JP2008233207A - Device and method for manufacturing liquid crystal display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stick a pair of film substrates to each other by reducing the distortion stresses caused in the film substrates during alignment. <P>SOLUTION: In the device for manufacturing a liquid crystal display panel by aligning a FT film substrate 1 and a CF film substrate 2, each of which has a plurality of display areas defined along a lengthwise direction with each other, with the respective display areas placed one over the other and then sticking them to each other, slit formation areas S for giving flexibility in a breadthwise direction of substrates are defined between display areas on at least one of the TFT film substrate 1 and the CF film substrate 2, and a sticking part 20a is provided which aligns the TFT substrate 1 and the CF film substrate 2, by bending the one film substrate in the breadthwise direction through the slit formation areas S and then sticks the TFT substrate 1 and the CF film substrate 2 to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a manufacturing apparatus and a manufacturing method of a liquid crystal display panel, and more particularly to an alignment technique for bonding a pair of film substrates in a liquid crystal display panel using a film substrate.

  In recent years, in fields such as liquid crystal displays and organic EL (Electro Luminescence) displays, flexible display panels using flexible film substrates have been developed in place of conventionally used glass substrates.

For example, in Patent Document 1, two insulating resin sheets wound around a roll are bonded to each cell unit by a sealing material, and then a cut line in a half cut state is provided on each insulating resin sheet. A method of manufacturing a liquid crystal display device (liquid crystal display panel) is disclosed in which each insulating resin sheet is divided into cell units via a cut line. And according to this manufacturing method, since it divides | segments after adhering two sheets, since a sheet | seat can be poured continuously, and a sheet | seat is half-cut, it is the wiring provided in a lower layer. It is described that disconnection can also be prevented.
JP-A-8-146372

  By the way, the liquid crystal display panel includes, for example, an active matrix substrate in which a plurality of pixel electrodes are formed in a matrix, and a counter substrate on which R, G, and B colored layers are formed so as to correspond to the pixel electrodes. Therefore, when the two substrates are bonded together, it is necessary to perform alignment so that each pixel electrode and each colored layer overlap each other.

  Moreover, when manufacturing a liquid crystal display panel using a film substrate, it is preferable to process a long film substrate continuously, for example by a roll-to-roll system from a viewpoint of improving production efficiency. Therefore, a first film substrate in which a plurality of active element layers each functioning as the active matrix substrate are formed along the length direction, and a plurality of CF element layers each functioning as the counter substrate are formed in the length direction. When the second film substrate thus formed is aligned for each cell unit constituted by each element layer and then sequentially bonded, the following problems may occur.

  FIG. 13 is a top view showing a state in which the upper second film substrate 102 is bonded to the lower first film substrate 101 after performing conventional alignment. In FIG. 13, the area A and the area B each indicate a cell unit for forming one liquid crystal display panel, and the lower arrow in the figure indicates the traveling direction of the substrate.

  In the cell unit of the area A (A1 and A2) on the right side of FIG. 13, before the first film substrate 101 and the second film substrate 102 are bonded, for example, the first element A1 of the first film substrate 101 is Since the CF element layer A2 of the two film substrates is disposed slightly obliquely, after the alignment by the θ correction that tilts the second film substrate 102 by the angle θ with respect to the traveling direction, the first film substrate 101 and the first film substrate Two film substrates 102 are bonded together with a sealant (not shown).

  Then, in the cell unit of the region B (B1 and B2) on the left side of FIG. 13 following the region A, as shown in FIG. 13, the second film substrate 102 remains inclined at an angle θ with respect to its traveling direction. Therefore, before the first film substrate 101 and the second film substrate 102 are bonded together, it is necessary to align the second film substrate 102 by an angle − (minus) θ with respect to its traveling direction by −θ correction. There is a case. In the region B, when the first film substrate 101 and the second film substrate 102 are bonded together after performing the alignment by -θ correction, they are caused by θ correction in the region A and -θ correction in the region B. Then, since the strain stress remains in the substrate, there is a possibility that the sealing material is peeled off from the first film substrate 101 and / or the second film substrate 102 in the process after the bonding. There is.

  This invention is made | formed in view of this point, The place made into the objective is to relieve | moderate the distortion stress which generate | occur | produces in a film substrate at the time of alignment, and to bond a pair of film substrate.

  In order to achieve the above object, the present invention has a slit formed in at least one of a pair of film substrates, and the pair of film substrates is aligned by bending the film substrate in the width direction through the slits. Is to do.

