TW201910545A - Apparatus for processing a substrate, processing system for processing a substrate and method for servicing an apparatus for processing a substrate - Google Patents

Abstract

An apparatus (100) for processing a substrate is described. The apparatus includes a first vacuum processing arrangement (101), a second vacuum processing arrangement (102), and a support structure (103) arranged in an atmospheric space (108) between the first vacuum processing arrangement (101) and the second vacuum processing arrangement (102).

Description

Apparatus for processing a substrate, a processing system for processing a substrate, and a method for maintaining a device for processing a substrate

Embodiments of the present disclosure relate to an apparatus for processing a substrate, a processing system for processing a substrate, and a method for servicing the apparatus. Embodiments of the present disclosure are particularly directed to vacuum processing apparatus for processing two or more substrates, such as for display manufacturing, with respect to processing systems configured for vacuum processing of substrates to fabricate display devices, and A method of maintaining a vacuum processing apparatus in an atmospheric space between two vacuum processing arrangements is provided.

Techniques for layer deposition on a substrate, for example, include sputter deposition, thermal evaporation, and chemical vapor deposition. The sputter deposition process can be used to deposit a layer of material, such as a layer of electrically conductive material or insulating material, on a substrate. During the sputter deposition process, a target having a target material to be deposited on a substrate is bombarded with ions generated in the plasma region to eject atoms from the surface of the target. The ejected atoms are capable of forming a layer of material on the substrate. In a reactive sputter deposition process, the ejected atomic energy reacts with a gas in the plasma zone, such as nitrogen or oxygen, to form an oxide, nitride, or oxynitride of the target material on the substrate.

The coated materials can be used in several applications and in several technical fields. For example, one application is in the field of microelectronics, such as the production of semiconductor devices. Also, the substrate for the display is often coated by a sputter deposition process. Additional applications include insulating plates, substrates with thin film transistors (TFTs), color filters, or the like.

For example, in display manufacturing, it is advantageous to reduce the manufacturing cost of the display, such as for mobile phones, tablets, television screens, and the like. The reduction in manufacturing cost can be achieved, for example, by increasing the throughput of a vacuum processing system such as a sputter deposition system. In addition, land occupation can be a relevant factor in reducing the cost of holding a vacuum processing system.

In view of the above, devices, systems, and methods that overcome at least some of the problems in the technical field are advantageous. The present disclosure is particularly directed to providing devices, systems, and methods for providing at least one of increased throughput, reduced footprint of a vacuum processing system, and reduced operating, maintenance, and manufacturing costs.

In view of the above, an apparatus for processing a substrate, a processing system for processing the substrate, and a method for servicing the apparatus are provided. Additional aspects, advantages, and features of the disclosure are apparent from the claims, the description, and the drawings.

According to one aspect of the present disclosure, an apparatus for processing a substrate is provided. The apparatus includes a first vacuum processing device, a second vacuum processing device, and a support structure. The support structure is disposed in an atmospheric space between the first vacuum processing device and the second vacuum processing device.

According to another aspect of the present disclosure, an apparatus for processing a substrate is provided. The apparatus includes a first vacuum processing device, a second vacuum processing device, and a support structure. The support structure is disposed in an atmospheric space between the first vacuum processing device and the second vacuum processing device. Additionally, the support structure includes a pedestal frame structure that supports a first bottom wall of the first vacuum chamber of one of the first vacuum processing devices. Additionally, the base frame structure of the support structure supports a second bottom wall of the second vacuum chamber of one of the second vacuum processing devices. Additionally, the support structure includes a stiffener structure coupled to a first back wall of the first vacuum chamber and to a second back wall of the second vacuum chamber. The first vacuum chamber is configured relative to the second vacuum chamber.

In accordance with yet another aspect of the present disclosure, a processing system for processing a substrate is provided. The processing system includes an apparatus for processing a substrate in accordance with any of the embodiments described herein. Additionally, the processing system includes a substrate loading module for loading the substrate into the device for processing the substrate. The substrate loading module comprises a holding device for holding the substrate, and a swinging module for changing the direction of the substrate between a horizontal direction and a vertical direction.

In accordance with still another aspect of the present disclosure, a method for servicing an apparatus for processing a substrate is provided, the apparatus comprising a first vacuum processing apparatus and a second vacuum processing apparatus supported by a shared support structure. The method maintains at least one of the first vacuum processing device and/or the second vacuum processing device from an atmospheric space provided above a pedestal structure of the support structure.

Embodiments are also directed to apparatus for performing the disclosed methods, and include apparatus portions for performing various aspects of the methods. These method aspects can be performed by hardware components, computers programmed with appropriate software, by any combination of the two, or in any other manner. Furthermore, embodiments in accordance with the present disclosure are also directed to methods for operating the device. A method for operating the device includes method aspects for performing each function of the device.

Various embodiments of the present disclosure will now be described in detail, one or more examples of which are illustrated in the drawings. In the following description of the drawings, the same element symbols indicate the same elements. Only the differences of the individual embodiments will be described. The examples are provided by way of explanation of the disclosure, and are not intended to be limiting. In addition, features illustrated or described as part of one embodiment can be used or combined with any other embodiment to produce yet another embodiment. The description is intended to cover such modifications and variations.

