TWI534932B - Wafer transfer mechanism - Google Patents
Wafer transfer mechanism Download PDFInfo
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- TWI534932B TWI534932B TW100133630A TW100133630A TWI534932B TW I534932 B TWI534932 B TW I534932B TW 100133630 A TW100133630 A TW 100133630A TW 100133630 A TW100133630 A TW 100133630A TW I534932 B TWI534932 B TW I534932B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本發明係有關一種保持半導體晶圓等之晶圓且將其搬送之晶圓搬送機構。 The present invention relates to a wafer transfer mechanism that holds a wafer of a semiconductor wafer or the like and transports the wafer.
在半導體裝置製程中，半導體晶圓之表面在藉由被稱為切割線之複數分割預定線而劃分的各領域形成有半導體裝置。半導體晶圓藉由研磨裝置研磨背面而加工成預定厚度之後，藉由切割裝置沿著切割線切削藉以分割成各個裝置，以製造IC、LSI等半導體裝置。 In the semiconductor device process, the surface of the semiconductor wafer is formed with semiconductor devices in various fields divided by a plurality of predetermined dividing lines called dicing lines. The semiconductor wafer is processed into a predetermined thickness by polishing the back surface by a polishing device, and then cut into individual devices by cutting along the dicing line to manufacture a semiconductor device such as an IC or an LSI.
研磨裝置係大概由保持晶圓之夾頭台、研磨保持於夾頭台之晶圓的研磨機構、從夾頭台搬出研磨後晶圓之晶圓搬送機構、清洗搬出後之晶圓的研磨面之旋轉清洗單元所形成，可將晶圓加工到所希望的厚度(例如參照特開2003-300155號公報)。 The polishing apparatus is mainly a polishing apparatus that holds a wafer chuck, a polishing mechanism that polishes and holds the wafer on the chuck table, a wafer transfer mechanism that removes the polished wafer from the chuck stage, and a polishing surface of the wafer after cleaning and carrying out The rotary cleaning unit is formed to process the wafer to a desired thickness (for example, see JP-A-2003-300155).
研磨晶圓背面之研磨裝置將晶圓研磨的較薄且要求研磨後晶圓之研磨面不附著微細的研磨屑。又，以研磨裝置研磨晶圓的背面，之後，有晶圓的背面形成次裝置(再配線層)的情況，在如此之情況必須使附著於晶圓背面之研磨屑等之沾汙低於基準值。 The polishing device that polishes the back surface of the wafer grinds the wafer to a thin surface and requires that the polished surface of the polished wafer does not adhere to fine abrasive grains. Further, the back surface of the wafer is polished by a polishing apparatus, and then a secondary device (rewiring layer) is formed on the back surface of the wafer. In such a case, it is necessary to make the contamination of the polishing paste adhering to the back surface of the wafer lower than the reference. value.
以往，一般來說，將研磨完之晶圓從夾頭台搬出之際，利用安裝於可旋動臂之前端的真空吸引式吸附墊來吸引晶 圓，並從夾頭台搬送到清洗單元。 In the past, in general, when the polished wafer was carried out from the chuck stage, the vacuum suction type adsorption pad attached to the front end of the rotatable arm was used to attract the crystal. Round and transported from the chuck to the cleaning unit.
【專利文獻1】特開2003-300155號公報 [Patent Document 1] JP-A-2003-300155
但是，在使用吸附墊之晶圓搬送裝置中，剛研磨後之晶圓為了清洗研磨面而搬送至清洗單元，然而有著所謂起因於晶圓搬送機構之吸附墊的吸引，且晶圓之背面乾燥，超過基準值之沾汙附著於晶圓的背面，即使以清洗單元清洗也無法去除研磨屑等沾汙的困難之問題。 However, in the wafer transfer apparatus using the adsorption pad, the wafer immediately after polishing is transferred to the cleaning unit for cleaning the polishing surface, but there is attraction of the adsorption pad caused by the wafer transfer mechanism, and the back surface of the wafer is dried. The contamination exceeding the reference value adheres to the back surface of the wafer, and even if it is cleaned by the cleaning unit, the problem of contamination such as polishing dust cannot be removed.
