CN109257933A - For handling the equipment, processing system and method for substrate - Google Patents
For handling the equipment, processing system and method for substrate Download PDFInfo
- Publication number
- CN109257933A CN109257933A CN201780015869.5A CN201780015869A CN109257933A CN 109257933 A CN109257933 A CN 109257933A CN 201780015869 A CN201780015869 A CN 201780015869A CN 109257933 A CN109257933 A CN 109257933A
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- Prior art keywords
- vacuum
- treatment installation
- substrate
- vacuum treatment
- equipment
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Describe a kind of equipment (100) for handling substrate.The equipment includes the first vacuum treatment installation (101), the second vacuum treatment installation (102) and support construction (103), and the support construction (103) configuration is in the airspace (108) between the first vacuum treatment installation (101) and the second vacuum treatment installation (102).
Description
Technical field
The embodiment of present disclosure be related to the equipment for handling substrate, the processing system for handling substrate and
Method for maintenance facility.The embodiment of present disclosure is more particularly to the vacuum for handling two or more substrates
Processing equipment, such as display manufacturing, it is related to being disposed for the vacuum processing of substrate to manufacture the place of display equipment
Reason system, and be related to for empty from the atmosphere provided between two vacuum treatment installations (processing arrangement)
Between maintain vacuum treatment device method.
Background technique
The technology of layer deposition on substrate, such as include sputtering sedimentation, hot evaporation and chemical vapor deposition.Sputtering
Depositing operation can be used in depositing materials on substrates layer, such as the layer of conductive material or insulating materials.In the sputter deposition craft phase
Between, there is the ion bombardment that is generated in the plasma region of target to be deposited on the target material on substrate, with from the table of target
Evict the atom of target material from face.The atomic energy being expelled out of forming material layer on substrate.In reactive sputtering depositing operation, quilt
Gas such as nitrogen or oxygen reaction in deported atomic energy and plasma slab, to form oxide, the nitrogen of target material on substrate
Compound or nitrogen oxides.
Coated material can be used in several applications and several technical fields.For example, a kind of application is in micro- electricity
The field that son is learned, such as generate semiconductor device.In addition, the substrate for display is applied frequently by sputter deposition craft
Cloth.In addition application comprising insulating panel, have thin film transistor (TFT) (TFT) substrate, colored filter or fellow.
For example, in display manufacturing, the manufacturing cost for reducing display is advantageous, the display for example with
In mobile phone, tablet computer, video screen and fellow.The reduction of manufacturing cost, can be for example by increasing vacuum flush system
It is realized such as the yield of sputtering depositing system.In addition, land occupation can reduce the correlative factor for the cost for holding vacuum flush system.
In view of above situation, it is advantageous for overcoming the equipment, system and method for the problems at least some technical fields
's.Present disclosure is especially directed to propose to provide the land occupation and reduction for increasing yield, reducing vacuum flush system
Operation, maintenance and manufacturing cost at least one of equipment, system and method.
Summary of the invention
In view of the foregoing, the equipment for handling substrate, the processing system for handling substrate are provided and for maintaining
The method of equipment.The other aspect of present disclosure, advantage and feature are bright from claims, specification and appended attached drawing
It is bright.
According to one aspect of the present disclosure, a kind of equipment for handling substrate is provided.The equipment includes first true
Empty processing unit, the second vacuum treatment installation and support construction.Support structure configuration is true in the first vacuum treatment installation and second
In airspace between empty processing unit.
According to the other side of present disclosure, a kind of equipment for handling substrate is provided.The equipment includes first
Vacuum treatment installation, the second vacuum treatment installation and support construction.Support structure configuration is in the first vacuum treatment installation and second
In airspace between vacuum treatment installation.In addition, support construction includes base mounting structures, the pedestal frame structural support first
First bottom wall of the first vacuum chamber of vacuum treatment installation.In addition, at pedestal frame the second vacuum of structural support of support construction
Manage the second bottom wall of the second vacuum chamber of device.In addition, support construction includes to strengthen frame structure, which is connected to
First back wall of the first vacuum chamber, and it is connected to the second back wall of the second vacuum chamber.First vacuum chamber is relative to second
Vacuum chamber configuration.
According to the yet other aspects of present disclosure, provide a kind of for handling the processing system of substrate.The processing system
System includes the equipment for handling substrate according to any embodiment for being described in this.In addition, the processing system includes substrate
Loading module, the substrate loading module is for loading substrate into the equipment for being used to handle substrate.Substrate loading module packet
Containing holding unit and swing module, holding unit for holding substrate, swing module be used for horizontal orientation and vertical orientation it
Between change substrate orientation.
According to another aspect of present disclosure, a kind of method for maintaining the equipment used in processing substrate is provided,
The equipment includes the first vacuum treatment installation and the second vacuum treatment installation, and the first vacuum treatment installation and second are vacuum-treated dress
It sets and is supported by shared support construction.This method is maintained from the airspace provided in the pedestal frame superstructure of support construction
First vacuum treatment installation and/or the second vacuum treatment installation.
Embodiment is also related to the equipment for carrying out disclosed method, and includes for executing each the method side
The environment division in face.In terms of these methods can by hardware component, with the computer of appropriate software programming, pass through any of the two
Combination executes in any other manner.Furthermore also it is related to according to the embodiment of the present disclosure for operating described set
Standby method.In terms of method for operating the equipment includes the method for carrying out each function of equipment.
Detailed description of the invention
In order to understand the details of present disclosure features described above, can be obtained by referring to embodiment for simple total
It includes and is described in more detail in upper disclosure.Appended attached drawing is related to the embodiment of present disclosure, and as described below:
Fig. 1 shows the schematic side view of the equipment for handling substrate according to the embodiment for being described in this.