Before describing various embodiments in detail, some aspects of the terms and expressions used herein are explained.

In the present disclosure, "a device for processing a substrate" can be understood as an apparatus configured to process a substrate as described herein. In particular, the apparatus for processing a substrate can be configured for processing a vertical substrate, such as for display manufacturing. More particularly, the apparatus for processing a substrate can be configured to process a large area substrate, such as by depositing one or more layers on the substrate in a vacuum deposition chamber. In addition, it should be noted that in the present disclosure, the "device for processing a substrate" may also be referred to as a "processing device."

In the present disclosure, the term "substrate" or "large-area substrate" as used herein shall specifically include non-flexible substrates such as glass plates and metal plates. However, the present disclosure is not limited thereto, and the term "substrate" can also encompass a flexible substrate such as a coil or foil. According to some embodiments, the substrate can be made of any material suitable for deposition of materials. For example, the substrate can be made of a material selected from the group consisting of glass (eg, soda lime glass, borosilicate glass, etc.), metals, polymers, ceramics, compound materials, carbon fiber materials, mica. Or any other combination of materials or materials that can be coated by a deposition process.

For example, a "large area substrate" as described herein can have a size of at least 0.01 square meters, particularly at least 0.1 square meters, and more particularly at least 0.5 square meters. For example, a large-area substrate or carrier can be a 4.5th generation corresponding to a substrate of about 0.67 square meters (0.73 meters x 0.92 meters), corresponding to a substrate of about 1.4 square meters (1.1 meters x 1.3 The fifth generation of the meter, the 7.5th generation corresponding to the substrate of about 4.29 square meters (1.95 meters x 2.2 meters), and the substrate corresponding to about 5.7 square meters (2.2 meters x 2.5 meters) The 10th generation of the 8.5th generation, or even the substrate (2.85 meters x 3.05 meters) corresponding to approximately 8.7 square meters. Larger generations such as the 11th and 12th generations and corresponding substrate areas can be implemented in a similar manner. Therefore, the substrate can be selected from the group consisting of: first generation, second generation, third generation, 3.5th generation, fourth generation, 4.5th generation, fifth generation, sixth generation, seventh generation , 7.5th, 8th, 8.5th, 10th, 11th, and 12th generations. In particular, the substrate can be selected from the group consisting of: 4.5th generation, 5th generation, 7.5th generation, 8.5th generation, 10th generation, 11th generation, and 12th generation, or larger Generation of substrates. Additionally, the substrate thickness can range from 0.1 to 1.8 mm, particularly about 0.9 mm or less, such as 0.7 mm or 0.5 mm.

In the present disclosure, a "vacuum processing device" can be understood as a processing device having one or more vacuum chambers. A "vacuum chamber" can be understood as a chamber having a vacuum pump for producing industrial vacuum. In particular, a vacuum chamber as described herein can be understood as a chamber that can be evacuated to below atmospheric pressure, for example to a pressure of 10 mbar or less, in particular 1 mbar or more. low. According to an exemplary configuration, the vacuum chamber can be a vacuum processing chamber configured to introduce process gases in a deposition zone in the vacuum processing chamber. For example, the process gas can comprise an inert gas such as argon, and/or a reactive gas such as oxygen, nitrogen, hydrogen and ammonia (NH3), ozone (O3), or the like.

Thus, the term "vacuum" as used herein, can be understood to mean the concept of an industrial grade vacuum having a vacuum pressure below, for example, 10 mbar. Typically, the pressure in the vacuum chamber as described herein may be between 10 ^-5 mbar and about 10 ^-8 mbar, typically between 10 ^-5 mbar and 10 ^-7 mbar. Even more typically between about 10 ^-6 mbar and about 10 ^-7 mbar. According to some embodiments, the pressure in the vacuum chamber can be considered as the partial pressure of the material evaporating in the vacuum chamber, or the total pressure (only in the vacuum chamber where the evaporated material is present as a component to be deposited, Can be about the same). In some embodiments, the total pressure in the vacuum chamber may fall in a range from about 10 ^-4 mbar to about 10 ^-7 mbar, particularly in which a second component other than the evaporated material is present. In the case of a vacuum chamber (such as a gas or the like).

In the present disclosure, "support structure" can be understood as a mechanical structure supporting the first vacuum processing device and the second vacuum processing device as described herein. That is, the support structure can be a support structure configured to support the sharing of the first vacuum processing device and the second vacuum processing device. More specifically, the "support structure" as described herein can be a mechanical structure including a shared reinforcing structure provided between the first vacuum processing device and the second vacuum processing device, such as a frame structure. In particular, the support structure can be coupled to a first back wall of the first vacuum processing apparatus and to a second back wall of the second vacuum processing apparatus, thus providing a shared reinforcement. Further, the "support structure" as described herein may include a base frame structure that provides a platform structure on which a first vacuum processing device and a second vacuum processing device can be disposed. Thus, the base frame structure can be a shared base frame structure that supports both the first vacuum processing device and the second vacuum processing device.

