TWI523157B - 具有嵌入式基板及引線框之模組封裝 - Google Patents

具有嵌入式基板及引線框之模組封裝 Download PDF

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Publication number
TWI523157B
TWI523157B TW099138958A TW99138958A TWI523157B TW I523157 B TWI523157 B TW I523157B TW 099138958 A TW099138958 A TW 099138958A TW 99138958 A TW99138958 A TW 99138958A TW I523157 B TWI523157 B TW I523157B
Authority
TW
Taiwan
Prior art keywords
substrate
integrated circuit
die attach
leads
metal clip
Prior art date
Application number
TW099138958A
Other languages
English (en)
Chinese (zh)
Other versions
TW201126659A (en
Inventor
李漢明
胡光裕
Original Assignee
國家半導體公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 國家半導體公司 filed Critical 國家半導體公司
Publication of TW201126659A publication Critical patent/TW201126659A/zh
Application granted granted Critical
Publication of TWI523157B publication Critical patent/TWI523157B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW099138958A 2009-12-10 2010-11-12 具有嵌入式基板及引線框之模組封裝 TWI523157B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/635,624 US8304887B2 (en) 2009-12-10 2009-12-10 Module package with embedded substrate and leadframe

Publications (2)

Publication Number Publication Date
TW201126659A TW201126659A (en) 2011-08-01
TWI523157B true TWI523157B (zh) 2016-02-21

Family

ID=44141994

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099138958A TWI523157B (zh) 2009-12-10 2010-11-12 具有嵌入式基板及引線框之模組封裝

Country Status (5)

Country Link
US (1) US8304887B2 (https=)
JP (1) JP2013513942A (https=)
CN (1) CN102576702B (https=)
TW (1) TWI523157B (https=)
WO (1) WO2011071603A2 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9035435B2 (en) 2012-11-14 2015-05-19 Power Integrations, Inc. Magnetically coupled galvanically isolated communication using lead frame
US8884414B2 (en) 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US9253910B2 (en) * 2013-01-30 2016-02-02 Texas Instruments Incorporated Circuit assembly
CN104037149A (zh) 2013-03-05 2014-09-10 飞思卡尔半导体公司 引线框和基板半导体封装
US10163808B2 (en) * 2015-10-22 2018-12-25 Avago Technologies International Sales Pte. Limited Module with embedded side shield structures and method of fabricating the same
US10134682B2 (en) 2015-10-22 2018-11-20 Avago Technologies International Sales Pte. Limited Circuit package with segmented external shield to provide internal shielding between electronic components
DE102016208782A1 (de) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
CN107946267B (zh) * 2017-11-23 2020-03-06 华进半导体封装先导技术研发中心有限公司 一种芯片结构及制作方法
CN108336056B (zh) * 2018-04-12 2024-06-04 苏州震坤科技有限公司 用于半导体封装结构的万用转接电路层
US11735541B2 (en) * 2018-06-28 2023-08-22 Murata Manufacturing Co., Ltd. Semiconductor device with protective protrusion
WO2020092290A1 (en) * 2018-10-30 2020-05-07 Exceutas Canada, Inc. Low inductance laser driver packaging using lead-frame and thin dielectric layer mask pad definition
US12176274B2 (en) * 2018-11-26 2024-12-24 Texas Instruments Incorporated Multi-die package with multiple heat channels
US20210082790A1 (en) * 2019-09-18 2021-03-18 Alpha And Omega Semiconductor (Cayman) Ltd. Power semiconductor package having integrated inductor and method of making the same
US12055633B2 (en) * 2020-08-25 2024-08-06 Lumentum Operations Llc Package for a time of flight device
CN113130454B (zh) * 2021-04-12 2024-07-05 长沙新雷半导体科技有限公司 一种芯片封装装置、电子模组及电子设备
CN117916878B (zh) * 2021-08-26 2025-07-22 维谢综合半导体有限责任公司 用于针对电部件的改善热管理的增强冷却封装
CN113793843B (zh) * 2021-09-30 2024-07-30 重庆平创半导体研究院有限责任公司 一种抗辐照封装结构及方法
US12125771B2 (en) 2021-12-08 2024-10-22 Nxp B.V. Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof
US11910530B2 (en) * 2022-03-25 2024-02-20 Tactotek Oy Method for manufacturing electronics assembly and electronics assembly

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266834A (en) * 1989-03-13 1993-11-30 Hitachi Ltd. Semiconductor device and an electronic device with the semiconductor devices mounted thereon
US5340771A (en) * 1993-03-18 1994-08-23 Lsi Logic Corporation Techniques for providing high I/O count connections to semiconductor dies
JP3003638B2 (ja) * 1997-08-05 2000-01-31 日本電気株式会社 半導体装置、その製造方法
JPH11312770A (ja) 1998-04-28 1999-11-09 Mitsumi Electric Co Ltd 薄型ｉｃの放熱フィン
JP3674333B2 (ja) * 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
AU2003299866A1 (en) * 2003-02-25 2004-09-28 Tessera, Inc. High frequency chip packages with connecting elements
WO2005059995A2 (en) * 2003-12-18 2005-06-30 Rf Module And Optical Design Limited Semiconductor package with integrated heatsink and electromagnetic shield
JP2006310821A (ja) * 2005-03-30 2006-11-09 Sanyo Electric Co Ltd 半導体モジュールおよびその製造方法
JP4821537B2 (ja) * 2006-09-26 2011-11-24 株式会社デンソー 電子制御装置
JP2009071234A (ja) * 2007-09-18 2009-04-02 Denso Corp 半導体装置
JP5233341B2 (ja) 2008-03-17 2013-07-10 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2011044452A (ja) * 2009-08-19 2011-03-03 Denso Corp 電子装置およびその製造方法

Also Published As

Publication number Publication date
TW201126659A (en) 2011-08-01
WO2011071603A3 (en) 2011-09-29
WO2011071603A2 (en) 2011-06-16
US8304887B2 (en) 2012-11-06
US20110140262A1 (en) 2011-06-16
JP2013513942A (ja) 2013-04-22
CN102576702B (zh) 2015-11-25
CN102576702A (zh) 2012-07-11

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