Fig. 2A -2C shows the vertical view signal of the equipment for handling substrate according to the other embodiment for being described in this
Figure.
Fig. 3 A shows the perspective diagram of the processing system according to the embodiment for being described in this.
Fig. 3 B shows the schematic top plan view of the processing system according to the embodiment for being described in this.
Fig. 4 is shown for illustrating the side for being used to maintain the equipment used in processing substrate according to the embodiment for being described in this
The flow chart of method.
Specific embodiment
A variety of different embodiments of present disclosure will be described in detail now, one or more are illustrated in
It is illustrated in attached drawing.In the narration below for attached drawing, identical appended drawing reference indicates identical component.Implement only for individual
The difference of mode is described.Each example is provided in a manner of explaining present disclosure, rather than is meaned and be used as this public affairs
Open the limitation of content.In addition, as an embodiment a part and the feature that is elucidated with or describes, can be used in or combine
Any other embodiments, to generate another embodiment.Narration content is intended to comprising this kind of modifications and variations.
Before the narration a variety of different embodiments of present disclosure in detail, first explain about being used in this some use
The some aspects of word and expression.
In this disclosure, " equipment for handling substrate " make sense into be such as described in this be disposed for locate
The equipment for managing substrate.In particular, the equipment for handling substrate can be disposed for handling vertical substrate, such as display
Manufacture.More particularly, the equipment for handling substrate can be disposed for handling large-area substrates, such as by vacuum deposition
In depositing one or more layers on substrate in chamber.In addition, it is to be noted that in this disclosure, " for handling substrate
Equipment " is also referred to as " processing equipment ".
In this disclosure, this word " substrate " or " large-area substrates " are such as used in, should especially be included non-flexible
Substrate, such as glass plate and metal plate.However, present disclosure is not only restricted to this, word " substrate " can also include flexible base board,
Such as coiled material or foil.According to some embodiments, substrate can be made of any material suitable for material deposition.Citing comes
It says, substrate can be made of the material selected from the group being made of the following option: glass (such as soda-lime glass, Pyrex etc.
Deng), metal, polymer, ceramics, compound-material, carbon fibre material, mica or any other can by depositing operation be coated with
The combination of material or material.
For example, at least 0.01 square metre of size can be had by being such as described in this " large-area substrates ", especially extremely
It is 0.1 square metre, more particularly at least 0.5 square metre few.For example, large-area substrates or carrier can be to be corresponding to about 0.67 flat
4.5th generation of the substrate (0.73 meter × 0.92 meter) of square rice, corresponding to about 1.4 square metres of substrate (1.1 meters × 1.3 meters) the
5 generations, the 7.5th generation of corresponding to about 4.29 square metres of substrate (1.95 meters × 2.2 meters), corresponding to about 5.7 square metres of substrate
In 8.5th generation of (2.2 meters × 2.5 meters), even corresponds to the 10th of about 8.7 square metres of substrate (2.85 meters × 3.05 meters)
Generation.Bigger 11 generation of Dai Ru and the 12nd generation and corresponding substrate area can be implemented in a similar way.Therefore, substrate can select
From in the group being made of the following option: 1st generation, 2nd generation, the 3rd generation, the 3.5th generation, the 4th generation, the 4.5th generation, the 5th generation, the 6th generation,
7th generation, the 7.5th generation, the 8th generation, the 8.5th generation, the 10th generation, the 11st generation and the 12nd generation.In particular, substrate can be selected from by following
The group that option is constituted: the 4.5th generation, the 5th generation, the 7.5th generation, the 8.5th generation, the 10th generation, the 11st generation and the 12nd generation or bigger
The substrate in generation.In addition, substrate thickness can be from 0.1 to 1.8 millimeter (mm), particularly from about 0.9 millimeter or lower, such as 0.7 millimeter
Or 0.5 millimeter.
In this disclosure, " vacuum treatment installation " makes sense into the processing with one or more vacuum chambers and fills
It sets." vacuum chamber " makes sense into the chamber with the vacuum pump for generation technology vacuum (technical vacuum).
In particular, being such as described in this vacuum chamber, the chamber that can be evacuated to subatmospheric power is made sense into, is e.g. arrived
10 millibars (mbar) or lower pressure, especially 1 millibar are lower.According to an illustrative configuration kenel, vacuum chamber energy
To be disposed for importing the vacuum processing chamber of processing gas in the crystallizing field being vacuum-treated in chamber.For example, it handles
Gas can include inert gas such as argon, and/or reactant gas such as oxygen, nitrogen, hydrogen and ammonia (NH3), ozone (O3) or fellow.
Therefore, the word " vacuum " for being such as used in this makes sense into the skill with the vacuum pressure lower than such as 10 millibars
The concept of art vacuum.Typically, the pressure being such as described in this vacuum chamber, can be between 10-5Millibar and about 10-8Millibar
Between, typically range between 10-5Millibar and 10-7Between millibar, even more typically between about 10-6Millibar and about 10-7Between millibar.
According to some embodiments, the pressure in vacuum chamber can be considered as the local pressure of the material evaporated in vacuum chamber, or
Person is gross pressure (when only having the material of the evaporation to exist as ingredient to be deposited in vacuum chamber, can be rough identical).?
In some embodiments, the gross pressure in vacuum chamber can be fallen in from about 10-4Millibar is to about 10-7In the range of millibar, especially
It is present in vacuum chamber the example of (such as gas or fellow) in the second composition wherein other than the material of the evaporation
In.
