TWI503916B - Transport mechanism of object to be processed - Google Patents

Transport mechanism of object to be processed Download PDF

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Publication number
TWI503916B
TWI503916B TW100139624A TW100139624A TWI503916B TW I503916 B TWI503916 B TW I503916B TW 100139624 A TW100139624 A TW 100139624A TW 100139624 A TW100139624 A TW 100139624A TW I503916 B TWI503916 B TW I503916B
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Prior art keywords
roller
transport
vacuum
substrate
film forming
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TW100139624A
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Chinese (zh)
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TW201246434A (en
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Tetsuhiro Ohno
Shigemitsu Sato
Hiroki Oozora
Yoshikatsu Satou
Ryuuji MATSUOKA
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Ulvac Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02Controlled or contamination-free environments or clean space conditions

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)

Description

被處理體之搬送機構Transport mechanism of the object to be processed

本發明係關於在真空處理裝置中,搬送被處理體之搬送機構。The present invention relates to a transport mechanism for transporting a target object in a vacuum processing apparatus.

本申請書主張基於2011年4月15日申請之日本專利申請案2011-091409號之優先權,並將其內容引用於此。The priority of Japanese Patent Application No. 2011-091409, filed on Apr. 15, 2011, is hereby incorporated by reference.

例如,用於電漿顯示器或液晶顯示器之大型玻璃基板,需要在真空下,升溫至所期望之溫度之加熱步驟;及以濺鍍、CVD(化學汽相沉積)、或蝕刻等之加工裝置成膜複數層之各種成膜步驟。For example, a large glass substrate for a plasma display or a liquid crystal display requires a heating step of heating to a desired temperature under vacuum; and a processing device such as sputtering, CVD (chemical vapor deposition), or etching. Various film forming steps of the multiple layers of the film.

自先前起,已將各種之成膜裝置提供實際使用。在將基板於水平狀態下成膜之成膜裝置中,若基板大型化,則伴隨於此,會產生裝置亦大型化之問題。因此,近年,研發有使基板大致直立來進行成膜等之縱型方式之成膜裝置。Various film forming apparatuses have been provided for practical use since the beginning. In the film forming apparatus in which the substrate is formed in a horizontal state, if the substrate is increased in size, there is a problem that the size of the device is also increased. Therefore, in recent years, a film forming apparatus having a vertical type in which a substrate is substantially erected to form a film or the like has been developed.

圖17係顯示先前之成膜裝置之基本構成之圖。Figure 17 is a view showing the basic configuration of a conventional film forming apparatus.

先前之成膜裝置100係具備:基板裝卸室120;連結於1直線上之第1至第3真空處理室200、220、240;及在大氣側與真空處理室200、220、240間搬送基板支架之L/UL室(Load/Unload:裝載/卸載)140。The film forming apparatus 100 of the prior art includes a substrate loading and unloading chamber 120, first to third vacuum processing chambers 200, 220, and 240 connected to one straight line, and a substrate for transporting between the atmospheric side and the vacuum processing chambers 200, 220, and 240. L/UL chamber of the bracket (Load/Unload: 140).

此外,於L/UL室140安裝有真空排氣裝置300。於加熱室安裝有加熱裝置及真空排氣裝置300。於各真空處理室200、220、240,分別安裝有濺鍍裝置等之成膜裝置210、230、250、及真空排氣裝置300。Further, a vacuum exhaust device 300 is attached to the L/UL chamber 140. A heating device and a vacuum exhaust device 300 are installed in the heating chamber. Film forming apparatuses 210, 230, and 250 and a vacuum exhausting apparatus 300, such as a sputtering apparatus, are attached to each of the vacuum processing chambers 200, 220, and 240, respectively.

又,於L/UL室140內及各真空處理室200、220、240內,設置有:第1搬送路徑160,其係成為將基板支架從L/UL室140搬送至各真空處理室200、220、240之去路之第1搬送路徑160;及成為從各真空處理室200、220、240經過加熱室,搬送至L/UL室140之回路之第2搬送路徑180。Further, in the L/UL chamber 140 and each of the vacuum processing chambers 200, 220, and 240, a first transport path 160 is provided to transport the substrate holder from the L/UL chamber 140 to each of the vacuum processing chambers 200, The first transport path 160 of the path of 220 and 240; and the second transport path 180 which is a circuit that passes through the heating chambers from the vacuum processing chambers 200, 220, and 240 and is transported to the L/UL chamber 140.

再者,成膜裝置100之最後部之第3真空處理室240,係具備將基板支架從第1搬送路徑(去路)160至第2搬送路徑(回路)180,相對於2個搬送路徑160、180於橫向移動移載之移載機構(未圖示)。該移載機構具有暫時舉起第1搬送路徑(去路)160上之基板支架,並移載至第2搬送路徑(回路)180之機構。In addition, the third vacuum processing chamber 240 at the rearmost portion of the film forming apparatus 100 includes the substrate holder from the first transport path (outgoing) 160 to the second transport path (loop) 180, and is connected to the two transport paths 160, 180 is a transfer mechanism (not shown) that moves in the lateral direction. The transfer mechanism has a mechanism for temporarily lifting the substrate holder on the first transport path (outgoing) 160 and transferring it to the second transport path (loop) 180.

第1及第2搬送路徑160、180係包含一對軌道,基板支架係藉由設置於其底部之複數對車輪,在該軌道上移動。The first and second transport paths 160 and 180 include a pair of tracks, and the substrate holder moves on the track by a plurality of pairs of wheels provided at the bottom thereof.

又,於基板支架之下表面設置有齒條,而於基板裝卸室120、第1至第3真空處理室200、220、240,係分別設置有以馬達之迴轉力迴轉之複數個小齒輪。藉由使小齒輪與齒條嚙合,來將馬達之驅動力傳達至基板支架,從而搬送基板支架。Further, a rack is provided on the lower surface of the substrate holder, and a plurality of pinion gears that are rotated by the rotational force of the motor are provided in the substrate loading and unloading chamber 120 and the first to third vacuum processing chambers 200, 220, and 240, respectively. By engaging the pinion gear with the rack, the driving force of the motor is transmitted to the substrate holder, thereby transporting the substrate holder.

說明如此之先前之成膜裝置100之基本動作。The basic operation of the prior film forming apparatus 100 is explained.

若在基板裝卸室120,將基板載置於基板支架,則該基板支架在被搬送至L/UL室140,且將該L/UL室140真空排氣,使其高真空化後,被搬送至準備於真空處理室200內、成為去路之第1搬送路徑160。When the substrate is placed on the substrate holder in the substrate loading and unloading chamber 120, the substrate holder is transported to the L/UL chamber 140, and the L/UL chamber 140 is evacuated and vacuumed, and then transported. The first transport path 160 is prepared to be in the vacuum processing chamber 200.

一面在第1搬送路徑(去路)160搬送基板支架(基板載體),一面在真空處理室200、220、240中,對所載置之基板施予加熱及成膜等真空處理。While the substrate holder (substrate carrier) is transported in the first transport path (outgoing) 160, the substrates to be placed are subjected to vacuum processing such as heating and film formation in the vacuum processing chambers 200, 220, and 240.

在真空處理室240真空處理基板後,藉由未圖示之移載機構將基板支架移載至成為回路之第2搬送路徑180,且在真空處理室200、220、240中,分別進行成膜等真空處理。基板支架在載置有經真空處理之基板之狀態下,經過L/UL室140,在基板裝卸室120卸載基板。After the substrate is vacuum-processed in the vacuum processing chamber 240, the substrate holder is transferred to the second transfer path 180 which is the circuit by the transfer mechanism (not shown), and the film formation is performed in the vacuum processing chambers 200, 220, and 240, respectively. Wait for vacuum treatment. The substrate holder is unloaded in the substrate loading and unloading chamber 120 through the L/UL chamber 140 while the vacuum-treated substrate is placed.

然而,在如上所述之先前之齒條及小齒輪形式之搬送機構中,因齒條與小齒輪之摩擦,產生因齒輪之缺損或磨耗所造成之微粒(粉塵),而成為良率之降低、及裝置之壽命縮短之主要原因。However, in the above-described conveying mechanism in the form of a rack and pinion, the friction between the rack and the pinion causes particles (dust) due to the loss or wear of the gear, resulting in a decrease in yield. And the main reason for the shortened life of the device.

[先前技術文獻][Previous Technical Literature] [專利文獻][Patent Literature]

[專利文獻1]日本特開2005-340425號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-340425

本發明係鑑於如此之先前之實際情況而研發者,其目的在於提供一種被處理體之搬送機構,其係能夠抑制磨耗所造成之微粒之產生,提高良率,並謀求裝置之長壽命化。The present invention has been made in view of such a conventional situation, and an object of the present invention is to provide a transport mechanism for a target object, which is capable of suppressing generation of fine particles due to abrasion, improving yield, and prolonging the life of the device.

本發明之第1態樣之被處理體之搬送機構係具備:於下部具備圓柱狀之滑動軸,且搬送被處理體之搬送構件;及包含複數個和前述滑動軸接觸,且具備誘導前述搬送構件之U字狀之溝部之輥的支撐構件者;且亦可前述滑動軸及前述輥中之一方之至少接觸部包含含有矽、鋁、氧、及氮之主體,前述滑動軸及前述輥中之另一方之至少接觸部包含不鏽鋼。The conveying mechanism of the object to be processed according to the first aspect of the present invention includes: a conveying shaft that has a cylindrical sliding shaft at a lower portion and conveys the object to be processed; and a plurality of the sliding members that are in contact with the sliding shaft and that induces the conveyance a supporting member of the roller of the U-shaped groove portion of the member; and at least one of the sliding shaft and the roller may include a body containing bismuth, aluminum, oxygen, and nitrogen, and the sliding shaft and the roller At least the contact portion of the other side contains stainless steel.

本發明之第2態樣之被處理體之搬送機構,在第1態樣中,前述主體亦可進一步包含釔、鈣、鎂、鋰、鈉之中至少一種。In the first aspect, the body of the object to be processed according to the second aspect of the present invention may further include at least one of barium, calcium, magnesium, lithium, and sodium.

本發明之第3態樣之被處理體之搬送機構,在第1或第2態樣中,前述支撐構件之U字狀之溝部,其曲率半徑R亦可在15~40 mm之範圍內。In the first or second aspect, the U-shaped groove portion of the support member may have a radius of curvature R of 15 to 40 mm in the first or second aspect.

本發明之第4態樣之被處理體之搬送機構,在第1至第3態樣之任一態樣中,藉由前述支撐構件,使前述搬送構件移動之搬送速度亦可在1~3000 mm/sec之範圍內。In the transport mechanism of the object to be processed according to the fourth aspect of the present invention, in any of the first to third aspects, the transporting speed of the transport member by the support member may be from 1 to 3,000. Within the range of mm/sec.

本發明之第5被處理體之搬送機構,在第1至第4態樣之任一態樣中,藉由前述支撐構件,使前述搬送構件移動之搬送加速度亦可為:加速時1200 mm/sec2 以下;減速時-650 mm/sec2 以下。In the transport mechanism of the fifth object to be processed according to the present invention, in any of the first to fourth aspects, the transporting acceleration of the transport member by the support member may be 1200 mm/acceleration. Sec 2 or less; -650 mm/sec 2 or less when decelerating.

本發明之第6態樣之成膜裝置,在第1或第2態樣中,前述搬送構件亦可縱型搬送被處理體。In the film forming apparatus according to the sixth aspect of the invention, in the first or second aspect, the conveying member may vertically convey the object to be processed.

本發明之態樣之搬送機構可不依存於減壓下或大氣壓下之使用環境,即可抑制磨耗引起之微粒之產生。The conveying mechanism of the aspect of the present invention can suppress the generation of particles caused by abrasion without depending on the use environment under reduced pressure or atmospheric pressure.

根據本發明之態樣之被處理體之搬送機構,可抑制磨耗所造成之微粒之產生。再者,可提供一種能提高良率,且進一步謀求裝置之長壽命化之被處理體之搬送機構。According to the conveying mechanism of the object to be processed according to the aspect of the invention, generation of particles due to abrasion can be suppressed. Further, it is possible to provide a transfer mechanism of a target object which can improve the yield and further increase the life of the device.

以下,說明本發明之實施形態之被處理體之搬送機構。Hereinafter, the conveying mechanism of the object to be processed according to the embodiment of the present invention will be described.

圖1係示意地顯示具備本發明之實施形態之被處理體之搬送機構的成膜裝置之一構成例。Fig. 1 is a view schematically showing an example of a configuration of a film forming apparatus including a conveying mechanism of a target object according to an embodiment of the present invention.

該成膜裝置1係具備:2個L/UL室(Load/Unload:裝載/卸載)10A、10B,依序配置之支架儲藏室60、加熱室20、第1成膜室30、及第2成膜室40。又,於L/UL室10A、10B之前面配置有基板裝卸室50。The film forming apparatus 1 includes two L/UL chambers (Load/Unload) 10A and 10B, a rack storage chamber 60, a heating chamber 20, a first film forming chamber 30, and a second unit which are disposed in this order. Film forming chamber 40. Further, a substrate loading and unloading chamber 50 is disposed in front of the L/UL chambers 10A and 10B.

各室之間係經由閥門(省略圖式)連通。又,於該等L/UL室10A、10B、前述加熱室20、及第1成膜室30,分別獨立設置有用於將該等之內部分別真空排氣之真空排氣裝置12、22、32。The chambers are connected via a valve (omitted from the drawing). Further, in the L/UL chambers 10A and 10B, the heating chamber 20, and the first film forming chamber 30, vacuum exhausting devices 12, 22, and 32 for respectively evacuating the inside of the respective L/UL chambers 10A and 10B are separately provided. .

基板裝卸室50將從外部搬運來之基板2(被處理體)安裝於支架70。支架70使基板2大致直立且固定保持,其後,藉由迴轉機構(省略圖式),轉換方向至L/UL室10A、10B之方向,平行地搬入至L/UL室10A、10B。The substrate loading and unloading chamber 50 is attached to the holder 70 from the substrate 2 (subject to be processed) that is transported from the outside. The holder 70 causes the substrate 2 to be substantially upright and fixedly held, and thereafter, the direction of rotation to the directions of the L/UL chambers 10A and 10B is reversed by the turning mechanism (omitted from the drawing), and carried into the L/UL chambers 10A and 10B in parallel.

又,如後所述,在基板裝卸室50中,由於從L/UL室10A、10B搬送來載置有經真空處理之基板2之支架70,故將該基板2從支架70卸載。將基板2卸載後之支架70利用於下一個基板2之搬送。Further, as will be described later, in the substrate loading and unloading chamber 50, since the holder 70 on which the vacuum-treated substrate 2 is placed is transported from the L/UL chambers 10A and 10B, the substrate 2 is unloaded from the holder 70. The holder 70 after the substrate 2 is unloaded is used for the conveyance of the next substrate 2.

L/UL室10A、10B,係在開放大氣壓的狀態下,進行基板裝卸室50與支架70之裝載與卸載。The L/UL chambers 10A and 10B are loaded and unloaded by the substrate loading and unloading chamber 50 and the holder 70 in a state where the atmospheric pressure is released.

於L/UL室10A、10B,分別設置有用於將其內部真空排氣之真空排氣裝置12A、12B。The L/UL chambers 10A and 10B are respectively provided with vacuum exhausting devices 12A and 12B for evacuating the inside thereof.

一般而言,在L/UL室10A、10B中,除了支架70之搬入搬出以外,亦進行真空排氣與大氣壓開放。In general, in the L/UL chambers 10A and 10B, in addition to the loading and unloading of the holder 70, vacuum evacuation and atmospheric pressure are also performed.

