TWI533988B - 具實心芯之研磨物件及其製造方法 - Google Patents

具實心芯之研磨物件及其製造方法 Download PDF

Info

Publication number
TWI533988B
TWI533988B TW099132679A TW99132679A TWI533988B TW I533988 B TWI533988 B TW I533988B TW 099132679 A TW099132679 A TW 099132679A TW 99132679 A TW99132679 A TW 99132679A TW I533988 B TWI533988 B TW I533988B
Authority
TW
Taiwan
Prior art keywords
abrasive
article
core
layer
major surface
Prior art date
Application number
TW099132679A
Other languages
English (en)
Chinese (zh)
Other versions
TW201134633A (en
Inventor
挪莫 那提爾 提西里森
布萊恩 大衛 高爾
Original Assignee
３Ｍ新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201134633A publication Critical patent/TW201134633A/zh
Application granted granted Critical
Publication of TWI533988B publication Critical patent/TWI533988B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mining & Mineral Resources (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW099132679A 2009-09-28 2010-09-27 具實心芯之研磨物件及其製造方法 TWI533988B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/567,937 US20110073094A1 (en) 2009-09-28 2009-09-28 Abrasive article with solid core and methods of making the same

Publications (2)

Publication Number Publication Date
TW201134633A TW201134633A (en) 2011-10-16
TWI533988B true TWI533988B (zh) 2016-05-21

Family

ID=43778900

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099132679A TWI533988B (zh) 2009-09-28 2010-09-27 具實心芯之研磨物件及其製造方法

Country Status (8)

Country Link
US (1) US20110073094A1 (enExample)
EP (1) EP2483035A4 (enExample)
JP (1) JP5647689B2 (enExample)
KR (1) KR101820177B1 (enExample)
CN (1) CN102574276B (enExample)
SG (1) SG179121A1 (enExample)
TW (1) TWI533988B (enExample)
WO (1) WO2011037776A2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5168601B2 (ja) 2010-03-31 2013-03-21 アイシン・エィ・ダブリュ株式会社 自車位置認識システム
JP6111011B2 (ja) * 2011-10-12 2017-04-05 株式会社Sumco 砥粒チャージ方法及び硬脆性基板の製造方法
JP5700682B2 (ja) * 2011-11-02 2015-04-15 旭ダイヤモンド工業株式会社 ロータリドレッサ
WO2013161849A1 (ja) 2012-04-24 2013-10-31 株式会社東京精密 ダイシングブレード
KR102022754B1 (ko) * 2012-06-15 2019-09-18 가부시키가이샤 토쿄 세이미쯔 다이싱 장치 및 다이싱 방법
CN103659576A (zh) * 2012-09-20 2014-03-26 苏州赫瑞特电子专用设备科技有限公司 一种单面研磨抛光机的研磨抛光盘
US20150105006A1 (en) * 2013-10-11 2015-04-16 HGST Netherlands B.V. Method to sustain minimum required aspect ratios of diamond grinding blades throughout service lifetime
JP6434266B2 (ja) * 2013-12-17 2018-12-05 富士紡ホールディングス株式会社 ラッピング用樹脂定盤及びそれを用いたラッピング方法
TWI580524B (zh) * 2014-02-18 2017-05-01 中國砂輪企業股份有限公司 高性能化學機械研磨修整器及其製作方法
ES2640635T3 (es) * 2014-06-13 2017-11-03 Meccanotecnica Veneta S.R.L. Disco de corte, dispositivo de corte y procedimiento para obtener dicho disco de corte
CN104385118A (zh) * 2014-09-17 2015-03-04 浙江舜宇光学有限公司 一种金刚石丸片及其应用方法、研磨工具
US10207392B2 (en) 2014-10-07 2019-02-19 3M Innovative Properties Company Abrasive article and related methods
CN105108661A (zh) * 2014-12-19 2015-12-02 李立群 陶瓷、橡胶复合型砂轮用结合剂及其制备方法
JP6964588B2 (ja) * 2015-09-08 2021-11-10 スリーエム イノベイティブ プロパティズ カンパニー 砥粒凝集体を伴う砥粒回転ツール
CN105563300A (zh) * 2016-01-08 2016-05-11 湖南大学 一种回转弹性体及研磨抛光设备
CN105643428A (zh) * 2016-01-08 2016-06-08 湖南大学 一种回转弹性体研磨抛光方法
CN105619272B (zh) * 2016-01-11 2018-05-22 苏州科技大学 一种激光钎焊单层金刚石砂轮的制作方法
TWI645940B (zh) * 2018-01-15 2019-01-01 中國砂輪企業股份有限公司 Grinding tool
CN115592578B (zh) * 2022-10-25 2025-05-30 苏州科技大学 一种真空压力焊Ti箔金刚石制造砂轮的方法
CN117681095A (zh) * 2024-01-16 2024-03-12 保定惠天速维风电科技有限公司 一种风力发电叶片维修用涂层打磨装置