In this disclosure, " support construction " make sense into be such as described in this first vacuum treatment installation of support and
The mechanical structure of second vacuum treatment installation.That is, support construction can be shared support construction, it is disposed for supporting
First vacuum treatment installation and the second vacuum treatment installation.More particularly, " support construction " for being such as described in this can be mechanical knot
Structure, such as frame structure (frame structure), the mechanical structure include to provide in the first vacuum treatment installation and the second vacuum
Shared reinforced structure between processing unit.In particular, support construction can be attached to the first back of the first vacuum treatment installation
Wall, and it is connected to the second back wall of the second vacuum treatment installation, so provide shared reinforcing.In addition, as being described in this
" support construction " may include providing the base mounting structures of platform structure, and the first vacuum processing can be configured on the top of platform structure
Device and the second vacuum treatment installation.Therefore, base mounting structures can be shared base mounting structures, and support first is vacuum-treated
Both device and the second vacuum treatment installation.
In this disclosure, " airspace " makes sense into offer at the first vacuum treatment installation and the second vacuum
The space between device is managed, wherein providing atmospheric pressure.Typically, " airspace " includes air, is mentioned so that people can rest on
For in the space between the first vacuum treatment installation and the second vacuum treatment installation, such as the first vacuum treatment installation
And/or second vacuum treatment installation maintenance or maintenance.Therefore, the size that can select airspace, enables people to pass in and out first
The back side of the back side of vacuum treatment installation and the second vacuum treatment installation.
Fig. 1 shows the schematic side view of the equipment 100 for handling substrate according to the embodiment for being described in this.Such as exist
It is illustrated in Fig. 1, equipment 100 includes the first vacuum treatment installation 101, the second vacuum treatment installation 102 and support knot
Structure 103.Airspace 108 of the support structure configuration between the first vacuum treatment installation 101 and the second vacuum treatment installation 102
In.In particular, the processing equipment comprising the first vacuum treatment installation and the second vacuum treatment installation is also referred to as pairs of herein
Processing equipment (twin processing apparatus).More particularly, " pairs of processing equipment ", which makes sense into, is such as described in
This processing equipment comprising two other vacuum treatment installations.That is, the first vacuum treatment installation and the second vacuum
Processing unit is typically designed to separated unit.
Therefore, compared to traditional process equipment, the embodiment for being such as described in this processing equipment is advantageously provided for
Increase yield, reduce land occupation and reduces operation, maintenance and manufacturing cost.In particular, by provide such as be described in this at
To processing equipment, it can increase yield and land occupation can be reduced.In addition, being such as described in this support construction, the first vacuum by providing
Processing unit and the back wall of the second vacuum treatment installation can advantageously be strengthened by efficiently and in a manner of section space-efficient.
More particularly, providing may be particularly advantageous as being described in this support construction, because each vacuum processing fills
The back wall set must endure as the difference of atmospheric pressure to vacuum pressure.Support construction due to being such as described in this is provided for first
The shared reinforcing of vacuum treatment installation and the second vacuum treatment installation, thus support construction have about composition, fixation and at
The advantages of present aspect.In particular, compared to other reinforcing of vacuum treatment installation, shared reinforcing reduces weight.
It is furthermore advantageous to provide the space between the first vacuum treatment installation and the second vacuum treatment installation, i.e. vacuum
Distance between the back wall of processing unit provides the maintenance area for being used in maintenance vacuum treatment installation.Therefore, such as it is described in this
Processing equipment embodiment be advantageously provided for from provide support construction pedestal frame superstructure airspace
Maintain the first vacuum treatment installation and/or the second vacuum treatment installation.
Fig. 1 is illustratively referred to, according to the embodiment for embodiment combination that can be described in this with any other, support
Structure 103 can be attached to the first wall 104 of the first vacuum treatment installation 101.In addition, support construction 103 can be attached to second very
Second wall 105 of empty processing unit 102.Typically, the second wall 105 is towards the first wall 104, the person of illustrating such as in Fig. 1.
Therefore, advantageously, the shared reinforcing for the first vacuum treatment installation and the second vacuum treatment installation is provided, so that support knot
An other reinforcing of the weight of structure compared to vacuum treatment installation can reduce.
The embodiment combined according to this embodiment can be described in any other, the first vacuum treatment installation 101
It can be the first tandem (in-line) processing unit.In addition, the second vacuum treatment installation 102 can be the second tandem processing dress
It sets.In particular, the first vacuum treatment installation 101 can be the first vertical processing arrangement.Additionally or alternatively, at the second vacuum
Managing device 102 can be the second vertical processing arrangement.Therefore, advantageously, the land occupation of processing equipment can reduce.
In this disclosure, " vertical processing arrangement " makes sense as processing unit, is configured for processing in reality
Substrate (substantially perpendicular=± 15 ° vertical) in matter in vertical orientation.As present disclosure in the whole text used in, word is such as
" vertical direction (vertical direction) " or " vertical orientation (vertical orientation) " is understood to and " water
Square to (horizontal direction) " or horizontal orientation (horizontal orientation) " distinguished.
Fig. 1 is illustratively referred to, according to the embodiment for embodiment combination that can be described in this with any other, support
Structure 103 includes base mounting structures 106.In particular, base mounting structures 106 support the first bottom of the first vacuum treatment installation 101
Wall 104B.In addition, base mounting structures 106 support the second bottom wall 105B of the second vacuum treatment installation 102.Therefore, advantageously, mention
For shared base mounting structures, both the first vacuum treatment installation and the second vacuum treatment installation are supported.It is such as chatted by providing
This shared base mounting structures are set forth in, use an other pedestal frame (base frame), branch compared to vacuum treatment installation
The weight of support structure can reduce.
