roller end to tear off the adhesive tape B1. The adhesive tape B1 is adhered to the film 32, and at the same time, the sizing roller 2133 can also press the adhesive tape B1 with the pressure to guide the belt-shaped displacement of the adhesive tape B1.

The pressure provided by the sizing roller 2133 from top to bottom can be adjusted by the thickness of the wafer to avoid damage to the wafer 30 when the pressure is too high, or when the pressure is too low, the peeling tape B1 is not easy to attach to the wafer. The film 32 is completely attached to the surface of the film 30 .

The clamping device 2132 is disposed on the other side of the adhesive tape B1 and includes a clamping member 2135 and a clamping cylinder 2136. The clamping cylinder 2136 provides the clamping member 2135 to face the glue application device. A pressing force is applied to the displacement of 2131, so that the clamping member 2135 and the gluing device 2131 jointly clamp the tear-off tape B1 passing through it.

The clamping member 2135 is formed corresponding to the contour of the gluing device 2131 facing the tear-off tape B1 to enhance the stability of the clamping member 2135 and the gluing device 2131 in clamping the tear-off tape B1.

The lower edge of the clamping member 2135 is in a smooth arc shape to prevent the tear-off tape B1 from breaking when the film 32 is subsequently removed.

Please refer to FIGS. 3A and 3B to illustrate a preferred embodiment in which the gluing module 213 adheres the tear-off tape B1 to the film 32 . Before this step is performed, at least part of the end of the peel-off tape B1 protrudes downward from the peel-off film set 20 . When the loading platform 13 is displaced to the gluing position and/or secondary positioning, the receiving platform 12 and/or the substrate 21 can optionally be displaced along the working direction according to the track 111 and/or the substrate track 22, so that the receiving platform 12 and the substrate 21 are close to each other.

Since the roller end of the sizing roller 2133 is at the same level as the sizing position, when the substrate 21 and the sizing roller 2133 move above the material placement table 13 , that is, the sizing roller 2133 corresponds to the sizing position. When it is upward, the end of the peel-off tape B1 protrudes from the peel-off film set 20 and will be attached to the loading table 13 and/or the wafer 30, as shown in FIG. 3A. As the receiving platform 12 and/or the substrate 21 continues to move, the gluing roller 2133 presses the side without adhesive to guide the adhesive tape B1 on the adhesive rod 211 and on the tape reel B. While moving the output, pressure can also be applied to the adhesive tape B1 to adhere to the surface of the wafer 30 . When the sizing roller 2133 is displaced along the working direction and completely passes over the loading table 13 , the adhesive tape B1 is also attached to the wafer 30 along the working direction and is attached to at least part of the wafer 30 . Above the film 32, as shown in Figure 3B. In this embodiment, the thin film 32 completely covers the surface of the wafer in a layered manner.

Please refer to FIGS. 3C to 3D to illustrate a preferred embodiment in which the sizing module 213 uses the tear-off tape B1 to remove the film 32 . After the sizing roller 2133 is displaced along the working direction and completely passes over the material placement table 13 , the clamping member 2135 is displaced toward the sizing device 2131 to clamp and pass through it. At this time, the receiving platform 12 and/or the substrate 21 are displaced and reset according to the reverse displacement of the track 111 and/or the substrate track 22 along the working direction, so that the receiving platform 12 and the substrate 21 move away from each other. direction movement.

Since the clamping member 2135 and the gluing device 2131 jointly clamp at least a part of the adhesive tape B1, the output of the adhesive tape B1 stops. At the same time, the peel-off tape B1 adhered to the surface of the wafer is pulled through the reverse displacement of the receiving platform 12 and/or the substrate 21 , so that the adhesive tape B1 adhered to the surface of the wafer 30 is pulled from the clamping point to the surface of the wafer 30 . Applying the tear-off tape B1 generates a force, wherein the tension is greater than the adhesive force of the tear-off tape B1 and/or the film 32 sticking to the surface of the wafer, and the tension is smaller than the adhesive force of the tear-off tape B1 sticking on the surface of the film 32 of adhesion. In this way, the peeling tape B1 can be separated from the surface of the wafer 30 by the reverse displacement of the receiving platform 12 and/or the substrate 21 , and at the same time, the film 32 can be removed from the surface of the wafer 30 .

