TWI534932B - Wafer transfer mechanism - Google Patents

Wafer transfer mechanism Download PDF

Info

Publication number
TWI534932B
TWI534932B TW100133630A TW100133630A TWI534932B TW I534932 B TWI534932 B TW I534932B TW 100133630 A TW100133630 A TW 100133630A TW 100133630 A TW100133630 A TW 100133630A TW I534932 B TWI534932 B TW I534932B
Authority
TW
Taiwan
Prior art keywords
wafer
holding
polishing
transfer mechanism
wafer transfer
Prior art date
Application number
TW100133630A
Other languages
English (en)
Chinese (zh)
Other versions
TW201222705A (en
Inventor
Yasutaka Mizomoto
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201222705A publication Critical patent/TW201222705A/zh
Application granted granted Critical
Publication of TWI534932B publication Critical patent/TWI534932B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW100133630A 2010-10-18 2011-09-19 Wafer transfer mechanism TWI534932B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010233938A JP5669518B2 (ja) 2010-10-18 2010-10-18 ウエーハ搬送機構

Publications (2)

Publication Number Publication Date
TW201222705A TW201222705A (en) 2012-06-01
TWI534932B true TWI534932B (zh) 2016-05-21

Family

ID=46039631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100133630A TWI534932B (zh) 2010-10-18 2011-09-19 Wafer transfer mechanism

Country Status (4)

Country Link
JP (1) JP5669518B2 (ko)
KR (1) KR101757932B1 (ko)
CN (1) CN102456600B (ko)
TW (1) TWI534932B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5999972B2 (ja) * 2012-05-10 2016-09-28 株式会社ディスコ 保持テーブル
JP5989501B2 (ja) * 2012-10-22 2016-09-07 株式会社ディスコ 搬送方法
JP2014110270A (ja) * 2012-11-30 2014-06-12 Disco Abrasive Syst Ltd 洗浄装置
JP6335672B2 (ja) * 2014-06-17 2018-05-30 株式会社ディスコ 搬送装置
JP7320940B2 (ja) * 2018-12-17 2023-08-04 株式会社東京精密 ウェハ保持装置及びウェハ搬送保持装置
JP7159898B2 (ja) * 2019-02-14 2022-10-25 株式会社Sumco ウェーハ回収装置、研磨システム、および、ウェーハ回収方法
JP7358096B2 (ja) * 2019-07-11 2023-10-10 株式会社ディスコ ウエーハ搬送機構および研削装置
KR20210084058A (ko) 2019-12-27 2021-07-07 삼성전자주식회사 기판 이송 장치 및 이를 이용한 기판 이송 시스템

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3082603B2 (ja) * 1994-11-22 2000-08-28 住友金属工業株式会社 ウエハ搬送装置
JP2000106390A (ja) * 1998-09-29 2000-04-11 Disco Abrasive Syst Ltd ウェーハ搬送装置
JP4634949B2 (ja) * 2006-03-20 2011-02-16 株式会社ディスコ ウエーハの保持パッド
JP2009252877A (ja) * 2008-04-03 2009-10-29 Disco Abrasive Syst Ltd ウエーハの搬送方法および搬送装置
JP5179928B2 (ja) * 2008-04-11 2013-04-10 株式会社ディスコ ウエーハの搬出方法
JP5137747B2 (ja) * 2008-08-28 2013-02-06 株式会社ディスコ ワーク保持機構
JP5318536B2 (ja) * 2008-11-10 2013-10-16 株式会社ディスコ 研削装置
JP5350818B2 (ja) * 2009-01-27 2013-11-27 株式会社ディスコ 研削装置

Also Published As

Publication number Publication date
CN102456600B (zh) 2016-08-17
CN102456600A (zh) 2012-05-16
JP5669518B2 (ja) 2015-02-12
KR101757932B1 (ko) 2017-07-13
KR20120040104A (ko) 2012-04-26
JP2012089627A (ja) 2012-05-10
TW201222705A (en) 2012-06-01

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