The embodiment combined according to that can be described in this embodiment with any other, support construction 103 may include strong
Change frame structure 107, the person of illustrating such as in Fig. 1.Typically, support construction 103, especially reinforcing frame structure 107, can connect
It is connected to the first back wall 104A of the first vacuum treatment installation 101.In addition, support construction 103, especially reinforcing frame structure 107, energy
It is connected to the second back wall 105A of the second vacuum treatment installation 102.For example, strengthening frame structure 107 can provide first very
Between first back wall 104A of empty processing unit 101 and the second back wall 105A of the second vacuum treatment installation 102, such as in Fig. 1
The person of illustrating.More particularly, strengthen frame structure 107 and can configure and be provided in the first vacuum treatment installation 101 and second very
In airspace 108 between empty processing unit 102.Therefore, advantageously, the back wall of each vacuum treatment installation can be reinforced,
Back wall is enabled to bear the difference of atmospheric pressure to vacuum pressure.
Fig. 1 is illustratively referred to, according to the embodiment for embodiment combination that can be described in this with any other, is strengthened
Frame structure 107 is connected to base mounting structures 106.For example, base mounting structures 106 can include platform 106P, strengthen frame structure
107 are connected to platform 106P.In particular, platform 106P can be disposed for being supported on the people to walk on the top of platform, example
Such as walk on the top of platform during the maintenance of vacuum treatment installation.Alternatively, strengthening frame structure 107 and base mounting structures
106 can be integrated the frame structure of (integral), and wherein base mounting structures 106 include platform 106P.
The embodiment combined according to this embodiment can be described in any other, the first vacuum treatment installation 101
And the second airspace 108 between vacuum treatment installation 102 provides maintenance area.In particular, the maintenance area is provided to first very
The disengaging of first back side of empty processing unit 101.In addition, the maintenance area provides the second back to the second vacuum treatment installation 102
The disengaging of side.Therefore, it is advantageously provided for from providing in support construction as being described in the embodiment of this processing equipment
The airspace of pedestal frame superstructure maintains the first vacuum treatment installation and/or the second vacuum treatment installation.
Fig. 1 is illustratively referred to, according to the embodiment for embodiment combination that can be described in this with any other, support
Structure 103 can be attached to the first vacuum chamber 110 of the first vacuum treatment installation 101.In addition, support construction 103 can be attached to
Second vacuum chamber 120 of the second vacuum treatment installation 102.Typically, the first vacuum chamber 110 is relative to the second vacuum chamber
120 configurations, the person of illustrating such as in Fig. 1.For example, the first vacuum chamber 110 and/or the choosing of the second vacuum chamber 120
From in the group being made of the following option: load locking cavity；Processing chamber housing, especially deposition chambers；Transfer chamber；And have
The vacuum chamber of vacuum pump for generation technology vacuum.
Therefore, compared to traditional processing equipment, the embodiment for being described in this is provided for about increase yield, reduction
Land occupation and the improved processing equipment for reducing operation, maintenance and manufacturing cost, such as display manufacturing.
As an energy and other be described in this configuration kenel and the example that combines of embodiment, equipment 100 includes the
One vacuum treatment installation 101, the second vacuum treatment installation 102 and support construction 103.Support structure configuration is at the first vacuum
It manages in the airspace 108 between device 101 and the second vacuum treatment installation 102.In addition, support construction 103 includes pedestal frame
Structure 106, base mounting structures 106 support the first bottom wall 104B of the first vacuum chamber 110 of the first vacuum treatment installation 101.
In addition, base mounting structures 106 support the second bottom wall 105B of the second vacuum chamber 120 of the second vacuum treatment installation 102.Support
Structure 103 includes to strengthen frame structure 107, strengthens the first back wall 104A that frame structure 107 is connected to the first vacuum chamber 110.This
Outside, strengthen the second back wall 105A that frame structure 107 is connected to the second vacuum chamber 120.First vacuum chamber 110 is relative to second
Vacuum chamber 120 configures, the person of illustrating such as in Fig. 1.
Fig. 2A -2C shows the vertical view signal of the equipment for handling substrate according to the other embodiment for being described in this
Figure.In particular, Fig. 2A -2C shows the example of the different arrangements of the processing equipment as being described in this.
Fig. 2A shows the first illustrative embodiments of processing equipment, which has the first vacuum treatment installation
101 and second vacuum treatment installation 102.First vacuum treatment installation 101 includes the first load locking cavity 111 and the first vacuum
Processing chamber housing 123.For example, the first vacuum treatment installation 101 can be connected at the first vacuum via valve, such as gate valve 115
Manage chamber 123.In this disclosure, " gate valve ", which makes sense into, allows to the adjacent vacuum-packed oral area of vacuum chamber.
Therefore, the second vacuum treatment installation 102 may include that the second load locking cavity 112 and second is vacuum-treated chamber 124.It is similar
Ground, the second load locking cavity 112 can be connected to the second vacuum processing chamber 124 via gate valve 115, such as exemplary in fig. 2
The person of showing.Therefore, the vacuum-energy in the individual vacuum chamber of the first vacuum treatment installation and/or the second vacuum treatment installation that
This is independently controlled.
In addition, the first load locking cavity 111 can include the first gate valve 115A as illustrated in fig. 2, and
Second load locking cavity 112 can include the second gate valve 115B.For example, the first gate valve 115A and the second gate valve 115B can be mentioned
For for such as showing in figure 3b to the adjacent connection for being used in the substrate loading module 180 loaded substrate into processing equipment
The example property person of showing.
Fig. 2A is illustratively referred to, be described in the embodiment of this embodiment combination with any other according to energy, the
One vacuum processing chamber 123 and the second vacuum processing chamber 124 can be provided with one indicated by appended drawing reference 133 and 134
Or the crystallizing field of multiple sedimentary origins or sedimentary origin array.
