TWI536881B - Power devices and power devices - Google Patents

Power devices and power devices Download PDF

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TWI536881B
TWI536881B TW101102686A TW101102686A TWI536881B TW I536881 B TWI536881 B TW I536881B TW 101102686 A TW101102686 A TW 101102686A TW 101102686 A TW101102686 A TW 101102686A TW I536881 B TWI536881 B TW I536881B
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repeating unit
liquid crystal
crystal polyester
mol
derived
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TW101102686A
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TW201251543A (en
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Hideaki Nezu
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Sumitomo Chemical Co
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
    • C08G63/605—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds the hydroxy and carboxylic groups being bound to aromatic rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29B7/00—Mixing; Kneading
    • B29B7/002—Methods
    • B29B7/007—Methods for continuous mixing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00—Mixing; Kneading
    • B29B7/30—Mixing; Kneading continuous, with mechanical mixing or kneading devices
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29B7/80—Component parts, details or accessories; Auxiliary operations
    • B29B7/88—Adding charges, i.e. additives
    • B29B7/90—Fillers or reinforcements, e.g. fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/12—Making granules characterised by structure or composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29B7/38—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary
    • B29B7/46—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft
    • B29B7/48—Mixing; Kneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary with more than one shaft with intermeshing devices, e.g. screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Description

功率裝置及功率裝置用封裝
本發明係關於一種具有由液晶聚酯所構成之端子支持構件的功率裝置。又，本發明亦關於作為該功率裝置之封裝使用之功率裝置用封裝。
功率裝置，通常係具有功率元件、與功率元件電氣連接之端子、支持端子之端子支持構件，將其之例示於圖1及2。圖1之例，功率元件1,1係固定於印刷配線板2，以導線連接功率元件1,1之電極與印刷配線板2之配線所成之功率模組，係固定於具有端子3,3、端子支持構件4,4與散熱板5之功率裝置用封裝之散熱板5，印刷配線板2之配線與端子3,3係以導線連接，而以密封材6密封功率模組。又，圖2之例，功率元件1係固定於墊片7，功率元件1之電極與端子3,3係以導線連接，而以端子支持構件兼密封材8支持端子3,3、並且密封功率元件1。
端子支持構件之材料，由於耐熱性優異，故探討著液晶聚酯。例如，於專利文獻1，揭示由具有來自對羥基苯甲酸之重複單元80莫耳%與來自6-羥基-2-萘甲酸之重複單元20莫耳%之液晶聚酯(Hoechst公司之「Hoechst C950」)所構成之端子支持構件。
專利文獻1：日本特開平3-126765號公報
如專利文獻1所揭示般，以往之具有由液晶聚酯所構成之端子支持構件之功率裝置，端子支持構件之絕緣性並不一定足夠，特別是若相鄰端子間之距離若短則有容易產生絕緣破壞的問題。因此，本發明之目的在於提供一種具有端子支持構件之功率裝置，該端子支持構件係由液晶聚酯所構成之絕緣性優異、即使相鄰端子間之距離短亦不易產生絕緣破壞。
本發明係為了達成上述目的所完成者，其包含以下較佳之實施形態。
〔1〕一種功率裝置，其具有功率元件、端子、與由液晶聚酯所構成之端子支持構件，該液晶聚酯，係具有來自芳香族羥基羧酸之重複單元(1)、來自芳香族二羧酸之重複單元(2)、與來自芳香族二醇之重複單元(3)的液晶聚酯，該液晶聚酯中之來自間苯二甲酸之重複單元的含量，相對於該液晶聚酯所具有之總重複單元之合計量，為0~7莫耳%。
〔2〕如〔1〕所記載之功率裝置，其中，該重複單元(1)，係來自對羥基苯甲酸或6-羥基-2-萘甲酸之重複單元，該重複單元(2)，係來自對苯二甲酸、間苯二甲酸或2,6-萘二羧酸之重複單元，該重複單元(3)，係 來自氫醌或4,4’-二羥基聯苯之重複單元。
〔3〕如〔1〕或〔2〕所記載之功率裝置，其中，該液晶聚酯，相對於其所具有之總重複單元之合計量，具有該重複單元(1)30~80莫耳%、該重複單元(2)10~35莫耳%、該重複單元(3)10~35莫耳%。
〔4〕如〔1〕~〔3〕中任一項所記載之功率裝置，其中，該端子支持構件，係含有玻璃纖維之構件。
〔5〕如〔4〕所記載之功率裝置，其中，該端子支持構件中之該玻璃纖維之含量，相對於該液晶聚酯100質量份，為10~100質量份。
〔6〕如〔1〕~〔5〕中任一項所記載之功率裝置，其中，相鄰之該端子間之距離，為0.2~1.5mm。