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3641718A (en) * 1969-07-31 1972-02-15 Gen Motors Corp Abrasive cutting tool
US4047902A (en) * 1975-04-01 1977-09-13 Wiand Richard K Metal-plated abrasive product and method of manufacturing the product
JPS5766864A (en) * 1980-10-08 1982-04-23 Noritake Dia Kk Electrodeposition grindstone and manufacture by transfer method
US5218948A (en) * 1988-03-11 1993-06-15 Mitsubishi Kinzoku Kabushiki Kaisha Inside diameter blade
US4882878A (en) * 1988-08-05 1989-11-28 Benner Robert L Grinding wheel
US5049165B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
US5190568B1 (en) * 1989-01-30 1996-03-12 Ultimate Abrasive Syst Inc Abrasive tool with contoured surface
US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
ATE118713T1 (de) * 1990-03-30 1995-03-15 Wiand Ronald C Marmor-, granit- und steinenbearbeitungsverfahren und schleifpolster hierfür.
JPH04250978A (ja) * 1990-12-28 1992-09-07 Toyoda Mach Works Ltd 電着砥石の製造方法
US5380390B1 (en) * 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
US5791330A (en) * 1991-06-10 1998-08-11 Ultimate Abrasive Systems, L.L.C. Abrasive cutting tool
US5817204A (en) * 1991-06-10 1998-10-06 Ultimate Abrasive Systems, L.L.C. Method for making patterned abrasive material
DE4138883C1 (enExample) * 1991-11-27 1993-05-27 Hoechst Ag, 6230 Frankfurt, De
US5219462A (en) * 1992-01-13 1993-06-15 Minnesota Mining And Manufacturing Company Abrasive article having abrasive composite members positioned in recesses
US5261385A (en) * 1992-03-27 1993-11-16 Dicing Technology Inc. Abrasive cutting blade assembly with multiple cutting edge exposures
US5203880B1 (en) * 1992-07-24 1995-10-17 Ultimate Abrasive Syst Inc Method and apparatus for making abrasive tools
US6478831B2 (en) * 1995-06-07 2002-11-12 Ultimate Abrasive Systems, L.L.C. Abrasive surface and article and methods for making them
US6453899B1 (en) * 1995-06-07 2002-09-24 Ultimate Abrasive Systems, L.L.C. Method for making a sintered article and products produced thereby
US6482244B2 (en) * 1995-06-07 2002-11-19 Ultimate Abrasive Systems, L.L.C. Process for making an abrasive sintered product
US5919549A (en) * 1996-11-27 1999-07-06 Minnesota Mining And Manufacturing Company Abrasive articles and method for the manufacture of same
US7323049B2 (en) * 1997-04-04 2008-01-29 Chien-Min Sung High pressure superabrasive particle synthesis
TW394723B (en) * 1997-04-04 2000-06-21 Sung Chien Min Abrasive tools with patterned grit distribution and method of manufacture
US7491116B2 (en) * 2004-09-29 2009-02-17 Chien-Min Sung CMP pad dresser with oriented particles and associated methods
US7124753B2 (en) * 1997-04-04 2006-10-24 Chien-Min Sung Brazed diamond tools and methods for making the same
JP3052896B2 (ja) * 1997-06-13 2000-06-19 日本電気株式会社 研磨布表面のドレス治具及びその製造方法
US6110031A (en) * 1997-06-25 2000-08-29 3M Innovative Properties Company Superabrasive cutting surface
US5989114A (en) * 1997-10-21 1999-11-23 Unova Ip Corp. Composite grinding and buffing disc with flexible rim
KR100285415B1 (ko) * 1998-09-03 2001-04-02 김세광 세그먼트타입의다이아몬드소우브레이드
KR100285413B1 (ko) * 1998-09-03 2001-04-02 김세광 림타입의다이아몬드브레이드
US6203416B1 (en) * 1998-09-10 2001-03-20 Atock Co., Ltd. Outer-diameter blade, inner-diameter blade, core drill and processing machines using same ones
CN2336919Y (zh) * 1998-10-06 1999-09-08 李子标 弹性砂轮
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
US6710446B2 (en) * 1999-12-30 2004-03-23 Renesas Technology Corporation Semiconductor device comprising stress relaxation layers and method for manufacturing the same
US6254461B1 (en) * 2000-03-15 2001-07-03 International Business Machines Corporation Process of dressing glass disk polishing pads using diamond-coated dressing disks
KR20020020724A (ko) * 2000-04-05 2002-03-15 이와가미 미치아키 연삭 숫돌
JP2001315062A (ja) * 2000-05-09 2001-11-13 Mitsubishi Materials Corp 電着砥石及びその製造方法
CN100344410C (zh) * 2000-11-07 2007-10-24 中国砂轮企业股份有限公司 化学－机械抛光软垫的修磨器及其制造方法
EP1207015A3 (en) * 2000-11-17 2003-07-30 Keltech Engineering, Inc. Raised island abrasive, method of use and lapping apparatus
US6669745B2 (en) * 2001-02-21 2003-12-30 3M Innovative Properties Company Abrasive article with optimally oriented abrasive particles and method of making the same
US20050081453A1 (en) * 2003-10-16 2005-04-21 Johnson Qian Process of manufacturing base of diamond abrasive stone
US7086394B2 (en) * 2004-02-17 2006-08-08 Nexedge Corp. Grindable self-cleaning singulation saw blade and method
US7134430B2 (en) * 2004-04-21 2006-11-14 Ehwa Diamond Industrial Co. Ltd. Cutting segment, method of manufacturing cutting segment, and cutting tool
US6945857B1 (en) * 2004-07-08 2005-09-20 Applied Materials, Inc. Polishing pad conditioner and methods of manufacture and recycling
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
JP4874121B2 (ja) * 2004-11-19 2012-02-15 豊田バンモップス株式会社 砥石車
CN1778520A (zh) * 2004-11-22 2006-05-31 龙治国 双面切割研磨片及其制造方法
US7258708B2 (en) * 2004-12-30 2007-08-21 Chien-Min Sung Chemical mechanical polishing pad dresser
US7744447B2 (en) * 2005-03-16 2010-06-29 Goei, Co., Ltd. Abrasive disc
KR100680850B1 (ko) * 2005-04-20 2007-02-09 이화다이아몬드공업 주식회사 다이아몬드 공구용 절삭팁 및 다이아몬드 공구
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
CN101090804A (zh) * 2005-12-27 2007-12-19 日本精细钢铁株式会社 固定磨粒的金属丝
JP4624293B2 (ja) * 2006-03-31 2011-02-02 株式会社ノリタケスーパーアブレーシブ Ｃｍｐパッドコンディショナー
CN101511542B (zh) * 2006-08-30 2011-05-25 3M创新有限公司 延长寿命的磨料制品及方法
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
TW200906546A (en) * 2007-08-07 2009-02-16 Tian-Yuan Yan Adjusting device for resin-bonded polishing pad and manufacturing method thereof
US8652225B2 (en) * 2009-07-27 2014-02-18 Joseph H. MacKay Flexible coated abrasive finishing article and method of manufacturing the same