According to the second illustrative embodiments of processing equipment, vacuum chamber (121,122) in addition may be provided in first
At vacuum treatment installation 101 and the respective load locking cavity (111,112) of the second vacuum treatment installation 102 and respective vacuum
It manages between chamber (123,124), does not in fig. 2b illustrate person such as.This kind of configuration kenel can be conducive in each load lock
Chamber (111,112) generates the first vacuum with the first vacuum pressure, and in other vacuum chamber (121,122) with the second vacuum
Pressure generates the second vacuum.Therefore, vacuum pressure can be reduced in two sseparated steps.As illustrated in fig. 2b
, vacuum chamber (121,122) in addition can include gate valve 115, and the gate valve 115 is for the other vacuum chamber to be connected to
Load locking cavity and vacuum processing chamber.
According to some embodiments that can be described in this embodiments with other and combine, processing equipment can be disposed for
Static layer deposition on substrate, is illustratively shown in Fig. 2A and 2B.Alternatively, processing equipment can be disposed for moving on substrate
State layer deposition, does not in fig. 2 c illustrate person such as.Dynamic deposition technique, such as sputter deposition craft, make sense into wherein
When sputter deposition craft carries out, substrate moves the depositing operation by crystallizing field along transmission direction.That is, substrate exists
It is non-for static state during sputter deposition craft.
In this way, processing equipment can be configured for moving according to some embodiments such as illustrated in fig. 2 c
State processing, especially Dynamic deposition, have tandem processing unit.In particular, in this disclosure, " tandem processing dress
Set " make sense into the configurations of two or more the vacuum chambers configured along the line.More particularly, such as it is described in this " tandem
It is in place on vertical substrate that processing unit " can be configured for one or more layers.For example, one or more layers can be quiet
It is deposited in state depositing operation or Dynamic deposition technique.Depositing operation can be physical gas-phase deposition such as sputtering technology or change
Learn gas-phase deposition.
Tandem processing unit is especially disposed for dynamic layer deposition person, provides for uniform treatment substrate, such as
Large-area substrates seem rectangular glass sheet.Handling implement, such as one or more sedimentary origins, mainly in one direction (such as
Vertical direction) in extend, and substrate is in second, different directions (such as the first transmission direction 1 or the second transmission direction
1 ', can be horizontal direction as illustrated in fig. 2 c) in move.
For the equipment or system of dynamic vacuum deposition, such as tandem processing equipment or system, have in one direction
In process uniformity, such as layer uniformity, by with constant speed moving substrate and one or more sputtering sedimentation sources being made to keep steady
The advantages of fixed energy power limit.The depositing operation of tandem processing equipment or Dynamic deposition equipment is by passing through one or more sedimentary origins
The mobile of substrate determined.For tandem processing equipment, crystallizing field or treatment region can be substantially linear region,
For handling such as large-area substrates.Crystallizing field can spray wherein from one or more sedimentary origins to be deposited over for deposition materials
Area on substrate.In contrast, crystallizing field or treatment region will be essentially corresponded to the area of substrate for static treatment equipment
Domain.
In some embodiments, compared to static treatment system, tandem processing system is such as the person that is used for Dynamic deposition
Another difference can by other vacuum chambers (such as the vacuum chamber 121,123 and 125 of the first vacuum treatment installation 101, with
And/or second vacuum treatment installation 102 vacuum chamber 122,124 and 126) in load locking cavity do not include be used for one
The fact that the device that vacuum chamber is sealed relative to the vacuum tight of another vacuum chamber, carrys out systematization definition, such as shows in fig. 2 c
The example property person of showing.In contrast, static treatment equipment can have can be relative to each other as illustrated in Figures 2 A and 2 B
By vacuum chamber (such as vacuum chamber 111,121 and of the first vacuum treatment installation 101 of 115 vacuum tight of gate valve sealing
123 and/or second vacuum treatment installation 102 vacuum chamber 112,122 and 124).
As illustrated in figs. 2 a-2 c, according to the reality for embodiment combination that can be described in this with any other
Mode is applied, support construction, especially reinforcing frame structure 107, configuration are being provided in the first vacuum treatment installation 101 and the second vacuum
In airspace 108 between processing unit 102.In addition, as seen in figs. 2a-2c, two or more reinforcing frame structures 107 can mention
For between the first vacuum treatment installation 101 of relative configuration and the vacuum chamber of the second vacuum treatment installation 102.Therefore, it answers
It should be appreciated that two or more base mounting structures 106 can provide the first vacuum treatment installation 101 for being used to support relative configuration
With the vacuum chamber of the second vacuum treatment installation 102.
According to some embodiments that can be described in this embodiments with other and combine, equipment 100 includes magnetic suspension
System, for base board carrier to be retained on to the state of suspension.Selectively, it is possible to provide 100 1 magnetic drive system of equipment, the magnetic
Property drive system is disposed in transmission direction, is such as in fig. 2 c in exemplary the first transmission direction 1 pointed out,
Mobile or transmission base board carrier.Magnetic drive system can be comprised in magnetic levitation systems, or can be provided and be used as a list
Only entity.
According to some embodiments that can be described in this embodiments with other and combine, base board carrier is with magnetic suspension system
System is supported in vacuum flush system.For example, magnetic levitation systems can include the first magnet, and first magnet is in no machine
Base board carrier is supported on hanging position in the case where tool contact.Magnetic levitation systems provide base board carrier and suspend, i.e., non-contact
The support of property.Therefore, it can reduce or avoid the particle of the movement due to carrier in the equipment for Dynamic deposition to generate.Magnetic
Property suspension system include the first magnet, first magnet provide power to the top of base board carrier, which is substantially equal to gravity.?
That is base board carrier is suspended below the first magnet untouchablely.