In the present disclosure, "atmospheric space" can be understood to provide a space between a first vacuum processing device and a second vacuum processing device in which atmospheric pressure is provided. Typically, the "atmospheric space" contains air such that a person can stay in the space between the first vacuum processing device and the second vacuum processing device, for example for the first vacuum processing device and/or the second vacuum processing device. Maintenance or maintenance. Therefore, the size of the atmospheric space can be selected such that a person can enter and exit a back side of the first vacuum processing apparatus and a back side of the second vacuum processing apparatus.

Figure 1 shows a schematic side view of an apparatus 100 for processing a substrate in accordance with an embodiment described herein. As exemplarily shown in FIG. 1, the apparatus 100 includes a first vacuum processing apparatus 101, a second vacuum processing apparatus 102, and a support structure 103. The support structure is disposed in an atmospheric space 108 between the first vacuum processing device 101 and the second vacuum processing device 102. In particular, a processing apparatus comprising a first vacuum processing apparatus and a second vacuum processing apparatus may also be referred to herein as a twin processing apparatus. More specifically, a "paired processing device" can be understood as a processing device comprising two separate vacuum processing devices as described herein. That is, the first vacuum processing device and the second vacuum processing device are typically designed as separate units.

Thus, embodiments of the processing apparatus as described herein are advantageously provided for increased throughput, reduced footprint, and reduced operational, maintenance, and manufacturing costs as compared to conventional processing equipment. In particular, by providing a paired processing apparatus as described herein, the throughput can be increased and the footprint can be reduced. In addition, by providing a support structure as described herein, the back walls of the first vacuum processing device and the second vacuum processing device can advantageously be reinforced in an efficient and space-saving manner.

More particularly, it may be particularly advantageous to provide a support structure as described herein, as the back wall of each vacuum processing device must withstand the difference in atmospheric pressure to vacuum pressure. Since the support structure as described herein provides for enhanced reinforcement of the first vacuum processing device and the second vacuum processing device, the support structure has advantages in terms of composition, fixation, and cost. In particular, the shared reinforcement reduces the weight compared to the individual reinforcement of the vacuum processing unit.

Additionally, advantageously, a space between the first vacuum processing device and the second vacuum processing device, that is, the path between the back walls of the vacuum processing device, is provided for providing a service area for servicing the vacuum processing device. Accordingly, embodiments of the processing apparatus as described herein are advantageously provided for servicing a first vacuum processing apparatus and/or a second vacuum processing apparatus from an atmospheric space provided above a pedestal structure of the support structure.

By way of example with reference to Figure 1, the support structure 103 can be coupled to a first wall 104 of the first vacuum processing apparatus 101 in accordance with an embodiment that can be combined with any of the other embodiments described herein. Additionally, the support structure 103 can be coupled to a second wall 105 of the second vacuum processing device 102. Typically, the second wall 105 faces the first wall 104, as exemplarily shown in FIG. Advantageously, therefore, a shared reinforcement of the first vacuum processing device and the second vacuum processing device is provided such that the weight of the support structure is reduced compared to the individual strengthening energy of the vacuum processing device.

According to an embodiment which can be combined with any of the other embodiments described herein, the first vacuum processing apparatus 101 can be a first in-line processing apparatus. Additionally, the second vacuum processing device 102 can be a second tandem processing device. In particular, the first vacuum processing device 101 can be a first vertical processing device. Additionally or alternatively, the second vacuum processing device 102 can be a second vertical processing device. Advantageously, therefore, the footprint of the processing device can be reduced.

In the present disclosure, "vertical processing device" can be understood to mean that the processing device is configured to process a substrate in a substantially vertical direction (substantially vertical = vertical ± 15°). As used throughout this disclosure, terms such as "vertical direction or vertical orientation" are understood to be distinguished from "horizontal direction or horizontal orientation."

Illustratively with reference to Figure 1, the support structure 103 includes a pedestal frame structure 106 in accordance with an embodiment that can be combined with any of the other embodiments described herein. In particular, the base frame structure 106 supports a first bottom wall 104B of the first vacuum processing apparatus 101. Additionally, the pedestal frame structure 106 supports a second bottom wall 105B of the second vacuum processing apparatus 102. Accordingly, advantageously, a shared pedestal frame structure is provided that supports both the first vacuum processing device and the second vacuum processing device. By providing a shared pedestal structure as described herein, the weight of the support structure can be reduced as compared to the use of individual base frames for vacuum processing equipment.

According to an embodiment that can be combined with any of the other embodiments described herein, the support structure 103 can include a stiffener structure 107, as exemplarily shown in FIG. Typically, the support structure 103, and in particular the reinforced frame structure 107, can be coupled to a first back wall 104A of the first vacuum processing apparatus 101. In addition, the support structure 103, and in particular the reinforced frame structure 107, can be coupled to a second back wall 105A of the second vacuum processing apparatus 102. For example, the stiffener structure 107 can be provided between the first back wall 104A of the first vacuum processing device 101 and the second back wall 105A of the second vacuum processing device 102, as exemplarily shown in FIG. . More specifically, the stiffener structure 107 can be disposed in the atmospheric space 108 provided between the first vacuum processing device 101 and the second vacuum processing device 102. Advantageously, therefore, the back wall of each vacuum processing device can be strengthened such that the back wall can withstand the difference in atmospheric pressure to vacuum pressure.

