US20140353195A1 - Box for carrying substrates - Google Patents

Box for carrying substrates Download PDF

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Publication number
US20140353195A1
US20140353195A1 US14/288,075 US201414288075A US2014353195A1 US 20140353195 A1 US20140353195 A1 US 20140353195A1 US 201414288075 A US201414288075 A US 201414288075A US 2014353195 A1 US2014353195 A1 US 2014353195A1
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US
United States
Prior art keywords
box
substrates
box body
cover
box cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/288,075
Other languages
English (en)
Inventor
BumRo Lee
Seok-Woong Kim
Kyu-Hwan Lee
Sangku Moon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Precision Materials Co Ltd
Original Assignee
Corning Precision Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Precision Materials Co Ltd filed Critical Corning Precision Materials Co Ltd
Assigned to CORNING PRECISION MATERIALS CO., LTD. reassignment CORNING PRECISION MATERIALS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, SEOK-WOONG, LEE, BUMRO, LEE, KYU-HWAN, MOON, SANGKU
Publication of US20140353195A1 publication Critical patent/US20140353195A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/54—Inspection openings or windows
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Definitions

  • the present invention relates to a box for carrying substrates, and more particularly, to a box for carrying substrates in which substrates which are used for displays can be carried and kept.
  • glass substrates which are used for flat panel displays such as a liquid crystal display (LCD), a plasma display panel (PDP) and an electroluminescent display (ELD), are carried and kept in the state in which they are received in a box.
  • a plurality of glass substrates which are received in the box are supported in the erected position such that they do not contact each other.
  • the box for carrying glass substrates (also referred to as a “glass substrate-carrying box”) includes a cuboid box body having an upper opening and a box cover which covers the upper portion of the box body.
  • a plurality of protrusions and a plurality of substrate insertion grooves are alternately formed on and in the inner surfaces of a pair of walls of the box body which face each other, such that the protrusions and grooves extend in the height direction.
  • the substrate insertion grooves are formed by the protrusions which protrude from the inner surfaces of the walls of the box body.
  • Each of the glass substrates which are received in the box body is inserted into a pair of glass insertion grooves which face each other and pressed by two pairs of protrusions, such that it stays in the state in which it is received and held inside the box body.
  • Various aspects of the present invention provide a box for carrying substrates with which reasons for defects that occur during carriage of the substrates can be examined.
  • a box for carrying substrates that includes: a box body having an upper opening, walls and a bottom, the walls and the bottom defining therein a substrate-receiving space; and a box cover having sidewalls and a covering section so as to cover and close the upper opening of the box body.
  • the box cover is made of a transparent material which allows the substrate-receiving space inside the box body to be seen.
  • a box for carrying substrates that includes: a box body having an upper opening, walls and a bottom, the walls and the bottom defining therein a substrate-receiving space; a box cover having sidewalls and a covering section so as to cover and close the upper opening of the box body; and a first transparent window formed in the covering section of the box cover. The first transparent window allows the substrate-receiving space inside the box body to be seen.
  • FIG. 1 is a schematic perspective view of a box for carrying substrates according to a first embodiment of the invention
  • FIG. 2 is a schematic perspective view of a box for carrying substrates according to a second embodiment of the invention.
  • FIG. 3 is a graph showing measurements of Vicker hardness depending on the material and thickness of first transparent windows
  • FIG. 4 is a schematic perspective view showing the inside of the box cover of the box for carrying substrates according to the second embodiment of the invention.
  • FIG. 5 is a cross-sectional view showing the support pad of the box for carrying substrates according to the second embodiment of the invention.
  • FIG. 6 is a schematic perspective view showing the box cover of the box for carrying substrates according to the second embodiment of the invention.
  • FIG. 7A and FIG. 7B show the box cover of the box for carrying substrates according to the second embodiment of the invention and a box cover of the related art
  • FIG. 8 is a graph comparing variations in the humidity with time of boxes for carrying substrates which include the box covers shown in FIG. 7A and FIG. 7B ;
  • FIG. 9 is a graph comparing variations in the temperature with time of boxes for carrying substrates which include the box covers shown in FIG. 7A and FIG. 7B ;
  • FIG. 10 is a graph showing measurements of static electricity according to positions of the box covers shown in FIG. 7A and FIG. 7B .
  • FIG. 1 is a schematic perspective view of a box for carrying substrates according to a first embodiment of the invention.
  • the box for carrying substrates according to the first embodiment of the invention includes a box body 110 and a box cover 120 .
  • the box body 110 receives a plurality of substrates and protects the substrates from the external environment and external impacts.
  • the box body 110 is configured as a case which has an upper opening, walls 112 and a bottom 114 , the walls 112 and the bottom 114 defining therein a substrate-receiving space.
  • the box body 110 is made into the shape of a cuboid.
  • the box body 110 can be made of a polypropylene material.
  • a plurality of insertion grooves (not shown) into and by which the received substrates are inserted and held is formed in a pair of opposing inner surfaces of the walls 112 of the box body 110 .
  • the opposing inner surfaces face each other.
  • the substrate insertion grooves (not shown) are formed in the opposing inner surfaces of the walls 112 , such that they extend in the height direction. The substrates can be firmly supported or held when they are inserted into the substrate insertion grooves (not shown).
  • the substrates received in the box body 110 can be glass substrates which are used for flat panel displays, such as a liquid crystal display (LCD), a plasma display panel (PDP) and an electroluminescent display (ELD).
  • LCD liquid crystal display
  • PDP plasma display panel
  • ELD electroluminescent display
  • the substrates will be received inside the box body 110 in the state in which they are vertically erected and aligned at regular distances.
  • the box cover 120 has sidewalls 122 and a covering section 124 so as to cover and close the upper opening of the box body 110 , and is made of a transparent material through which the substrate-receiving space inside the box body 110 can be seen.
  • the box cover 120 is made of a transparent material like this, it is possible to observe the state of the substrates which are received and arranged in the box body 110 when box cover 120 is placed over the box body 110 . Accordingly, when the substrates received in the box for carrying substrates according to this embodiment of the invention become defective, such as when, for example, the substrates have been broken or become overlapped on each other due to any reason during the actual practice of being carried, it is possible to examine reasons or a mechanism for defects.
  • box cover 120 be made of an acrylic material and have a thickness of 1.5 mm.
  • the box for carrying substrates according to the first embodiment of the invention can also include a support pad (not shown) which is coupled to the inner surface of the covering section 124 of the box cover.