本發明係鑑於如此之點而完成者，其目的在於提供一種不汙染研磨後之晶圓的研磨面且研磨屑不附著於研磨面之晶圓搬送機構。 The present invention has been made in view of such circumstances, and an object thereof is to provide a wafer transfer mechanism that does not contaminate a polished surface of a polished wafer and that does not adhere to the polished surface.
依據本發明，提供一種晶圓搬送機構，係保持並搬送晶圓者，其特徵在於具備有：臂部；及保持墊，係透過彈性支持手段支持於該臂部之前端，並吸引保持晶圓者，該保持墊包含有吸引保持晶圓之外周的環狀吸引保持部、被該環狀吸引保持部圍繞且在與被吸引保持之晶圓之間形成空間的凹部、將液體供給到該凹部之液體供給部、及自該凹部排出液體且形成於該環狀吸引保持部之排出部。 According to the present invention, there is provided a wafer transfer mechanism for holding and transporting a wafer, comprising: an arm portion; and a holding pad supported by the elastic support means at a front end of the arm portion and sucking and holding the wafer The holding mat includes an annular suction holding portion that sucks and holds the outer circumference of the wafer, a concave portion surrounded by the annular suction holding portion and forms a space between the suction and holding wafer, and supplies the liquid to the concave portion. The liquid supply unit and the discharge unit that discharges the liquid from the recess and is formed in the annular suction holding unit.
依據本發明之晶圓搬送機構，由於利用環狀之吸引保 持部保持研磨後之晶圓的外周部，因此，接觸於晶圓研磨面的部分較少之外，由於一面經常以水之層填滿晶圓研磨面，一面從夾頭台搬送晶圓到清洗單元，所以研磨面不乾燥，而可防止超過基準值之沾汙附著。 The wafer transfer mechanism according to the present invention is protected by the use of a ring Since the holding portion holds the outer peripheral portion of the polished wafer, the portion that is in contact with the polished surface of the wafer is small, and the wafer is transferred from the chuck to the wafer while the wafer is often filled with a layer of water. The unit is cleaned so that the polished surface is not dried, and contamination adhering beyond the reference value can be prevented.
第1圖係半導體晶圓之表面側立體圖。 Fig. 1 is a perspective view of a surface side of a semiconductor wafer.
第2圖係表面貼附保護膠帶狀態之半導體晶圓的背面側立體圖。 Fig. 2 is a perspective view showing the back side of a semiconductor wafer in which a protective tape is attached to the surface.
第3圖係具備本發明之晶圓搬送機構之研磨裝置的立體圖。 Fig. 3 is a perspective view of a polishing apparatus including the wafer transfer mechanism of the present invention.
第4圖係本發明實施形態之晶圓搬送機構的立體圖。 Fig. 4 is a perspective view showing a wafer transfer mechanism according to an embodiment of the present invention.
第5圖係晶圓搬送機構之主要部分斷面圖。 Fig. 5 is a cross-sectional view showing the main part of the wafer transfer mechanism.
第6圖係保持墊之背面側立體圖。 Figure 6 is a perspective view of the back side of the holding mat.
第7圖係顯示水從排出部排出之狀態的保持墊部分之立體圖。 Fig. 7 is a perspective view showing a portion of the holding mat in a state where water is discharged from the discharge portion.
以下，一面參照圖示一面詳細說明本發明實施形態之晶圓搬送機構。第1圖係加工至預定厚度前之半導體晶圓11的立體圖。第1圖所示之半導體晶圓11例如係由厚度為700μm之矽晶圓11構成，且於表面11a複數切割線(分割預定線)13形成格子狀，並且藉由該複數切割線13所劃分之複數領域形成有IC、LSI等裝置15。 Hereinafter, the wafer transfer mechanism according to the embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a perspective view of the semiconductor wafer 11 before being processed to a predetermined thickness. The semiconductor wafer 11 shown in FIG. 1 is formed, for example, of a silicon wafer 11 having a thickness of 700 μm, and is formed in a lattice shape by a plurality of cutting lines (divided lines) 13 on the surface 11a, and is divided by the plurality of cutting lines 13. Devices 15 such as ICs and LSIs are formed in the plural field.