Referring to FIG. 1 by way of example, the reinforced frame structure 107 is coupled to the pedestal frame structure 106 in accordance with an embodiment that can be combined with any of the other embodiments described herein. For example, the pedestal frame structure 106 can include a platform 106P that is coupled to the platform 106P. In particular, the platform 106P can be configured to support a person walking on the top of the platform, for example walking on top of the platform during maintenance of the vacuum processing device. Alternatively, the stiffener structure 107 and the base frame structure 106 can be an integral shelf structure, wherein the base frame structure 106 includes a platform 106P.

According to an embodiment that can be combined with any of the other embodiments described herein, the atmosphere space 108 between the first vacuum processing device 101 and the second vacuum processing device 102 provides a service area. In particular, the maintenance zone provides access to the first back side of one of the first vacuum processing devices 101. In addition, the service zone provides access to the second back side of one of the second vacuum processing devices 102. Accordingly, embodiments of the processing apparatus as described herein are advantageously provided for servicing a first vacuum processing apparatus and/or a second vacuum processing apparatus from an atmospheric space provided above a pedestal structure of the support structure.

By way of example with reference to Figure 1, the support structure 103 can be coupled to a first vacuum chamber 110 of the first vacuum processing apparatus 101 in accordance with an embodiment that can be combined with any of the other embodiments described herein. Additionally, the support structure 103 can be coupled to a second vacuum chamber 120 of the second vacuum processing device 102. Typically, the first vacuum chamber 110 is configured relative to the second vacuum chamber 120, as exemplarily shown in FIG. For example, the first vacuum chamber 110 and/or the second vacuum chamber 120 are selected from the group consisting of: a loading chamber; a processing chamber, in particular; a transfer chamber; A vacuum chamber that produces a vacuum pump of industrial grade vacuum.

Thus, embodiments described herein provide processing equipment for increased throughput, reduced footprint, and reduced operational, maintenance, and manufacturing costs, such as for display manufacturing, as compared to conventional processing equipment.

As an example that can be combined with other configurations and embodiments described herein, apparatus 100 includes a first vacuum processing device 101, a second vacuum processing device 102, and a support structure 103. The support structure is disposed in an atmospheric space 108 between the first vacuum processing device 101 and the second vacuum processing device 102. In addition, the support structure 103 includes a pedestal structure 106 that supports a first bottom wall 104B of the first vacuum chamber 110 of the first vacuum processing apparatus 101. In addition, the pedestal frame structure 106 supports a second bottom wall 105B of the second vacuum chamber 120 of one of the second vacuum processing devices 102. The support structure 103 includes a stiffener structure 107 that is coupled to a first back wall 104A of the first vacuum chamber 110. Further, the stiffener structure 107 is coupled to a second back wall 105A of the second vacuum chamber 120. The first vacuum chamber 110 is configured relative to the second vacuum chamber 120, as exemplarily shown in FIG.

2A-2C illustrate top plan views of an apparatus for processing a substrate according to another embodiment of the present invention. In particular, FIGS. 2A-2C illustrate examples of different arrangements of processing devices as described herein.

FIG. 2A shows a first exemplary embodiment of a processing apparatus having a first vacuum processing apparatus 101 and a second vacuum processing apparatus 102. The first vacuum processing apparatus 101 includes a first loading chamber 111 and a first vacuum processing chamber 123. For example, the first vacuum processing device 101 can be coupled to the first vacuum processing chamber 123 via a valve, such as a gate valve 115. In the present disclosure, a "gate valve" can be understood as a portion that allows a vacuum seal to an adjacent vacuum chamber. Accordingly, the second vacuum processing apparatus 102 can include a second loading chamber 112 and a second vacuum processing chamber 124. Similarly, the second loading chamber 112 can be coupled to the second vacuum processing chamber 124 via a gate valve 115, as exemplarily shown in FIG. 2A. Therefore, the vacuum in the individual vacuum chambers of the first vacuum processing device and/or the second vacuum processing device can be controlled independently of each other.

Additionally, as exemplarily shown in FIG. 2A, the first loading chamber 111 can include a first gate valve 115A, and the second loading chamber 112 can include a second gate valve 115B. For example, the first gate valve 115A and the second gate valve 115B can provide connections for adjacent substrate loading modules 180 for loading substrates into the processing apparatus, as exemplarily shown in FIG. 3B By.

By way of example with reference to FIG. 2A, the first vacuum processing chamber 123 and the second vacuum processing chamber 124 can be provided with one or more components by any other embodiment that can be combined with any of the other embodiments described herein. Symbols 133 and 134 are used to indicate the deposition area of the deposition source or deposition source array.

According to a second exemplary embodiment of the processing apparatus, additional vacuum chambers (121, 122) may be provided in respective loading chambers (111, 112) of the first vacuum processing apparatus 101 and the second vacuum processing apparatus 102 and respective Between the vacuum processing chambers (123, 124), as exemplarily shown in Figure 2B. This type of configuration may facilitate generating a first vacuum at each of the load chambers (111, 112) at a first vacuum pressure and a second vacuum pressure at the other vacuum chambers (121, 122). The second vacuum. Therefore, the vacuum pressure can be reduced in two separate steps. As exemplarily shown in FIG. 2B, additional vacuum chambers (121, 122) can include gate valves 115 for connecting the additional vacuum chambers to the loading chamber and the vacuum processing chamber.