在L/UL室10A、10B之前述作業時間,較各真空處理室(加熱室20及成膜室30、40)中之真空處理(加熱、成膜)所需之加工時間大幅度地長之情形,L/UL室10A、10B為單數時,支架70往真空處理室之裝載較費工夫,且在各真空處理室中會產生無法進行真空處理之空白時間,從而產生生產效率降低之問題。In the above-described operation time of the L/UL chambers 10A and 10B, the processing time required for vacuum processing (heating, film formation) in each of the vacuum processing chambers (heating chamber 20 and film forming chambers 30, 40) is greatly long. In other words, when the L/UL chambers 10A and 10B are singular, the loading of the holder 70 into the vacuum processing chamber takes time, and a blank time in which vacuum processing cannot be performed occurs in each vacuum processing chamber, resulting in a problem of reduced production efficiency.

因此,在該成膜裝置中,設置有複數個(圖示中為2個)L/UL室10A、10B;輸送至加熱室20、成膜室30、40之支架70;及暫時儲藏輸送至L/UL室10A、10B之支架70之支架儲藏室60。藉此,可謀求生產效率之提高。Therefore, in the film forming apparatus, a plurality of (two in the drawing) L/UL chambers 10A and 10B, a holder 70 that is transported to the heating chamber 20 and the film forming chambers 30 and 40, and a temporary storage and transportation are provided. The rack storage compartment 60 of the bracket 70 of the L/UL chambers 10A, 10B. Thereby, the production efficiency can be improved.

於加熱室20設置加熱裝置23,升溫至適合基板2成膜之溫度。The heating device 23 is provided in the heating chamber 20, and the temperature is raised to a temperature suitable for film formation of the substrate 2.

於加熱室20,設置有用於將其內部真空排氣之真空排氣裝置22。In the heating chamber 20, a vacuum exhausting device 22 for evacuating the inside thereof is provided.

基板2在成膜室30、40中,藉由成膜裝置33、43,進行成膜處理。In the film forming chambers 30 and 40, the substrate 2 is subjected to a film forming process by the film forming apparatuses 33 and 43.

作為成膜裝置33、43,並無特別限定,例如舉出濺鍍用之陰極,或CVD用之平行平板型電極。The film forming apparatuses 33 and 43 are not particularly limited, and examples thereof include a cathode for sputtering and a parallel plate electrode for CVD.

在如此之成膜裝置1中,對於被處理體即基板2,一面藉由搬送構件搬送,一面施予加熱或成膜等之處理。In the film forming apparatus 1 as described above, the substrate 2 as the object to be processed is subjected to a treatment such as heating or film formation while being conveyed by the conveying member.

搬送基板2之搬送構件,係具備保持基板2之支架70(載體)、及搬送保持有基板2之支架70之線路80。又,搬送構件係縱型搬送基板2。The transport member for transporting the substrate 2 includes a holder 70 (carrier) for holding the substrate 2 and a line 80 for transporting the holder 70 holding the substrate 2. Moreover, the conveyance member is the vertical conveyance board|substrate 2.

此處,將基板2縱置之宗旨,主要係由於隨著大型之液晶顯示器及電漿顯示器之普及,基板本身亦大型化、薄型化,因為橫置之情形,成膜裝置本身之平面積會隨之大型化,故採用縱型從而謀求省空間化。又,因為橫置之情形,會產生因基板2之自重所造成之彎曲,從而難以保持平坦性,亦難以均一地成膜。Here, the purpose of vertically arranging the substrate 2 is mainly because the substrate itself is enlarged and thinned with the spread of large-sized liquid crystal displays and plasma displays, and the flat area of the film forming apparatus itself is flatned. With the increase in size, the vertical type is used to save space. Further, since it is placed horizontally, bending due to the self-weight of the substrate 2 occurs, and it is difficult to maintain flatness, and it is difficult to form a film uniformly.

且,在該成膜裝置1中,前述第1成膜室30係具有分別包含去路與回路之線路80,且該線路80係全部貫通前述L/UL室10A、10B、前述加熱室20、及成膜室30、40而配置。線路80係具備第1線路81、及第2線路82。Further, in the film forming apparatus 1, the first film forming chamber 30 has a line 80 including an outward path and a circuit, and the line 80 is entirely penetrated through the L/UL chambers 10A and 10B, the heating chamber 20, and The film forming chambers 30 and 40 are disposed. The line 80 includes a first line 81 and a second line 82.

又,成膜裝置1係具備將支架70從第1線路81至第2線路82(回路),相對於線路於橫向移動移載之移動裝置(未圖示)。該移動裝置係具有暫時舉起第1線路81上之支架70,並移載至第2線路82之機構。Further, the film forming apparatus 1 includes a moving device (not shown) that moves the holder 70 from the first line 81 to the second line 82 (circuit) in the lateral direction with respect to the line. The mobile device has a mechanism for temporarily lifting the bracket 70 on the first line 81 and transferring it to the second line 82.

圖2係顯示支架70之概略構成之立體圖。FIG. 2 is a perspective view showing a schematic configuration of the bracket 70.

如圖2所示,支架70係具備:包含鋁等之框狀框體71;以沿著框體71之上邊之方式而設置之磁鐵72;以沿著框體71之下邊之方式而設置之圓柱狀滑動軸73;用於承受基板2之負載,並保持基板2之水平度之基板座74;用於使基板2保持於支架70之夾具75;及用於覆蓋基板2之周緣之非成膜區域之遮罩76。As shown in FIG. 2, the bracket 70 is provided with a frame-shaped housing 71 including aluminum or the like; a magnet 72 provided along the upper side of the housing 71; and is disposed along the lower side of the housing 71. a cylindrical sliding shaft 73; a substrate holder 74 for receiving the load of the substrate 2 and maintaining the level of the substrate 2; a jig 75 for holding the substrate 2 on the holder 70; and a non-form for covering the periphery of the substrate 2. A mask 76 of the membrane area.

線路80係具備:下部支撐機構84,其構成可一面支撐支架70之負載,一面搬送支架70;及上部支撐機構88,其構成為可不接觸地支撐支架70之上部。支架70構成為可於藉由下部支撐機構84及上部支撐機構88保持大致垂直的狀態下移動。The line 80 includes a lower support mechanism 84 configured to be capable of supporting the support 70 while supporting the support 70, and an upper support mechanism 88 configured to support the upper portion of the support 70 without contact. The bracket 70 is configured to be movable in a state where the lower support mechanism 84 and the upper support mechanism 88 are kept substantially vertical.

圖3及圖4係顯示下部支撐機構84之構成之立體圖。3 and 4 are perspective views showing the configuration of the lower support mechanism 84.

如圖3所示,下部支撐機構84係具備馬達85、及輥86。如圖4所示,輥86係具備誘導支架70之U字狀溝部86a。構成藉由馬達85驅動,使輥86迴轉,並使支架70在輥86上水平移動。具體而言,係構成設置於支架70之下部之滑動軸73扣合於輥86之溝部86a,使支架70可水平移動。As shown in FIG. 3, the lower support mechanism 84 is provided with the motor 85 and the roller 86. As shown in FIG. 4, the roller 86 is provided with the U-shaped groove part 86a of the induction bracket 70. The configuration is driven by the motor 85 to rotate the roller 86 and to horizontally move the carriage 70 on the roller 86. Specifically, the slide shaft 73 that is disposed at the lower portion of the bracket 70 is engaged with the groove portion 86a of the roller 86, so that the bracket 70 can be horizontally moved.

在本發明之實施形態中,係以滑動軸73與輥86構成搬送機構。藉由採用軸及輥方式,相較於齒條及小齒輪方式之搬送機構,可大幅減少磨耗量。In the embodiment of the present invention, the slide shaft 73 and the roller 86 constitute a conveying mechanism. By using the shaft and roller method, the amount of wear can be greatly reduced compared to the rack and pinion type conveying mechanism.

又,在本發明之實施形態中,藉由將輥86之溝部86a設為U字形狀,可順利地搬送,且可大幅抑制滑動軸73與輥86之磨耗,從而可減少磨耗所造成之粉塵之產生。Further, in the embodiment of the present invention, since the groove portion 86a of the roller 86 has a U-shape, the conveyance can be smoothly performed, and the abrasion of the slide shaft 73 and the roller 86 can be greatly suppressed, and the dust caused by abrasion can be reduced. Produced.

又,圖5係顯示上部支撐機構88之構成之說明圖。In addition, FIG. 5 is an explanatory view showing the configuration of the upper support mechanism 88.

如圖5所示,上部支撐機構88係設置有複數個磁鐵89。且,於支架70之上邊亦安裝有磁鐵72,磁鐵89與磁鐵72係以於垂直方向對向,且各磁鐵89、72相互吸附的方式配置。As shown in FIG. 5, the upper support mechanism 88 is provided with a plurality of magnets 89. Further, a magnet 72 is attached to the upper side of the holder 70, and the magnet 89 and the magnet 72 are opposed to each other in the vertical direction, and the magnets 89 and 72 are disposed to be attracted to each other.

藉由採用如此之構成,可使磁鐵89、72彼此相互吸附,使支架70保持於垂直狀態。即,藉由將基板2垂直保持,可抑制隨著基板2之大型化,成膜裝置1之設置面積之增大,且可避免因大型基板2之彎曲所造成之影響。By adopting such a configuration, the magnets 89, 72 can be attracted to each other, and the holder 70 can be held in a vertical state. In other words, by holding the substrate 2 vertically, it is possible to suppress an increase in the installation area of the film forming apparatus 1 as the size of the substrate 2 is increased, and it is possible to avoid the influence of the bending of the large substrate 2.

且,本發明之實施形態之被處理體之搬送機構,係載體70之滑動軸73、或下部支撐機構84之輥86中之一方之至少接觸部包含含有矽(Si)、鋁(Al)、氧(O)、及氮(N)之主體,而滑動軸73或輥86中之另一方之至少接觸部包含不鏽鋼(SUS)。Further, in the conveying mechanism of the object to be processed according to the embodiment of the present invention, at least one of the sliding shaft 73 of the carrier 70 or the roller 86 of the lower supporting mechanism 84 includes bismuth (Si), aluminum (Al), The main body of oxygen (O) and nitrogen (N), and at least the contact portion of the other of the sliding shaft 73 or the roller 86 contains stainless steel (SUS).

藉由以如上所述之材料來構成滑動軸73或輥86之接觸部,可抑制滑動軸73與輥86之磨耗,減少因磨耗所造成之粉塵之產生。藉此,可提高良率,且可謀求裝置之長壽命化。By forming the contact portion of the slide shaft 73 or the roller 86 with the material as described above, abrasion of the slide shaft 73 and the roller 86 can be suppressed, and generation of dust due to abrasion can be reduced. Thereby, the yield can be improved, and the life of the device can be extended.

作為如此之包含矽(Si)、鋁(Al)、氧(O)、及氮(N)之主體,並無特別限定,但最理想為例如在高溫環境下之機械強度、耐熱衝擊性、及耐磨耗性優良之賽隆(SiAlON)。The main body including bismuth (Si), aluminum (Al), oxygen (O), and nitrogen (N) is not particularly limited, but is preferably, for example, mechanical strength and thermal shock resistance in a high-temperature environment. SiAlON with excellent wear resistance.

在本發明之實施形態之被處理體之搬送機構中,前述主體最理想為進一步含有釔、鈣、鎂、鋰、及鈉中之至少一種。In the conveying mechanism of the object to be processed according to the embodiment of the present invention, it is preferable that the main body further contains at least one of barium, calcium, magnesium, lithium, and sodium.

再者,藉由使用含有如上所述之元素之材料,可大幅抑制滑動軸73與輥86之磨耗,並減少因磨耗所造成之粉塵之產生。Further, by using a material containing the element as described above, abrasion of the sliding shaft 73 and the roller 86 can be greatly suppressed, and generation of dust due to abrasion can be reduced.

輥86所具有之U字狀溝部,其曲率半徑R最理想為在20~34 mm之範圍內。The U-shaped groove portion of the roller 86 preferably has a radius of curvature R in the range of 20 to 34 mm.

如後揭之圖16所示,相對於溝部之曲率半徑R越小,滑動係數越大,內部剪切應力則具有變小之傾向。As shown in Fig. 16 which will be described later, the smaller the radius of curvature R with respect to the groove portion, the larger the sliding coefficient, and the lower the internal shear stress tends to be.

為減少因滑動所造成之磨耗,曲率半徑R較大(溝部淺)為佳。In order to reduce the abrasion caused by the sliding, the radius of curvature R is large (the shallow portion is shallow).

另一方面,為防止因轉動疲勞所造成之切削,曲率半徑R較小(溝部深)為佳。考慮該等之滑動係數與內部剪切應力,藉由將溝部之曲率半徑設在特定範圍,可抑制轉動疲勞所造成之切削、及因滑動所造成之磨耗兩者。例如,將溝部之曲率半徑R設在20 mm≦R≦34 mm最理想。On the other hand, in order to prevent cutting due to rotational fatigue, the radius of curvature R is small (ditch portion depth). Considering the sliding coefficient and the internal shear stress, by setting the radius of curvature of the groove portion to a specific range, both the cutting caused by the rotational fatigue and the abrasion caused by the sliding can be suppressed. For example, it is most preferable to set the radius of curvature R of the groove portion to 20 mm ≦ R ≦ 34 mm.

又,在本發明之實施形態之被處理體之搬送機構中,使前述支架70(搬送構件)移動之搬送速度[mm/sec],即使在減壓或大氣壓之任一之條件下,最理想為1~3000之範圍。又,使前述支架70(搬送構件)移動時之搬送速度[mm/sec2 ],若前述支架70加速之際超過1200,則會產生搬送偏差而不理想。另一方面,若前述支架70減速之際超過650,則會產生搬送偏差而不理想。但,該等之數值係基於將前述支架70之重量設為240 kg之情形之實測資料者。Further, in the transport mechanism of the object to be processed according to the embodiment of the present invention, the transport speed [mm/sec] for moving the holder 70 (transport member) is optimal even under conditions of decompression or atmospheric pressure. It is in the range of 1~3000. Moreover, when the conveyance speed [mm/sec 2 ] when the bracket 70 (transport member) is moved is more than 1200 when the bracket 70 is accelerated, the conveyance deviation is not preferable. On the other hand, if the bracket 70 is decelerated to exceed 650, a conveyance deviation may occur, which is not preferable. However, the values are based on the measured data of the case where the weight of the aforementioned bracket 70 is set to 240 kg.

且,具備本發明之實施形態之被處理體之搬送機構之成膜裝置1,係藉由沿著第1線路81(去路)移動之支架70(搬送構件),將基板2(被處理體),從前述L/UL室10A、10B,通過前述支架儲藏室60、加熱室20,搬運至成膜室30、40;在成膜室30、40經成膜後,載置前述基板2之搬送構件,係在成膜室30、40之內部,藉由移動構件,從第1線路81(去路)移動至第2線路82(回路),且沿著第2線路82,從成膜室30、40之內部,通過前述加熱室20、支架儲藏室60,搬運至前述L/UL室10A、10B。In addition, the film forming apparatus 1 including the transport mechanism of the object to be processed according to the embodiment of the present invention is the substrate 2 (the object to be processed) by the holder 70 (transport member) that moves along the first line 81 (outward path). The L/UL chambers 10A and 10B are transported to the film forming chambers 30 and 40 through the rack storage chamber 60 and the heating chamber 20, and after the film forming chambers 30 and 40 are formed, the substrate 2 is placed and transported. The member is moved inside the film forming chambers 30 and 40, and moves from the first line 81 (outward path) to the second line 82 (loop) by the moving member, and along the second line 82, from the film forming chamber 30, The inside of 40 is transported to the L/UL chambers 10A and 10B through the heating chamber 20 and the rack storage chamber 60.