Also Published As

Publication number Publication date
CN102574276B (zh) 2015-11-25
WO2011037776A2 (en) 2011-03-31
JP2013505842A (ja) 2013-02-21
KR101820177B1 (ko) 2018-01-18
KR20120088729A (ko) 2012-08-08
EP2483035A2 (en) 2012-08-08
CN102574276A (zh) 2012-07-11
JP5647689B2 (ja) 2015-01-07
TW201134633A (en) 2011-10-16
SG179121A1 (en) 2012-05-30
US20110073094A1 (en) 2011-03-31
EP2483035A4 (en) 2017-09-06
WO2011037776A3 (en) 2011-06-30

Similar Documents

Publication Publication Date Title
CN102574276B (zh) 具有实芯的磨料制品及其制备方法
EP0732175B1 (en) Abrasive product and method for making
KR101483314B1 (ko) 수명이 연장된 연마 물품 및 방법
KR100583717B1 (ko) 연삭 휘일
JP5105491B2 (ja) パターン化した研磨工具
TWI451942B (zh) 具實質平坦顆粒尖端之超研磨工具及其相關方法
JP4287301B2 (ja) パターン化された研磨材料およびその製造方法
CN1980773B (zh) 高精度的多磨粒切割刀片
TW201016387A (en) CMP Pad Dressers with Hybridized abrasive surface and related methods
TW201141663A (en) Conditioning tools and techniques for chemical mechanical planarization
TW200911462A (en) Superhard cutters and associated methods
JP5701211B2 (ja) 研磨剤を含浸する電鋳製薄型カッティングソー及びコアドリル
US8191545B2 (en) Electroformed thin-wall core drills impregnated with abrasives
KR102229135B1 (ko) 개별 절삭팁 부착형 cmp 패드 컨디셔너 및 그 제조방법
JPH0215977A (ja) ダイヤモンド砥石とその製造方法
US7614395B2 (en) Electroformed thin-wall cutting saw impregnated with abrasives
JP6578985B2 (ja) 基板、基板の切断方法
KR100522779B1 (ko) 다공질 숫돌 및 그 제조방법
JPH10202533A (ja) ダイヤモンド切断砥石
GB2362653A (en) Laminated diamond saw blade
JP2002103232A (ja) 砥石及びその製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees