TWI513080B - 金屬掩膜版的混合製作方法 - Google Patents

金屬掩膜版的混合製作方法 Download PDF

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Publication number
TWI513080B
TWI513080B TW102116297A TW102116297A TWI513080B TW I513080 B TWI513080 B TW I513080B TW 102116297 A TW102116297 A TW 102116297A TW 102116297 A TW102116297 A TW 102116297A TW I513080 B TWI513080 B TW I513080B
Authority
TW
Taiwan
Prior art keywords
core mold
preparing
electroforming
metal mask
electroformed
Prior art date
Application number
TW102116297A
Other languages
English (en)
Chinese (zh)
Other versions
TW201347267A (zh
Inventor
Chih-Ling Wei
Hsiao-Ping Kao
Original Assignee
Kun Shan Power Stencil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kun Shan Power Stencil Co Ltd filed Critical Kun Shan Power Stencil Co Ltd
Publication of TW201347267A publication Critical patent/TW201347267A/zh
Application granted granted Critical
Publication of TWI513080B publication Critical patent/TWI513080B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/142—Forme preparation for stencil-printing or silk-screen printing using a galvanic or electroless metal deposition processing step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/147—Forme preparation for stencil-printing or silk-screen printing by imagewise deposition of a liquid, e.g. from an ink jet; Chemical perforation by the hardening or solubilizing of the ink impervious coating or sheet
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C23F1/04—Chemical milling
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Electroluminescent Light Sources (AREA)
  • ing And Chemical Polishing (AREA)
TW102116297A 2012-05-08 2013-05-08 金屬掩膜版的混合製作方法 TWI513080B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210139817.8A CN103388121B (zh) 2012-05-08 2012-05-08 一种高精度金属掩模板的混合制作工艺

Publications (2)

Publication Number Publication Date
TW201347267A TW201347267A (zh) 2013-11-16
TWI513080B true TWI513080B (zh) 2015-12-11

Family

ID=49532539

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102116297A TWI513080B (zh) 2012-05-08 2013-05-08 金屬掩膜版的混合製作方法

Country Status (5)

Country Link
JP (1) JP5969114B2 (ja)
KR (1) KR101911416B1 (ja)
CN (1) CN103388121B (ja)
TW (1) TWI513080B (ja)
WO (1) WO2013166951A1 (ja)

