TWI532655B - 基板搬運用盒 - Google Patents

基板搬運用盒 Download PDF

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Publication number
TWI532655B
TWI532655B TW103118702A TW103118702A TWI532655B TW I532655 B TWI532655 B TW I532655B TW 103118702 A TW103118702 A TW 103118702A TW 103118702 A TW103118702 A TW 103118702A TW I532655 B TWI532655 B TW I532655B
Authority
TW
Taiwan
Prior art keywords
cover
glass display
display substrate
carrying case
substrate carrying
Prior art date
Application number
TW103118702A
Other languages
English (en)
Chinese (zh)
Other versions
TW201509771A (zh
Inventor
李範魯
金錫雄
李圭桓
文相球
Original Assignee
康寧精密素材股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 康寧精密素材股份有限公司 filed Critical 康寧精密素材股份有限公司
Publication of TW201509771A publication Critical patent/TW201509771A/zh
Application granted granted Critical
Publication of TWI532655B publication Critical patent/TWI532655B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
TW103118702A 2013-05-28 2014-05-28 基板搬運用盒 TWI532655B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130060040A KR101617275B1 (ko) 2013-05-28 2013-05-28 기판 반송용 박스

Publications (2)

Publication Number Publication Date
TW201509771A TW201509771A (zh) 2015-03-16
TWI532655B true TWI532655B (zh) 2016-05-11

Family

ID=51983905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103118702A TWI532655B (zh) 2013-05-28 2014-05-28 基板搬運用盒

Country Status (5)

Country Link
US (1) US20140353195A1 (ko)
JP (1) JP2014231394A (ko)
KR (1) KR101617275B1 (ko)
CN (1) CN104210747A (ko)
TW (1) TWI532655B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104401563B (zh) * 2014-11-25 2016-07-06 董卫芹 医用大小便样品瓶的收集装置
CN106800126A (zh) * 2017-04-05 2017-06-06 武汉华星光电技术有限公司 一种包装盒

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3017987A (en) * 1958-04-03 1962-01-23 Ernest P Moslo Container with transparent windows
JPH061372B2 (ja) * 1984-05-23 1994-01-05 株式会社ニコン 基板の収納ケース、及び該収納ケースの装着装置
AU5983986A (en) * 1985-07-09 1987-01-15 Basf Aktiengesellschaft Container for discs
US4793488A (en) * 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
US4739353A (en) * 1987-09-14 1988-04-19 Ansco Photo-Optical Products Corporation Packaged camera assembly
JPH01164190U (ko) * 1988-05-02 1989-11-16
FR2663003B1 (fr) * 1990-06-12 1992-09-11 Sgs Thomson Microelectronics Conteneur pour plaquette semiconductrice.
JP4855569B2 (ja) * 2000-10-20 2012-01-18 コーニング インコーポレイテッド ガラス基板を梱包するための容器
US20030014892A1 (en) * 2001-07-19 2003-01-23 Rembrandt Photo Services, A California Corporation Protective display holders
JP2003170993A (ja) * 2001-09-27 2003-06-17 Nissho Iwai Plastic Corp ガラス基板搬送用ボックス
JP3871924B2 (ja) * 2001-09-27 2007-01-24 プラネット株式会社 ガラス基板搬送用ボックス
CN2560594Y (zh) * 2002-02-19 2003-07-16 江博助 易碎板片物装运箱的改良构造
CN1982172A (zh) * 2002-07-17 2007-06-20 淀川惠德株式会社 基板输送用发泡箱
JP2004051131A (ja) * 2002-07-17 2004-02-19 Yodogawa Hu-Tech Kk ガラス基板搬送用ボックス
US20070017841A1 (en) * 2005-07-22 2007-01-25 Corning Incorporated Restraining dense packaging system for LCD glass sheets
TWI316040B (en) * 2006-11-10 2009-10-21 Innolux Display Corp Packing box for glass substrate and a package structure of a glass substrate using the same
CN201321215Y (zh) * 2008-09-18 2009-10-07 真豪国际股份有限公司 易碎板材保护箱
CN201321216Y (zh) * 2008-10-30 2009-10-07 富阳光电股份有限公司 易碎板片包装保护装置改良结构
US8066178B2 (en) * 2008-12-01 2011-11-29 Colgate-Palmolive Company Display carton for a plurality of products
KR20110124913A (ko) * 2010-05-12 2011-11-18 삼성코닝정밀소재 주식회사 표시장치 유리기판 포장용 박스
CN201729422U (zh) * 2010-06-30 2011-02-02 中芯国际集成电路制造(上海)有限公司 晶片包装盒
CN201990076U (zh) * 2011-03-11 2011-09-28 顾亚萍 一种多功能有机玻璃湿盒
CN202244367U (zh) * 2011-09-16 2012-05-30 苏州正隆纸业有限公司 液晶面板运输用瓦楞纸结构
KR101385953B1 (ko) * 2011-09-27 2014-04-16 김봉희 글래스 패널 운반상자의 격리부재
CN102887300B (zh) * 2012-09-20 2015-02-11 深圳市华星光电技术有限公司 一种液晶玻璃基板存储架

Also Published As

Publication number Publication date
JP2014231394A (ja) 2014-12-11
TW201509771A (zh) 2015-03-16
KR101617275B1 (ko) 2016-05-02
KR20140139701A (ko) 2014-12-08
US20140353195A1 (en) 2014-12-04
CN104210747A (zh) 2014-12-17

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