如此構成之半導體晶圓11係具有形成有裝置15之裝置 領域17、及圍繞裝置領域17之外周剩餘領域19。又，半導體晶圓17之外周形成有作為顯示矽晶圓之結晶方位之標示的切口21。 The semiconductor wafer 11 thus constructed has a device in which the device 15 is formed Field 17, and the remaining areas of the periphery of the device field 17 are 19. Further, a slit 21 as a mark indicating the crystal orientation of the germanium wafer is formed on the outer periphery of the semiconductor wafer 17.
在研磨半導體晶圓11背面11b前，半導體晶圓11表面11a藉由保護膠帶貼附步驟而貼附有保護膠帶23。因此，半導體晶圓11表面11a藉由保護膠帶23保護，而如第2圖所示般成為背面露出的形態。也可使用具剛性之玻璃等保護構件替代保護膠帶23。 Before the back surface 11b of the semiconductor wafer 11 is polished, the surface 11a of the semiconductor wafer 11 is attached with a protective tape 23 by a protective tape attaching step. Therefore, the surface 11a of the semiconductor wafer 11 is protected by the protective tape 23, and as shown in Fig. 2, the back surface is exposed. It is also possible to replace the protective tape 23 with a protective member such as a rigid glass.
其次，參照第3圖，就有關採用本發明實施形態之晶圓搬送機構的研磨裝置進行說明。4是研磨裝置2之基座，基座的後方垂直地豎立設置有二個柱部6a、6b。柱部6a固定有於上下方向延伸之一對導軌(只圖示一根)8。 Next, a polishing apparatus using the wafer transfer mechanism according to the embodiment of the present invention will be described with reference to Fig. 3 . 4 is a base of the polishing apparatus 2, and two column portions 6a, 6b are vertically erected at the rear of the base. The column portion 6a is fixed to a pair of guide rails (only one shown) 8 extending in the vertical direction.
沿著該一對導軌8於上下方向可移動地裝設有粗研磨單元10。粗研磨單元10安裝在其殼體20會沿著一對導軌8而於上下方向移動之移動基台12上。 A rough polishing unit 10 is movably mounted in the vertical direction along the pair of guide rails 8. The rough grinding unit 10 is mounted on a moving base 12 whose casing 20 is moved in the vertical direction along a pair of guide rails 8.
粗研磨單元10包含有殼體20、可旋轉地收容於殼體20中之未圖示的心軸、旋轉驅動心軸之伺服馬達22、及具有固定於心軸前端之複數粗研磨用之研磨砥石26的研磨輪24。 The rough polishing unit 10 includes a casing 20, a spindle (not shown) rotatably accommodated in the casing 20, a servo motor 22 that rotationally drives the spindle, and a plurality of coarse grindings fixed to the tip end of the spindle. Grinding wheel 24 of vermiculite 26.
粗研磨單元10具有由沿著一對導軌8將粗研磨單元10於上下方向移動之滾珠螺桿14與脈衝馬達16構成之粗研磨單元移動機構18。脈衝驅動脈衝馬達16時，滾珠螺桿14旋轉，移動基台12沿上下方向移動。 The rough grinding unit 10 has a coarse grinding unit moving mechanism 18 composed of a ball screw 14 that moves the rough grinding unit 10 in the vertical direction along a pair of guide rails 8 and a pulse motor 16. When the pulse motor 16 is pulse-driven, the ball screw 14 rotates, and the moving base 12 moves in the vertical direction.
另一柱部6b也固定有朝上下方向延伸之一對導軌(僅 圖示一根)19。沿著該一對導軌19裝設有可朝上下方向移動的修整研磨單元28。 The other column portion 6b is also fixed with a pair of guide rails extending in the up and down direction (only Show a) 19. A dressing and polishing unit 28 that is movable in the vertical direction is attached along the pair of guide rails 19.
修整研磨單元28係安裝於其殼體36會沿著一對導軌19而朝上下方向移動之未圖示的移動基台。修整研磨單元28包含有殼體36、可旋轉地收容於殼體36中之未圖示的心軸、旋轉驅動心軸之伺服馬達38、及具有固定於心軸前端之修整研磨用的研磨砥石42之研磨輪40。 The dressing and polishing unit 28 is attached to a moving base (not shown) in which the casing 36 moves in the vertical direction along the pair of guide rails 19. The dressing and polishing unit 28 includes a casing 36, a spindle (not shown) rotatably accommodated in the casing 36, a servo motor 38 that rotationally drives the spindle, and a grinding stone having trimming and polishing fixed to the tip end of the spindle. 42 grinding wheel 40.