  Specifically, the liquid crystal display panel manufacturing apparatus according to the present invention aligns a pair of film substrates each having a plurality of display areas defined along the length direction so that the display areas overlap each other. A device for manufacturing a liquid crystal display panel by sequentially laminating, wherein at least one of the pair of film substrates is a slit for providing flexibility in the width direction of the film substrate between the display regions. The film substrate on which the slit is formed is bent in the width direction through the slit, and then the pair of film substrates is aligned, and then the pair of film substrates is bonded together It has a bonding part.

  According to said structure, since at least one of a pair of film board | substrate has the slit for providing the flexibility of the width direction of a film board | substrate between each display area, alignment of a pair of film board | substrate is carried out. When performing, the film substrate having the slit was bent in the width direction by the bonding portion, thereby performing alignment by θ correction by tilting the portion behind the slit of the film substrate by the angle θ with respect to the traveling direction of the substrate. However, the strain stress generated in the film substrate due to the θ correction is divided by the slit. Thereby, since the distortion stress which generate | occur | produces in the film substrate becomes small, it becomes possible to relieve | moderate the distortion stress which generate | occur | produces in a film substrate at the time of alignment, and to bond a pair of film substrate.

  The bonding portion includes a pair of alignment rolls configured such that a part of the peripheral wall is in contact with the film substrate on which the slits are formed, and at least one of the pair of alignment rolls is formed with the slits. The angle with respect to the advancing direction of the film substrate may be arbitrarily set so that the film substrate is bent in the width direction via the slit.

  According to the above configuration, at least one of the pair of alignment rolls that respectively contact the film substrate on which the slit is formed is configured such that an angle with respect to the traveling direction of the film substrate can be arbitrarily set. By arranging the film substrate obliquely with respect to the traveling direction of the film substrate, it becomes possible to perform alignment by θ correction in which a portion behind the slit of the film substrate is inclined by an angle θ with respect to the traveling direction of the substrate. The effects of the invention are specifically demonstrated.

  At least one of the pair of alignment rolls is configured to be movable in at least one of the width direction and the thickness direction of the film substrate in contact with a part of the peripheral wall so that the display areas of the pair of film substrates overlap each other. It may be.

  According to said structure, by moving at least one of a pair of alignment roll to the width direction and / or thickness direction of the film substrate which contact | abuts to it, along the width direction and / or thickness direction of the film substrate It becomes possible to adjust each positional deviation.

  The laminating portion includes an adsorption stage for adsorbing each display area of the film substrate on which the slit is formed to the surface, and the adsorption stage has a width through which the film substrate adsorbed on the surface is interposed. The angle with respect to the traveling direction of the film substrate may be arbitrarily set so as to be bent in the direction.

  According to said structure, since the angle with respect to the advancing direction of the film substrate of the adsorption | suction stage which adsorb | sucks each display area of a film substrate can be set arbitrarily, the adsorption | suction stage is set with respect to the advancing direction of a film substrate. By arranging it diagonally, it becomes possible to perform alignment by θ correction that tilts the portion behind the slit of the film substrate by an angle θ with respect to the traveling direction of the substrate. Played.

  The suction stage may be configured to be movable in at least one of the traveling direction and the width direction of the film substrate sucked on the surface so that the display areas of the pair of film substrates overlap each other.

  According to the above configuration, by moving the suction stage in the width direction and / or thickness direction of the film substrate sucked by the suction stage, the positional deviation along the width direction and / or thickness direction of the film substrate is respectively changed. It becomes possible to adjust.

  In addition, the liquid crystal display panel manufacturing method according to the present invention sequentially aligns a pair of film substrates each having a plurality of display areas defined along the length direction so that the display areas overlap each other. A method of manufacturing a liquid crystal display panel by bonding, wherein at least one of the pair of film substrates is provided with a slit for imparting flexibility in the width direction of the film substrate between the display regions. The pair of film substrates after the slit forming step to be formed and the film substrate on which the slits are formed in the slit forming step are aligned in the width direction through the slits. And a bonding step of bonding together.

  According to the above method, since a slit for imparting flexibility in the width direction of the film substrate is formed between each display region for at least one of the pair of film substrates in the slit forming step, When aligning a pair of film substrates, by bending the film substrate in the width direction through the slit, the portion behind the slit of the film substrate is inclined by an angle θ with respect to the traveling direction of the substrate. Even if the alignment is performed, the strain stress generated in the film substrate due to the θ correction is divided by the slit. Thereby, since the distortion stress which generate | occur | produces in the film substrate becomes small, it becomes possible to relieve | moderate the distortion stress which generate | occur | produces in a film substrate at the time of alignment, and to bond a pair of film substrate.

