CN102574276B - 具有实芯的磨料制品及其制备方法 - Google Patents

具有实芯的磨料制品及其制备方法 Download PDF

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Publication number
CN102574276B
CN102574276B CN201080043218.5A CN201080043218A CN102574276B CN 102574276 B CN102574276 B CN 102574276B CN 201080043218 A CN201080043218 A CN 201080043218A CN 102574276 B CN102574276 B CN 102574276B
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CN
China
Prior art keywords
abrasive
article
layer
core
unitary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080043218.5A
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English (en)
Chinese (zh)
Other versions
CN102574276A (zh
Inventor
瑙姆·采列辛
布赖恩·D·格斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN102574276A publication Critical patent/CN102574276A/zh
Application granted granted Critical
Publication of CN102574276B publication Critical patent/CN102574276B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mining & Mineral Resources (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN201080043218.5A 2009-09-28 2010-09-13 具有实芯的磨料制品及其制备方法 Expired - Fee Related CN102574276B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/567,937 US20110073094A1 (en) 2009-09-28 2009-09-28 Abrasive article with solid core and methods of making the same
US12/567,937 2009-09-28
PCT/US2010/048603 WO2011037776A2 (en) 2009-09-28 2010-09-13 Abrasive article with solid core and methods of making the same

Publications (2)

Publication Number Publication Date
CN102574276A CN102574276A (zh) 2012-07-11
CN102574276B true CN102574276B (zh) 2015-11-25

Family

ID=43778900

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080043218.5A Expired - Fee Related CN102574276B (zh) 2009-09-28 2010-09-13 具有实芯的磨料制品及其制备方法

Country Status (8)

Country Link
US (1) US20110073094A1 (enExample)
EP (1) EP2483035A4 (enExample)
JP (1) JP5647689B2 (enExample)
KR (1) KR101820177B1 (enExample)
CN (1) CN102574276B (enExample)
SG (1) SG179121A1 (enExample)
TW (1) TWI533988B (enExample)
WO (1) WO2011037776A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645940B (zh) 2018-01-15 2019-01-01 中國砂輪企業股份有限公司 Grinding tool
US10207392B2 (en) 2014-10-07 2019-02-19 3M Innovative Properties Company Abrasive article and related methods

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JP5168601B2 (ja) 2010-03-31 2013-03-21 アイシン・エィ・ダブリュ株式会社 自車位置認識システム
JP6111011B2 (ja) * 2011-10-12 2017-04-05 株式会社Sumco 砥粒チャージ方法及び硬脆性基板の製造方法
JP5700682B2 (ja) * 2011-11-02 2015-04-15 旭ダイヤモンド工業株式会社 ロータリドレッサ
WO2013161849A1 (ja) 2012-04-24 2013-10-31 株式会社東京精密 ダイシングブレード
KR102022754B1 (ko) * 2012-06-15 2019-09-18 가부시키가이샤 토쿄 세이미쯔 다이싱 장치 및 다이싱 방법
CN103659576A (zh) * 2012-09-20 2014-03-26 苏州赫瑞特电子专用设备科技有限公司 一种单面研磨抛光机的研磨抛光盘
US20150105006A1 (en) * 2013-10-11 2015-04-16 HGST Netherlands B.V. Method to sustain minimum required aspect ratios of diamond grinding blades throughout service lifetime
JP6434266B2 (ja) * 2013-12-17 2018-12-05 富士紡ホールディングス株式会社 ラッピング用樹脂定盤及びそれを用いたラッピング方法
TWI580524B (zh) * 2014-02-18 2017-05-01 中國砂輪企業股份有限公司 高性能化學機械研磨修整器及其製作方法
ES2640635T3 (es) * 2014-06-13 2017-11-03 Meccanotecnica Veneta S.R.L. Disco de corte, dispositivo de corte y procedimiento para obtener dicho disco de corte
CN104385118A (zh) * 2014-09-17 2015-03-04 浙江舜宇光学有限公司 一种金刚石丸片及其应用方法、研磨工具
CN105108661A (zh) * 2014-12-19 2015-12-02 李立群 陶瓷、橡胶复合型砂轮用结合剂及其制备方法
JP6964588B2 (ja) * 2015-09-08 2021-11-10 スリーエム イノベイティブ プロパティズ カンパニー 砥粒凝集体を伴う砥粒回転ツール
CN105563300A (zh) * 2016-01-08 2016-05-11 湖南大学 一种回转弹性体及研磨抛光设备
CN105643428A (zh) * 2016-01-08 2016-06-08 湖南大学 一种回转弹性体研磨抛光方法
CN105619272B (zh) * 2016-01-11 2018-05-22 苏州科技大学 一种激光钎焊单层金刚石砂轮的制作方法
CN115592578B (zh) * 2022-10-25 2025-05-30 苏州科技大学 一种真空压力焊Ti箔金刚石制造砂轮的方法
CN117681095A (zh) * 2024-01-16 2024-03-12 保定惠天速维风电科技有限公司 一种风力发电叶片维修用涂层打磨装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10207392B2 (en) 2014-10-07 2019-02-19 3M Innovative Properties Company Abrasive article and related methods
TWI645940B (zh) 2018-01-15 2019-01-01 中國砂輪企業股份有限公司 Grinding tool

Also Published As

Publication number Publication date
WO2011037776A2 (en) 2011-03-31
JP2013505842A (ja) 2013-02-21
KR101820177B1 (ko) 2018-01-18
KR20120088729A (ko) 2012-08-08
EP2483035A2 (en) 2012-08-08
CN102574276A (zh) 2012-07-11
TWI533988B (zh) 2016-05-21
JP5647689B2 (ja) 2015-01-07
TW201134633A (en) 2011-10-16
SG179121A1 (en) 2012-05-30
US20110073094A1 (en) 2011-03-31
EP2483035A4 (en) 2017-09-06
WO2011037776A3 (en) 2011-06-30

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Granted publication date: 20151125

Termination date: 20200913