  • the support pad (not shown) has a plurality of support grooves into and by which the substrates received in the box body 110 are inserted and held. That is, it is possible to carry the substrates more safely by inserting the substrates into the support grooves of the support pad (not shown) coupled to the inner surface of the covering section 124 of the box cover such that the substrates are held by the support grooves.
  • the cross-section of the support grooves formed in the support pad (not shown) has the shape of an upside-down “Y” Since the cross-section of the support grooves of the support pad (not shown) has the shape of upside-down “Y,” the substrates can be easily inserted into the support grooves.
  • the box for carrying substrates according to the first embodiment of the invention can also include support slots (not shown) which are coupled to a pair of opposing inner surfaces of the sidewalls 122 of the box cover 120 .
  • Each of the support slots (not shown) has a plurality of support grooves which supports the substrates received in the box body 110 . Since the substrates are inserted into and held by the support grooves of the support slots (not shown) which are configured as above, it is possible to carry the substrates by holding them more firmly.
  • each of the support grooves formed in the support slots (not shown) is formed collinear with a corresponding one of the substrate insertion grooves (not shown) formed in the walls 112 of the box body 110 .
  • the shape of the support pad and the support slots illustrated with reference to the first embodiment will be identical to a support pad and support slots which will be illustrated with reference to a following second embodiment.
  • FIG. 2 is a schematic perspective view of a box for carrying substrates according to the second embodiment of the invention.
  • the box for carrying substrates according to the second embodiment of the invention includes a box body 210 and a box cover 220 .
  • box body 210 A description of the box body 210 will be omitted, since it is identical with the box body 110 which has been illustrated with reference to the first embodiment.
  • the box cover 220 has sidewalls 222 and a covering section 224 in order to cover and close the upper opening of the box body 210 .
  • First transparent windows 226 are formed in the covering section 224 of the box cover 220 , such that the substrate-receiving space of the box body 210 can be seen through the first transparent windows 226 .
  • the first transparent windows 226 are formed in the covering section 224 of the box cover 220 , it is possible to observe the state of the substrates which are received and arranged in the box body 210 when box cover 220 is placed over the box body 210 . Accordingly, when the substrates received in the box for carrying substrates according to this embodiment of the invention become defective, such as when, for example, the substrates have been broken or become overlapped on each other due to any reason during the actual practice of being carried, it is possible to examine reasons or a mechanism for defects.
  • the first transparent windows 226 may be made of any transparent material through which the substrate-receiving space of the box body 210 can be seen. However, considering the hardness of the first transparent windows 226 and a manufacturing cost thereof, it is preferred that the first transparent windows 226 be made of an acrylic material and have a thickness of 1.5 mm.
  • FIG. 3 is a graph showing measurements of Vicker hardness depending on the material and thickness of the first transparent windows 226 .
  • the first transparent windows 226 made of an acrylic material and having a thickness of 1.5 mm have a Vicker hardness of about 17.6, which is higher than that made of an A-PET or G-PET material. Accordingly, the first transparent windows 226 can minimize the occurrence of scratches, thereby maintaining high transparency.
  • the first transparent windows 226 can be formed in some portions of the covering section 224 of the box cover 220 .
  • the first transparent windows 226 can be a plurality of windows, in which case the first transparent windows 226 are preferably formed in the central portion and at both sides of the central portion of the covering section 224 . Since the first transparent windows 226 are formed in this way, it is possible to economically and accurately perceive the overlap and damaged positions of the substrates received in the box for carrying substrates according to the invention.
  • the box for carrying substrates according to the second embodiment of the invention can also include a support pad 228 which is coupled to the inner surface of the covering section 224 .
  • the support pad 228 has a plurality of support grooves into and by which the substrates received in the box body 210 are inserted and held.
  • the cross-section of the support grooves formed in the support pad 228 has the shape of an upside-down “Y,” as shown in FIG. 5 . Since the cross-section of the support grooves of the support pad 228 has the shape of an upside-down “Y,” the substrates can be easily inserted into the support grooves.
  • the support pad 228 is preferably coupled to the inner surface of the covering section 224 in which the first transparent windows 226 are not formed.
  • the box for carrying substrates according to the second embodiment of the invention can also include support slots 229 which are coupled to a pair of opposing inner surfaces of the sidewalls 222 of the box cover 220 .
  • Each of the support slots 229 has a plurality of support grooves which supports the substrates received in the box body 210 . Since the substrates are inserted into and held by the support grooves of the support slots 229 which are configured as above, it is possible to carry the substrates by holding them more firmly.
  • second transparent windows 227 can be formed in a pair of opposing sidewalls of the four sidewalls of the box cover 220 , such that both edges of the received substrates can be seen through the second transparent windows 227 .
  • the second transparent windows 227 are made of an acrylic material, and preferably have a thickness of about 1.5 mm.
  • FIG. 7A shows a box cover according to the second embodiment of the invention
  • FIG. 7B is a box cover of the related art
  • FIG. 8 is a graph comparing variations in the humidity with time of boxes for carrying substrates which include the box covers shown in FIG. 7A and FIG. 7B
  • FIG. 9 is a graph comparing variations in the temperature with time of boxes for carrying substrates which include the box covers shown in FIG. 7A and FIG. 7B
  • FIG. 10 is a graph showing measurements of static electricity according to positions (A, B, C, D and E) of the box covers shown in FIG. 7A and FIG. 7B .
  • both of the box covers shown in FIG. 7A and FIG. 7B are made of a polypropylene material
  • the first transparent windows shown in FIG. 7A are made of an acrylic material.
  • the box for carrying substrates according to the second embodiment of the invention has temperature and humidity reliability at the same level as that of the box for carrying substrates of the related art which includes the box cover with no transparent windows.
  • the surface resistance of the box cover according to the second embodiment of the invention is at the same level as that of the box cover of the related art.
  • the temperature/humidity characteristic and the surface resistance characteristic of the box cover are the same as those of the box cover of the related art and there is no problem in the box for carrying substrates according to the invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
US14/288,075 2013-05-28 2014-05-27 Box for carrying substrates Abandoned US20140353195A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130060040A KR101617275B1 (ko) 2013-05-28 2013-05-28 기판 반송용 박스
KR10-2013-0060040 2013-05-28

Publications (1)

Publication Number Publication Date
US20140353195A1 true US20140353195A1 (en) 2014-12-04

Family

ID=51983905

Family Applications (1)

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US14/288,075 Abandoned US20140353195A1 (en) 2013-05-28 2014-05-27 Box for carrying substrates

Country Status (5)

Country Link
US (1) US20140353195A1 (ko)
JP (1) JP2014231394A (ko)
KR (1) KR101617275B1 (ko)
CN (1) CN104210747A (ko)
TW (1) TWI532655B (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104401563B (zh) * 2014-11-25 2016-07-06 董卫芹 医用大小便样品瓶的收集装置
CN106800126A (zh) * 2017-04-05 2017-06-06 武汉华星光电技术有限公司 一种包装盒

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US4739353A (en) * 1987-09-14 1988-04-19 Ansco Photo-Optical Products Corporation Packaged camera assembly
US4779732A (en) * 1985-07-09 1988-10-25 Basf Aktiengesellschaft Container for a plurality of disk-shaped articles and container part thereof
US4793488A (en) * 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
US5211717A (en) * 1990-06-12 1993-05-18 Sgs-Thomson Microelectronics, S.A. Sawtooth container for semiconductor wafers
US20030014892A1 (en) * 2001-07-19 2003-01-23 Rembrandt Photo Services, A California Corporation Protective display holders
US8066178B2 (en) * 2008-12-01 2011-11-29 Colgate-Palmolive Company Display carton for a plurality of products

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US3017987A (en) * 1958-04-03 1962-01-23 Ernest P Moslo Container with transparent windows
US4779732A (en) * 1985-07-09 1988-10-25 Basf Aktiengesellschaft Container for a plurality of disk-shaped articles and container part thereof
US4793488A (en) * 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
US4739353A (en) * 1987-09-14 1988-04-19 Ansco Photo-Optical Products Corporation Packaged camera assembly
US5211717A (en) * 1990-06-12 1993-05-18 Sgs-Thomson Microelectronics, S.A. Sawtooth container for semiconductor wafers
US20030014892A1 (en) * 2001-07-19 2003-01-23 Rembrandt Photo Services, A California Corporation Protective display holders
US8066178B2 (en) * 2008-12-01 2011-11-29 Colgate-Palmolive Company Display carton for a plurality of products

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Also Published As

Publication number Publication date
KR101617275B1 (ko) 2016-05-02
TWI532655B (zh) 2016-05-11
KR20140139701A (ko) 2014-12-08
TW201509771A (zh) 2015-03-16
CN104210747A (zh) 2014-12-17
JP2014231394A (ja) 2014-12-11

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