According to some embodiments which can be combined with other embodiments described herein, the processing apparatus can be configured for static layer deposition on a substrate, exemplarily shown in Figures 2A and 2B. Alternatively, the processing device can be configured for dynamic layer deposition on a substrate, as exemplarily shown in Figure 2C. A dynamic deposition process, such as a sputter deposition process, can be understood as a deposition process in which a substrate is moved through a deposition zone along a transport direction as the sputter deposition process proceeds. That is, the substrate is not static during the sputter deposition process.

As such, according to some embodiments as exemplarily shown in FIG. 2C, the processing device can be configured for dynamic processing, particularly dynamic deposition, with a tandem processing device. In particular, in the present disclosure, a "series processing device" can be understood as a configuration of two or more vacuum chambers arranged along a line. More particularly, a "series processing device" as described herein can be configured for seating of one or more layers on a vertical substrate. For example, one or more layers can be deposited in a static deposition process or a dynamic deposition process. The deposition process can be a physical vapor deposition process such as a sputtering process, or a chemical vapor deposition process.

Tandem processing devices, particularly those configured for use in dynamic layer depositors, are provided for uniform processing of substrates, such as large area substrates, such as rectangular glass sheets. A processing tool, such as one or more deposition sources, extends primarily in one direction (eg, a vertical direction) while the substrate is in a second, different direction (eg, a first transport direction 1 or a second transport direction 1' It can move in the horizontal direction as exemplarily shown in FIG. 2C.

Apparatus or system for dynamic vacuum deposition, such as a tandem processing apparatus or system, having process uniformity in one direction, such as layer uniformity, by moving the substrate at a constant velocity and depositing one or more sputters The source maintains the advantages of a stable capacity limit. The deposition process of a tandem processing apparatus or a dynamic deposition apparatus is determined by the movement of a substrate through one or more deposition sources. For tandem processing equipment, the deposition or processing zone can be a substantially linear region for processing, for example, a large area substrate. The deposition zone can be a zone in which the deposition material is ejected from one or more deposition sources to be deposited on the substrate. In contrast, for a static processing device, the deposition or processing region will substantially correspond to the region of the substrate.

In some embodiments, a tandem processing system, such as another difference for a dynamic depositor, can be utilized by other vacuum chambers (eg, vacuum chambers 121, 123 of the first vacuum processing device 101) compared to a static processing system. And 125, and/or the loading chambers in the vacuum chambers 122, 124, and 126 of the second vacuum processing device 102 do not include a vacuum hermetic seal for a vacuum chamber relative to another vacuum chamber. The facts of the device are systematically defined, as exemplarily shown in Figure 2C. In contrast, as exemplarily shown in FIGS. 2A and 2B, the static processing apparatus may have a vacuum chamber (eg, a vacuum chamber of the first vacuum processing apparatus 101) that can be hermetically sealed with respect to each other by the gate valve 115. Chambers 111, 121, and 123, and/or vacuum chambers 112, 122, and 124 of the second vacuum processing apparatus 102).

As exemplarily shown in FIGS. 2A-2C, the support structure, particularly the reinforced frame structure 107, is disposed in the first vacuum processing apparatus according to an embodiment that can be combined with any other embodiment described herein. The atmosphere space 108 between the 101 and the second vacuum processing device 102. In addition, as shown in FIGS. 2A-2C, two or more reinforcing frame structures 107 may be provided between the vacuum chambers of the first vacuum processing apparatus 101 and the second vacuum processing apparatus 102 that are disposed opposite each other. Accordingly, it should be understood that two or more pedestal frame structures 106 can provide vacuum chambers for supporting the opposing first and second vacuum processing devices 101, 102.

In accordance with some embodiments that can be combined with other embodiments described herein, apparatus 100 includes a magnetic suspension system for holding the substrate carrier in a floating state. Alternatively, apparatus 100 may be provided with a magnetic drive system configured to move or transfer a substrate in a transport direction, such as, for example, in a first transport direction 1 exemplarily indicated in FIG. 2C. With. The magnetic drive system can be included in a magnetic suspension system or can be provided as a separate entity.

According to some embodiments that can be combined with other embodiments described herein, the substrate carrier is supported in a vacuum processing system with a magnetic suspension system. For example, a magnetic suspension system can include a plurality of first magnets that support the substrate carrier in a suspended position without mechanical contact. The magnetic suspension system provides substrate carrier suspension, ie non-contact support. Thus, particle generation resulting from movement of the carrier in the apparatus for dynamic deposition can be reduced or avoided. The magnetic suspension system includes a first magnet that provides a force to the top of the substrate carrier that is substantially equal to gravity. That is, the substrate carrier is non-contactly suspended below the first magnet.

Additionally, the magnetic suspension system can include a plurality of second magnets that provide translational movement for the substrate carrier in the direction of transport. The substrate carrier can be non-contactly supported in the apparatus by the first magnet and a second magnet is used in the apparatus, such as in a vacuum chamber (eg, the first loading chamber 111 of the first vacuum processing apparatus 101 and the vacuum) The chambers 121, 123, and 125, and/or the second loading chamber 112 of the second vacuum processing device 102 and the vacuum chambers 122, 124, and 126) are moved.

An embodiment of a processing system 200 for processing a substrate is described by way of example with reference to Figures 3A and 3B. In particular, Figure 3A shows a perspective schematic view of a processing system 200 in accordance with an embodiment described herein, and Figure 3B shows a top plan view.

Processing system 200 includes an apparatus 100 for processing a substrate in accordance with any of the embodiments described herein. Additionally, processing system 200 includes a substrate loading module 180 for loading substrates into device 100 for processing substrates. The substrate loading module 180 includes a holding device 140 for holding the substrate, and a swinging module 160 for changing the substrate direction between a horizontal direction and a vertical direction.

For example, the substrate loading module 180 can be coupled to the device 100 for processing a substrate via one or more valves, such as a first gate valve 115A and a second gate valve 115B. In some embodiments, the oscillating module and one or more loading chambers, such as the first loading chamber 111 and/or the second loading chamber 112, can form a combined oscillating module and loading chamber. The substrate carrier having the substrate thereon can be locked into the device 100 via the first gate valve 115A of the first loading chamber 111 and/or the second gate valve 115B of the second loading chamber 112.

According to an embodiment that can be combined with any other embodiments described herein, the holding device 140 includes a first holding member and a second holding member, the first holding member for holding a substrate, such as a first substrate, and a second The holder is for holding another substrate, such as a second substrate, and the second holder and the first holder are vertically stacked. That is, the first substrate holder can be at least partially provided over the second substrate holder. Due to the configuration of the first and second retaining members above each other, a width W of the processing system 200 can be reduced, for example, by 50% or more compared to systems in which the retaining members are disposed adjacent to one another. Therefore, the footprint of the processing system can be reduced.

In view of the present disclosure, it should be understood that the embodiments of the present disclosure are directed to the display industry. For example, displays can be fabricated on large area substrates in processes such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). For example, a TFT display can be fabricated on a large area substrate. Due to the increased display size, the size of the vacuum processing system has increased, particularly in the case of horizontal loading of substrates. In the present disclosure, the size of the clean room area for substrate loading, that is, the footprint size, can be reduced because the holding members such as the substrate loading members are vertically stacked. The display can be flat, or smooth curved or curved parts. For example, glass substrates of various generations can be used in display manufacturing.

As exemplarily shown in FIG. 3A, the substrate 10 can be handed over to the substrate loading module 180 at a loading/unloading location. This is typically done with the substrate in a horizontal orientation. For example, the substrate can be handed over from a cassette. The substrate can be provided to a first holder, such as a first whiteurly holder 142. For example, the first holder can be a holder for loading the substrate on the swing module 160. The processed substrate can be received from the second holder, such as a second whiteurly holder 144. For example, the second retaining member can be a retaining member for unloading the substrate from the swing module 160. It should be understood that the first retaining member and the second retaining member are interchangeable. Additionally, one or both of the holders can be used for loading and unloading of the substrate.

In the present disclosure, a "Benuli support" can be understood to be configured to provide a pressure between a substrate and a surface for suspending the substrate, such as under-pressure or reduced pressure. Holder. In particular, a gap or space can be provided between the surface and the substrate through which the airflow flows. Therefore, the Bainuoli retainer is provided for suspending the substrate based on the Cannino effect. More specifically, the Cannoli retainer (or the Cannino type retainer) supports the substrate without making (direct) mechanical contact with the face of the substrate. In particular, the substrate floats on a gas cushion. That is, the holding device 140 is in a non-contact position on the face of the substrate 10. The words "decompression" and "negative pressure" can be defined relative to the environmental stress of the Bainuoli holdings. In particular, the pressure between the substrate and the surface, such as reduced pressure or negative pressure, is configured for suspension of the substrate. For example, the difference between this pressure and ambient pressure is sufficient to compensate for the weight of the substrate.

According to embodiments of the present disclosure, the holders can be stacked at least partially vertically above each other. A carrier such as an electrostatic chuck (E-Chuck) can be provided on the swing module 160. The substrate can be loaded onto the carrier using the first holder and/or the second holder. The substrate can be loaded in a horizontal state. After the substrate is loaded on the carrier, the swing module 160, and in particular a swing module board 164 of the swing module 160, can be moved from a substantially horizontal direction to a substantially vertical direction, for example by swinging Movement of one arm 162 of module 160. 3A and 3B illustrate the wobble module 160 in a substantially vertical direction.

Therefore, the first holder and the second holder can be horizontally moved between the frame structure and the swing module 160. In addition, the holder and the swing module 160 are vertically movable relative to each other to place the substrate on the carrier on the swing module 160 or to remove the substrate from the swing module. The relative relative movement of the vertical can be provided by the movement of the swinging module, the holding member, or both.

The oscillating module 160 can be configured to load a carrier having a substrate thereon onto the first loading chamber 111 and/or the second loading chamber 112. The swing module 160 can be rotated clockwise or counterclockwise from the horizontal direction. Thus, the carrier can be loaded into each loading chamber and/or can be unloaded from each loading chamber. For example, the loading chambers can be used interchangeably.

The loading chamber can be evacuated. After evacuating the loading chamber, the carrier can be transferred to one or more vacuum chambers of the processing apparatus, as described herein. As shown in Figures 3A and 3B, two lines can be provided. The first loading chamber 111 and the vacuum chambers 121, 123, and 125 can form the first vacuum processing device 101. The second loading chamber 112 and the vacuum chambers 122, 124, and 126 can form a second vacuum processing device 102.

Illustratively with reference to Figures 3A and 3B, a clean room zone 150 can be provided in accordance with some embodiments that can be combined with any of the other embodiments described herein. For example, the holding device 140 and/or the oscillating module 160 can be provided in the clean room zone 150.

It will be understood from Figures 3A and 3B that, advantageously, the processing system 200 as described herein is provided for use with two tandem units, such as the first vacuum processing device 101 and the second vacuum processing device 102, simultaneously Two or more substrates to increase production. The simultaneous processing of the paired processing devices as described herein reduces the footprint of the processing system. Especially for large-area substrates, land occupation can be a relevant factor in reducing the cost of holding a processing system.

A method 300 for servicing an apparatus for processing a substrate is exemplarily described with reference to the flow chart shown in FIG. In particular, method 300 includes providing (block 310) an apparatus 100 for processing a substrate, such as an apparatus 100 for processing a substrate in accordance with any of the embodiments described herein. Apparatus 100 includes a first vacuum processing device 101 and a second vacuum processing device 102. The first vacuum processing device 101 and the second vacuum processing device 102 are supported by a shared support structure 103. Additionally, the method includes servicing (block 320) the first vacuum processing apparatus 101 from an atmospheric space 108 provided above a pedestal structure of the support structure 103. Additionally or alternatively, the method includes servicing (block 330) the second vacuum processing device 102 from the atmospheric space 108 provided above the support structure 103.

In view of the foregoing, it should be understood that this embodiment is advantageously provided for increased throughput, reduced footprint, and reduced operational, maintenance, and manufacturing costs as described. In particular, by providing the paired processing apparatus described herein, the yield can be increased and the footprint can be reduced. In addition, by providing a support structure as described herein, the back walls of the first vacuum processing device and the second vacuum processing device can advantageously be reinforced in an efficient and space-saving manner. Additionally, as described herein, embodiments are advantageously provided to assist in the maintenance of a vacuum processing system, particularly a vacuum processing system having a pair of processing apparatus as described herein.

While the foregoing is directed to the embodiments of the present disclosure, the disclosure of the embodiments of the present invention, and the scope of the disclosure is determined by the following claims.

In particular, the written description uses examples to disclose the present disclosure, including the best mode thereof, and also to enable any person skilled in the art to practice the subject matter, including the manufacture and use of any device or system, And perform any methods that are included. Although the foregoing has disclosed various specific embodiments, the technical features that do not contradict each other in the above-described embodiments can be combined with each other. The patentable scope is determined by the claim, and if the scope of the patent application has structural elements that are no different from the literal language of the claim, or if the scope of the patent application contains equivalent structural elements that are not substantially different from the literal language of the claim, Other examples are also intended to be included in the scope of the claim.

1‧‧‧First transmission direction

1'‧‧‧second transmission direction

10‧‧‧Substrate

100‧‧‧ Equipment

101‧‧‧First vacuum processing unit

102‧‧‧Second vacuum treatment unit

103‧‧‧Support structure

104‧‧‧First Wall

104A‧‧‧First back wall

104B‧‧‧ first bottom wall

105‧‧‧ second wall

105A‧‧‧Second back wall

105B‧‧‧ second bottom wall

106‧‧‧Base frame structure

106P‧‧‧ platform

107‧‧‧Strength frame structure

108‧‧‧Atmospheric space

110‧‧‧First vacuum chamber

111‧‧‧First loading chamber

112‧‧‧Second loading chamber

115‧‧‧ gate valve

115A‧‧‧First Gate Valve

115B‧‧‧Second gate valve

120‧‧‧Second vacuum chamber

121‧‧‧vacuum chamber

122‧‧‧vacuum chamber

123‧‧‧First vacuum processing chamber

124‧‧‧Second vacuum processing chamber

125‧‧‧vacuum chamber

126‧‧‧vacuum chamber

133‧‧‧Component symbol

134‧‧‧Component symbol

140‧‧‧ Holding device

142‧‧‧First Bainuuli Holder

144‧‧‧Second Bainuuli Holder

150‧‧‧Clean room area

160‧‧‧Swing module

162‧‧‧ Arm

164‧‧‧Swing module board

180‧‧‧Substrate loading module

200‧‧‧Processing system

300‧‧‧ method

310‧‧‧ square

320‧‧‧ squares

330‧‧‧ square

W‧‧‧Width

In order to understand the details of the above-described features, a more detailed description of the disclosure of the present disclosure will be made by referring to the embodiments. The drawings relate to embodiments of the present disclosure and are as follows: Figure 1 shows a schematic side view of an apparatus for processing a substrate according to the embodiments described herein. 2A-2C illustrate top plan views of an apparatus for processing a substrate according to another embodiment of the present invention. Figure 3A shows a perspective schematic view of a processing system in accordance with an embodiment described herein. Figure 3B shows a top plan view of a processing system in accordance with an embodiment described herein. Fig. 4 is a flow chart for explaining a method for servicing an apparatus for processing a substrate according to the embodiment described herein.

