TWI513097B - 天線總成 - Google Patents
天線總成 Download PDFInfo
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- TWI513097B TWI513097B TW101151124A TW101151124A TWI513097B TW I513097 B TWI513097 B TW I513097B TW 101151124 A TW101151124 A TW 101151124A TW 101151124 A TW101151124 A TW 101151124A TW I513097 B TWI513097 B TW I513097B
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- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
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- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000013011 mating Effects 0.000 description 8
- 239000012212 insulator Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
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- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/08—Means for collapsing antennas or parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/362—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith for broadside radiating helical antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q11/00—Electrically-long antennas having dimensions more than twice the shortest operating wavelength and consisting of conductive active radiating elements
- H01Q11/02—Non-resonant antennas, e.g. travelling-wave antenna
- H01Q11/08—Helical antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/30—Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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Description
本發明係關於用於以超過200 MHz之頻率操作的天線總成,該總成包括介電負載之天線及用於將天線耦接至主機設備之連接器。
此類總成揭示於2010年9月21日申請之英國公開專利申請案第GB2473676A號及對應之美國申請案第12/887,220號中,該等申請案之揭示內容以引用的方式併入本文中。在此已知總成中,具有實心絕緣介電核心之介電負載之螺旋天線具有在天線之中央軸線上穿過核心中之通道的同軸饋電線。在核心之外部圓柱形表面上鍍敷四個螺旋天線及平衡-不平衡轉換器(balun)套筒。核心之鄰近平衡-不平衡轉換器套筒的端面亦經鍍敷,且用以將平衡-不平衡轉換器套筒連接至饋電線在天線之基座處的外導體。連接器包含焊接至饋電線之內導體中央接腳以及環繞接腳且焊接至核心之鍍敷端面的中空外連接部件,使得接腳及外連接部件兩者自天線之基座突出。絕緣模製覆蓋物包裝天線及連接器兩者。
在公開之國際申請案第WO2011/092498號中,揭示一種逆火介電負載之四臂(quadrifilar)螺旋天線,其中饋
電線呈安放於核心之通道中之長形層板的形式。
已知提供具有積體低雜訊放大器之逆火介電負載之螺旋天線。在一實例中,將天線安裝於矩形鍍敷殼體之端面上,該放大器包含一印刷電路板,其安放於殼體中且於一邊緣耦接至自天線之基座突出的同軸饋電線及在相對邊緣耦接至安裝於殼體之相對末端上的同軸連接器。該殼體具有一可移除傳導罩。此類總成揭示於由Sarantel Limited在2003年5月發佈且題為「GeoHelix-HTM GPS Antenna」的廣告傳單中。
本發明之目的為提供經改良且更多用途之強固型天線總成。
根據本發明,用於在超過200 MHz之一頻率下操作的天線總成包含一介電負載之天線與一外殼之組合,該外殼合併用於將該天線耦接至主機設備之一連接器,其中:該天線包含具有一外表面且經塑形來界定一中央天線軸線的一絕緣核心、於該核心外表面上或鄰近其之至少一傳導元件、及在該中央軸線上之一層板,該核心之該外表面包括相對於該軸線橫向定向之近及遠表面部分以及圍繞該軸線且在該近與遠表面部分之間延伸的一側表面部分,且該層板自該近核心表面部分近端延伸;該外殼包含一外殼主體,其為該層板形成一中空傳導屏蔽物且其中心位在該天線軸線上,該外殼主體具有一遠凹座,其由一遠外殼輪緣界限且經塑形及設計尺寸來安放該天線之一近部分,
其中該遠輪緣圍繞且接合該天線側表面部分,自該外殼輪緣於近端延伸來圍繞該軸線之一側壁藉此圍住含有該層板之一內部空間,及一近連接器部分安放與該傳導屏蔽物絕緣且連接至該層板之一信號導體的一信號接點;及該外殼經塑形來提供一安裝表面,其在一垂直於該軸線之橫截面平面中界定在該平面中一區域之一周邊,該區域至少與該天線之該近部分之橫截面面積一樣大。在根據本發明之一較佳天線總成中,該天線具有一實心核心,且該核心外表面界定一天線容積,其主要部分由該核心之實心介電材料佔據。在此較佳總成中,天線核心具有鍍敷於圓柱形表面上之多個螺旋天線元件。該核心之材料可為陶瓷,且其較佳具有至少為5的相對介電常數。該核心具有自核心遠表面部分延伸至近表面部分的軸向通道。在本發明之此實施例中,該核心具有恆定橫截面且為圓柱形的,但其他橫截面為可能的。較佳地是層板構成一長形饋電線結構,其自核心遠表面部分處之饋入連接延伸穿過通道至與該外殼連接器之信號接點的上述連接。在核心之遠表面部分上面對面置放一小碟形橫向層板部分,其用以將饋電線結構連接至螺旋天線元件。在此狀況下,層板包含在核心通道中之長形傳輸線區段及近部分,該板位於含有該中央軸線之平面中。當該板自核心之近端面部分突出時,其橫向範圍大於傳輸線區段之橫向範圍。將饋電線結構耦接至天線元件之層板部分垂直於該軸線及長形層板之平面。
該外殼通常包括一絕緣蓋,較佳一模製熱塑性
蓋,其圍繞且囊封該天線及外殼主體。外殼之上述安裝表面可在蓋上或其可在外殼主體上。在任一狀況下,該表面較佳為環形且在天線軸線中央。舉例而言,安裝表面可為近端面向表面抵靠設備外殼上之一配合表面而接合及密封;或其可為徑向向外面對來接合例如設備外殼中之凹座的側部之表面。在後者狀況下,安裝表面可具有螺紋。安裝表面較佳為近安裝表面,此係因為其定位於外殼之近部分上。