〔7〕一種功率裝置用封裝，其係具有端子、與由液晶聚酯所構成之端子支持構件，該液晶聚酯，係具有來自芳香族羥基羧酸之重複單元(1)、來自芳香族二羧酸之重複單元(2)、與來自芳香族二醇之重複單元(3)的液晶聚酯，該液晶聚酯中之來自間苯二甲酸之重複單元的含量，相對於該液晶聚酯所具有之總重複單元之合計量，為0~7莫耳%。
〔8〕如〔7〕所記載之功率裝置用封裝，其中，該重複單元(1)，係來自對羥基苯甲酸或6-羥基-2-萘甲酸之重複單元，該重複單元(2)，係來自對苯二甲酸、間苯二甲酸或2,6-萘二羧酸之重複單元，該重複單元(3)，係來自氫醌或4,4’-二羥基聯苯之重複單元。
〔9〕如〔7〕或〔8〕所記載之功率裝置用封裝，其中，該液晶聚酯，相對於其所具有之總重複單元之合計量，具有該重複單元(1)30~80莫耳%、該重複單元(2)10~35莫耳%、該重複單元(3)10~35莫耳%。
〔10〕如〔7〕~〔9〕項中任一項所記載之功率裝置用封裝，其中，該端子支持構件，係含有玻璃纖維之構件。
〔11〕如〔10〕所記載之功率裝置用封裝，其中，該端子支持構件中之該玻璃纖維之含量，相對於該液晶聚酯100質量份，為10~100質量份。
〔12〕如〔7〕~〔11〕項中任一項所記載之功率裝置用封裝，其中，相鄰之該端子間之距離，為0.2~1.5mm。
本發明之功率裝置及功率裝置用封裝，端子支持構件之絕緣性優異，即使相鄰端子間之距離為短亦不易產生絕緣破壞。因此，本發明之功率裝置及功率裝置用封裝，相鄰端子間之距離以0.2~1.5mm為宜。
本發明之功率裝置，具有功率元件、端子與端子支持構件。而端子構件係由既定之液晶聚酯所構成。
功率元件，係電子機器之半導體元件，具有將電流由 交流改變成直流或由直流改變成交流、並控制電流、電壓或頻率的功能，一般係控制200V以上之電壓或20A以上之電流的半導體元件。功率元件之例，可舉例如整流器二極體、功率電晶體、功率MOSFET(MetalOxide Semicoductor Field Effect Transistor，金屬氧化物半導體場效電晶體)、絕緣閘雙極電晶體(IGBT，Insulated Gate Bipolar Transistor)、閘流電晶體、截斷閘流體(GTO，gate turn off thyristor)及雙向三極體(triac)。
功率元件，如圖1所示可將複數個構裝於印刷配線板，亦可與控制電路、驅動電路或保護電路一同構裝於印刷配線板，作為所謂之功率模組使用。又，功率元件於印刷配線板之構裝，可將功率元件以焊接或接著劑等固定於印刷配線板，藉由連接功率元件之電極與印刷配線板之配線來進行，該連接，如圖1所示可藉以鋁或銅等金屬製之導線之連結來進行，亦可藉焊接之直接接合來進行。
端子，係使用於功率裝置與電源或其他機器的連接，通常係由鋁或銅等金屬所構成。功率裝置通常係具備2~20個端子。功率元件之電極與端子的連接、或功率元件所構裝之印刷配線板之配線與端子的連接，如圖1及2所示可藉以鋁或銅等金屬製之導線之連結來進行，亦可藉焊接之直接接合來進行。
構成端子支持構件之液晶聚酯，係以熔融狀態顯示液晶性之液晶聚酯，而較佳為以450℃以下之溫度熔融者。而於本發明，液晶聚酯，係使用下述者：具有來自芳香族 羥基羧酸之重複單元(1)、來自芳香族二羧酸之重複單元(2)、與來自芳香族二醇之重複單元(3)，並且，重複單元(2)之來自間苯二甲酸之重複單元的含量，相對於總重複單元之合計量，為0~7莫耳%。藉此，可得絕緣性優異、即使相鄰端子間之距離短亦不易產生絕緣破壞之端子支持構件。來自間苯二甲酸之重複單元的含量，相對於總重複單元之合計量，較佳為6莫耳%以下、更佳為4莫耳%以下、又更佳為3莫耳%以下，又通常為1莫耳%以上。該含量愈少，端子支持構件之絕緣性容易提昇，但若過少，則液晶聚酯難以成形。
