JP5055776B2 - Deposition equipment - Google Patents

Description

  The present invention relates to a film forming apparatus for forming a film on one surface side of a processing substrate while carrying the entire substrate in-line with the processing substrate mounted on the carrier, and in particular, a loading chamber that repeats air and vacuum and / or The present invention relates to a film forming apparatus capable of preventing dust from being rolled up during exhaust or supply of air in an unloading chamber.

In recent years, progress toward an information society has been remarkable, and the use of display devices has been diversified, and various display devices have been developed and put into practical use.
In particular, liquid crystal display devices have been widely used in place of CRT (Cathode-Ray Tube, CRT).
In a liquid crystal panel for color display for a liquid crystal display device, light from a backlight is displayed through a colored layer of each color, but the light passing through the colored layer of each color is liquid crystal for each pixel. Are controlled on and off as switching elements.
A transparent conductive ITO film (indium oxide doped with tin) has been conventionally used as a material for a control electrode for on-off control using a liquid crystal as a switching element for each pixel.
As a method for forming an ITO film, a method for forming a desired ITO film by sputtering an ITO on a substrate under a predetermined sputtering condition using an ITO sintered body as a target is disclosed in JP-A-6-24826. It is known in Japanese Patent Publication (Patent Document 1), Japanese Patent Application Laid-Open No. 6-247765 (Patent Document 2), and the like.
Japanese Patent Laid-Open No. 6-24826 JP-A-6-247765

Impositional production is carried out from the viewpoint of productivity improvement and cost reduction, but there is a strong demand for enlargement of the transparent glass substrate used for this, and recently, the G6 generation (1800 mm x 1500 mm size) ) Mass production with large glass substrates is becoming a reality.
And, from the viewpoint of productivity, in-line deposition of the ITO film on the processing substrate using such a large glass substrate is performed in-line, as shown in FIG. An inline ITO sputter deposition apparatus has also been proposed.
In the sputtering apparatus shown here, as shown in FIG. 5B, a processing substrate 863 having a large glass substrate as a base substrate is mounted on a carrier 860 and placed in a vertical direction 892 in-line. Then, sputtering is performed while being conveyed, and an ITO film for electrodes is formed on one surface side of the processing substrate 863 by sputtering.
Briefly, the processing substrate 863 is put into the loading chamber 811, passed through the preliminary chamber 812, put into the first sputter chamber 883, sputtered while being transported, and carried into the rotation processing unit 820, where Each carrier is rotated 180 degrees by the rotating unit, the direction is changed, and the carrier is put into the second sputtering chamber 833 and sputtered while being conveyed.
Then, after sputtering, the material is unloaded through the preliminary chamber 832 and the unloading chamber 831.
Here, as shown in FIG. 5B, the processing substrate 863 is placed on a support member called a carrier (also referred to as a substrate holder) 860 having a frame body 861 for holding the processing substrate 863. Then, the carrier 860 is conveyed in a standing state.
The carrier 860 includes a processing substrate holding portion 101 that holds the processing substrate 863 in order by fitting the processing substrate 863 and the back plate 861 into the frame 861, and the processing substrate 863 is arranged along the vertical direction 892. The carrier 860 is fitted into the processing substrate holding part 101 in a state where it stands upright.
Then, as shown in FIG. 5A, the processing substrate 863 is mounted on the carrier 860 together with the processing substrate holding unit 101, is transported in the horizontal direction 891, and stands in the vertical direction 892. Sputtering is performed parallel to 871 and facing.
In FIG. 5A, a dotted arrow indicates the conveyance direction of the carrier 860.
Although not shown, the sputtering method here is designed so that the magnetic field is closed between the outer magnetic pole and the inner magnetic pole on the back side of the target 871 (the side opposite to the processing substrate 863 side). Is of a magnetron sputtering method, so that it exists only in the vicinity of the target 871.
An example of a large-size processing substrate is a color filter-formed substrate in which a colored layer of each color is formed as a color filter (hereinafter also referred to as CF) on one surface side of a large-size transparent glass substrate. An ITO film for electrodes is formed on the CF forming surface side of the substrate.

The carrier 860 shown in FIG. 5B has a groove in which a groove for transmitting a driving force from a driving motor (not shown on the carrier side) (not shown) is engaged with a gear (not shown). A forming portion 868 is provided at the lower portion thereof, and in order to suppress wear by the gears as much as possible, conveyance support rails 866 and 867 having flat portions on both sides in the traveling direction of the groove forming portion 868 of the carrier 860 and below, It is provided to support the load of the carrier, and the flat portions of the carrier support rails 866 and 868 are placed on a rotating body 869 such as a bobbin different from the gear on the main body side.
The carrier 860 is conveyed by receiving the driving force from the driving motor by the engagement of the gears at the groove forming portion 868 while being held by the conveying support rails 866 and 867 provided below the carrier 860.
In the G6 generation, the combined weight of the processing substrate 863 to be sputtered and the carrier 860a is about 100 kg, so wear is inevitably generated. Thus, the fitting between the groove forming portion 200 and the gear is reduced as much as possible. doing.
As a material of the carrier 860, Ti is preferably used from the viewpoint of weight and rigidity.
Sputtering is performed in an Ar gas atmosphere under a pressure of 10 ^{−3 to} 10 ⁻² torr using a plate-shaped ITO having a film composition to be formed as a target.
In this case, it is required to form the film at a low temperature from the viewpoint of heat resistance (degassing from CF) of the colored layer forming CF.
In addition, in such a magnetron sputtering method, for example, a sintered target material having a composition of In ₂ O ₃ , 90 w% + SnO ₂ , 10 w% is used in a low temperature sputtering with a thickness of 8 mm to 15 mm.
For example, as a target, a Cu plate is used as a backing material, indium solder is used as an adhesive layer, and joints are slanted to join a large number of sintered target materials.

In such a sputtering apparatus, as described above, the conveyance support rails 866 and 867 for supporting the load of the carrier and the rotating body 869 come into contact with each other in a state where the load is applied, so that the carrier is roller-conveyed. Wear debris is generated at the contact point.
Further, since the gear 210 and the groove forming portion 200 are fitted to each other and used as a transport driving force, wear debris is generated here.
In particular, in a processing substrate based on a glass substrate of the G6 generation size, the combined weight of the processing substrate 863 to be sputtered and the carrier 860 is about 100 kg.
As much as possible, the fitting between the groove forming portion 200 and the gear 200 is reduced.
As a material of the carrier 860, Ti is preferably used from the viewpoint of weight and rigidity.

As described above, in recent years, progress toward the information society has been remarkable, and the use of display devices has been diversified. In particular, liquid crystal display devices have become widespread, improving productivity and reducing costs. Therefore, imposition production is performed, but there is a strong demand for larger processing based on the glass substrate used for this, and recently, a large transparent glass substrate of G6 generation (1800 mm × 1500 mm size). Mass production at has become a reality.
In such a situation, in the sputtering apparatus as shown in FIG. 5A, the sputtering process is performed while the target 871 and the processing substrate 863 face each other in an upright state. In this case, wear debris is inevitably generated, which is a problem in terms of quality, and in the loading chamber and / or unloading chamber, the dust carried along with the carrier transport is exhausted or supplied. Rolling up, this has become a problem in terms of quality, and these measures have been required.
The present invention corresponds to these, and is a film forming apparatus for forming a film on one surface side of a processing substrate while transferring the whole substrate in-line with the processing substrate mounted on the carrier. Even if this occurs, an object of the present invention is to provide a film forming apparatus capable of reducing the adverse effect on the quality due to the wear residue.
In particular, when processing a large-sized processing substrate of G6 generation or more with a vertical in-line sputtering apparatus that performs sputtering processing while transporting the target and the processing substrate in an upright state, wear debris, etc. It is an object of the present invention to provide a sputtering apparatus that can reduce the adverse effects on the quality due to the dust.