此時,在本發明之實施形態之搬送機構中,藉由規定滑動軸與輥之接觸部之材料,可減少滑動軸與輥之間之摩擦。藉此,可抑制因磨耗所造成之粉塵之產生。其結果,在本發明之實施形態之被處理體之搬送機構中,可提高良率,且可謀求裝置之長壽命化。At this time, in the conveying mechanism according to the embodiment of the present invention, the friction between the sliding shaft and the roller can be reduced by defining the material of the contact portion between the sliding shaft and the roller. Thereby, the generation of dust due to abrasion can be suppressed. As a result, in the conveying mechanism of the object to be processed according to the embodiment of the present invention, the yield can be improved, and the life of the device can be extended.

(實驗例)(Experimental example)

以下,說明為確認本發明之實施形態之效果所進行之實驗例。Hereinafter, an experimental example performed to confirm the effects of the embodiment of the present invention will be described.

(對搬送方式之評估)(evaluation of the transfer method)

首先,於運行在大氣中之搬送路徑中,就軸及輥式之搬送路徑(實驗例1),與齒條及小齒輪形式之搬送路徑(實驗例2、3),測定並評估其磨耗量之差異。First, in the transport path running in the atmosphere, the shaft and roll transfer path (Experimental Example 1) and the rack and pinion transfer path (Experimental Examples 2 and 3) were measured and evaluated for wear. The difference.

齒條及小齒輪、軸及輥,不論哪一方均使用包含SUS440C者。又,將輥具有之溝部之形狀,設為U字形狀。For racks, pinions, shafts, and rollers, SUS440C is used for either party. Further, the shape of the groove portion of the roller is U-shaped.

使加重了260 kg之負載之支架,以0.65 m/秒之速度,在長度12 m之搬送路徑來回運行,測定每個輥平均之磨耗粉量。The racks with a load of 260 kg were loaded and operated at a speed of 0.65 m/sec in a transport path of 12 m in length, and the average amount of wear per roll was measured.

又,在齒條及小齒輪形式之搬送路徑中,進行使齒條與小齒輪之動作完全同步之情形(實驗例2)、及完全不同步之情形(實驗例3)。Further, in the conveyance path of the rack and pinion type, the case where the operation of the rack and the pinion is completely synchronized (Experimental Example 2) and the case where it is completely out of synchronization (Experimental Example 3) are performed.

於圖6顯示實驗例1~實驗例3中,搬送路徑之來回次數與每個輥平均之磨耗粉量之關係。又,磨耗粉量係於輥下配置盤子,以電子天平來測定。Fig. 6 shows the relationship between the number of round trips of the transport path and the average amount of wear powder per roller in Experimental Example 1 to Experimental Example 3. Further, the amount of abrasion powder was measured on a plate placed under a roller and measured by an electronic balance.

從圖6可明知,軸及輥搬送之實驗例1,相較於齒條及小齒輪搬送之實驗例2、3,可大幅減少磨耗量。As is apparent from Fig. 6, in Experimental Example 1 in which the shaft and the roller were transported, the amount of wear was significantly reduced as compared with Experimental Examples 2 and 3 in which the rack and the pinion were transported.

(對輥材料及溝部形狀之評估)(Evaluation of roll material and groove shape)

在以下之實驗中,就軸及輥形式之搬送路徑,將輥之材質及溝部之形狀做各種改變,在大氣中進行運行實驗,測定並評估其磨耗量之差異。又,軸之材質係全部統一為SUS440C。In the following experiment, the material of the roll and the shape of the groove were changed in the transfer path in the form of a shaft and a roll, and an operation test was carried out in the atmosphere to measure and evaluate the difference in the amount of wear. Moreover, the materials of the shaft are all unified into SUS440C.

使加重了260 kg之負載之支架,以0.65 m/秒之速度,在長度12 m之搬送路徑來回運行,測定每2個輥平均之總磨耗粉量。The rack with a load of 260 kg was loaded and operated at a speed of 0.65 m/sec in a transport path of 12 m in length, and the average total amount of powder consumed per two rolls was measured.

(實驗例4)(Experimental Example 4)

將輥之材質設為Al2 O3The material of the roll was set to Al 2 O 3 .

(實驗例5)(Experimental Example 5)

將輥之材質設為SUS440C(表面粗糙度Ra:1.6 μm)。The material of the roll was SUS440C (surface roughness Ra: 1.6 μm).

(實驗例6)(Experimental Example 6)

將輥之材質設為SUS440C(表面粗糙度Ra<0.4 μm)。The material of the roll was SUS440C (surface roughness Ra<0.4 μm).

(實驗例7)(Experimental Example 7)

將輥之材質設為使用陶瓷系材料之USR-1。此處,「USR-1」係於含有矽(Si)、鋁(Al)、氧(O)、及氮(N)之主體,進一步含有元素M(釔、鈣、鎂、鋰、及鈉之中至少一種)而成之陶瓷系材料之簡稱。該陶瓷系材料之適當之組合[mol%]之範圍為:0<Al<33、0<O<33、25<N<60、0<(元素M)<7,其餘為Si。又,作為該陶瓷系材料之適當之物性值,舉出3點彎曲強度[MPa]:>850、破壞韌性值[MPa‧m1/2 ]:>5、楊氏係數[GPa]:>290、及容積密度[g‧cm-3 ]:>3.2等。The material of the roll was set to USR-1 using a ceramic material. Here, "USR-1" is a host containing bismuth (Si), aluminum (Al), oxygen (O), and nitrogen (N), and further contains an element M (germanium, calcium, magnesium, lithium, and sodium). Abbreviation for ceramic materials made of at least one of them. The appropriate combination [mol%] of the ceramic-based material is in the range of 0 < Al < 33, 0 < O < 33, 25 < N < 60, 0 < (element M) < 7, and the balance is Si. Moreover, as a suitable physical property value of the ceramic-based material, three-point bending strength [MPa]: >850, fracture toughness value [MPa‧m 1/2 ]: >5, Young's modulus [GPa]: >290 And bulk density [g‧cm -3 ]: >3.2.

(實驗例8)(Experimental Example 8)

將輥之材質設為SUS440C。且,將溝部之形狀設為V字形狀。The material of the roller was set to SUS440C. Further, the shape of the groove portion is set to a V shape.

於圖7顯示實驗例4~實驗例8中,搬送路徑之來回次數與每2個輥平均之總磨耗粉量之關係。Fig. 7 shows the relationship between the number of round trips of the transport path and the total amount of total wear powder per two rolls in Experimental Example 4 to Experimental Example 8.

從圖7可明知,相較於包含Al2 O3 之實驗例4之輥,包含SUS系材料之實驗例5、6之輥更能抑制磨耗量。又,表面粗糙度Ra小之實驗例6,相較於表面粗糙度Ra大之實驗例5,磨耗量較小。As is clear from Fig. 7, the rolls of Experimental Examples 5 and 6 containing SUS-based materials were more resistant to abrasion than the rolls of Experimental Example 4 containing Al 2 O 3 . Further, in Experimental Example 6 in which the surface roughness Ra was small, the amount of abrasion was small as compared with Experimental Example 5 in which the surface roughness Ra was large.

再者,發現包含USR-1之實驗例7之輥,比包含SUS系材料之輥,能進一步大幅地減少磨耗量。Further, it was found that the roll of the experimental example 7 containing USR-1 can further reduce the amount of abrasion more than the roll containing the SUS-based material.

又,關於輥具有之溝部之形狀,在設為V字形狀之實驗例8中,相較於設為U字形狀之實驗例5、6磨耗較大。認為此為在V字形狀之溝部之左右,產生了周速差之緣故。藉此,發現藉由將溝部設為U字形狀,可順利地進行搬送。Further, in the experimental example 8 in which the shape of the groove portion of the roller was set to be V-shaped, the abrasion was larger than that in the experimental examples 5 and 6 in which the U-shape was set. It is considered that this is a difference in the peripheral speed in the vicinity of the groove portion of the V shape. As a result, it has been found that the groove can be smoothly conveyed by setting the groove portion into a U shape.