  In the slit forming step, a plurality of the slits may be formed along the width direction of the film substrate, and among the plurality of formed slits, the slits arranged at both ends may be opened to the side of the film substrate. Good.

  According to the above method, among the plurality of slits formed on the film substrate in the slit forming step, each slit arranged at both ends opens to the side of the substrate, so that the film substrate is arranged in the width direction via the slit. By bending, it is possible to easily release the strain stress generated on the film substrate when alignment is performed by θ correction that tilts the portion behind the slit of the film substrate with respect to the traveling direction by an angle θ. Become.

  In the slit forming step, among the plurality of slits, each of the slits arranged at both ends may be opened in a V shape with a round bottom.

  According to the above method, since the bottoms of the V-shaped slits formed on both sides of the film substrate in the slit forming step are rounded, they are generated on the film substrate when alignment is performed by θ correction. Strain stress is difficult to concentrate on the bottom of the slit.

  In the slit forming step, the slit may be formed by laser processing or punching.

  According to the above method, since the slit for imparting the flexibility in the width direction is formed on the film substrate by a general processing technique such as laser processing or punching processing, the effects of the present invention are specifically demonstrated. Is done.

  According to the present invention, the slit is formed in at least one of the pair of film substrates, and the pair of film substrates is aligned by bending the film substrate in the width direction through the slits. A pair of film substrates can be bonded together by alleviating the strain stress that sometimes occurs in the film substrates.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
1 to 11 show Embodiment 1 of a manufacturing apparatus and a manufacturing method of a liquid crystal display panel according to the present invention. Specifically, FIG. 1 shows a substrate bonding apparatus 30 which is a manufacturing apparatus of a liquid crystal display panel according to the present embodiment, and FIG. 2 shows a bonding portion 20 a constituting the substrate bonding apparatus 30.

  As shown in FIG. 1, the substrate laminating apparatus 30 includes a first unwinding roll 10a for unwinding a TFT (Thin Film Transistor) film substrate 1 wound in a roll shape, and a CF ( Color Filter) For the second unwinding roll 10b for unwinding the film substrate 2, and the TFT film substrate 1 and the CF film substrate 2 unwound from the first unwinding roll 10a and the second unwinding roll 10b, respectively. A bonding section 20 is provided for bonding the substrates 1 and 2 together after sequential alignment.

  As shown in FIG. 2, the bonding unit 20a corresponding to the bonding unit 20 rotates with a part of the peripheral wall in contact with the TFT film substrate 1 conveyed from the lower side to the right side from the left side in the drawing. A part of the peripheral wall comes into contact with the first feed roll 11a, the first alignment roll 12a, the second alignment roll 12b, and the CF film substrate 2 conveyed from the left side to the right side in the drawing, and rotates. A feed roll 11b, a third alignment roll 16a, a pressing roll 13 and a fourth alignment roll 16b, and a stage 14 for holding the TFT film substrate 1 from the lower side between the first alignment roll 12a and the second alignment roll 12b; Each alignment mark of the TFT film substrate 1 and the CF film substrate 2 held on the stage 14 And a position detector 15 for detecting. In FIG. 2, the horizontal direction and the vertical direction in the figure are the X direction and the Z direction, respectively, and the directions orthogonal to the X direction and the Z direction are the Y direction.

  The 1st unwinding roll 10a, the 2nd unwinding roll 10b, the 1st feed roll 11a, and the 2nd feed roll 11b are arrange | positioned so that each rotating shaft may become mutually parallel.

As will be described later, the first alignment roll 12a is configured such that angles (θ _Z and θ _Y ) with respect to the traveling direction of the TFT film substrate 1 can be arbitrarily set, and in the Y direction (substrate width direction) and the Z direction. It is configured to be movable in parallel (in the substrate thickness direction).

  The second alignment roll 12b, the third alignment roll 16a, and the fourth alignment roll 16b are exemplified by a configuration in which the rotation axis is fixed to be parallel to the first feed roll 11a and the second feed roll 11b. A non-fixed configuration such as the first alignment roll 12a may be used.