In addition, magnetic levitation systems can include the second magnet, which is provided for base board carrier along transmission side
To translational movement.Base board carrier can be supported by the first magnet untouchablely in a device, and use second in a device
Magnet and for example in vacuum chamber (such as the first load locking cavity 111, the vacuum chamber of the first vacuum treatment installation 101
121,123 and 125 and/or second vacuum treatment installation 102 the second load locking cavity 112, vacuum chamber 122,124
And 126) between moved.
Fig. 3 A and 3B are illustratively referred to, the embodiment for handling the processing system 200 of substrate is described.In particular,
Fig. 3 A shows the perspective diagram of the processing system 200 according to the embodiment for being described in this, and Fig. 3 B shows schematic top plan view.
Processing system 200 includes according to any embodiment for being described in this for handling the equipment 100 of substrate.Separately
Outside, processing system 200 includes substrate loading module 180, for loading substrate into the equipment 100 for being used to handle substrate.Base
Plate loading module 180 includes holding unit 140 and swings module 160, and holding unit 140 swings module 160 for holding substrate
For changing substrate orientation between horizontal orientation and vertical orientation.
For example, substrate loading module 180 can be via one or more valves, such as the first gate valve 115A and the second gate valve
115B is connected to the equipment 100 for handling substrate.In some embodiments, module and one or more load locks are swung
Determine chamber such as the first load locking cavity 111 and/or the second load locking cavity 112, can constitute convolution swing module and
Load locking cavity.It can be via the first gate valve of the first load locking cavity 111 with substrate base board carrier disposed thereon
Second gate valve 115B of 115A and/or the second load locking cavity 112 is locked (lock) into equipment 100.
The embodiment combined according to that can be described in this embodiment with any other, holding unit 140 include first
Retaining piece and the second retaining piece, for the first retaining piece for holding substrate, such as first substrate, the second retaining piece is another for holding
Substrate, such as the second substrate, the second retaining piece and the first retaining piece are vertically stacked.That is, first substrate retaining piece energy
It at least partly provides above the second substrate retaining piece.The matching in top each other due to the first retaining piece and the second retaining piece
It sets, the width W of processing system 200 can be lowered, such as the system configured adjacent to each other compared to wherein retaining piece reduces by 50%
Or more.Therefore, the land occupation of processing system can be reduced.
In view of present disclosure, it should be understood that the embodiment of present disclosure talks about display industry.It lifts
For example, display can be manufactured with the technique for seeming chemical vapor deposition (CVD) and physical vapour deposition (PVD) (PVD) in large area base
On plate.For example, TFT display can be fabricated on large-area substrates.Due to increased display sizes, it is vacuum-treated system
The size of system increases, especially in the example that substrate level loads.In this disclosure, it can reduce for substrate loading
The size in dust free room area, i.e. land occupation size, because retaining piece such as substrate carrier member is vertically stacked.Display can for it is flat,
Or smooth surface or curved component.For example, the glass substrate in various different generations can be used for display manufacturing.
As illustrated in figure 3 a, substrate 10 can be handed over on substrate loading module 180 in loading/discharge position
Side.This is typically completed in the case where substrate is in horizontal orientation.For example, substrate energy self-reference substrate box (cassette) moves
It hands over.Substrate can be provided to the first retaining piece, such as first Bernoulli Jacob's retaining piece 142.For example, the first retaining piece can be use
In the retaining piece being loaded in substrate in swing module 160.Processed substrate can be received from the second retaining piece, the second retaining piece
E.g. second Bernoulli Jacob's retaining piece 144.For example, the second retaining piece can for for by substrate from swing 160 removal of module
Retaining piece.It should be understood that the first retaining piece and the second retaining piece are commutative.In addition, the one of them of retaining piece or two
Person can be used for the loading and removal of substrate.
In this disclosure, " Bernoulli Jacob's retaining piece ", which makes sense into, is disposed for suspending in substrate and for substrate
Surface between pressure is provided, such as negative pressure (under-pressure) or depressurize the retaining piece of (reduced pressure).
In particular, gap or space can be provided between the surface and substrate, air-flow is flowed by it.Therefore, Bernoulli Jacob's retaining piece base
It is provided in Bernoulli effect and is used for suspension board.More particularly, Bernoulli Jacob's retaining piece (or Bernoulli Jacob's type retaining piece) branch support group
Plate, and do not make and the face of substrate (direct) Mechanical Contact.In particular, substrate is swum on air cushion (gas cushion).Also
It is to say, the non-contact status of holding unit 140 is on the face of substrate 10.Word " decompression " and " negative pressure " can be held relative to Bernoulli Jacob
Environmental pressure locating for part is defined.In particular, the pressure between substrate and the surface, such as decompression or negative pressure, it is configured to
Suspension for substrate.For example, the difference between the pressure and environmental pressure is enough to compensate the gravity of substrate.
According to the embodiment of the present disclosure, retaining piece can be stacked as at least partly vertically in top each other.
Carrier, such as electrostatic chuck (electrostatic chuck, E-Chuck) can be provided at and swing in module 160.Substrate energy
It is loaded on carrier using the first retaining piece and/or the second retaining piece.Substrate can be loaded with horizontality.It is filled by substrate
After being loaded on carrier, module 160 is swung, the swing module board 164 of especially swing module 160 can be from substantial horizontal orientation
It is moved to substantially perpendicular orientation, such as the movement of the arm 162 by swinging module 160.Fig. 3 A and 3B, which are shown, substantially to hang down
Swing module 160 in straight orientation.
Therefore, the first retaining piece and the second retaining piece can move horizontally between frame structure and swing module 160.Separately
Outside, retaining piece and swing module 160 can be vertically movable relative to each other, to place a substrate in the load swung in module 160
On tool, or from module is swung from carrier removal substrate.Vertical relative movement can by swing module, retaining piece, or both
Movement is to provide.