(對賽隆之評估)(Evaluation of Sialon)

在以下之實驗中,關於軸&輥形式之搬送路徑,係就包含賽隆(SiAlON)之輥以各種條件進行運行實驗,測定並評估其磨耗量之差異。In the following experiments, the transfer path in the form of a shaft & roll was carried out in various conditions including a roll of SiAlON, and the difference in the amount of wear was measured and evaluated.

使加重了260 kg之負載之支架,以0.65m/秒之速度,在長度12 m之搬送路徑來回運行,測定每2個輥平均之總磨耗粉量。The rack with a load of 260 kg was loaded and operated at a speed of 0.65 m/sec in a transport path of 12 m in length, and the average total amount of powder consumed per two rolls was measured.

(實驗例9)(Experimental Example 9)

在真空中進行運行實驗。Run experiments in vacuum.

(實驗例10)(Experimental Example 10)

在大氣中進行運行實驗。Run experiments in the atmosphere.

(實驗例11)(Experimental Example 11)

在真空中,加熱至120℃,進行運行實驗。The experiment was carried out by heating to 120 ° C in a vacuum.

(實驗例12)(Experimental Example 12)

在真空中,以2 m/秒之速度高速運行,進行運行實驗。The test was run at a high speed of 2 m/sec in a vacuum.

(實驗例13)(Experimental Example 13)

使用包含SUS系材料之輥,在真空中進行運行實驗。The running experiment was carried out in a vacuum using a roll containing a SUS-based material.

於圖8~圖12分別顯示實驗例9~實驗例13中,來回次數與每2個輥平均之總磨耗粉量之關係。The relationship between the number of round trips and the total amount of total abrasion powder per two rolls in Experimental Example 9 to Experimental Example 13 is shown in Figs. 8 to 12, respectively.

分別於圖8表示在真空中進行運行實驗之情形,於圖9表示在大氣中進行運行實驗之情形,於圖10表示在加熱真空中進行運行實驗之情形,於圖11表示在真空中進行高速運行實驗之情形,於圖12表示在真空中進行運行實驗之情形。Fig. 8 shows a case where an operation experiment is performed in a vacuum, and Fig. 9 shows a case where an operation test is performed in the atmosphere, Fig. 10 shows a case where an operation experiment is performed in a heating vacuum, and Fig. 11 shows a case where a high speed is performed in a vacuum. In the case of running an experiment, Fig. 12 shows a case where an operation experiment was performed in a vacuum.

將圖8與圖12進行比較可明知,使用賽隆作為輥之材質之實驗例9,相較於使用包含SUS系材料之輥之實驗例13,在真空搬送中亦可大幅減少磨耗量。Comparing Fig. 8 with Fig. 12, it is understood that the experimental example 9 in which sialon is used as the material of the roller can significantly reduce the amount of abrasion during vacuum transportation as compared with the experimental example 13 using a roller containing a SUS-based material.

又,從圖9~圖11可明知,可藉由使用賽隆作為輥之材質,在大氣搬送、真空加熱搬送、真空高速搬送之任一情形中均可大幅減少磨耗量。即,確認了藉由使用賽隆作為輥之材質,使用空間為減壓下、大氣壓下(即,減壓氛圍或大氣壓氛圍)之任一者,均可抑制滑動軸與輥間之摩擦至較低。Further, as is apparent from FIGS. 9 to 11, the amount of wear can be greatly reduced in any of the atmospheric transfer, the vacuum heat transfer, and the vacuum high-speed transfer by using the material of the roll as the material of the roll. In other words, it has been confirmed that by using the material of the roll as the roll, the use space can be any one of the reduced pressure and the atmospheric pressure (that is, the reduced pressure atmosphere or the atmospheric pressure atmosphere), and the friction between the sliding shaft and the roller can be suppressed. low.

(對真空搬送與真空加熱搬送之組合運行之評估)(Evaluation of combined operation of vacuum transfer and vacuum heat transfer)

在以下之實驗中,改變軸與輥之材質之組合,且在真空中及大氣中進行運行實驗,測定並評估其磨耗量之差異。In the following experiments, the combination of the material of the shaft and the roller was changed, and the running experiment was carried out in a vacuum and in the atmosphere, and the difference in the amount of abrasion was measured and evaluated.

使加重了260 kg之負載之支架,以0.65 m/秒之速度,在長度120 m之搬送路徑來回運行。此時,依序進行1.4×10-2 Pa之真空搬送60萬循環、及以120℃之真空加熱搬送20萬循環,測定每2個輥平均之總磨耗粉量。A bracket that has a load of 260 kg is loaded and operated at a speed of 0.65 m/sec in a transport path of 120 m in length. At this time, a vacuum transfer of 1.4 × 10 -2 Pa was performed for 600,000 cycles, and 200,000 cycles of vacuum heating at 120 ° C were carried out, and the average amount of total abrasion powder per two rolls was measured.

(實驗例14)(Experimental Example 14)

將軸材質設為SUS,並將輥之材質設為賽隆。Set the axis material to SUS and set the material of the roller to Sialon.

(實驗例15)(Experimental Example 15)

將軸材質設為SUS,並將輥之材質設為SUS。Set the shaft material to SUS and set the material of the roller to SUS.

於圖13顯示搬送路徑之來回次數與每2個輥平均之總磨耗粉量之關係。Fig. 13 shows the relationship between the number of round trips of the transport path and the average amount of wear powder per two rolls.

從圖13可明知,相較於將輥之材質設為SUS之實驗例15,將輥之材質設為賽隆之實驗例14之輥在真空搬送、真空加熱搬送之組合搬送,亦可大幅減少磨耗量。As can be seen from Fig. 13, in comparison with the experimental example 15 in which the material of the roll was SUS, the material of the roll was set to be a combination of the vacuum transfer and the vacuum heat transfer of the test piece 14 of Sialon, and the wear was greatly reduced. the amount.

(對軸材料與輥材料之評估)(Evaluation of shaft material and roller material)

在以下之實驗中,將軸與輥之材質之組合進行各種改變,在大氣中進行運行實驗,測定並評估其磨耗量之差異。In the following experiments, the combination of the material of the shaft and the roller was variously changed, and an operation experiment was conducted in the atmosphere to measure and evaluate the difference in the amount of wear.

使加重了260 kg之負載之支架,以0.65 m/秒之速度,在長度12 m之搬送路徑來回運行,測定每2個輥平均之總磨耗粉量。The rack with a load of 260 kg was loaded and operated at a speed of 0.65 m/sec in a transport path of 12 m in length, and the average total amount of powder consumed per two rolls was measured.

(實驗例16)(Experimental Example 16)

將軸材質設為SUS440C,並將輥之材質設為SUS440C(表面粗糙度Ra:1.6 μm)。The shaft material was SUS440C, and the material of the roller was SUS440C (surface roughness Ra: 1.6 μm).

(實驗例17)(Experimental Example 17)

將軸材質設為SUS440C,並將輥之材質設為SUS440C(表面粗糙度Ra:0.2 μm)。The shaft material was SUS440C, and the material of the roller was SUS440C (surface roughness Ra: 0.2 μm).

(實驗例18)(Experimental Example 18)

將軸材質設為SUS440C,並將輥之材質設為USR-1。Set the shaft material to SUS440C and the material of the roller to USR-1.

(實驗例19)(Experimental Example 19)

將軸材質設為SUS304C,並將輥之材質設為USR-1。Set the shaft material to SUS304C and set the material of the roller to USR-1.

於圖14顯示實驗例16~實驗例19中,搬送路徑之來回次數與每2個輥平均之總磨耗粉量之關係。Fig. 14 shows the relationship between the number of round trips of the transport path and the total amount of total wear powder per two rolls in Experimental Example 16 to Experimental Example 19.

