KR101820177B1 - 고상 코어를 갖는 연마 용품 및 이의 제조 방법 - Google Patents

고상 코어를 갖는 연마 용품 및 이의 제조 방법 Download PDF

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Publication number
KR101820177B1
KR101820177B1 KR1020127010494A KR20127010494A KR101820177B1 KR 101820177 B1 KR101820177 B1 KR 101820177B1 KR 1020127010494 A KR1020127010494 A KR 1020127010494A KR 20127010494 A KR20127010494 A KR 20127010494A KR 101820177 B1 KR101820177 B1 KR 101820177B1
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KR
South Korea
Prior art keywords
abrasive
delete delete
layer
core
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020127010494A
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English (en)
Korean (ko)
Other versions
KR20120088729A (ko
Inventor
나음 셀레신
브라이언 디 고어스
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20120088729A publication Critical patent/KR20120088729A/ko
Application granted granted Critical
Publication of KR101820177B1 publication Critical patent/KR101820177B1/ko
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mining & Mineral Resources (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020127010494A 2009-09-28 2010-09-13 고상 코어를 갖는 연마 용품 및 이의 제조 방법 Expired - Fee Related KR101820177B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/567,937 US20110073094A1 (en) 2009-09-28 2009-09-28 Abrasive article with solid core and methods of making the same
US12/567,937 2009-09-28
PCT/US2010/048603 WO2011037776A2 (en) 2009-09-28 2010-09-13 Abrasive article with solid core and methods of making the same

Publications (2)

Publication Number Publication Date
KR20120088729A KR20120088729A (ko) 2012-08-08
KR101820177B1 true KR101820177B1 (ko) 2018-01-18

Family

ID=43778900

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127010494A Expired - Fee Related KR101820177B1 (ko) 2009-09-28 2010-09-13 고상 코어를 갖는 연마 용품 및 이의 제조 방법

Country Status (8)

Country Link
US (1) US20110073094A1 (enExample)
EP (1) EP2483035A4 (enExample)
JP (1) JP5647689B2 (enExample)
KR (1) KR101820177B1 (enExample)
CN (1) CN102574276B (enExample)
SG (1) SG179121A1 (enExample)
TW (1) TWI533988B (enExample)
WO (1) WO2011037776A2 (enExample)

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JP5168601B2 (ja) 2010-03-31 2013-03-21 アイシン・エィ・ダブリュ株式会社 自車位置認識システム
JP6111011B2 (ja) * 2011-10-12 2017-04-05 株式会社Sumco 砥粒チャージ方法及び硬脆性基板の製造方法
JP5700682B2 (ja) * 2011-11-02 2015-04-15 旭ダイヤモンド工業株式会社 ロータリドレッサ
WO2013161849A1 (ja) 2012-04-24 2013-10-31 株式会社東京精密 ダイシングブレード
KR102022754B1 (ko) * 2012-06-15 2019-09-18 가부시키가이샤 토쿄 세이미쯔 다이싱 장치 및 다이싱 방법
CN103659576A (zh) * 2012-09-20 2014-03-26 苏州赫瑞特电子专用设备科技有限公司 一种单面研磨抛光机的研磨抛光盘
US20150105006A1 (en) * 2013-10-11 2015-04-16 HGST Netherlands B.V. Method to sustain minimum required aspect ratios of diamond grinding blades throughout service lifetime
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ES2640635T3 (es) * 2014-06-13 2017-11-03 Meccanotecnica Veneta S.R.L. Disco de corte, dispositivo de corte y procedimiento para obtener dicho disco de corte
CN104385118A (zh) * 2014-09-17 2015-03-04 浙江舜宇光学有限公司 一种金刚石丸片及其应用方法、研磨工具
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CN105108661A (zh) * 2014-12-19 2015-12-02 李立群 陶瓷、橡胶复合型砂轮用结合剂及其制备方法
JP6964588B2 (ja) * 2015-09-08 2021-11-10 スリーエム イノベイティブ プロパティズ カンパニー 砥粒凝集体を伴う砥粒回転ツール
CN105563300A (zh) * 2016-01-08 2016-05-11 湖南大学 一种回转弹性体及研磨抛光设备
CN105643428A (zh) * 2016-01-08 2016-06-08 湖南大学 一种回转弹性体研磨抛光方法
CN105619272B (zh) * 2016-01-11 2018-05-22 苏州科技大学 一种激光钎焊单层金刚石砂轮的制作方法
TWI645940B (zh) * 2018-01-15 2019-01-01 中國砂輪企業股份有限公司 Grinding tool
CN115592578B (zh) * 2022-10-25 2025-05-30 苏州科技大学 一种真空压力焊Ti箔金刚石制造砂轮的方法
CN117681095A (zh) * 2024-01-16 2024-03-12 保定惠天速维风电科技有限公司 一种风力发电叶片维修用涂层打磨装置

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Also Published As

Publication number Publication date
CN102574276B (zh) 2015-11-25
WO2011037776A2 (en) 2011-03-31
JP2013505842A (ja) 2013-02-21
KR20120088729A (ko) 2012-08-08
EP2483035A2 (en) 2012-08-08
CN102574276A (zh) 2012-07-11
TWI533988B (zh) 2016-05-21
JP5647689B2 (ja) 2015-01-07
TW201134633A (en) 2011-10-16
SG179121A1 (en) 2012-05-30
US20110073094A1 (en) 2011-03-31
EP2483035A4 (en) 2017-09-06
WO2011037776A3 (en) 2011-06-30

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