修整研磨單元28具有由沿著一對導軌19將修整研磨單元28於上下方向移動之滾珠螺桿30與脈衝馬達32構成之修整研磨單元移動機構34。驅動脈衝馬達32時，滾珠螺桿30旋轉，修整研磨單元28沿上下方向移動。 The dressing and polishing unit 28 has a dressing and polishing unit moving mechanism 34 composed of a ball screw 30 and a pulse motor 32 that move the dressing and polishing unit 28 in the vertical direction along a pair of guide rails 19. When the pulse motor 32 is driven, the ball screw 30 rotates, and the dressing and polishing unit 28 moves in the vertical direction.
研磨裝置2具備有於柱部6a、6b側配設成與基座4之上面大略呈無段差的轉動台44。轉動台44形成比較上大直徑的圓盤狀，且藉由未圖示之旋轉驅動機構而朝箭頭45所示方向旋轉。 The polishing apparatus 2 is provided with a turntable 44 that is disposed on the side of the column portions 6a and 6b so as to be substantially indistinguishable from the upper surface of the susceptor 4. The turntable 44 is formed in a disk shape having a relatively large diameter, and is rotated in a direction indicated by an arrow 45 by a rotation drive mechanism (not shown).
3個相互地於圓周方向離開1200的夾頭台46係在水平面內可旋轉地配置於轉動台44上。夾頭台46具有藉由多孔陶瓷材而形成圓盤狀之吸附部，並藉由作動真空吸引手段而吸引保持載置在吸附部之保持面上的晶圓。 Three chuck stages 46 that are spaced apart from each other in the circumferential direction by 120 0 are rotatably disposed on the rotating table 44 in a horizontal plane. The chuck table 46 has a disk-shaped adsorption portion formed of a porous ceramic material, and sucks and holds the wafer placed on the holding surface of the adsorption portion by a vacuum suction means.
配設於轉動台44之3個夾頭台46藉由適宜旋轉轉動台44，而依序移動到晶圓搬入搬出領域A、粗研磨加工領域B、修整研磨加工領域C及晶圓搬入搬出領域A。 The three chuck stages 46 disposed on the rotating table 44 are sequentially moved to the wafer loading/unloading area A, the rough grinding processing area B, the finishing polishing processing field C, and the wafer loading and unloading field by appropriately rotating the rotating table 44. A.
基座4之前側部分配設有第1晶圓匣50、第2晶圓匣66、具有連桿機構51及手部52之晶圓搬送機器人54、具有複數 定位銷58之定位台56、晶圓搬入機構(加載臂)60、晶圓搬出機構(卸載臂)62及旋轉清洗單元64。 The first wafer cassette 50, the second wafer cassette 66, and the wafer transfer robot 54 having the link mechanism 51 and the hand 52 are disposed on the front side of the susceptor 4, and have a plurality of wafer transfer robots 54 The positioning table 56 of the positioning pin 58, the wafer loading mechanism (loading arm) 60, the wafer unloading mechanism (unloading arm) 62, and the rotary cleaning unit 64.
旋轉清洗單元64具有吸引保持並旋轉晶圓之旋轉台68。70係旋轉清洗單元64之外罩。晶圓搬出機構62構成本發明實施形態之晶圓搬送機構。 The rotary cleaning unit 64 has a rotary table 68 that attracts and rotates the wafer. The 70-series rotates the cleaning unit 64 to cover the outer cover. The wafer unloading mechanism 62 constitutes a wafer transfer mechanism according to an embodiment of the present invention.
研磨後之晶圓11為了清洗研磨面而搬送至旋轉清洗單元64，然而利用吸附墊吸附晶圓之研磨面而搬送時，由於吸附墊接觸晶圓之研磨面而擔心會汙染研磨面。 The polished wafer 11 is conveyed to the spin cleaning unit 64 in order to clean the polishing surface. However, when the polishing pad is used to adsorb the polishing surface of the wafer and is transported, the adsorption pad contacts the polishing surface of the wafer to cause contamination of the polishing surface.
再者，晶圓搬送時會發生所謂起因於吸附墊的吸引且晶圓之背面乾燥，研磨屑固著於晶圓之研磨面，即使在旋轉清洗單元64清洗也不會掉落的問題。參照第4圖至第7圖詳細說明解決該問題之本發明實施形態之晶圓搬送機構62。 Further, during the wafer transfer, the suction due to the suction pad is caused and the back surface of the wafer is dried, and the polishing particles are fixed to the polishing surface of the wafer, and the polishing cleaning unit 64 does not fall even if it is cleaned. The wafer transfer mechanism 62 according to the embodiment of the present invention for solving the above problems will be described in detail with reference to Figs. 4 to 7 .
晶圓搬送機構62如第4圖所示，包含有可朝上下方向移動之柱部72、可旋動地裝設於柱部72之前端部的臂部74、及安裝於臂部74之前端部的保持墊(吸附墊)76。 As shown in Fig. 4, the wafer transfer mechanism 62 includes a column portion 72 that is movable in the vertical direction, an arm portion 74 that is rotatably attached to the end portion of the column portion 72, and a front end that is attached to the arm portion 74. The holding pad (adsorption pad) 76 of the part.
如第5圖所示，臂部74之前端部形成有插入孔75，保持墊76之支持部78插入到該插入孔75中，藉由在保持墊76與臂部74之間夾設螺旋彈簧80，而使保持部76彈性地支持於臂部74之前端。 As shown in Fig. 5, the front end portion of the arm portion 74 is formed with an insertion hole 75 into which the support portion 78 of the holding pad 76 is inserted, by interposing a coil spring between the holding pad 76 and the arm portion 74. 80, while the holding portion 76 is elastically supported at the front end of the arm portion 74.
如第6圖所最佳顯示般，保持墊76具有吸引保持晶圓11外周的環狀之吸引保持部82、及被環狀吸引保持部82圍繞且在與晶圓11之間形成空間的圓形凹部84。且，吸引保持部82與圓形凹部84之階差h形成為1~2mm左右。 As shown in FIG. 6, the holding pad 76 has an annular suction holding portion 82 that sucks and holds the outer periphery of the wafer 11, and a circle that is surrounded by the annular suction holding portion 82 and forms a space with the wafer 11. A concave portion 84. Further, the step h of the suction holding portion 82 and the circular concave portion 84 is formed to be about 1 to 2 mm.
環狀之吸引保持部82上形成有複數吸引孔86，如第5圖所示，該等吸引孔86透過環狀吸引路88及吸引口90而連接於吸引源92。環狀之吸引保持部82上更形成有複數(本實施形態為4個)排出部94。 A plurality of suction holes 86 are formed in the annular suction holding portion 82. As shown in Fig. 5, the suction holes 86 are connected to the suction source 92 through the annular suction path 88 and the suction port 90. Further, in the annular suction holding portion 82, a plurality of (four in the present embodiment) discharge portions 94 are formed.
圓形凹部84形成有將水供給到圓形凹部84之複數(本實施形態為4個)供給孔96，該等供給孔96透過配設於保持墊76表面之可撓性配管98，如第5圖所示，而連接於水源100。 The circular recessed portion 84 is formed with a plurality of (four in the present embodiment) supply holes 96 for supplying water to the circular recessed portion 84, and the supply holes 96 pass through the flexible piping 98 disposed on the surface of the holding mat 76, as described in 5 is connected to the water source 100.
以下，就有關如上述構成之本發明實施形態之晶圓搬送機構(晶圓搬出機構)62的作用，進行說明。粗研磨單元10所產生之粗研磨及修整研磨單元28所產生之修整研磨完成後之晶圓11係旋轉轉動台44而固定位置於晶圓搬入搬出領域A。 Hereinafter, the operation of the wafer transfer mechanism (wafer carry-out mechanism) 62 according to the embodiment of the present invention configured as described above will be described. The wafer 11 after the finish polishing by the rough polishing and trimming polishing unit 28 generated by the rough polishing unit 10 rotates the turntable 44 to be fixed at the wafer loading/unloading area A.
其次，旋動晶圓搬送機構之臂部74，而使保持墊76固定位置於保持在夾頭台46的晶圓11之上，並使柱部72下降而使保持墊76抵接於晶圓11的背面(研磨面)11b。 Next, the arm portion 74 of the wafer transfer mechanism is rotated, and the holding pad 76 is fixedly positioned on the wafer 11 held by the chuck table 46, and the column portion 72 is lowered to bring the holding pad 76 into contact with the wafer. 11 back (grinding surface) 11b.
然後，解除夾頭台46的吸引保持之後，以保持墊76之環狀吸引保持部82吸引保持晶圓11之外周部。因此，晶圓11之研磨面與保持墊76之間藉由圓形凹部84而形成空間，晶圓11只在其外周部藉由保持墊76而被保持吸引。 Then, after the suction holding of the chuck table 46 is released, the outer peripheral portion of the wafer 11 is sucked and held by the annular suction holding portion 82 of the holding pad 76. Therefore, a space is formed between the polishing surface of the wafer 11 and the holding pad 76 by the circular recess 84, and the wafer 11 is held and attracted only by the holding pad 76 at the outer peripheral portion thereof.
水從連接於水源100之供給孔96供給到圓形凹部84內，吸引保持晶圓11之圓形凹部84內以水填滿，如第7圖所示，排水102從形成於環狀之吸引保持部82的排出部94排出。 The water is supplied from the supply hole 96 connected to the water source 100 into the circular recess 84, and the circular concave portion 84 of the holding wafer 11 is sucked and filled with water. As shown in Fig. 7, the drainage 102 is attracted from the annular shape. The discharge portion 94 of the holding portion 82 is discharged.
在該狀態下，將柱部72朝預定距離上方移動，且從夾頭台46使晶圓11上升，再藉由旋動臂部74而在以保持墊76吸引保持晶圓11的狀態下搬送晶圓11直到旋轉清洗單元64之旋轉台68，且解除保持墊76之環狀吸引保持部82的吸引。 In this state, the column portion 72 is moved upward by a predetermined distance, and the wafer 11 is lifted from the chuck table 46, and the arm portion 74 is swung, and the wafer 11 is sucked and held by the holding pad 76. The wafer 11 is rotated until the rotary table 68 of the cleaning unit 64 is rotated, and the suction of the annular suction holding portion 82 of the holding pad 76 is released.
在旋轉清洗單元64中，利用旋轉台68吸引保持晶圓11，一面將旋轉台68旋轉一面清洗晶圓11。晶圓11之清洗完成時，利用旋轉清洗單元64旋轉乾燥晶圓11之後，以晶圓搬送機器人54之手部52吸引保持晶圓11，將晶圓11收容於第2晶圓匣62的預定處所。 In the spin cleaning unit 64, the wafer 11 is sucked and held by the turntable 68, and the wafer 11 is cleaned while rotating the turntable 68. When the cleaning of the wafer 11 is completed, the wafer 11 is rotated and dried by the rotary cleaning unit 64, and then the wafer 52 is sucked and held by the hand 52 of the wafer transfer robot 54 to store the wafer 11 in the second wafer cassette 62. Premises.
依據上述實施形態之晶圓搬送機構62，由於一面利用環狀之吸引保持部82保持研磨後之晶圓11的外周部一面進行搬送，因此接觸於晶圓研磨面的部分較少之外，由於一面在晶圓11之研磨面經常形成水之層一面進行搬送，因此晶圓11之研磨面不會乾燥，且徹底防止研磨屑等所產生之沾污的晶圓研磨面之汙染，而可從夾頭台46到清洗單元64搬送晶圓。 According to the wafer transfer mechanism 62 of the above-described embodiment, the outer peripheral portion of the wafer 11 after polishing is held by the annular suction holding portion 82, so that the portion that is in contact with the wafer polishing surface is small, Since the polishing surface of the wafer 11 is often formed by transporting a layer of water, the polished surface of the wafer 11 is not dried, and the contamination of the polished surface of the wafer by the grinding debris or the like is completely prevented. The chuck table 46 reaches the cleaning unit 64 to transport the wafer.
2‧‧‧研磨裝置 2‧‧‧grinding device
4‧‧‧基座 4‧‧‧Base
6a‧‧‧柱部 6a‧‧‧ pillar
6b‧‧‧柱部 6b‧‧‧ pillar
8‧‧‧導軌 8‧‧‧rail
10‧‧‧粗研磨單元 10‧‧‧Rough grinding unit
11‧‧‧半導體晶圓 11‧‧‧Semiconductor wafer
11a‧‧‧表面 11a‧‧‧ surface
11b‧‧‧背面 11b‧‧‧Back
12‧‧‧移動基台 12‧‧‧Mobile Abutment
13‧‧‧切割線 13‧‧‧ cutting line
14‧‧‧滾珠螺桿 14‧‧‧Ball screw
15‧‧‧裝置 15‧‧‧ device
16‧‧‧脈衝馬達 16‧‧‧pulse motor
17‧‧‧裝置領域 17‧‧‧Device area
18‧‧‧粗研磨單元移動機構 18‧‧‧ coarse grinding unit moving mechanism
19‧‧‧外周剩餘領域 19‧‧‧Remaining areas of the periphery
20‧‧‧殼體 20‧‧‧shell
21‧‧‧伺服馬達 21‧‧‧Servo motor
22‧‧‧伺服馬達 22‧‧‧Servo motor
23‧‧‧保護膠帶 23‧‧‧Protection tape
24‧‧‧研磨輪 24‧‧‧ grinding wheel
26‧‧‧研磨砥石 26‧‧‧ grinding diamonds
28‧‧‧修整研磨單元 28‧‧‧Finishing grinding unit
30‧‧‧滾珠螺桿 30‧‧‧Ball screw
32‧‧‧脈衝馬達 32‧‧‧pulse motor
34‧‧‧修整研磨單元移動機構 34‧‧‧Finishing grinding unit moving mechanism
36‧‧‧殼體 36‧‧‧Shell
38‧‧‧伺服馬達 38‧‧‧Servo motor
40‧‧‧研磨輪 40‧‧‧ grinding wheel
42‧‧‧研磨砥石 42‧‧‧ grinding diamonds
44‧‧‧轉動台 44‧‧‧Rotating table
45‧‧‧箭頭 45‧‧‧ arrow
46‧‧‧夾頭台 46‧‧‧ chuck table
50‧‧‧第1晶圓匣 50‧‧‧First Wafer匣
51‧‧‧連桿機構 51‧‧‧ linkage mechanism
52‧‧‧手部 52‧‧‧Hands
54‧‧‧晶圓搬送機器人 54‧‧‧ wafer transfer robot
56‧‧‧定位台 56‧‧‧ positioning table
58‧‧‧定位銷 58‧‧‧Locating pin
60‧‧‧晶圓搬入機構 60‧‧‧ wafer loading mechanism
62‧‧‧晶圓搬送機構 62‧‧‧ wafer transfer mechanism
64‧‧‧旋轉清洗單元 64‧‧‧Rotary cleaning unit
66‧‧‧第2晶圓匣 66‧‧‧2nd wafer crucible
68‧‧‧旋轉台 68‧‧‧Rotating table
70‧‧‧外罩 70‧‧‧ Cover
72‧‧‧柱部 72‧‧‧ Column
74‧‧‧臂部 74‧‧‧arm
75‧‧‧插入孔 75‧‧‧ insertion hole
76‧‧‧保持部 76‧‧‧ Keeping Department
78‧‧‧支持部 78‧‧‧Support Department
80‧‧‧螺旋彈簧 80‧‧‧Helical spring
82‧‧‧吸引保持部 82‧‧‧Attraction and Maintenance Department
84‧‧‧凹部 84‧‧‧ recess
86‧‧‧吸引孔 86‧‧‧Attraction hole
88‧‧‧吸引路 88‧‧‧Attracting the way
90‧‧‧吸引口 90‧‧‧ attracting mouth
92‧‧‧吸引源 92‧‧‧Attraction source
94‧‧‧排出部 94‧‧‧Exporting Department
96‧‧‧供給孔 96‧‧‧Supply hole
98‧‧‧可撓性配管 98‧‧‧Flexible piping
100‧‧‧水源 100‧‧‧Water source
102‧‧‧排水 102‧‧‧Drainage
A‧‧‧搬出領域 A‧‧‧ moving out of the field
B‧‧‧粗研磨加工領域 B‧‧‧Rough grinding processing
C‧‧‧修整研磨加工領域 C‧‧‧Finishing and grinding
第1圖係半導體晶圓之表面側立體圖。 Fig. 1 is a perspective view of a surface side of a semiconductor wafer.
第2圖係表面貼附保護膠帶狀態之半導體晶圓的背面側立體圖。 Fig. 2 is a perspective view showing the back side of a semiconductor wafer in which a protective tape is attached to the surface.
第3圖係具備本發明之晶圓搬送機構之研磨裝置的立體圖。 Fig. 3 is a perspective view of a polishing apparatus including the wafer transfer mechanism of the present invention.
第4圖係本發明實施形態之晶圓搬送機構的立體圖。 Fig. 4 is a perspective view showing a wafer transfer mechanism according to an embodiment of the present invention.
第5圖係晶圓搬送機構之主要部分斷面圖。 Fig. 5 is a cross-sectional view showing the main part of the wafer transfer mechanism.
第6圖係保持墊之背面側立體圖。 Figure 6 is a perspective view of the back side of the holding mat.
第7圖係顯示水從排出部排出之狀態的保持墊部分之立體圖。 Fig. 7 is a perspective view showing a portion of the holding mat in a state where water is discharged from the discharge portion.
62．．．晶圓搬送機構62. . . Wafer transfer mechanism
74．．．臂部74. . . Arm
75．．．插入孔75. . . Insertion hole
76．．．保持部76. . . Holding department
78．．．支持部78. . . Support department
80．．．螺旋彈簧80. . . Coil spring
82．．．吸引保持部82. . . Attraction retention department
84．．．凹部84. . . Concave
86．．．吸引孔86. . . Attraction hole
88．．．吸引路88. . . Attracting the way
90．．．吸引口90. . . Attraction
92．．．吸引源92. . . Attracting source
98．．．可撓性配管98. . . Flexible piping
100．．．水源100. . . Water source
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| JP2010233938A JP5669518B2 (en) | 2010-10-18 | 2010-10-18 | Wafer transfer mechanism |
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| TWI534932B true TWI534932B (en) | 2016-05-21 |
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| KR (1) | KR101757932B1 (en) |
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| JP5999972B2 (en) * | 2012-05-10 | 2016-09-28 | 株式会社ディスコ | Holding table |
| JP5989501B2 (en) * | 2012-10-22 | 2016-09-07 | 株式会社ディスコ | Transport method |
| JP2014110270A (en) * | 2012-11-30 | 2014-06-12 | Disco Abrasive Syst Ltd | Cleaning device |
| JP6335672B2 (en) * | 2014-06-17 | 2018-05-30 | 株式会社ディスコ | Transport device |
| JP7320940B2 (en) * | 2018-12-17 | 2023-08-04 | 株式会社東京精密 | Wafer holding device and wafer carrier holding device |
| JP7159898B2 (en) * | 2019-02-14 | 2022-10-25 | 株式会社Sumco | Wafer recovery device, polishing system, and wafer recovery method |
| JP7358096B2 (en) * | 2019-07-11 | 2023-10-10 | 株式会社ディスコ | Wafer transport mechanism and grinding equipment |
| KR20210084058A (en) | 2019-12-27 | 2021-07-07 | 삼성전자주식회사 | Semiconductor substrate transfer apparatus and substrate transfer system using the same |
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| JP3082603B2 (en) * | 1994-11-22 | 2000-08-28 | 住友金属工業株式会社 | Wafer transfer device |
| JP2000106390A (en) * | 1998-09-29 | 2000-04-11 | Disco Abrasive Syst Ltd | Wafer-carrier device |
| JP4634949B2 (en) * | 2006-03-20 | 2011-02-16 | 株式会社ディスコ | Wafer holding pad |
| JP2009252877A (en) * | 2008-04-03 | 2009-10-29 | Disco Abrasive Syst Ltd | Conveying method and conveying device for wafer |
| JP5179928B2 (en) * | 2008-04-11 | 2013-04-10 | 株式会社ディスコ | How to carry out the wafer |
| JP5137747B2 (en) * | 2008-08-28 | 2013-02-06 | 株式会社ディスコ | Work holding mechanism |
| JP5318536B2 (en) * | 2008-11-10 | 2013-10-16 | 株式会社ディスコ | Grinding equipment |
| JP5350818B2 (en) * | 2009-01-27 | 2013-11-27 | 株式会社ディスコ | Grinding equipment |
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| TW201222705A (en) | 2012-06-01 |
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| CN102456600B (en) | 2016-08-17 |
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