  The press roll 13 is configured to contact the CF film substrate 2 on the stage 14 via the TFT film substrate 1 after the alignment of the TFT film substrate 1 and the CF film substrate 2 is completed.

  The stage 14 may be configured to adsorb the TFT film substrate 1 on the stage 14 by a vacuum chuck or an electrostatic chuck after the alignment of the TFT film substrate 1 and the CF film substrate 2 is completed.

  The position detector 15 includes alignment marks (M1L and M1R, see FIG. 4) formed on the left and right ends of the TFT film substrate 1, respectively, and alignment marks formed on the left and right ends of the CF film substrate 2, respectively. By detecting the mark (M2L and M2R, see FIG. 4) with a CCD camera, a laser oscillation / detector, etc., the positional deviation between the TFT film substrate 1 and the CF film substrate 2 and the amount of the deviation are detected. Has been.

Here, using FIG. 3 to FIG. 5, alignment by θ _Y correction with respect to the TFT film substrate 1 will be described.

  First, when the alignment marks (M1L and M1R, see FIG. 4) previously formed on the TFT film substrate 1 and the alignment marks (M2L and M2R, see FIG. 4) previously formed on the CF film substrate 2 overlap each other. As shown in FIG. 3, the TFT film substrate 1 is moved straight along the X direction in a state where the first alignment roll 12a and the second alignment roll 12b are arranged in parallel to each other (L1 = L2). 3 to 5, the horizontal direction and the vertical direction in the drawings are the X direction and the Y direction, respectively.

Then, for example, as shown in FIG. 4, the position detector 15 indicates that the alignment mark M1L on the left side of the TFT film substrate 1 is shifted rearward with respect to the alignment mark M2L on the left side of the CF film substrate 2. 5, as shown in FIG. 5, the right side of the first alignment roll 12a is moved slightly rearward by moving the first alignment roll 12a by a predetermined amount in the _θY direction from the point P as a base point. , The distance between the rolls is set to L3 <L4, and the TFT film substrate 1 is moved slightly obliquely along the X direction. Thus, the feeding speed of the TFT film substrate 1 will be different at the left and right of the substrate width direction, it is possible to alignment marks M1L is overlap the alignment mark M2L, performing alignment by theta _Y correction.

Here, the theta _Y correction is to vary the angle with respect to the substrate traveling direction of the first alignment roll 12a in the XY plane. Instead of the theta _Y correction, an angle with respect to the substrate traveling direction of the first alignment roll 12a by θz correction changing on the YZ plane may be performed alignment.

  Next, the TFT film substrate 1 and the CF film substrate 2 that are continuously processed by the substrate bonding apparatus 30 having the above configuration will be described.

  As shown in FIG. 1, a plurality of display areas D are continuously defined along the length direction on the TFT film substrate 1 and the CF film substrate 2, and the width direction of the film substrate is defined between the display areas D. A slit forming region S for imparting flexibility is defined.

  Each display region D of the TFT film substrate 1 includes, for example, a plurality of gate lines extending in parallel with each other, a plurality of source lines extending in parallel with each other in a direction orthogonal to the gate lines, and each intersection of the gate lines and the source lines. An active element layer 3 including a plurality of thin film transistors (hereinafter referred to as TFTs) provided as switching elements in the portion and a plurality of pixel electrodes provided corresponding to the respective TFTs is formed. Note that a photo spacer for securing a cell thickness is formed on the TFT film substrate 1.

  In each display region D of the CF film substrate 2, for example, a color filter provided with R, G, and B colored layers so as to correspond to the pixel electrodes on the TFT film substrate 1, and so as to cover the color filter A CF element layer 5 including the provided common electrode is formed.

  Here, the film substrate F constituting the TFT film substrate 1 and the CF film substrate 2 will be described with reference to FIGS.

  In the film substrate F, slits S <b> 1 to S <b> 11 that form the slit forming regions S of the TFT film substrate 1 and the CF film substrate 2 are formed.

  The slit S <b> 1 is a notch cut out in a rectangular shape along the width direction of the film substrate F as shown in FIGS. 6 (a) to (d) and FIGS. 9 (a) to (d). 6D and 9D, the slit S1 is formed obliquely along the width direction of the film substrate F. Here, for example, about 45 slits S1 are formed with a length of 10 mm and a width of 5 mm with respect to a film substrate F having a width of 500 mm.

  The slit S2 is a cutout portion that is cut out in a circular shape along the width direction of the film substrate F, as shown in FIGS. 6 (e) and 11 (a). Here, for example, about 70 slits S2 having a diameter of 5 mm are formed on a film substrate F having a width of 500 mm.