在安裝表面係位於絕緣蓋的狀況下,其可形成為該蓋之內部唇緣上之近端面向表面,該外殼主體具有一近端面向承抵表面,其抵靠於內部唇緣之遠表面上使得當例如用螺絲將外殼主體擰至設備外殼上的螺紋凸座(boss)上時,蓋唇緣壓在外殼主體承抵表面與設備外殼上之環形安裝表面之間。
一般而言,較佳的是外殼主體具有用於將總成緊固至主機設備之環形螺紋部分,該螺紋部分係定心於天線軸線上。
在較佳實施例中,外殼具有大體圓柱形外表面,其在天線軸線中央且自外殼輪緣延伸至近連接器部分,此安裝表面係環形且周邊為大體環形。安裝表面通常為圍繞該連接器之近端定向表面。
該連接器較佳包含電連接至材料從而形成由外殼主體形成之傳導屏蔽物之套筒接點與形成信號接點之軸向接腳的同軸組合。有利地是,兩接點均相對於近端定向
之安裝表面近端突出。
在內部,較佳實施例之外殼具有定位層板之近邊緣的溝槽,且類似地,該天線核心在其近表面部分中具有凹座,其收納且定位層板之徑向延伸遠端定向邊緣。
外殼之內部空間可充分大以容納一層板,其具有將天線元件或多個元件耦接至連接器信號接點之濾波器或放大器電路。
為幫助結構強度,可在外殼主體之遠凹座中將天線核心結合至外殼主體。在外殼主體構成總成之實心金屬化組件且天線具有具金屬化塗層之近部分的狀況下,諸如上文所述之平衡-不平衡套筒,可藉由焊接或使用諸如銀加載環氧樹脂之傳導膠來將核心結合至外殼。或者,外殼主體可為總成之傳導鍍敷之塑膠組件。此外,接著可將外殼主體傳導結合至核心上之傳導層。外殼主體為單一整體組件為較佳的。
本發明較佳體現於一種總成中,其中天線包含一圓柱形逆火螺旋天線,其具有鍍敷於該核心之該側表面部分上之多個螺旋天線元件,且自與該核心遠表面部分之一軸向屏蔽饋電線的一連接而延伸至鍍敷於該核心側表面部分之一近部分上的一傳導平衡-不平衡套筒,該套筒係於該天線核心與鄰近該遠外殼輪緣之該外殼主體之間的一環形界面周圍結合至該外殼主體。為了進行保護,提供一模製絕緣蓋,其圍住該天線及該外殼之該側部,該外殼具有至少一鍵控特徵來抵抗該蓋在軸向方向上之移除及該蓋在天
線與外殼之組合上的旋轉。
本發明之實施例組合穩固性、連接至主機設備之簡易性及生產經濟。
10‧‧‧天線
10A~F、11C~D‧‧‧天線元件
12‧‧‧外殼
12A‧‧‧肩部
12B‧‧‧外殼主體
12I‧‧‧絕緣體
12U‧‧‧遠輪緣
12S‧‧‧側壁
12K‧‧‧平台
12P‧‧‧安裝表面
12R‧‧‧凹座
12BA‧‧‧近端面向環形承抵表面/外殼主體遠表面
12BB‧‧‧基座壁
12CP‧‧‧近連接器部分
12IG、24‧‧‧溝槽
14‧‧‧連接器
16‧‧‧圓柱形介電核心
16B‧‧‧孔
16D‧‧‧遠端面部分
16P‧‧‧近表面部分
16S‧‧‧側表面部分
18L、18K‧‧‧饋入連接節點
20‧‧‧傳導套筒
20U‧‧‧輪緣
22‧‧‧軸線
26‧‧‧層板
26C‧‧‧導體區
26D‧‧‧遠連接部分
26I‧‧‧細長中間部分
26P、36P‧‧‧近端部分
26Z‧‧‧阻抗匹配網路
26PD‧‧‧遠側面對邊緣
28‧‧‧前端RF放大器
30‧‧‧接點接腳
32‧‧‧碟形橫向層板部分
32S‧‧‧中央狹槽
34‧‧‧套筒接點/連接器套筒
36‧‧‧蓋
36PL‧‧‧內部唇緣
38‧‧‧環形溝槽
40‧‧‧彈性O形環
現將參看附圖以舉例說明方式來描述本發明:圖1為根據本發明之包括保護性蓋之天線總成的剖開透視圖;圖2為圖1之天線總成移除蓋的剖開透視圖;及圖3為圖1及圖2之天線總成的分解圖。
參看圖1至圖3,根據本發明之天線總成具有用於在超過200 MHz之兩頻率下操作的雙頻介電負載之天線10,在此狀況下,GPS L1及L2頻率為1575 MHz及1228 MHz。天線10收納於外殼12中,外殼12併有用於將天線耦接至主機設備之連接器14。在本發明之此實施例中,天線為雙頻多臂天線,如圖2中所示,其具有兩組螺旋傳導天線元件10A至10F、11A至11D(圖2中並非全部可見),該等螺旋傳導天線元件鍍敷於圓柱形介電核心16之圓柱形側表面部分16S上,如WO2010/103264中所揭示,其揭示內容以引用的方式併入本申請案中。第一組之天線元件10A至10F包含在以下範圍內之閉路螺旋傳導軌道:其經由核心之遠端面部分16D上之徑向連接軌道而自遠端面部分16D上的饋入連接節點18K、18L延伸至鍍敷於核心側表面部分16S之近端部分上的傳導套筒20之輪緣20U。第二組11A至11D之
天線元件為在以下範圍內之開路:其自饋入連接節點18K、18L延伸至與套筒20之輪緣20U間隔開的開路末端。
關於核心16,其由陶瓷材料製成,且在此實施例中為在區域21中具有恆定介電常數之鈣-鎂-鈦酸鹽材料。該核心除了孔16B在天線之中央軸線22上居中之外為實心的,使得該核心之實心材料佔據由核心外表面界定之內部容積的主要部分。
核心遠表面部分16D垂直於軸線22。核心16具有亦垂直於軸線之相反定向的近表面部分16P,且孔16B自遠表面部分16D通過核心至近表面部分16P。在直徑上且在孔16B之相對側上延伸,遠表面部分16D具有在直徑上居中之一對溝槽24。遠表面部分16D及溝槽24兩者經鍍敷,鍍敷傳導層係與套筒20電連續。安放於軸向孔16B中的為形成天線之饋電線結構之部分的層板26。該板之遠饋入連接部分26D自核心之遠表面部分16D突出短距離。藉由連接至遠連接部分26D,層板26具有形成饋電線結構之傳輸線區段的長形中間部分26I。在中間部分26I之近端,在近核心溝槽24之基座或基底,板26具有近端部分26P,其在中間部分26I之兩側上比中間部分26I寬且突出超出核心16之近端面部分16P。在本發明之此實施例中,板26之近端部分26P載運前端RF放大器28,其中輸入端連接至板中間部分26I之傳輸線區段,且輸出端連接至位於軸線22上之叉狀接點接腳30。由於比中間部分26I寬,該板之近端部分26P具有遠側面對邊緣26PD,其就座於核心中之溝槽24中來界定板26之軸向位
置及其相對於天線元件10A至10F、11A至11D及鍍敷於核心遠端面部分16D上之相關聯導體的旋轉位置,如在分別在2011年11月25及2011年11月28日申請之同在申請中的英國申請案第1120466.6號及美國申請案第61/564,227號中所揭示,該等申請案之內容以引用的方式併入本文中。板26具有三個傳導層,其在中間區段16I中形成一似同軸屏蔽傳輸線,其屏蔽物在板上連接至鄰近位於溝槽24中之遠側面對邊緣26PD的導體區26C(圖2),其中經由焊接連接,其在每一溝槽24之基座中連接至核心之近端部分上的傳導層。因此,天線之套筒20連接至由板中間區段16I形成的傳輸線之屏蔽物,其中套筒輪緣20U與屏蔽物之間的最小路徑長度特定由溝槽24之基座的軸向位置界定,藉此界定一套筒平衡-不平衡轉換器。在本發明之其他變體中,可省略溝槽24。
如圖2所示,在核心16之遠表面部分16D上面對面緊固的為碟形橫向層板部分32,其具有收納軸線22上之層板26之突出遠端部分26D的中央狹槽32S。層板26之傳導層與橫向層板部分32之該等傳導層之間以及橫向層板部分32之該等傳導層與核心遠表面部分26D之饋電線連接節點18K、18L之間的電連接將層板中間部分26I之傳輸線經由阻抗匹配網路26Z而耦接至天線元件,如上文參考之英國申請案第1120466.6號中所揭示。在此狀況下,匹配網路可操作而以兩操作頻率來將天線元件10A至10F、11A至11D匹配至傳輸線。
如圖1及圖2中所示,包含鍍敷核心、軸向定向層