從圖14可明知,相較於軸、輥雙方均包含SUS系材料之實驗例16、17,將一方(此處為輥)設為USR-1之實驗例18、19之輥能大幅減少磨耗量。又,認為將輥設為SUS系材料,並將軸設為USR-1之情形,亦可獲得相同之效果。As is clear from Fig. 14, the experimental examples 16 and 17 in which the SUS-based material is included in both the shaft and the roller, and the roller of the experimental examples 18 and 19 in which one (here, the roller) is USR-1 can greatly reduce the wear. the amount. In addition, it is considered that the same effect can be obtained by setting the roll to a SUS-based material and setting the axis to USR-1.

(對真空搬送與大氣搬送之組合運行之評估)(Evaluation of combined operation of vacuum transfer and atmospheric transfer)

在以下之實驗中,改變軸與輥之材質之組合,在真空中及大氣中進行運行實驗,測定並評估其磨耗量之差異。In the following experiments, the combination of the material of the shaft and the roller was changed, and the running experiment was carried out in a vacuum and in the atmosphere, and the difference in the amount of wear was measured and evaluated.

使加重了260 kg之負載之支架,以0.65 m/秒之速度,在長度12 m之搬送路徑來回運行。此時,依序進行1.4×10-2 Pa之真空搬送60萬循環、120℃之真空加熱搬送10萬循環、大氣搬送20萬循環、及真空高速搬送20萬循環,測定每2個輥平均(相當於2個小室)之總磨耗粉量。The bracket with a load of 260 kg was loaded and operated at a speed of 0.65 m/sec in a transport path of 12 m in length. At this time, a vacuum transfer of 1.4 × 10 -2 Pa was performed for 600,000 cycles, a vacuum heating of 120 ° C was carried out for 100,000 cycles, an atmospheric transfer of 200,000 cycles, and a vacuum high-speed transfer of 200,000 cycles, and the average of each of the two rolls was measured ( The total amount of wear powder equivalent to 2 small chambers.

(實驗例20)(Experimental Example 20)

將軸材質設為SUS440C,並將輥之材質設為SUS440C。Set the shaft material to SUS440C and the material of the roller to SUS440C.

(實驗例21)(Experimental Example 21)

將軸材質設為SUS440C,並將輥之材質設為USR-1。Set the shaft material to SUS440C and the material of the roller to USR-1.

於圖15顯示實驗例20~實驗例21中,搬送路徑之來回次數與每2個輥平均之總磨耗粉量之關係。Fig. 15 shows the relationship between the number of round trips of the transport path and the total amount of total wear powder per two rolls in Experimental Example 20 to Experimental Example 21.

從圖15可明知,相較於軸、輥雙方均包含SUS系材料之實驗例20,將一方(此處為輥)設為USR-1之實驗例21之輥,在真空搬送、真空加熱搬送、大氣搬送、真空高速搬送之組合搬送中,均可大幅減少磨耗量。As is clear from Fig. 15, the experimental example 20 of the SUS-based material was used for both the shaft and the roller, and one (here, the roller) was used as the roller of the experimental example 21 of the USR-1, and was transported by vacuum transfer or vacuum heating. In the combined transfer of atmospheric transfer and vacuum high-speed transfer, the amount of wear can be greatly reduced.

(對輥之溝部形狀之評估)(Evaluation of the shape of the groove of the roll)

評估輥之溝部之曲率半徑,與滑動係數及內部剪切應力之關係。The relationship between the radius of curvature of the groove portion of the roller and the sliding coefficient and internal shear stress.

(實驗例22)(Experimental Example 22)

就具有曲率半徑R=∞(平面)、R=34 mm、R=28 mm、R=20 mm之溝部之輥,分別測定滑動量及內部剪切應力。The amount of slip and the internal shear stress were measured for the rolls having the grooves of the radius of curvature R = ∞ (plane), R = 34 mm, R = 28 mm, and R = 20 mm, respectively.

於圖16顯示溝部之曲率半徑R與滑動係數及內部剪切應力之關係。Fig. 16 shows the relationship between the radius of curvature R of the groove portion and the sliding coefficient and the internal shear stress.

從圖16可知,溝部之曲率半徑R越小,滑動係數越大,另一方面,溝部之曲率半徑R越大,內部剪切應力越小。As can be seen from Fig. 16, the smaller the radius of curvature R of the groove portion is, the larger the sliding coefficient is. On the other hand, the larger the radius of curvature R of the groove portion, the smaller the internal shear stress.

為減少滑動造成之磨耗,曲率半徑R較大(溝部淺)為佳。另一方面,為防止因轉動疲勞所造成之切削,曲率半徑R較小(溝部深)為佳。考慮該等之滑動係數與內部剪切應力,藉由將溝部之曲率半徑設在特定範圍,可抑制轉動疲勞所造成之切削與滑動所導致之磨耗兩者。例如,將曲率半徑R設在20 mm≦R≦34 mm最理想。In order to reduce the abrasion caused by the sliding, the radius of curvature R is large (the shallow portion is shallow). On the other hand, in order to prevent cutting due to rotational fatigue, the radius of curvature R is small (ditch portion depth). Considering the sliding coefficient and the internal shear stress, by setting the radius of curvature of the groove portion to a specific range, both the cutting and the sliding caused by the rotational fatigue can be suppressed. For example, it is most desirable to set the radius of curvature R to 20 mm ≦ R ≦ 34 mm.

在本發明之實施形態中,搬送機構係包含:「搬送構件(支架),其係於下部具備圓柱狀之滑動軸,且搬送被處理體」;及「支撐構件,其係包含複數個和前述滑動軸接觸,且具備誘導前述搬送構件之U字狀之溝部之輥」;且藉由規定前述滑動軸與前述輥之接觸部之材料,即使所使用之空間在減壓下、大氣壓下(即,減壓氛圍或大氣壓氛圍)中之任一者,均可減少滑動軸與輥之間之摩擦。藉此,本發明之實施形態之搬送機構可不依存於減壓下或大氣壓下之使用環境,來抑制磨耗所造成之微粒之產生。In the embodiment of the present invention, the conveying mechanism includes: a conveying member (a holder) having a cylindrical sliding shaft at a lower portion and conveying the object to be processed; and a “supporting member including a plurality of and the aforementioned a roller that contacts the U-shaped groove portion of the conveying member is provided in contact with the sliding shaft; and by using a material that defines a contact portion between the sliding shaft and the roller, even if the space used is under reduced pressure and atmospheric pressure (ie, Any of the reduced pressure atmosphere or the atmospheric pressure atmosphere can reduce the friction between the sliding shaft and the roller. As a result, the conveying mechanism according to the embodiment of the present invention can suppress the generation of fine particles caused by abrasion without depending on the use environment under reduced pressure or atmospheric pressure.

以上,雖已說明本發明之實施形態之被處理體之搬送機構,但本發明並不限定於此,在不脫離發明之宗旨之範圍內,可進行適當之變更。In the above, the transport mechanism of the object to be processed according to the embodiment of the present invention has been described, but the present invention is not limited thereto, and may be appropriately modified without departing from the scope of the invention.

[產業上之可利用性][Industrial availability]

本發明可廣泛適用於被處理體之搬送機構。The present invention can be widely applied to a conveying mechanism of a target object.