  The slit S3 is a cut portion that is cut linearly along the width direction of the film substrate F, as shown in FIGS. 7 (a) to 7 (d) and FIGS. 10 (a) to 10 (d). 7D and 10D, the slit S3 is formed obliquely along the width direction of the film substrate F. Here, for example, about 45 slits S3 with a length of 10 mm are formed on a film substrate F having a width of 500 mm.

  The slit S4 is a cutout portion cut out in a rectangular shape along the length direction of the film substrate F as shown in FIGS. 8A and 8B and FIGS. 11D and 11E. . Here, for example, about 50 slits S4 are formed in a length of 8 mm × width of 10 mm for a film substrate F having a width of 500 mm.

  The slit S5 is a cut portion that is cut linearly along the length direction of the film substrate F, as shown in FIGS. Here, for example, about 50 slits S5 having a length of 15 mm are formed on a film substrate F having a width of 500 mm.

  As shown in FIGS. 9A to 9D, the slit S <b> 6 is a cutout portion that is cut out in a rectangular shape along the width direction of the film substrate F and opened sideways. In FIG. 9D, the slit S6 is formed obliquely along the width direction of the film substrate F. Here, the slit S6 is about the same size as the slit S1.

  As shown in FIGS. 10A to 10D, the slit S7 is a cut portion that is cut linearly along the width direction of the film substrate F and reaches the side (opens microscopically). is there. In FIG. 10D, the slit S7 is formed obliquely along the width direction of the film substrate F. Here, the slit S7 is about the same size as the slit S3.

  As shown in FIG. 11A, the slit S <b> 8 is a cutout portion that is cut out in a semicircular shape on the side of the film substrate F and opened. Here, the slit S8 is about half the size of the slit S2.

  As shown in FIG. 11B, the slit S <b> 9 is a cutout portion that is cut out in a V shape on the side of the film substrate F and opened. Here, for example, the slit S9 is formed with a hypotenuse of 10 mm and a V-shaped angle of about 30 ° with respect to the film substrate F having a width of 500 mm.

  In the slit S10, as shown in FIG. 11 (c), the bottom of the slit S9 in FIG. 11 (b) has a rounded shape. Here, the bottom of the slit S10 is formed in an arc shape having a diameter of 3 mm, for example.

  As shown in FIG. 11 (d), the slit S <b> 11 is a cut-out portion that is cut out in a rectangular shape along the length direction of the film substrate F and opened to the side. Here, the slit S11 is about the same size as the slit S4.

  The slits S1 to S11 described above are merely examples, and the size, the number along the substrate width direction, the number of columns along the substrate length direction, the arrangement, and the combination thereof are limited. is not.

  Next, a method for manufacturing a liquid crystal display panel using the substrate bonding apparatus 30 having the above configuration will be described. Note that the manufacturing method of this embodiment includes a slit forming step, an element layer forming step, a bonding step, a dividing step, and a liquid crystal injecting step.

<Slit formation process>
For example, as shown in FIGS. 6 to 11, slits are formed at predetermined positions of a pair of plastic films having a width of 500 mm, a length of 50 m, and a thickness of 100 μm by, for example, roll-to-roll laser processing or punching. Form.

<Element layer forming step>
A plurality of active element layers 3 are formed along the length direction by patterning TFTs, pixel electrodes, and the like by a roll-to-roll method or the like on one plastic film in which slits are formed in the slit forming step. After that, an alignment film is formed on the surface, and the TFT film substrate 1 in which a plurality of display regions D are defined along the length direction is manufactured.

  Further, a plurality of CF element layers are formed along the length direction by patterning a color filter, a common electrode, and the like by a roll-to-roll method on the other plastic film in which the slit is formed in the slit forming step. 5 is formed, an alignment film is formed on the surface thereof, and the CF film substrate 2 in which a plurality of display regions D are defined along the length direction is manufactured.

  Further, for example, an epoxy resin is drawn or printed around each display region D of the TFT film substrate 1 by a roll-to-roll method or the like to form the sealing material 4 having a liquid crystal injection port. The sealing material 4 contains a spherical spacer for maintaining the distance (cell thickness) between the TFT film substrate 1 and the CF film substrate 2 and is made of an epoxy resin or the like.