Furthermore, the gluing module 213 or the gluing device 2132 can be moved up and down relative to the substrate 21 before removing the film 32 or during the removal of the film 32 to change the clamping position to adhere to the wafer 30 The peel-off tape B1 on the surface has a removal angle relative to the wafer surface to facilitate the removal of the peel-off tape B1 and the film 32 . Wherein, the initial removal angle is preferably 15 degrees, and the removal angle will change the film tearing angle according to the proportion of the film 32 relative to the surface of the wafer 30 .

When the gluing module 213 completes removing the film 32, the cutting device 23 can be used to cut off the peel-off tape B1 and the film 32 that protrude from the peel-off film set 20 and have been used. The cutting device 23 is disposed at a level lower than the gluing position and away from the receiving platform 12 , so that after the tear-off tape B1 is cut off by the cutting device 23 , at least a portion of the tear-off tape B1 can be retained. The end protrudes from the peel-off film set 20 for use when removing the film 32 next time.

Furthermore, the cutting device 23 can also be disposed higher than the cutting device 23. When the gluing module 213 completes removing the film 32, the tear-off tape B1 and the film 32 can be moved upward together. to the cutting device 23 for removal.

Further, the edge-finding device 14 or an additional image vision lens (CCD lens) is used to detect whether there are scratches, cracks, or residual glue on the surface of the wafer 30 after the film 32 is removed.

Furthermore, the edge finding device 14 can determine the relative position of the cutting position 31 and the working direction according to the shape of the film 32 and the position on the surface of the wafer 30 . In this embodiment, if the cutting position 31 is a flat angle, a flat edge formed by the cutting position 31 is perpendicular to the working direction, so that the film 32 can evenly accept the tear-off tape on the flat edge. B1 removes the pulling force. Or the working direction can be aligned at the intersection between the flat edge and an arc edge of the wafer, so that the peel-off tape B1 can more easily remove the film 32 .

Further, the wafer adhesive film removal device may also include a control center to automatically or manually execute the above-mentioned operations of the loading module 10 and the adhesive film removal group 20, or the wafer adhesive film removal device may include There is an operation interface connected to the control center, so that an operator can use the operation interface to provide conditions according to the above paragraphs (the thickness of the wafer 30 , the type of the cutting position 31 and the type and position of the film 32 ) to adjust a process data when the wafer film removal device is started to ensure that the film 32 is successfully removed from the wafer 30 .

In addition, when the wafer film removal device removes the film 32, the operating interface simultaneously displays the tension value to ensure the safety of the wafer 30 when the film 32 is removed.

The wafer film removal device provided by this new model has the following advantages:

1. Through the relative displacement of the loading module 10 and the peel-off film set 20, ensure that the peel-off tape B1 is attached to the surface of the wafer 30 and the film 32 and effectively removes the film 32 during reset. .

2. Through the setting of the edge-finding device 14, the wafer film removal device can determine the relative position of the cutting position 31 and the working direction according to the shape of the film 32 and the position on the surface of the wafer 30.

3. Through the displacement of the gluing module 213 or the clamping device 2132 relative to the substrate 21, the angle of the peeling tape B1 relative to the wafer surface is changed to facilitate the movement of the peeling tape B1 and the film 32. remove.