板26及橫向層板部分32之天線10緊固於形成為外殼12之凹座12R的插座中。外殼12包含一實心金屬外殼主體12B,其為單一、整合形成之單塊組件。外殼主體12B具有具外圓柱形表面之側壁12S,其直徑大於天線核心16之直徑,側壁12S具有遠輪緣12U,遠輪緣12U與內部肩部12A組合界定凹座12R。在本發明之此實施例中,外殼主體12之輪緣12U為連續的。作為替代,輪緣可代替包含多個城形物(castellation),其目的為將天線10定位於外殼主體12B上。在肩部12A下方,外殼主體側壁12S之厚度使得外殼主體界定一含有層板26之接近部分26P的內部空間。此空間藉由外殼主體之近連接器部分12CP之近基座壁12BB來近端封閉,其具有用於連接至14之接點接腳30的中央孔。在本發明之實施例中,接點接腳30就座於塑膠絕緣體12I中而形成用於基座壁12BB中之中央孔的插頭,絕緣體12I具有在孔中圍繞接腳30之中央輪轂且具有覆蓋基座壁12BB之內表面的較大直徑凸緣部分。
接點接腳30為叉狀的,具有用以收納層板26之近邊緣之遠狹槽,使得接腳30及板26兩者可位於軸線22上。藉由焊接連接至層板近部分26P之相對主面上的傳導層而將接腳30緊固至板26。呈記憶體12I中溝槽12IG形式之直徑凹座支撐層板26之近邊緣。
中心在軸線上且自外殼主體之近連接器部分12CP之基座壁12BB突出的,為內部螺紋傳導連接器套筒34,其作為導向外殼主體12B之一部分形成一套筒接點。在
本發明之此實施例中,此套筒接點及軸向接腳30構成一SMA連接器。可在其他實施例中使用替代標準連接器格式。
藉由凹座12R中之焊接連接將外殼主體12B緊固至天線10,亦即在外殼主體輪緣12U之內表面與天線核心16之近部分上之鍍敷表面之間,詳言之套筒20與鍍敷近表面16P之間。如圖3中最佳可見,天線10、外殼12及軸向接點接腳30之總成包含以下初步步驟:組裝天線組件及將接點接腳30裝配至層板近部分26P,接著將絕緣體12I插入至外殼主體12B之內部空間中,接著將具有接點接腳30之天線10插入至外殼主體12P中,使得接腳30之絕緣體12I之中央近端突出而與連接器14之套筒接點34配準。最後,在凹座12R中之外殼主體12B之材料與天線10之鍍敷近部分之間形成焊接接合或替代性傳導結合。
天線外殼包括模製保護之熱塑性蓋36(見圖1)。將此蓋原位模製於天線10及外殼主體12B上以便匹配兩者之輪廓且囊封兩者。在本發明之實施例中,蓋36具有圍繞外殼主體12B之近連接器部分12CP的近端部分36P,此近端部分36P終止於安裝表面12P中,定位該安裝表面12P來將配合表面接合於主機設備上。安裝表面12P為環形且經近端定向,其中心係位於軸線22上以便環繞同軸連接器14之套筒接點34。蓋近部分36P具有內部環形唇緣36PL,其接合外殼主體12B上之抵靠於內部唇緣36PL之遠表面上的近端面向環形承抵表面12BA。近安裝表面12P形成於內部唇緣36PL上。因此,當藉由將連接器14用螺絲擰於主機設備上之配
合連接器部分上而將總成裝配至主機設備時,外殼主體遠表面12BA抵靠於蓋36之內部唇緣36PL上,以便推動近安裝表面12P抵靠主機設備。
由於近安裝表面12P具有一在垂直於軸線22之平面中圍住一區域的圓形周邊(該區域大於天線核心之橫截面面積),所以在本發明之此較佳實施例中之近安裝表面12P的鄰接表面具有至少與天線核心16一樣大的直徑。此意味可將天線總成整體硬固性地且穩固地安裝至主機設備上的合適配合表面。總成之安裝並不單獨依賴於同軸連接器14對垂直於總成軸線22之軸線周圍的力矩的抵抗力,該等力矩由例如橫向吹風或橫向壓力所引起的橫向作用於總成側部上的力而產生。不管藉由屏蔽之近層板部分26P而添加至天線10之長度及該結構所產生之所得較長桿臂,與天線經組配來直接安置於主機表面上的結構相比,環形近安裝表面12P之存在減輕了在連接器14之接點30、34上的潛在損害應變。將注意,外殼主體12B具有平台12K(其中一者在圖12中展示於其外表面上),其形成作為主要特徵之凹座,該等凹座經塑形以不僅在軸向方向上將蓋36保持在外殼上而且防止蓋36相對於外殼主體12B圍繞軸線22旋轉。