Claims (20)

A device (100) for processing a substrate, comprising: a first vacuum processing device (101); a second vacuum processing device (102); and a support structure (103) disposed in the first vacuum processing device ( 101) and an atmosphere (108) between the second vacuum processing device (102). The apparatus (100) of claim 1, wherein the support structure (103) is coupled to a first wall (104) of the first vacuum processing apparatus (101) and connected to the second vacuum A second wall (105) of the processing device (102), wherein the second wall (105) faces the first wall (104). The apparatus (100) of claim 1, wherein the first vacuum processing device (101) is a first tandem processing device, and wherein the second vacuum processing device (102) is a second serial device Processing device. The apparatus (100) of any one of claims 1 to 3, wherein the first vacuum processing apparatus (101) is a first vertical processing apparatus, and wherein the second vacuum processing apparatus (102) A second vertical processing device. The apparatus (100) of any one of claims 1 to 3, wherein the support structure (103) includes a base frame structure (106), the base frame structure (106) supporting the first A first bottom wall (104B) of the vacuum processing device (101) supports a second bottom wall (105B) of the second vacuum processing device (102). The apparatus (100) of claim 4, wherein the support structure (103) comprises a base frame structure (106), the base frame structure (106) supporting the first vacuum processing device (101) a first bottom wall (104B) and supporting a second bottom wall (105B) of the second vacuum processing device (102). The apparatus (100) according to any one of claims 1 to 3, wherein the support structure (103) comprises a reinforcing frame structure (107) connected to the first vacuum A first back wall (104A) of the processing device (101) is coupled to a second back wall (105A) of the second vacuum processing device (102). The apparatus (100) of claim 4, wherein the support structure (103) comprises a reinforcing frame structure (107) connected to the first vacuum processing device (101) a first back wall (104A) and connected to a second back wall (105A) of the second vacuum processing device (102). The apparatus (100) of claim 6, wherein the support structure (103) comprises a reinforcing frame structure (107) connected to the first vacuum processing device (101) a first back wall (104A) and connected to a second back wall (105A) of the second vacuum processing device (102). The apparatus (100) of claim 7, wherein the stiffener structure (107) is coupled to the base frame structure (106). The apparatus (100) of claim 8 wherein the stiffener structure (107) is coupled to the base frame structure (106). The apparatus (100) according to any one of claims 1 to 3, wherein the atmospheric space (108) between the first vacuum processing device (101) and the second vacuum processing device (102) A service area is provided for providing access to the first back side of one of the first vacuum processing devices (101) and access to the second back side of one of the second vacuum processing devices (102). The apparatus of claim 4, wherein the atmosphere (108) between the first vacuum processing device (101) and the second vacuum processing device (102) provides a maintenance area for the maintenance area Access to the first back side of one of the first vacuum processing devices (101) and access to the second back side of one of the second vacuum processing devices (102) are provided. The apparatus (100) according to any one of claims 1 to 3, wherein the support structure (103) is connected to a first vacuum chamber (110) of the first vacuum processing apparatus (101) And connected to a second vacuum chamber (120) of the second vacuum processing device (102), wherein the first vacuum chamber (110) is configured relative to the second vacuum chamber (120). The apparatus (100) of claim 14, wherein the first vacuum chamber (110) and the second vacuum chamber (120) are selected from the group consisting of: a loading chamber a processing chamber, a deposition chamber, a transfer chamber, and a vacuum chamber having a vacuum pump for producing an industrial grade vacuum. A device (100) for processing a substrate, comprising: a first vacuum processing device (101); a second vacuum processing device (102); and a support structure (103) disposed in the first vacuum processing device ( 101) and an atmosphere (108) between the second vacuum processing device (102); wherein the support structure (103) includes a pedestal frame structure (106), the pedestal frame structure (106) supporting the a first bottom wall (104B) of the first vacuum chamber (110) of the first vacuum processing device (101) and supporting the second vacuum chamber (120) of one of the second vacuum processing devices (102) a second bottom wall (105B), wherein the support structure (103) includes a reinforcing frame structure (107) connected to a first back wall of the first vacuum chamber (110) ( 104A) is coupled to a second back wall (105A) of the second vacuum chamber (120), and wherein the first vacuum chamber (110) is disposed relative to the second vacuum chamber (120). A processing system (200) for processing a substrate, comprising: the apparatus (100) for processing a substrate according to any one of claims 1 to 16; and a substrate loading module (180), For loading the substrate into the device (100) for processing a substrate, the substrate loading module comprises: a holding device (140) for holding the substrate; and a swing module (160) for The direction of the substrate is changed between the horizontal direction and a vertical direction. The system (200) of claim 17, wherein the holding device (140) comprises a first substrate holder and a second substrate holder, wherein the first substrate holder is at least partially provided Above the second holder. A method for servicing a device (100) for processing a substrate, the device (100) comprising a first vacuum processing device (101) and a second vacuum processing device (102), the first vacuum processing device ( 101) and the second vacuum processing device (102) is supported by a shared support structure (103) including an atmospheric space (108) provided above a pedestal structure of the support structure (103) At least one of the first vacuum processing device (101) and the second vacuum processing device (102) is maintained. The method of claim 19, wherein the apparatus (100) for processing a substrate is the apparatus of any one of claims 1 to 16.