TWI510855B - A photohardenable thermosetting resin composition, a dry film and a cured product using the composition, and a printed wiring board using the same - Google Patents

A photohardenable thermosetting resin composition, a dry film and a cured product using the composition, and a printed wiring board using the same Download PDF

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Publication number
TWI510855B
TWI510855B TW099104340A TW99104340A TWI510855B TW I510855 B TWI510855 B TW I510855B TW 099104340 A TW099104340 A TW 099104340A TW 99104340 A TW99104340 A TW 99104340A TW I510855 B TWI510855 B TW I510855B
Authority
TW
Taiwan
Prior art keywords
group
resin composition
compound
film
thermosetting resin
Prior art date
Application number
TW099104340A
Other languages
English (en)
Chinese (zh)
Other versions
TW201102754A (en
Inventor
Nobuhito Ito
Masao Arima
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201102754A publication Critical patent/TW201102754A/zh
Application granted granted Critical
Publication of TWI510855B publication Critical patent/TWI510855B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW099104340A 2009-07-02 2010-02-11 A photohardenable thermosetting resin composition, a dry film and a cured product using the composition, and a printed wiring board using the same TWI510855B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009157992A JP5356934B2 (ja) 2009-07-02 2009-07-02 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Publications (2)

Publication Number Publication Date
TW201102754A TW201102754A (en) 2011-01-16
TWI510855B true TWI510855B (zh) 2015-12-01

Family

ID=43410585

Family Applications (2)

Application Number Title Priority Date Filing Date
TW099104340A TWI510855B (zh) 2009-07-02 2010-02-11 A photohardenable thermosetting resin composition, a dry film and a cured product using the composition, and a printed wiring board using the same
TW103112974A TW201430491A (zh) 2009-07-02 2010-02-11 光硬化性熱硬化性樹脂組成物、使用該組成物之乾膜及硬化物、以及使用該等材料之印刷配線板

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103112974A TW201430491A (zh) 2009-07-02 2010-02-11 光硬化性熱硬化性樹脂組成物、使用該組成物之乾膜及硬化物、以及使用該等材料之印刷配線板

Country Status (3)

Country Link
JP (1) JP5356934B2 (enrdf_load_stackoverflow)
TW (2) TWI510855B (enrdf_load_stackoverflow)
WO (1) WO2011001484A1 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102792224A (zh) * 2010-03-08 2012-11-21 株式会社Lg化学 具有优良耐热性和机械性能的光敏树脂组合物及印刷电路板用保护膜
JP2011215392A (ja) * 2010-03-31 2011-10-27 Fujifilm Corp 感光性組成物、並びに、感光性積層体、永久パターン形成方法、及びプリント基板
JP2012159657A (ja) * 2011-01-31 2012-08-23 Asahi Kasei E-Materials Corp 光硬化型樹脂組成物及びそれを用いたパターン形成された基材の製造方法、並びに該基材を備える電子部品
CN103430100B (zh) * 2011-03-03 2016-08-17 日兴材料株式会社 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法以及导体图案的形成方法
TWI547759B (zh) * 2011-09-30 2016-09-01 Taiyo Ink Mfg Co Ltd A photosensitive resin composition, a hardened film thereof, and a printed wiring board
WO2015022885A1 (ja) * 2013-08-13 2015-02-19 太陽インキ製造株式会社 アルカリ現像型光硬化性熱硬化性樹脂組成物およびそれを用いたプリント配線板
CN105467765B (zh) * 2014-09-30 2020-04-24 富士胶片株式会社 感光性组合物、硬化膜的制造方法、硬化膜及其应用
JP6278933B2 (ja) * 2015-09-02 2018-02-14 株式会社タムラ製作所 絶縁被膜の形成方法、電子基板の製造方法および感光性樹脂組成物
JP6785122B2 (ja) * 2016-10-24 2020-11-18 東京応化工業株式会社 感光性組成物、及び硬化膜の形成方法
JP6701614B2 (ja) * 2018-05-30 2020-05-27 Dic株式会社 （メタ）アクリレート化合物、硬化性組成物、硬化物及び物品
TW202445265A (zh) 2023-03-31 2024-11-16 日商太陽控股股份有限公司 感光性樹脂組成物、乾膜、硬化物及印刷配線板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200417816A (en) * 2002-10-08 2004-09-16 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the composition, method for forming resist pattern and printed wiring board
TW200641524A (en) * 2005-03-04 2006-12-01 Fuji Photo Film Co Ltd Photosensitive solder resist composition, photosensitive solder resist film, permanent pattern and method for forming the same
TW200738771A (en) * 2005-12-27 2007-10-16 Taiyo Ink Mfg Co Ltd Alkali developable curable composition and cured product thereof
CN101290471A (zh) * 2007-04-17 2008-10-22 旭化成电子材料元件株式会社 感光性树脂组合物和层压体
TW200912534A (en) * 2007-06-04 2009-03-16 Taiyo Ink Mfg Co Ltd Photocuring and thermosetting resin composition and printed wiring obtained using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4127010B2 (ja) * 2002-10-08 2008-07-30 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板
JP2004138752A (ja) * 2002-10-17 2004-05-13 Tamura Kaken Co Ltd 感光性樹脂組成物及びプリント配線板
JP4328593B2 (ja) * 2003-09-18 2009-09-09 太陽インキ製造株式会社 カルボキシル基含有感光性樹脂を含有する組成物
JP2006003570A (ja) * 2004-06-16 2006-01-05 Tokyo Ohka Kogyo Co Ltd 印刷版製造用感光性組成物、並びに、これを用いた感光性印刷原版積層体および印刷版
JP2008250055A (ja) * 2007-03-30 2008-10-16 Toyobo Co Ltd 感光性樹脂組成物及びそれを用いた感光性樹脂印刷原版
JP2009063873A (ja) * 2007-09-07 2009-03-26 Toray Ind Inc 感光性印刷版原版
JP5513711B2 (ja) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200417816A (en) * 2002-10-08 2004-09-16 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the composition, method for forming resist pattern and printed wiring board
TW200641524A (en) * 2005-03-04 2006-12-01 Fuji Photo Film Co Ltd Photosensitive solder resist composition, photosensitive solder resist film, permanent pattern and method for forming the same
TW200738771A (en) * 2005-12-27 2007-10-16 Taiyo Ink Mfg Co Ltd Alkali developable curable composition and cured product thereof
CN101290471A (zh) * 2007-04-17 2008-10-22 旭化成电子材料元件株式会社 感光性树脂组合物和层压体
TW200912534A (en) * 2007-06-04 2009-03-16 Taiyo Ink Mfg Co Ltd Photocuring and thermosetting resin composition and printed wiring obtained using the same

Also Published As

Publication number Publication date
WO2011001484A1 (ja) 2011-01-06
TW201430491A (zh) 2014-08-01
JP5356934B2 (ja) 2013-12-04
TW201102754A (en) 2011-01-16
JP2011013486A (ja) 2011-01-20

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