在近安裝表面12P中切割一環形溝槽38,其可用以安放一彈性O形環40作為安裝表面12P之部分,以用於抵靠主機設備之配合表面的改良密封。
在上述實施例中,如圖1中所示,將蓋36原位模製於外殼主體12B與天線10之組合上。作為替代,可分開模
製蓋36,且接著將其咬合於天線及外殼主體上。
上文所描述且在附圖中展示之天線總成經組配來裝配至SMA連接器,SMA連接器站立於主機設備上之配合表面上。由於此原因,連接器14在蓋36之近部分36P內凹入。在替代實施例中,連接器14相對於蓋36之近邊緣近端突出,以接合相對於主機設備配合表面整體或部分凹入之連接器。實際上,近安裝表面12P可形成於外殼主體12B上而非蓋36上,從而提供由安裝表面12P界定之周邊,其圍住一比天線核心16之橫截面面積大的區域以便保持上文提及之安裝硬固性。在此狀況下,安裝表面12P抵靠主機設備上之配合表面的鄰接係由於將總成用螺絲擰於主機設備之螺紋部分上,該安裝表面被推動至與主機設備配合表面密封接觸。所描述及所說明實施例之連接器14具有內部螺紋。改為在外殼主體12B之外表面上提供一緊固螺紋為可能的。實際上,螺紋表面可自身形成近安裝表面以便提供所需硬固性。亦即,除了中心在總成軸線上之螺紋連接之外,可提供其他固定構件。
上文所描述且在附圖中展示之較佳實施例合併具有四個螺旋天線元件10A至10F、11A至11D的雙頻帶天線。其他天線配置為可能的,包括例如四臂或八臂天線。可形成此類總成之基礎的四臂天線揭示於上文提及之WO2011/092498中。在此狀況下,該天線意欲在單一頻率下或在單一頻率頻帶內操作,且匹配網路相應地經組配。
10‧‧‧天線
12‧‧‧外殼
12A‧‧‧肩部
12B‧‧‧外殼主體
12I‧‧‧絕緣體
12U‧‧‧遠輪緣
12S‧‧‧側壁
12R‧‧‧凹座
12BB‧‧‧基座壁
12CP‧‧‧近連接器部分
12IG‧‧‧溝槽
16‧‧‧圓柱形介電核心
16B‧‧‧孔
16D‧‧‧遠端面部分
16P‧‧‧近表面部分
20‧‧‧導電套筒
20U‧‧‧輪緣
24‧‧‧溝槽
26‧‧‧層板
26D‧‧‧遠連接部分
26I‧‧‧細長中間部分
26P‧‧‧近端部分
26Z‧‧‧阻抗匹配網路
26PD‧‧‧遠側面對邊緣
28‧‧‧前端RF放大器
30‧‧‧接點接腳
32‧‧‧碟形橫向層板部分
34‧‧‧套筒接點/連接器套筒
Claims (23)
- 一種用於在超過200MHz之頻率下操作的天線總成,其包含一介電負載之天線與一外殼之組合,該外殼合併用於將該天線耦接至主機設備之一連接器,其中:該天線包含具有一外表面且塑形來界定一中央天線軸線的一絕緣核心、於該核心之外表面上或鄰近其之至少一傳導元件、及在該中央軸線上之一層板,該核心之該外表面包括相對於該軸線橫向定向之近及遠表面部分、以及圍繞該軸線且在該近與遠表面部分之間延伸的一側表面部分,且該層板自該核心之近表面部分近端延伸;該外殼包含一外殼主體,其為該層板形成一中空傳導屏蔽物且其中心位在該天線軸線上,該外殼主體具有一遠凹座,其由一遠外殼輪緣界限且塑形及設計尺寸來安放該天線之一近部分,其中該遠輪緣圍繞且接合該側表面部分,自該外殼輪緣於近端延伸來圍繞該軸線之一側壁,藉此圍成含有該層板之一內部空間,及一近連接器部分安放與該傳導屏蔽物絕緣且連接至該層板之一信號導體的一信號接點;以及該外殼塑形以提供一安裝表面,其在一垂直於該軸線之橫截面平面中界定在該平面中一區域之一周邊,該區域至少與該天線之該近部分之橫截面面積一樣大,該安裝表面係近端地定位於該外殼上,及其中該外殼包括 圍繞該天線及該外殼主體之一絕緣蓋,以實質匹配該天線及該外殼主體之輪廓,並包封該天線及該外殼主體兩者。
- 如請求項1之總成,其中該安裝表面在該蓋上。
- 如請求項1之總成,其中該安裝表面在該外殼主體上。
- 如請求項1之總成,其中該安裝表面為環形且其中心在該天線軸線上。
- 如請求項1之總成,其中該安裝表面為一近端面向表面。
- 如請求項2之總成,其中該安裝表面為在該蓋之一整體唇緣上之一近端面向表面,該外殼主體具有抵靠於內部唇緣之一遠表面上之一近端面向承抵表面。
- 如請求項1之總成,其中該外殼主體具有用於將該總成緊固於主機設備之一環形螺紋部分,該螺紋部分之中心係位於該天線軸線上。
- 如請求項1之總成,其中該外殼具有中心位在該天線軸線上且自該輪緣延伸至該近連接器部分的一大體圓柱形外表面。
- 如請求項1之總成,其中該安裝表面為環形且具有一大體圓形周邊。
- 如請求項1之總成,其中該連接器包含電氣連接至形成該傳導屏蔽物的材料之一套筒接點、及形成該信號接點之一軸向接腳的同軸組合,兩接點均相對於該外殼主體近端突出。
- 如請求項10之總成,其中該安裝表面為一環形近端定向 表面,且連接器接點自該安裝表面近端突出。
- 如請求項1之總成,其中該外殼之該主體包括定位該層板之一邊緣的一溝槽。
- 如請求項1之總成,其中該層板具有一徑向延伸遠端定向之邊緣,且該核心在其近表面部分具有一凹座,其收納及定位該層板之該遠端定向之邊緣。
- 如請求項1之總成,其中該天線之核心具有一延伸穿過其之軸向通道,且該層板構成一長形饋電線結構,其自該核心之遠表面部分之一饋入連接穿過該通道延伸至與該外殼之連接器之該信號接點的連接處。
- 如請求項14之總成,其中該層板包含在該核心通道中之一長形傳輸線區段、及在該外殼內部空間中之一近部分,該近部分之橫向範圍係大於該傳輸線區段之橫向範圍。
- 如請求項1之總成,其中在該外殼之該內部空間中,該層板具有將該天線元件耦接至該連接器信號接點的濾波器或放大器電路。
- 如請求項1之總成,其中該天線之核心在其之該遠凹座中結合至該外殼主體。
- 如請求項1之總成,其中該外殼主體為該總成之一實心金屬組件或該總成之一傳導鍍敷之塑膠組件。
- 如請求項18之總成,其中該外殼主體為一整體單件組件。
- 如請求項18之總成,其中該天線之近部分具有在該凹座中傳導結合至該外殼主體之一金屬化塗層。
- 如請求項20之總成,其中該天線包含一圓柱形逆火螺旋 天線,其具有鍍敷於該核心之該側表面部分上之多個螺旋天線元件,且此等天線元件自與該核心之遠表面部分之一軸向屏蔽饋電線的一連接而延伸至鍍敷於該核心之側表面部分之一近部分上的一傳導平衡-不平衡套筒,該套筒係於該天線核心與鄰近該遠外殼輪緣之該外殼主體之間的一環形界面周圍傳導性結合至該外殼主體。
- 如請求項1之總成,其中該絕緣蓋為一模製蓋,其圍住該天線且鍵接至該外殼之該側壁。
- 如請求項1之總成,其中該天線之核心及該外殼主體具有形狀特徵件,該等形狀特徵件旋迴地圍繞該軸線相對於該天線核心定位該外殼主體。
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KR20140138600A (ko) | 2014-12-04 |
GB201200638D0 (en) | 2012-02-29 |
US9112273B2 (en) | 2015-08-18 |
US20130181881A1 (en) | 2013-07-18 |
GB2498431B (en) | 2015-01-28 |
WO2013104882A1 (en) | 2013-07-18 |
GB2498431A (en) | 2013-07-17 |
KR101553987B1 (ko) | 2015-09-17 |
GB201222323D0 (en) | 2013-01-23 |
TW201334282A (zh) | 2013-08-16 |
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