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* Cited by examiner, † Cited by third party
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KR102134363B1 (ko) * 2013-09-10 2020-07-16 삼성디스플레이 주식회사 메탈 마스크 제작 방법 및 이를 이용한 메탈 마스크
CN103882375B (zh) * 2014-03-12 2016-03-09 京东方科技集团股份有限公司 一种掩膜板及其制作方法
CN104593722B (zh) * 2014-12-23 2017-06-06 深圳市华星光电技术有限公司 掩膜板的制作方法
CN106033802B (zh) * 2015-03-17 2018-06-29 上海和辉光电有限公司 一种蒸镀用掩模板及其制作方法
EP3993075A1 (en) * 2015-04-24 2022-05-04 Lg Innotek Co. Ltd Deposition mask
WO2017045122A1 (en) * 2015-09-15 2017-03-23 Applied Materials, Inc. A shadow mask for organic light emitting diode manufacture
WO2017142231A1 (ko) * 2016-02-16 2017-08-24 엘지이노텍 주식회사 금속판, 증착용마스크 및 이의 제조방법
CN105714248A (zh) * 2016-04-01 2016-06-29 昆山允升吉光电科技有限公司 一种高精度蒸镀用复合掩模板组件制作方法
JP6264523B1 (ja) * 2016-05-23 2018-01-24 凸版印刷株式会社 蒸着用メタルマスク、蒸着用メタルマスクの製造方法、および、蒸着用メタルマスク形成基材
WO2017201669A1 (en) * 2016-05-24 2017-11-30 Applied Materials, Inc. A shadow mask with plasma resistant coating
CN106119773B (zh) 2016-08-03 2018-10-26 京东方科技集团股份有限公司 掩膜板及其制造方法、蒸镀掩膜板组件及其制造方法
CN106350769B (zh) * 2016-09-22 2019-03-01 常州友机光显电子科技有限公司 一种金属荫罩及其制备方法
CN108728790A (zh) * 2017-04-21 2018-11-02 苏州苏大维格光电科技股份有限公司 Amoled用金属掩膜板的制造方法
CN107164788B (zh) * 2017-05-23 2019-08-02 上海天马有机发光显示技术有限公司 掩膜板及其制作方法
CN107699854B (zh) * 2017-11-10 2019-09-17 京东方科技集团股份有限公司 掩膜组件及其制造方法
CN108251868B (zh) * 2018-02-10 2018-12-04 胡泮 一种仪表板搪塑模具镍壳与树脂芯模的分离方法
CN108630832A (zh) * 2018-03-13 2018-10-09 阿德文泰克全球有限公司 金属荫罩及其制备方法
CN108300963B (zh) * 2018-03-30 2019-08-27 昆山国显光电有限公司 一种掩模板
CN111508349B (zh) * 2019-01-31 2022-03-08 武汉华星光电半导体显示技术有限公司 一种显示面板、显示面板的制造方法及电子设备
CN109898104A (zh) * 2019-02-20 2019-06-18 合肥永淇智材科技有限公司 一种锥状开口的fmm电铸母板制作方法
CN110484864B (zh) * 2019-09-29 2021-09-10 京东方科技集团股份有限公司 子掩膜版以及掩膜版
CN112606544B (zh) * 2020-11-19 2023-05-12 浙江硕克科技有限公司 一种金属版及其加工工艺
CN113276536B (zh) * 2021-05-14 2022-05-27 常州天禄显示科技有限公司 一种微结构孔金属印刷模板及其制造方法
TWI810563B (zh) * 2021-05-14 2023-08-01 達運精密工業股份有限公司 遮罩的製造方法及遮罩製造裝置
TWI822510B (zh) * 2022-12-09 2023-11-11 達運精密工業股份有限公司 金屬遮罩及金屬遮罩的製造方法
CN116511842B (zh) * 2023-04-27 2023-10-03 寰采星科技(宁波)有限公司 一种精密金属掩模板的制作方法及精密金属掩模板
CN116825752B (zh) * 2023-08-29 2024-02-09 江西兆驰半导体有限公司 一种晶圆及其印刷方法

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TW200923111A (en) * 2007-11-23 2009-06-01 Samsung Sdi Co Ltd Mask assembly for thin film vapor deposition of flat panel display
TW201013305A (en) * 2008-09-01 2010-04-01 Samsung Mobile Display Co Ltd Mask for thin film deposition and method of manufacturing OLED using the same
JP2011088107A (ja) * 2009-10-26 2011-05-06 Seiko Epson Corp フィルターの製造方法及びフィルター
US20110168087A1 (en) * 2010-01-11 2011-07-14 Lee Choong-Ho Mask frame assembly for thin film deposition

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US4615781A (en) * 1985-10-23 1986-10-07 Gte Products Corporation Mask assembly having mask stress relieving feature
US20030101932A1 (en) * 2001-12-05 2003-06-05 Samsung Nec Mobile Display Co., Ltd. Tension mask assembly for use in vacuum deposition of thin film of organic electroluminescent device
CN1804138A (zh) * 2005-11-14 2006-07-19 深圳市允升吉电子有限公司 一种有机发光显示器蒸镀用掩膜的电铸制作方法
TW200923111A (en) * 2007-11-23 2009-06-01 Samsung Sdi Co Ltd Mask assembly for thin film vapor deposition of flat panel display
TW201013305A (en) * 2008-09-01 2010-04-01 Samsung Mobile Display Co Ltd Mask for thin film deposition and method of manufacturing OLED using the same
JP2011088107A (ja) * 2009-10-26 2011-05-06 Seiko Epson Corp フィルターの製造方法及びフィルター
US20110168087A1 (en) * 2010-01-11 2011-07-14 Lee Choong-Ho Mask frame assembly for thin film deposition

Also Published As

Publication number Publication date
TW201347267A (zh) 2013-11-16
WO2013166951A1 (zh) 2013-11-14
KR101911416B1 (ko) 2018-10-24
CN103388121A (zh) 2013-11-13
KR20150021914A (ko) 2015-03-03
CN103388121B (zh) 2017-07-11
JP5969114B2 (ja) 2016-08-10
JP2015518524A (ja) 2015-07-02

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