Swinging module 160 can be configured for loading with substrate carrier disposed thereon to the first load locking cavity
111 and/or second on load locking cavity 112.Swinging module 160 can be from horizontal orientation clockwise or counterclockwise.Therefore,
Carrier can be loaded in each load locking cavity, and/or can be from each load locking cavity removal.For example, it loads
Locking cavity can be used alternately.
Load locking cavity can be evacuated.After evacuating load locking cavity, carrier can be transferred to processing equipment
In one or more vacuum chambers, it is such as described in this.As shown in figs.3 a and 3b, two-lines can be provided.First load locking cavity
111, vacuum chamber 121,123 and 125 can form the first vacuum treatment installation 101.Second load locking cavity 112, vacuum chamber
Room 122,124 and 126 can form the second vacuum treatment installation 102.
Fig. 3 A and 3B are illustratively referred to, according to some implementations that can be described in this embodiment with any other and combine
Mode, it is possible to provide dust free room area 150.For example, holding unit 140 and/or swing module 160 can be provided in dust free room area
In 150.
It should be understood that advantageously from Fig. 3 A and 3B, be such as described in this processing system 200, provide for using two
A tandem unit, such as the first vacuum treatment installation 101 and the second vacuum treatment installation 102, while handling two or more
Substrate, to increase yield.Using being such as described in this pairs of processing equipment while handling, the land occupation of processing system is reduced.Especially
It is for large-area substrates, land occupation can reduce the correlative factor for the cost for holding processing system.
The illustratively flow chart with reference to shown in Fig. 4, narration are used in the method 300 of the equipment of processing substrate for maintaining
Embodiment.In particular, method 300 includes the equipment 100 for providing (square 310) and being used to handle substrate, such as according to any
It is described in the equipment 100 for being used to handle substrate of this embodiment.Equipment 100 includes the first vacuum treatment installation 101 and the
Two vacuum treatment installations 102.First vacuum treatment installation 101 and the second vacuum treatment installation 102 are by shared support construction 103
It is supported.In addition, this method includes to maintain (square 320) first from the airspace 108 provided in the top of support construction 103
Vacuum treatment installation 101.Additionally or alternatively, this method includes empty from the atmosphere provided in the top of support construction 103
Between 108 maintenance (square 330) second vacuum treatment installations 102.
In view of above content, it should be understood that be such as described in this embodiment be advantageously provided for increase yield,
It reduces land occupation and reduces operation, maintenance and manufacturing cost.In particular, this pairs of processing equipment is described in by providing,
It can increase yield and land occupation can be reduced.In addition, be such as described in this support construction by providing, the first vacuum treatment installation and the
The back wall of two vacuum treatment installations can advantageously be strengthened by efficiently and in a manner of section space-efficient.In addition, being such as described in this implementation
Mode is advantageously provided for helping to maintain vacuum flush system, especially has the true of the pairs of processing equipment for being such as described in this
Empty processing system.
Although foregoing teachings design the embodiment of present disclosure, can be in the base region without departing substantially from present disclosure
In the case of, present disclosure other and further embodiment are designed, and scope of the present disclosure the power by being appended
Sharp claim determines.
In particular, this written narration using example with for present disclosure carry out disclosure, include its optimal mode, and
But also those skilled in the art can carry out the theme, comprising manufacturing and using any device or system and executing any
The method being included into.Although foregoing teachings disclose a variety of different particular implementations, do not disagreed mutually in above embodiment
The technical characteristic of back can be bonded to each other.Patentable scope determined by claims, and if claims have it is not different
In the literal language of claims structural detail or if claims include with the literal language of claims without
The equivalent structural elements of substantial difference, then other examples are also intended among the range for being included in claims.
Claims (15)
1. a kind of equipment (100) for handling substrate, comprising:
First vacuum treatment installation (101)；
Second vacuum treatment installation (102)；With
Support construction (103) is configured in first vacuum treatment installation (101) and second vacuum treatment installation (102)
Between airspace (108) in.
2. equipment (100) described in claim 1, wherein the support construction (103), which is connected to described first, is vacuum-treated dress
First wall (104) of (101) is set, and is connected to the second wall (105) of second vacuum treatment installation (102), wherein described
Second wall (105) is towards first wall (104).
3. equipment (100) of any of claims 1 or 2, wherein first vacuum treatment installation (101) is at the first tandem
Device is managed, and wherein second vacuum treatment installation (102) is the second tandem processing unit.
4. equipment described in any one of claims 1 to 3 (100), wherein first vacuum treatment installation (101) is first
Vertical processing arrangement, and wherein second vacuum treatment installation (102) is the second vertical processing arrangement.
5. equipment (100) described in any one of Claims 1-4, wherein the support construction (103) includes base mounting structures
(106), the base mounting structures (106) support the first bottom wall (104B) of first vacuum treatment installation (101), and support
The second bottom wall (105B) of second vacuum treatment installation (102).
6. equipment described in any one of claims 1 to 5 (100), wherein the support construction (103) includes strengthening frame structure
(107), first back wall (104A) strengthened frame structure (107) and be connected to first vacuum treatment installation (101), and even
It is connected to the second back wall (105A) of second vacuum treatment installation (102).
7. equipment described in claim 5 and 6 (100), wherein the reinforcing frame structure (107) is connected to base mounting structures
(106)。
8. equipment described in any one of claims 1 to 7 (100), wherein first vacuum treatment installation (101) and described
The airspace (108) between second vacuum treatment installation (102) provides maintenance area, and the maintenance area is for providing to institute
State the disengaging of the first back side of the first vacuum treatment installation (101) and the second back to second vacuum treatment installation (102)
The disengaging of side.