  Here, in the manufacturing method of the TFT film substrate 1 and the CF film substrate 2, the method of forming slits in each film body in advance is exemplified, but the active element layer 3 and the CF element layer 5 are formed in each film body. After each forming, a slit may be formed in the film body.

<Lamination process>
First, the TFT film substrate 1 and the CF film substrate 2 formed in the element layer forming step are formed into rolls and attached to the first unwinding roll 10a and the second unwinding roll 10b of the substrate bonding apparatus 30, respectively.

  Subsequently, the TFT film substrate 1 is unwound from the first unwinding roll 10a, and as shown in FIG. 2, along the first feeding roll 11a, the first alignment roll 12a, and the second alignment roll 12b, for example, Step conveyance is performed in units of the display area D. Further, the CF film substrate 2 is unwound from the second unwinding roll 10b, and as shown in FIG. 2, along the second feeding roll 11b, the third alignment roll 16a, and the fourth alignment roll 16b, for example, each display Step conveyance is performed in units of area D.

  Then, on the stage 14, the position detector 15 detects the alignment marks (M1L, M1R, M2L and M2R, see FIG. 4) of the TFT film substrate 1 and the CF film substrate 2.

  Here, in the case where no position shift is detected by the detection of each alignment mark by the position detector 15, the pressing roll 13 is brought into contact with the surface of the CF film substrate 2, whereby the TFT film substrate 1 and the CF film substrate. Paste 2 together.

In addition, when a positional deviation is detected by detecting each alignment mark by the position detector 15, as described above, after performing alignment by _θY correction using the first alignment roll 12a, the CF film substrate The TFT film substrate 1 and the CF film substrate 2 are bonded to each other by bringing the pressing roll 13 into contact with the surface of 2.

  Subsequently, the bonded TFT film substrate 1 and CF film substrate 2 are heated by a roll-to-roll method or the like to cure the sealing material 4.

<Division process>
The TFT film substrate 1 and the CF film substrate 2 bonded in the bonding step and cured with the sealing material 4 are cut at each slit forming region S and divided into cell units.

<Liquid crystal injection process>
After injecting the liquid crystal material (6) by the dip injection method between the TFT film substrate (1a) and the CF film substrate (2a) which are divided for each cell unit in the above dividing step, the liquid crystal injection port is made by UV curable resin or the like. Is sealed.

  As described above, the liquid crystal display panel 8 (see FIG. 1) in which the liquid crystal layer 6 is provided between the TFT film substrate 1a and the CF film substrate 2a can be manufactured.

As described above, according to the manufacturing apparatus and the manufacturing method of the liquid crystal display panel of the present embodiment, in the slit forming process, the width direction of the film substrate between the display regions D of the TFT film substrate 1 and the CF film substrate 2. The slits (S1 to S11) for imparting the flexibility are formed, and the slit forming region S is defined. Therefore, when the TFT film substrate 1 and the CF film substrate 2 are aligned in the bonding step, By bending the TFT film substrate 1 in the width direction by the first alignment roll 12a constituting the bonding portion 20a, the portion behind the slit forming region S of the TFT film substrate 1 is angled θ with respect to the traveling direction of the substrate. tilting theta _Y correction even alignment was performed position by, TFT film substrate 1 two shot due to its theta _Y correction Strain stress can be made to break at the slit forming region S. Thereby, since the distortion stress which generate | occur | produces in the TFT film substrate 1 becomes small, the distortion stress which generate | occur | produces in the TFT film substrate 1 at the time of alignment can be eased, and the TFT film substrate 1 and CF film substrate 2 can be bonded together. .

  According to the manufacturing apparatus and the manufacturing method of the liquid crystal display panel of the present embodiment, the first alignment roll 12a has the TFT film so that the display areas D of the TFT film substrate 1 and the CF film substrate 2 overlap each other in the bonding portion 20a. Since it is configured to be movable in at least one of the width direction and the thickness direction of the substrate 1, the positional deviation along at least one of the width direction and the thickness direction of the TFT film substrate 1 can be adjusted.

  According to the manufacturing apparatus and the manufacturing method of the liquid crystal display panel of the present embodiment, among the plurality of slits (S1 to S11) formed on the film substrate F in the slit forming step, the slits (S6 to S11) disposed at both ends. Since the film substrate F is bent in the width direction through the slit, the portion behind the slit of the film substrate F is inclined at an angle θ with respect to the traveling direction. It is possible to easily release the strain stress generated in the film substrate F, that is, the TFT film substrate 1 and the CF film substrate 2 when the alignment by the θ correction is performed.