1...成膜裝置1. . . Film forming device

2...基板(被處理體)2. . . Substrate (subject to be processed)

10A...L/UL室10A. . . L/UL room

10B...L/UL室10B. . . L/UL room

12A...真空排氣裝置12A. . . Vacuum exhaust

12B...真空排氣裝置12B. . . Vacuum exhaust

20...加熱室20. . . Heating chamber

22...真空排氣裝置twenty two. . . Vacuum exhaust

23...加熱裝置twenty three. . . heating equipment

30...成膜室30. . . Film forming chamber

32...真空排氣裝置32. . . Vacuum exhaust

33...成膜裝置33. . . Film forming device

40...成膜室40. . . Film forming chamber

43...成膜裝置43. . . Film forming device

50...基板裝卸機構50. . . Substrate loading and unloading mechanism

60...支架搬送構件60. . . Bracket conveying member

70...支架70. . . support

71...框狀框體71. . . Framed frame

72...磁鐵72. . . magnet

73...滑動軸73. . . Sliding shaft

74...基板座74. . . Substrate holder

75...夾具75. . . Fixture

76...遮罩76. . . Mask

80...線路80. . . line

81...第1線路(去路)81. . . First line (detour)

82...第2線路(回路)82. . . Second line (loop)

84...下部支撐機構84. . . Lower support mechanism

85...馬達85. . . motor

86...輥86. . . Roll

86a...溝部86a. . . Ditch

88...上部支撐機構88. . . Upper support mechanism

89...磁鐵89. . . magnet

100...成膜裝置100. . . Film forming device

120...基板裝卸室120. . . Substrate loading and unloading room

140...L/UL室140. . . L/UL room

160...第1搬送路徑160. . . First transport path

180...第2搬送路徑180. . . Second transport path

200...第1真空處理室200. . . First vacuum processing room

210...成膜裝置210. . . Film forming device

220...第2真空處理室220. . . Second vacuum processing room

230...成膜裝置230. . . Film forming device

240...第3真空處理室240. . . Third vacuum processing room

250...成膜裝置250. . . Film forming device

300...真空排氣裝置300. . . Vacuum exhaust

圖1係示意地顯示具備本發明之實施形態之被處理體之搬送機構的成膜裝置之一構成例。Fig. 1 is a view schematically showing an example of a configuration of a film forming apparatus including a conveying mechanism of a target object according to an embodiment of the present invention.

圖2係顯示搭載基板之基板支架之一例之圖。Fig. 2 is a view showing an example of a substrate holder on which a substrate is mounted.

圖3係顯示基板支架之下部支撐機構之一例之圖。Fig. 3 is a view showing an example of a support mechanism for the lower portion of the substrate holder.

圖4係顯示基板支架之下部支撐機構之一例之圖。Fig. 4 is a view showing an example of a support mechanism for the lower portion of the substrate holder.

圖5係顯示基板支架之上部支撐機構之一例之圖。Fig. 5 is a view showing an example of a support mechanism for the upper portion of the substrate holder.

圖6係顯示改變了搬送方式之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 6 is a view showing the relationship between the number of round trips of the transport path and the amount of wear powder in the case where the transport mode is changed.

圖7係顯示改變搬送方式之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 7 is a view showing the relationship between the number of round trips of the transport path and the amount of wear powder in the case of changing the transport mode.

圖8係顯示在真空中進行運行實驗之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 8 is a graph showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case where the running experiment is performed in a vacuum.

圖9係顯示在大氣中進行運行實驗之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 9 is a graph showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case where the running experiment is performed in the atmosphere.

圖10係顯示在加熱真空中進行運行實驗之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 10 is a graph showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case where the running experiment is performed in a heating vacuum.

圖11係顯示在真空中進行高速運行實驗之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 11 is a graph showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case of performing a high-speed running experiment in a vacuum.

圖12係顯示在真空中進行運行實驗之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 12 is a graph showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case where the running experiment is performed in a vacuum.

圖13係顯示以真空搬送與真空加熱搬送之組合,進行運行實驗之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 13 is a graph showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case of performing a running experiment by a combination of vacuum transfer and vacuum heat transfer.

圖14係顯示將軸之材質、及輥之材質之組合進行各種改變之情形的搬送路徑之來回次數與磨耗粉量之關係之圖。Fig. 14 is a view showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case where the combination of the material of the shaft and the material of the roller is variously changed.

圖15係顯示以真空搬送與大氣搬送之組合,進行運行實驗之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。Fig. 15 is a graph showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case of performing an operation test by a combination of vacuum transfer and atmospheric transfer.

圖16係顯示關於輥之溝部之曲率半徑R、滑動係數及內部剪切應力的關係之圖。Fig. 16 is a view showing the relationship between the radius of curvature R, the sliding coefficient, and the internal shear stress of the groove portion of the roller.

圖17係示意地顯示先前之具備被處理體之搬送機構之成膜裝置的一構成例之圖。Fig. 17 is a view schematically showing a configuration example of a film forming apparatus of a conventional conveying mechanism including a target object.

71...框狀框體71. . . Framed frame

73...滑動軸73. . . Sliding shaft

84...下部支撐機構84. . . Lower support mechanism

85...馬達85. . . motor

86...輥86. . . Roll

86a...溝部86a. . . Ditch

Claims (6)

一種被處理體之搬送機構,其係包含:於下部具備圓柱狀之滑動軸,且搬送被處理體之搬送構件;及支撐構件,其包含:和前述滑動軸相接,且具備誘導前述搬送構件之U字狀之溝部之複數個輥;且前述滑動軸及前述輥中之一方之至少接觸部包含含有矽、鋁、氧、及氮之主體,前述滑動軸及前述輥中之另一方之至少接觸部包含不鏽鋼;且前述主體係進一步包含釔、鈣、鎂、鋰、及鈉中之至少一者。 A transport mechanism for a target object includes: a transport member that transports a target body with a cylindrical sliding shaft at a lower portion; and a support member that includes a guide member that is in contact with the slide shaft and that induces the transport member a plurality of rollers of the U-shaped groove portion; and at least one of the sliding shaft and the roller includes a body including bismuth, aluminum, oxygen, and nitrogen, and at least the other of the sliding shaft and the roller The contact portion comprises stainless steel; and the aforementioned main system further comprises at least one of barium, calcium, magnesium, lithium, and sodium. 如請求項1之被處理體之搬送機構,其中前述支撐構件之U字狀之溝部,其曲率半徑R在15~40mm之範圍內。 The conveying mechanism of the object to be processed according to claim 1, wherein the U-shaped groove portion of the support member has a radius of curvature R of 15 to 40 mm. 一種被處理體之搬送機構,其係包含:於下部具備圓柱狀之滑動軸,且搬送被處理體之搬送構件;及支撐構件,其包含:和前述滑動軸相接,且具備誘導前述搬送構件之U字狀之溝部之複數個輥;且前述滑動軸及前述輥中之一方之至少接觸部包含含有矽、鋁、氧、及氮之主體,前述滑動軸及前述輥中之另一方之至少接觸部包含不鏽鋼;其中前述支撐構件之U字狀之溝部,其曲率半徑R在 15~40mm之範圍內。 A transport mechanism for a target object includes: a transport member that transports a target body with a cylindrical sliding shaft at a lower portion; and a support member that includes a guide member that is in contact with the slide shaft and that induces the transport member a plurality of rollers of the U-shaped groove portion; and at least one of the sliding shaft and the roller includes a body including bismuth, aluminum, oxygen, and nitrogen, and at least the other of the sliding shaft and the roller The contact portion comprises stainless steel; wherein the U-shaped groove portion of the aforementioned support member has a radius of curvature R Within the range of 15~40mm. 如請求項1或3之被處理體之搬送機構,其中藉由前述支撐構件使前述搬送構件移動之搬送速度在1~3000mm/sec之範圍內。 The conveying mechanism of the object to be processed according to claim 1 or 3, wherein the conveying speed at which the conveying member is moved by the support member is in the range of 1 to 3000 mm/sec. 如請求項1或3之被處理體之搬送機構,其中藉由前述支撐構件使前述搬送構件移動之搬送加速度係加速時為1200mm/sec2 以下,而減速時為-650mm/sec2 以下。The transport mechanism of the object to be processed according to claim 1 or 3, wherein the transport acceleration by moving the transport member by the support member is 1200 mm/sec 2 or less, and the deceleration is -650 mm/sec 2 or less. 如請求項1或3之被處理體之搬送機構,其中前述搬送構件係縱型搬送前述被處理體。 The conveying mechanism of the object to be processed according to claim 1 or 3, wherein the conveying member vertically conveys the object to be processed.
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