9. equipment (100) described in any item of the claim 1 to 8, wherein the support construction (103) is connected to described first
The first vacuum chamber (110) of vacuum treatment installation (101), and it is connected to the second of second vacuum treatment installation (102)
Vacuum chamber (120), wherein first vacuum chamber (110) is configured relative to second vacuum chamber (120).
10. equipment (100) as claimed in claim 9, wherein first vacuum chamber (110) and second vacuum chamber
(120) selected from the group being made of the following option: load locking cavity；Processing chamber housing, especially deposition chambers；Transfer chamber
Room；With the vacuum chamber with the vacuum pump for generation technology vacuum.
11. a kind of equipment (100) for handling substrate, comprising:
First vacuum treatment installation (101)；
Second vacuum treatment installation (102)；With
Support construction (103) is configured in first vacuum treatment installation (101) and second vacuum treatment installation (102)
Between airspace (108) in；
Wherein the support construction (103) includes base mounting structures (106), base mounting structures (106) support described first
The first bottom wall (104B) of the first vacuum chamber (110) of vacuum treatment installation (101), and support described second to be vacuum-treated dress
The second bottom wall (105B) of second vacuum chamber (120) of (102) is set,
Wherein the support construction (103) includes strengthening frame structure (107), and the reinforcing frame structure (107) is connected to described the
The first back wall (104A) of one vacuum chamber (110), and it is connected to the second back wall of second vacuum chamber (120)
(105A), and
Wherein first vacuum chamber (110) configures relative to second vacuum chamber (120).
12. a kind of processing system (200) for handling substrate, comprising:
For handling the equipment (100) of substrate described in any one of claims 1 to 11；With
Substrate loading module (180), for loading substrate into the equipment (100) for being used to handle substrate, the substrate
Loading module includes:
Holding unit (140), for holding substrate；With
It swings module (160), for changing substrate orientation between horizontal orientation and vertical orientation.
13. system described in claim 12 (200), wherein the holding unit (140) includes first substrate retaining piece and
Two substrate retaining pieces, wherein the first substrate retaining piece is at least partly provided above second retaining piece.
14. a kind of for maintaining the method for being used in the equipment (100) of processing substrate, the equipment (100) includes at the first vacuum
Device (101) and the second vacuum treatment installation (102) are managed, at first vacuum treatment installation (101) and second vacuum
Reason device (102) is supported by shared support construction (103), the method includes from offer in the support construction (103)
Pedestal frame superstructure airspace (108), maintain first vacuum treatment installation (101) and/or described second true
Empty processing unit (102).
15. method of claim 14, wherein the equipment (100) for handling substrate is in claim 1 to 11
Described in any item equipment.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2017/061728 WO2018210408A1 (en) | 2017-05-16 | 2017-05-16 | Apparatus for processing a substrate, processing system and method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109257933A true CN109257933A (en) | 2019-01-22 |
Family
ID=58709966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780015869.5A Pending CN109257933A (en) | 2017-05-16 | 2017-05-16 | For handling the equipment, processing system and method for substrate |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20190002415A (en) |
| CN (1) | CN109257933A (en) |
| TW (1) | TW201910545A (en) |
| WO (1) | WO2018210408A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI128385B (en) * | 2018-12-27 | 2020-04-15 | Mediatalo Volframi Oy | An apparatus and a method for forming conductive patterns on a surface of a substrate plate by a sputtering process |
| FI130006B (en) * | 2020-12-02 | 2022-12-15 | Volframi Oy Ltd | An apparatus for forming patterns on a surface of a substrate plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5846328A (en) * | 1995-03-30 | 1998-12-08 | Anelva Corporation | In-line film deposition system |
| CN101767719A (en) * | 2008-12-31 | 2010-07-07 | 英属开曼群岛商精曜有限公司 | System for processing substrates, convey system and method and mobile transverse chamber |
| CN102112655A (en) * | 2008-08-01 | 2011-06-29 | 皮考逊公司 | Atomic layer deposition apparatus and loading methods |
| CN104781448A (en) * | 2012-11-15 | 2015-07-15 | 应用材料公司 | Method and system for maintaining an edge exclusion shield |
| CN106165081A (en) * | 2014-04-02 | 2016-11-23 | 应用材料公司 | Base plate processing system, for the vacuum rotating module of base plate processing system and for the method that operates base plate processing system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010000447A1 (en) * | 2010-02-17 | 2011-08-18 | Aixtron Ag, 52134 | Coating device and method for operating a coating device with a screen plate |
-
2017
- 2017-05-16 KR KR1020187013641A patent/KR20190002415A/en not_active Application Discontinuation
- 2017-05-16 WO PCT/EP2017/061728 patent/WO2018210408A1/en active Application Filing
- 2017-05-16 CN CN201780015869.5A patent/CN109257933A/en active Pending
-
2018
- 2018-04-23 TW TW107113653A patent/TW201910545A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5846328A (en) * | 1995-03-30 | 1998-12-08 | Anelva Corporation | In-line film deposition system |
| CN102112655A (en) * | 2008-08-01 | 2011-06-29 | 皮考逊公司 | Atomic layer deposition apparatus and loading methods |
| CN101767719A (en) * | 2008-12-31 | 2010-07-07 | 英属开曼群岛商精曜有限公司 | System for processing substrates, convey system and method and mobile transverse chamber |
| CN104781448A (en) * | 2012-11-15 | 2015-07-15 | 应用材料公司 | Method and system for maintaining an edge exclusion shield |
| CN106165081A (en) * | 2014-04-02 | 2016-11-23 | 应用材料公司 | Base plate processing system, for the vacuum rotating module of base plate processing system and for the method that operates base plate processing system |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190002415A (en) | 2019-01-08 |
| WO2018210408A1 (en) | 2018-11-22 |
| TW201910545A (en) | 2019-03-16 |
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Application publication date: 20190122 |