10: Material placement module

11: base

111:Orbit

12:Taking platform

13: Material table

131: Built-in material table

132: External material table

14: Edge finding device

20:Tear off adhesive film set

21:Substrate

211: Place the glue rod

212:Glue guide rod

213: Glue module

22:Substrate track

23: Cutting device

30:wafer

B:Tape reel

B1: Apply and tear off tape

Claims (13)

A wafer adhesive film removal device includes: a loading module for carrying a wafer with a film attached to its surface at a gluing position; and an edge-finding device for positioning the wafer. At least a part of the film corresponds to a working direction; and a gluing module includes a gluing device and a gluing device adjacently arranged along the working direction, and a tear-off tape can be guided to the gluing device And between the gluing device, the gluing device can optionally provide a pressure on the adhesive tape from top to bottom at the gluing position, and the gluing device can optionally move toward the adhesive device and clamp the adhesive tape. , wherein the material placement module and/or the sizing module can be displaced along the working direction to change the distance between them, so that the sizing device corresponds to above the sizing position. The wafer film removal device according to claim 1, wherein: the loading module includes a receiving platform and a loading platform disposed on the receiving platform. The loading platform is circular and columnar and can A loading table is selected to move up and down and rotate relative to the receiving table. The upper end surface of the loading table is used to receive the lower surface of the wafer. The loading table is positioned in front or behind the edge finding device relative to the wafer. The receiving platform moves up and down to the gluing position; and a base plate, including: a glue rod protruding from one side of the base plate, and a tape reel is set around the outer periphery, and the tape reel is used for the sticking and tearing tape to surround and stack into roll; at least one glue guide rod protrudes from one side of the substrate, and a strip guides at least a part of the tear-off tape to move on the tape reel to the gluing module; and the gluing module is arranged on the substrate One of the side surfaces and at least a part of the gluing device protrudes downward from the base plate, and one of the tracks is used for the displacement of the loading table or the base plate along the working direction. As for the wafer film removal device described in claim 2, the material loading platform includes an internal material platform and an external material platform arranged in concentric circles, the end surface of the internal material platform is the upper end surface, and the outer material platform A horizontal position on the end surface of the material table is the gluing position, wherein: the built-in material table can selectively move upward to protrude the external material table, and the built-in material table can optionally rotate relative to the external material table; and the The diameter of the built-in material table is smaller than the diameter of the wafer, and the diameter of the external material table is larger than the diameter of the wafer; wherein: when the upper end surface of the built-in material table receives the wafer, the edge finding device is activated And the built-in material table rotates relative to the external material table; and the edge-finding device detects a cutting position of the wafer. When the cutting position corresponds to a detection area of the edge-finding device, the built-in material table stops rotating. . In the wafer film removal device of claim 3, the loading table includes a vacuum structure to fix the wafer. As for the wafer adhesive film removal device described in claim 4, the vacuum structure is a plurality of perforations penetrated on the upper end surface. In the wafer film removal device of claim 4, the vacuum structure is a gap formed between the built-in material table and the external material table. The wafer adhesive film removal device as described in any one of claims 2 to 6, wherein: the sizing device is provided on the non-adhesive side of the tear-off tape and includes: a sizing roller, and a sizing roller. The roller end protrudes from the base plate, and a horizontal height of the lower edge of the roller end corresponds to the gluing position; and a gluing cylinder provides the pressure from top to bottom of the gluing roller at the other end relative to the roller end; and The clamping device is arranged on the other side of the adhesive tape of the tear-off tape, and includes a clamping member that provides a pressing force for the displacement of the gluing device through a clamping cylinder, so that the clamping member and the gluing device jointly clamp and pass through Put tear tape on it. In the wafer adhesive film removal device of claim 7, the clamping member is formed corresponding to the contour of the adhesive device facing the peel-off tape. According to the wafer adhesive film removal device of claim 7, the lower edge of the clamping member is in a smooth arc shape. For the wafer adhesive film removal device described in claim 7, the adhesive rod and the adhesive guide rod can rotate or displace relative to the substrate as required. As for the wafer adhesive film removal device described in claim 7, one of the adhesive guide rods corresponds to the adhesive module, so that the tear-off tape is guided downward to the adhesive module from top to bottom. According to the wafer adhesive film removal device of claim 7, a cutting device is disposed at a location where the horizontal height is lower than the adhesive position and away from the receiving platform. For the wafer film removal device described in claim 3, the cutting position is a flat angle. When the wafer is positioned, a flat edge formed by the cutting position is perpendicular to the working direction, or the flat edge is aligned with the working direction. The intersection of one arc edge of the wafer is aligned with the working direction.

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