  According to the manufacturing apparatus and the manufacturing method of the liquid crystal display panel of the present embodiment, the bottoms of the V-shaped slits S10 formed on both sides of the film substrate F in the slit forming step are rounded. It is possible to make it difficult to concentrate strain stress generated in the film substrate F, that is, the TFT film substrate 1 and the CF film substrate 2 at the bottom of the slit S10 when the alignment is performed.

  In the present embodiment, after the TFT film substrate 1 and the CF film substrate 2 are bonded together, a method of injecting a liquid crystal material between both substrates by a dip injection method is exemplified. It may be injected in between.

  In this embodiment, the slits are formed in both the TFT film substrate 1 and the CF film substrate 2, but the slits may be formed only in the film substrate (for example, the TFT film substrate 1) on the side to be aligned by θ correction. Good.

<< Embodiment 2 of the Invention >>
FIG. 12 is a side view of the bonding unit 20b constituting the substrate bonding apparatus of the present embodiment. In the following embodiments, the same parts as those in FIGS. 1 to 11 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 12, the laminating portion 20b includes a third feed roll 17a and a third feed roll 17a that rotate with a part of the peripheral wall in contact with the TFT film substrate 1 conveyed from the lower side to the right side from the left side in the figure. A fourth feed roll 19a, a fifth feed roll 17b and a sixth feed roll 19b, each of which rotates with a part of the peripheral wall in contact with the CF film substrate 2 conveyed from the upper side to the right side from the left side to the right side in FIG. A suction stage 18 for holding the TFT film substrate 1 from below between the feed roll 17a and the fourth feed roll 19a, and each alignment mark of the TFT film substrate 1 and the CF film substrate 2 held on the suction stage 18 And a position detector 15 for detecting.

  The rotation axes of the third feed roll 17a, the fourth feed roll 19a, the fifth feed roll 17b, and the sixth feed roll 19b are parallel to the rotation axes of the first unwinding roll 10a and the second unwinding roll 10b. Are arranged as follows.

When the TFT film substrate 1 and the CF film substrate 2 are aligned, the suction stage 18 moves the TFT film substrate 1 in a state in which the lower TFT film substrate 1 is sucked by a vacuum chuck or an electrostatic chuck. The angles (θ _Z and θ _Y ) with respect to the angle are configured to be arbitrarily set, and can be translated in the Y direction (substrate width direction) and the Z direction (substrate thickness direction).

  The manufacturing method of the liquid crystal display panel by the board | substrate bonding apparatus 30 provided with the bonding part 20b of the said structure uses the 1st alignment roll 12a for position alignment by (theta) correction | amendment of the film substrate in the bonding process of the said Embodiment 1. FIG. Instead of performing it, the suction stage 18 may be operated as appropriate, and thus detailed description thereof is omitted.

  According to the manufacturing apparatus and manufacturing method of the liquid crystal display panel of the present embodiment, the angle of the suction stage 18 that sucks each display region D of the TFT film substrate 1 with respect to the traveling direction of the substrate can be arbitrarily set. By positioning the suction stage 18 obliquely with respect to the traveling direction of the substrate, alignment by θ correction is performed so that the portion behind the slit forming region S of the TFT film substrate 1 is inclined at an angle θ with respect to the traveling direction of the substrate. It can be carried out. Further, since the strain stress generated in the TFT film substrate 1 due to the θ correction is reduced in the slit forming region S, the strain stress generated in the TFT film substrate 1 at the time of alignment is relaxed, and the TFT film substrate 1 and CF film The film substrate 2 can be bonded.

  According to the manufacturing apparatus and the manufacturing method of the liquid crystal display panel of the present embodiment, the suction stage 18 is attached to the TFT film substrate 1 so that the display regions D of the TFT film substrate 1 and the CF film substrate 2 overlap each other in the bonding portion 20b. Since the TFT film substrate 1 is configured to be movable in at least one of the width direction and the thickness direction, the displacement of the TFT film substrate 1 along at least one of the width direction and the thickness direction can be adjusted.

  As described above, the present invention can relieve the strain stress generated in the film substrate during alignment and bond the pair of film substrates together, so that a pair of film substrates such as a liquid crystal display panel and an EL display panel can be attached. It is useful for all display panels manufactured by bonding.

It is a schematic explanatory drawing of the board | substrate bonding apparatus 30 which concerns on Embodiment 1. FIG. 3 is a side view of a bonding unit 20a that constitutes a substrate bonding apparatus 30. FIG. It is a top view which shows the state at the time of the normal time of the alignment rolls 12a and 12b. It is a top view of the TFT film substrate 1 and the CF film 2 in which the positional deviation has occurred. It is a top view which shows the state at the time of alignment of alignment roll 12a and 12b. It is a top view of the film board | substrate F in which slit S1 or S2 was formed. It is a top view of the film substrate F in which the slit S3 is formed. It is a top view of the film board | substrate F in which slit S4 or S5 was formed. It is a top view of the film board | substrate F in which slit S6 was formed. It is a top view of the film board | substrate F in which slit S7 was formed. It is a top view of the film substrate F in which slits S8 to S11 are formed. It is a side view of the bonding part 20b which comprises the board | substrate bonding apparatus which concerns on Embodiment 2. FIG. It is a top view of the 1st film substrate 101 and the 2nd film substrate 102 which were bonded together after performing the position alignment by the conventional (theta) correction.

Explanation of symbols

D Display area F Film substrate S Slit formation areas S1 to S11 Slit 1 TFT film substrate 2 CF film substrates 12a and 12b Alignment roll 18 Adsorption stage 20, 20a and 20b Bonding unit 30 Substrate bonding apparatus (liquid crystal display panel manufacturing apparatus) )

Claims (9)

An apparatus for manufacturing a liquid crystal display panel by aligning a pair of film substrates each having a plurality of display areas along the length direction so that the respective display areas overlap each other and then sequentially bonding them together. And
At least one of the pair of film substrates is provided with a slit for imparting flexibility in the width direction of the film substrate between the display regions.
A bonding portion for bonding the pair of film substrates is provided after aligning the pair of film substrates by bending the film substrate formed with the slits in the width direction through the slits. An apparatus for manufacturing a liquid crystal display panel. The apparatus for manufacturing a liquid crystal display panel according to claim 1,
The bonding portion includes a pair of alignment rolls configured such that a part of the peripheral wall abuts on the film substrate on which the slit is formed,
At least one of the pair of alignment rolls is configured such that the angle with respect to the traveling direction of the film substrate can be arbitrarily set so that the film substrate on which the slit is formed is bent in the width direction via the slit. An apparatus for manufacturing a liquid crystal display panel. The apparatus for manufacturing a liquid crystal display panel according to claim 2,
At least one of the pair of alignment rolls is configured to be movable in at least one of the width direction and the thickness direction of the film substrate in contact with a part of the peripheral wall so that the display areas of the pair of film substrates overlap each other. An apparatus for manufacturing a liquid crystal display panel. The apparatus for manufacturing a liquid crystal display panel according to claim 1,
The bonding unit includes a suction stage for sucking each display area of the film substrate on which the slit is formed on the surface,
The suction stage is configured such that an angle with respect to the traveling direction of the film substrate can be arbitrarily set so that the film substrate sucked on the surface is bent in the width direction through the slit. Liquid crystal display panel manufacturing equipment. In the manufacturing apparatus of the liquid crystal display panel described in Claim 4,
The suction stage is configured to be movable in at least one of the traveling direction and the width direction of the film substrate sucked on the surface so that the display areas of the pair of film substrates overlap each other. Liquid crystal display panel manufacturing equipment. A method of manufacturing a liquid crystal display panel by sequentially aligning a pair of film substrates each having a plurality of display areas defined along the length direction so that the display areas overlap each other. And
A slit forming step of forming a slit for imparting flexibility in the width direction of the film substrate between the display regions for at least one of the pair of film substrates,
A bonding step of bonding the pair of film substrates after aligning the pair of film substrates by bending the film substrate formed with slits in the slit forming step in the width direction through the slits; A method for producing a liquid crystal display panel, comprising: In the manufacturing method of the liquid crystal display panel described in Claim 6,
In the slit forming step, a plurality of the slits are formed along the width direction of the film substrate, and among the formed slits, the slits arranged at both ends are opened to the side of the film substrate. A method for producing a liquid crystal display panel. In the manufacturing method of the liquid crystal display panel described in Claim 7,
In the slit forming step, a method of manufacturing a liquid crystal display panel, wherein the slits arranged at both ends of the plurality of slits are opened in a V shape having a round bottom. In the manufacturing method of the liquid crystal display panel described in Claim 6,
In the slit forming step, the slit is formed by laser processing or punching processing.

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