TWI539029B - 用於欲處理之平坦材料之濕式化學處理的裝置及方法 - Google Patents
用於欲處理之平坦材料之濕式化學處理的裝置及方法 Download PDFInfo
- Publication number
- TWI539029B TWI539029B TW103114753A TW103114753A TWI539029B TW I539029 B TWI539029 B TW I539029B TW 103114753 A TW103114753 A TW 103114753A TW 103114753 A TW103114753 A TW 103114753A TW I539029 B TWI539029 B TW I539029B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- module
- processing
- treated
- flushing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G3/00—Apparatus for cleaning or pickling metallic material
- C23G3/02—Apparatus for cleaning or pickling metallic material for cleaning wires, strips, filaments continuously
- C23G3/027—Associated apparatus, e.g. for pretreating or after-treating
- C23G3/029—Associated apparatus, e.g. for pretreating or after-treating for removing the pickling fluid from the objects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Ink Jet (AREA)
- Pretreatment Of Seeds And Plants (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013207343.7A DE102013207343B3 (de) | 2013-04-23 | 2013-04-23 | Vorrichtung und Verfahren zum nasschemischen Behandeln von flächigem Behandlungsgut |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201500589A TW201500589A (zh) | 2015-01-01 |
TWI539029B true TWI539029B (zh) | 2016-06-21 |
Family
ID=50486902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103114753A TWI539029B (zh) | 2013-04-23 | 2014-04-23 | 用於欲處理之平坦材料之濕式化學處理的裝置及方法 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5963992B1 (de) |
KR (1) | KR101731751B1 (de) |
CN (1) | CN105075406B (de) |
AT (1) | AT518975B1 (de) |
DE (1) | DE102013207343B3 (de) |
TW (1) | TWI539029B (de) |
WO (1) | WO2014173693A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015121349A1 (de) * | 2015-12-08 | 2017-06-08 | Staku Anlagenbau Gmbh | Vorrichtung zur Oberflächenbehandlung eines Endlosmaterials sowie deren Verwendung |
DE102019215572A1 (de) | 2019-04-09 | 2020-10-15 | Sms Group Gmbh | Kaskadenspülanlage zum Behandeln eines bandförmigen Flachprodukts |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0329808A1 (de) * | 1988-02-25 | 1989-08-30 | Gebr. Schmid GmbH & Co. | Verfahren und Vorrichtung zur Reinigung frisch verzinnter Leiterplatten |
US5179967A (en) | 1991-08-28 | 1993-01-19 | Nelson Steel | Apparatus for rinsing metal strip |
DE4337988A1 (de) * | 1993-11-06 | 1995-05-11 | Hoellmueller Maschbau H | Verfahren zur Herstellung von Multilayern sowie Vorrichtung zur Durchführung dieses Verfahrens |
DE4418277A1 (de) | 1994-05-26 | 1995-11-30 | Atotech Deutschland Gmbh | Verfahren zum Reinigen mit anschließendem Spülen in Anlagen zur Oberflächenbehandlung |
DE19717511C2 (de) * | 1997-04-25 | 2000-09-14 | Atotech Deutschland Gmbh | Verfahren zur spezifischen naßchemischen Behandlung von flachem Behandlungsgut in Durchlaufanlagen |
DE19802755A1 (de) * | 1998-01-26 | 1999-07-29 | Hoellmueller Maschbau H | Vorrichtung zum Behandeln plattenförmiger Gegenstände, insbesondere elektronischer Leiterplatten, mit einer Behandlungsflüssigkeit |
EP0989790A1 (de) * | 1998-09-22 | 2000-03-29 | Agfa-Gevaert N.V. | Vorrichtung und Verfahren zur Behandlung von Substraten mit einer Ätzflüssigkeit |
DE102007035086B3 (de) * | 2007-07-26 | 2008-10-30 | Rena Sondermaschinen Gmbh | Vorrichtung und Verfahren zur Oberflächenbehandlung von Gut in Durchlaufanlagen |
JP5410598B2 (ja) * | 2009-05-13 | 2014-02-05 | アトテック・ドイチュラント・ゲーエムベーハー | 平面的な被処理材料を処理するための方法およびアセンブリ、ならびに処理液を除去または離隔するためのデバイス |
DE102009060676B4 (de) * | 2009-12-28 | 2015-07-23 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut |
-
2013
- 2013-04-23 DE DE102013207343.7A patent/DE102013207343B3/de active Active
-
2014
- 2014-04-10 KR KR1020157030350A patent/KR101731751B1/ko active IP Right Grant
- 2014-04-10 JP JP2016509367A patent/JP5963992B1/ja active Active
- 2014-04-10 WO PCT/EP2014/057298 patent/WO2014173693A1/en active Application Filing
- 2014-04-10 AT ATA9173/2014A patent/AT518975B1/de active
- 2014-04-10 CN CN201480018030.3A patent/CN105075406B/zh active Active
- 2014-04-23 TW TW103114753A patent/TWI539029B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN105075406B (zh) | 2018-02-09 |
TW201500589A (zh) | 2015-01-01 |
KR101731751B1 (ko) | 2017-04-28 |
KR20150126970A (ko) | 2015-11-13 |
JP5963992B1 (ja) | 2016-08-03 |
CN105075406A (zh) | 2015-11-18 |
AT518975A5 (de) | 2018-03-15 |
WO2014173693A1 (en) | 2014-10-30 |
AT518975B1 (de) | 2018-03-15 |
DE102013207343B3 (de) | 2014-08-28 |
JP2016524523A (ja) | 2016-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5763100B2 (ja) | 処理される材料の湿式化学処理のための方法およびデバイス | |
TWI539029B (zh) | 用於欲處理之平坦材料之濕式化學處理的裝置及方法 | |
JP6189279B2 (ja) | エッチング装置 | |
TWI402900B (zh) | 基板之處理裝置及處理方法 | |
JP4997080B2 (ja) | 基板処理装置 | |
TW200918988A (en) | Apparatus for treating substrates | |
JP4861970B2 (ja) | 基板処理装置 | |
JP2019162748A (ja) | 版洗浄装置および版洗浄方法 | |
JP2004006631A (ja) | 基板処理装置 | |
KR101717261B1 (ko) | 기판 처리 방법 및 기판 처리 장치 | |
JP6723000B2 (ja) | 基板処理装置 | |
KR102153815B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
KR101124024B1 (ko) | 반도체 웨이퍼 처리 방법 | |
KR101100961B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
KR101406048B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
TW201531584A (zh) | 在用於電流或溼式化學金屬沉積之水平處理裝置之處理區域內積聚處理液之裝置 | |
JP5271060B2 (ja) | 基板処理方法及び基板処理装置 | |
JP4665717B2 (ja) | フープ材のメッキ処理槽及びそれを用いたメッキ処理装置 | |
TW201515974A (zh) | 用於濕化學或電化學處理之方法與裝置 | |
KR200458141Y1 (ko) | 대면적 기판 처리장치 | |
JPH07268684A (ja) | 帯状材の処理装置における排液構造 | |
JP2009285557A (ja) | 洗浄装置 | |
JP2011177678A (ja) | ストリップの洗浄又は塗布装置及びストリップの洗浄又は塗布方法 | |
TWM408121U (en) | Board surface treatment apparatus |