重複單元(1)，以來自對羥基苯甲酸或6-羥基-2-萘甲酸之重複單元為佳，重複單元(2)，以來自對苯二甲酸、間苯二甲酸或2,6-萘二羧酸之重複單元為佳，重複單元(3)，以來自氫醌或4,4’-二羥基聯苯之重複單元為佳。
重複單元(1)之含量，相對於總重複單元之合計量(藉由將構成液晶聚酯之各重複單元之質量除以各重複單元之式量，求出各重複單元之物質量相當量(莫耳)，該等合計之值)，通常為30莫耳%以上、較佳為30~80莫耳%、更佳為40~70莫耳%、又更佳為45~65莫耳%。重複單元(2)之含量，相對於總重複單元之合計量，通常為35莫耳%以下、較佳為10~35莫耳%、更佳為15~30莫耳%、又更佳為17.5~27.5莫耳%。重複單元(3)之含量，相對於總重複單元之合計量，通常為35莫耳%以下、 較佳為10~35莫耳%、更佳為15~30莫耳%、又更佳為17.5~27.5莫耳%。重複單元(1)之含量愈多，熔融流動性、耐熱性及強度、剛性容易提昇，但若過多，則熔融溫度及熔融黏度容易增高，使得成形所需之溫度容易變高。
重複單元(2)之含量與重複單元(3)之含量的比例，以「重複單元(2)之含量」/「重複單元(3)之含量」(莫耳/莫耳)表示，通常為0.9/1~1/0.9、較佳為0.95/1~1/0.95、更佳為0.98/1~1/0.98。
又，液晶聚酯，以可分別地具有2種以上之重複單元(1)~(3)。又，液晶聚酯，亦可具有重複單元(1)~(3)以外之重複單元，而其之含量，相對於總重複單元之合計量，通常為10莫耳%以下、較佳為5莫耳%以下。
液晶聚酯，係將提供重複單元(1)之單體(亦即芳香族羥基羧酸)、提供重複單元(2)之單體(亦即芳香族二羧酸)、與提供重複單元(3)之單體(亦即芳香族二醇)，使芳香族二羧酸之間苯二甲酸之量，相對於總單體之合計量為0~7莫耳%的方式，進行聚合(縮聚合)，藉此來製造。此時，亦可使用其之可聚合的衍生物取代芳香族羥基羧酸、芳香族二羧酸及芳香族二醇之各別的一部分或全部。如芳香族羥基羧酸及芳香族二羧酸等具有羧基之化合物之可聚合的衍生物之例，可舉例如，將羧基改變成烷氧基羰基或芳氧基羰基者、將羧基改變成鹵代甲醯基者、將羧基改變成醯氧基者。如芳香族羥基羧酸及芳香族 二醇等具有羥基之化合物之可聚合的衍生物之例，可舉例如，將羥基醯基化改變成醯氧基者。
又，液晶聚酯，較佳為，藉由使單體熔融聚合，將所得之聚合物(預聚物)固相聚合來製造。藉此，可操作性佳地製造耐熱性及熔融張力高之液晶聚酯。熔融聚合，亦可於觸媒的存在下進行，該觸媒之例，可舉例如乙酸鎂、乙酸亞錫、鈦酸四丁酯、乙酸鉛、乙酸鈉、乙酸鉀、三氧化銻等金屬化合物、或N,N-三甲基胺基吡啶、N-甲基咪唑等含氮之雜環式化合物，而較佳為使用含氮之雜環式化合物。
液晶聚酯，其之開始流動溫度，較佳為280℃以上、更佳為290℃以上、又更佳為295℃以上，又通常為380℃以下、較佳為350℃以下。開始流動溫度愈高，難熱性及熔融張力容易提昇，但若過高，則使其熔融需要高溫，成形時容易熱劣化。
又，開始流動溫度，亦稱為流動溫度(flow temperature)或流動溫度，係使用具有內徑1mm、長度10mm之噴嘴之毛細管流變計，於9.8MPa(100kg/cm2)之荷重下，以4℃/分之昇溫速度將液晶聚酯之加熱熔融體由噴嘴擠出時，熔融黏度顯示4800Pa．s(48000泊)之溫度，液晶聚酯之分子量為適宜者(參照小出直之編，「液晶聚酯-合成．成形．應用-」，股份有限公司CMC，1987年6月5日，p.95)。
液晶聚酯，亦可於其配合1種以上之填充材、添加劑 、液晶聚酯以外之樹脂等之其他成分，作成液晶聚酯組成物使用。
填充材，可為纖維狀填充材、亦可為板狀填充材，除纖維狀及板狀之外，亦可為球狀或其他之粒狀填充材。又，填充材，可為無機填充材、亦可為有機填充材。纖維狀無機填充材之例，可舉例如玻璃纖維；聚丙烯腈系碳纖維、瀝青系碳纖維等碳纖維；氧化矽纖維、氧化鋁纖維、氧化矽氧化鋁纖維等陶瓷纖維；及不鏽鋼纖維等金屬纖維。又，亦可聚例如鈦酸鉀晶鬚、鈦酸鋇晶鬚、矽灰石晶鬚、硼酸鋁晶鬚、氮化矽晶鬚、碳酸矽晶鬚等晶鬚。纖維狀有機填充材之例，可舉例如聚酯纖維及醯胺纖維。板狀無機填充材之例，可舉例如滑石、雲母、石墨、矽灰石、玻璃鱗片、硫酸鋇及碳酸鈣。雲母，可為白雲母、可為金雲母、可為氟金雲母、亦可為四矽雲母。粒狀無機填充材，可舉例如氧化矽、氧化鋁、氧化鈦、玻璃珠、玻璃氣球、氮化硼、碳化矽及碳酸鈣。填充材之配合量，相對於液晶聚酯100質量份，通常為0~100質量份。
其中，藉由於液晶聚酯配合玻璃纖維，若於端子支持構件含有玻璃纖維，則端子支持構件之強度容易提昇，故較佳。玻璃纖維之量，相對於液晶聚酯100質量份，較佳為10~100質量份、更佳為30~100質量份、又更佳為30~80質量份。玻璃纖維之量若過少，則強度提昇效果不充分，若過多，則容易產生異向性。又，玻璃纖維，其之數量平均纖維徑較佳為25μm以下、更佳為20μm以下，其 之數量平均纖維長度較佳為500μm以下、更佳為300μm以下。玻璃纖維之數量平均纖維徑及數量平均纖維長度，可藉以顯微鏡觀察來測定。
添加劑之例，可舉例如抗氧化劑、熱安定劑、紫外線吸收劑、抗靜電劑、界面活性劑、難燃劑及著色劑。添加劑之配合量，相對於液晶聚酯100質量份，通常為0~5質量份。
液晶聚酯以外之樹脂之例，可舉例如聚丙烯、聚醯胺、液晶聚酯以外之聚酯、聚碸、聚苯硫、聚醚酮、聚碳酸酯、聚苯醚、聚醚醯亞胺等液晶聚酯以外之熱可塑性樹脂；及酚樹脂、環氧樹脂、聚醯亞胺樹脂、氰酸酯樹脂等熱硬化性樹脂。液晶聚酯以外之樹脂之配合量，相對於液晶聚酯100質量份，通常為0~20質量份。
液晶聚酯組成物，較佳為，將液晶聚酯及視需要所使用之其他成分，使用擠製機熔融混練，擠製成顆粒狀，藉此來調製。擠製機，較佳為使用具有缸體、配置於缸體內之1根以上之螺槳、與設置於缸體之1部位以上之供給口者，更佳為使用於缸體再設置有1部位以上之閥部者。
液晶聚酯成形為端子支持構件之成形，較佳為以熔融成形法進行，更佳為以射出成形法進行。特別是，若以將端子嵌入模具，而將液晶聚酯射出之方法、亦即嵌入成形法進行，則可於將液晶聚酯成形為端子支持構件的同時，將端子與端子支持構件一體化。
藉由將端子與端子支持構件一體化，可得如圖1所示 之功率裝置用封裝。功率裝置用封裝，亦可具有端子及端子支持構件以外之構件，例如，如圖1所示將固定有功率模組的部分作為散熱板，可有效地除去由功率模組所產生的熱，例如，作為汽車用功率裝置，設置於引擎室內等於高溫下動作時為有利。
又，端子支持構件，如圖2所示亦可兼作功率裝置之密封材，具有該端子支持構件兼密封材之功率裝置，可藉由以下之方法製造：將功率裝置與端子電氣連接，嵌入模具，以將液晶聚酯射出之方法(亦即嵌入成形法)。功率裝置，亦可具有功率元件、端子及端子支持構件以外之構件，例如，可為如圖2所示固定有功率元件之部分與端子一同構成導線框架之墊片，亦可將該墊片作為散熱板的功能。
如此所得之功率裝置，可活用其之端子支持構件之耐熱性及絕緣性，作為例如汽車或電車等車輛、產業機械、OA機器及家電製品中之電力機器使用，特別適合於作為汽車用之電力機器使用。
〔實施例〕
〔液晶聚酯之開始流動溫度之測定〕
使用流動測試儀((股)島津製作所之「CFT-500型」)，將液晶聚酯約2g，充填於具有內徑1mm及長度10mm之噴嘴之安裝有模口的缸體，於9.8MPa(100kg/cm2)之荷重下，於以4℃/分鐘之速度昇溫之下，使液 晶聚酯熔融，而由噴嘴擠製，測定顯示4800Pa．s(48000泊)之黏度的溫度。
〔液晶聚酯(1)之製造〕
於具備攪拌裝置、轉矩計、氮氣導入管、溫度計及環流冷卻器的反應器，置入對羥基苯甲酸828.8g(6.0莫耳)、對苯二甲酸473.4g(2.85莫耳)、間苯二甲酸24.9g(0.15莫耳)、4,4’-二羥基聯苯558.6g(3.0莫耳)及乙酸酐1347.6g(13.2莫耳)，於氮氣氣流下，邊攪拌、邊以15分鐘由室溫昇溫至150℃，以150℃回流3小時。接著，將副生成之乙酸及未反應之乙酸酐蒸餾除去，並邊以2小時50分鐘由150℃昇溫至320℃，於確認轉矩無上升之時間點，將內容物由反應器取出，冷卻至室溫。將所得之固體成分，以粉碎機粉碎，於氮氣環境氣氛下，以1小時由室溫昇溫至250℃，以5小時由250℃昇溫至320℃，以320℃保持3小時，藉此固相聚合後，冷卻，製得粉末狀之液晶聚酯(1)。該液晶聚酯(1)，相對於總重複單元之合計量，具有來自對羥基苯甲酸之重複單元50莫耳%、來自對苯二甲酸之重複單元23.75莫耳%、來自間苯二甲酸之重複單元1.25莫耳%、來自4,4’-二羥基聯苯之重複單元25莫耳%，其之開始流動溫度為380℃。
〔液晶聚酯(2)之製造〕
於具備攪拌裝置、轉矩計、氮氣導入管、溫度計及環 流冷卻器的反應器，置入對羥基苯甲酸994.5g(7.2莫耳)、對苯二甲酸299.0g(1.8莫耳)、間苯二甲酸99.7g(0.6莫耳)、4,4’-二羥基聯苯446.9g(2.4莫耳)、乙酸酐1347.6g(13.2莫耳)及1-甲基咪唑0.18g，於氮氣氣流下，邊攪拌、邊以30分鐘由室溫昇溫至150℃，以150℃回流30分鐘。接著，加入1-甲基咪唑2.4g，將副生成之乙酸及未反應之乙酸酐蒸餾除去，並邊以2小時50分鐘由150℃昇溫至320℃，於確認轉矩無上升之時間點，將內容物由反應器取出，冷卻至室溫。將所得之固體成分，以粉碎機粉碎，於氮氣環境氣氛下，以1小時由室溫昇溫至250℃，以5小時由250℃昇溫至295℃，以295℃保持3小時，藉此固相聚合後，冷卻，製得粉末狀之液晶聚酯(2)。該液晶聚酯(2)，相對於總重複單元之合計量，具有來自對羥基苯甲酸之重複單元60莫耳%、來自對苯二甲酸之重複單元15莫耳%、來自間苯二甲酸之重複單元5莫耳%、來自4,4’-二羥基聯苯之重複單元20莫耳%，其之開始流動溫度為330℃。
〔液晶聚酯(3)之製造〕
於具備攪拌裝置、轉矩計、氮氣導入管、溫度計及環流冷卻器的反應器，置入對羥基苯甲酸994.5g(7.2莫耳)、對苯二甲酸239.2g(1.44莫耳)、間苯二甲酸159.5g(0.96莫耳)、4,4’-二羥基聯苯446.9g(2.4莫耳)、乙酸酐1347.6g(13.2莫耳)及1-甲基咪唑0.18g，於氮 氣氣流下，邊攪拌、邊以30分鐘由室溫昇溫至150℃，以150℃回流30分鐘。接著，加入1-甲基咪唑2.4g，將副生成之乙酸及未反應之乙酸酐蒸餾除去，並邊以2小時50分鐘由150℃昇溫至320℃，於確認轉矩無上升之時間點，將內容物由反應器取出，冷卻至室溫。將所得之固體成分，以粉碎機粉碎，於氮氣環境氣氛下，以1小時由室溫昇溫至220℃，以30分鐘由220℃昇溫至240℃，以240℃保持10小時，藉此固相聚合後，冷卻，製得粉末狀之液晶聚酯(3)。該液晶聚酯(3)，相對於總重複單元之合計量，具有來自對羥基苯甲酸之重複單元60莫耳%、來自對苯二甲酸之重複單元12莫耳%、來自間苯二甲酸之重複單元8莫耳%、來自4,4’-二羥基聯苯之重複單元20莫耳%，其之開始流動溫度為290℃。
〔玻璃纖維〕
玻璃纖維係使用以下者。
玻璃纖維(1)：日本板硝子(股)之「REV8」(數量平均纖維徑13μm、數量平均纖維長度70μm)玻璃纖維(2)：Central Glass(股)之「EFH75-01」(數量平均纖維徑11μm、數量平均纖維長度75μm)
實驗例1、2、比較實驗例1
將液晶聚酯(1)、(2)或(3)與玻璃纖維(1)或(2)以表1所示之比例混合，使用雙軸擠製機(池貝鐵 工(股)之「PCM-30」)，以缸體溫度390℃(液晶聚酯(1))、340℃(液晶聚酯(2))或300℃(液晶聚酯(3))進行造粒，製得顆粒狀之液晶聚酯組成物。將所得之液晶聚酯組成物進行射出成形，製得64mm×64mm×厚度0.5mm之成形體、100mm×100mm×厚度1.0mm之成形體及100mm×100mm×厚度1.6mm之成形體。對所得之成形體，根據JIS C2110，以短時間破壞試驗法於室溫下測定絕緣破壞電壓。將結果示於表1。
1‧‧‧功率元件
2‧‧‧印刷配線板
3‧‧‧端子
4‧‧‧端子支持構件
5‧‧‧散熱板
6‧‧‧密封材
7‧‧‧墊片
8‧‧‧端子支持構件兼密封材
圖1，係模式顯示功率裝置之例之截面圖。
圖2，係模式顯示功率裝置之例之截面圖。
1‧‧‧功率元件
2‧‧‧印刷配線板
3‧‧‧端子
4‧‧‧端子支持構件
5‧‧‧散熱板
6‧‧‧密封材

Claims (8)

  1. 一種功率裝置，其具有功率元件、端子、與由液晶聚酯所構成之端子支持構件，該液晶聚酯，係具有來自芳香族羥基羧酸之重複單元(1)、來自芳香族二羧酸之重複單元(2)、與來自芳香族二醇之重複單元(3)的液晶聚酯，該液晶聚酯中之來自間苯二甲酸之重複單元的含量，相對於該液晶聚酯所具有之總重複單元之合計量，為0~7莫耳%，該端子支持構件係含有玻璃纖維之構件，該玻璃纖維其之數量平均纖維長度為500μm以下，該端子支持構件中之該玻璃纖維之含量，相對於該液晶聚酯100質量份，為30~100質量份。
  2. 如申請專利範圍第1項之功率裝置，其中，該重複單元(1)，係來自對羥基苯甲酸或6-羥基-2-萘甲酸之重複單元，該重複單元(2)，係來自對苯二甲酸、間苯二甲酸或2,6-萘二羧酸之重複單元，該重複單元(3)，係來自氫醌或4,4’-二羥基聯苯之重複單元。
  3. 如申請專利範圍第1項之功率裝置，其中，該液晶聚酯，相對於其所具有之總重複單元之合計量，具有該重複單元(1)30~80莫耳%、該重複單元(2)10~35莫耳%、該重複單元(3)10~35莫耳%。
  4. 如申請專利範圍第1項之功率裝置，其中，相鄰之該端子間之距離，為0.2~1.5mm。
  5. 一種功率裝置用封裝，其係具有端子、與由液晶 聚酯所構成之端子支持構件，該液晶聚酯，係具有來自芳香族羥基羧酸之重複單元(1)、來自芳香族二羧酸之重複單元(2)、與來自芳香族二醇之重複單元(3)的液晶聚酯，該液晶聚酯中之來自間苯二甲酸之重複單元的含量，相對於該液晶聚酯所具有之總重複單元之合計量，為0~7莫耳%，該端子支持構件係含有玻璃纖維之構件，該玻璃纖維其之數量平均纖維長度為500μm以下，該端子支持構件中之該玻璃纖維之含量，相對於該液晶聚酯100質量份，為30~100質量份。
  6. 如申請專利範圍第5項之功率裝置用封裝，其中，該重複單元(1)，係來自對羥基苯甲酸或6-羥基-2-萘甲酸之重複單元，該重複單元(2)，係來自對苯二甲酸、間苯二甲酸或2,6-萘二羧酸之重複單元，該重複單元(3)，係來自氫醌或4,4’-二羥基聯苯之重複單元。
  7. 如申請專利範圍第5項之功率裝置用封裝，其中，該液晶聚酯，相對於其所具有之總重複單元之合計量，具有該重複單元(1)30~80莫耳%、該重複單元(2)10~35莫耳%、該重複單元(3)10~35莫耳%。
  8. 如申請專利範圍第5項之功率裝置用封裝，其中，相鄰之該端子間之距離，為0.2~1.5mm。
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