The sputtering apparatus of the present invention is a film forming apparatus for forming a film on one surface side of a processing substrate while carrying the entire substrate in-line while the processing substrate is mounted on a carrier. In addition to the exhaust mechanism and air supply mechanism for loading or unloading, the chamber has a lower portion of the loading chamber and / or an unloading chamber to prevent dust from being rolled up during exhaust or air supply. the bottom of the loading chamber, by disposing the exhaust port, the exhaust port includes a vacuum unit for performing evacuation so as to suppress dust roll up to, when performing vacuuming by the vacuum unit To control the flow of gas (also called airflow) in the chamber in order to effectively prevent dust from rolling up One or more gas flow control members are disposed, and the gas flow control member is provided with a wear debris adsorbing portion that magnetically adsorbs wear debris made of a ferromagnetic material. The attracting portion is characterized in that a magnet is disposed in contact with the attracting material made of a magnetic material, and the attracting material is magnetized .
Further , in the film forming apparatus described above, gas flow control that controls a gas flow so as to surround a dust generation source (a transfer roller unit or the like) and prevent the dust from rolling up from the dust generation source. A member for use is provided.
And also the be any film forming apparatus, the bottom of the loading chamber and or unloading chamber, the upper side of the exhaust port, the wear debris made of a ferromagnetic material that has been carried along with the carrier transfer by magnetic It is characterized by having a wear residue adsorbing portion that adsorbs.
Further, in any one of the above film forming apparatuses, the dust generated from the dust generation source is stored below the dust generation source of the transport system, and the influence is exerted when the chamber is supplied and exhausted. An air pocket portion (another space) that is difficult to receive is provided, and an air pocket exhaust portion that exhausts the air pocket portion is provided separately.
Further, in any one of the above film forming apparatuses, the processing substrate is roller-transferred using the carrier as a drive source and a gear separate from the carrier as a driving source, and the carrier has a roller-transporting rail below the carrier. And a fitting tooth portion to be fitted with the gear is provided in a straight line, and a driving force for conveyance is obtained from the fitting tooth portion, and is roller-conveyed. is there.
Further, in any one of the above film forming apparatuses, the processing substrate is a color filter forming substrate in which a glass substrate is used as a base substrate and a colored layer of each color is formed as a color filter on one surface side of the glass substrate. It is a sputtering apparatus for sputtering an ITO film on the filter forming surface side.

(Function)
The sputtering apparatus according to the present invention is a film forming apparatus for forming a film on one surface side of the processing substrate while carrying the carrier in-line in a state where the processing substrate is mounted on the carrier. Even if wear debris is generated in the transport system, it is possible to provide a film forming apparatus that can reduce the adverse effects on quality due to the wear debris.
In particular, when processing a large size processing substrate of G6 generation or more with a vertical in-line sputtering apparatus that performs sputtering processing while transporting the target and the processing substrate facing each other in a standing state, wear debris is lost. Thus, it is possible to provide a sputtering apparatus that can reduce the adverse effects on quality due to dust and the like.
Specifically, in order to prevent dust from being rolled up in the loading chamber and / or the unloading chamber, separately from the exhaust mechanism and the air supply mechanism for loading or unloading. in the lower part of the lower and or unloading chamber of the loading chamber, by disposing the exhaust port, the exhaust port includes a vacuum unit for performing evacuation so as to suppress dust roll up of the vacuum One or more gas flow control members for controlling the flow of gas in the chamber are disposed in order to effectively suppress the dust from being rolled up when evacuating by the pulling portion, and the gas flow The control member is provided with a wear residue adsorbing portion that magnetically adsorbs the wear residue consisting of a ferromagnetic material, and Worn Kas suction unit is disposed a magnet in contact with the suction timber made of a magnetic material, by those obtained by magnetized to absorbent wearing material, we have achieved this.
That is, the loading, during Anrodin grayed, and an exhaust mechanism for evacuating separately from the air supply mechanism for returning to the atmosphere, the loading chamber and or unloading chamber, the air flow so that dust does not rise winding By providing a vacuuming section that controls the flow and performs vacuuming, it is possible to reduce adverse effects on quality due to dust such as debris in the loading chamber and / or unloading chamber.
One or more gas flow control members for controlling the gas flow in the chamber are disposed in order to effectively suppress the dust from being rolled up when evacuation is performed by the evacuation unit . Due to the form , in the loading chamber and / or the unloading chamber, it is possible to further reduce the adverse effects of quality due to dust such as abrasion debris.
In this embodiment , in particular, a gas flow control member is provided for controlling the gas flow so as to surround the dust generation source (such as a roller section for conveyance) and prevent the dust from rolling up from the dust generation source. According to the second aspect of the invention , the dust from the dust generation source can be effectively prevented from rolling up and scattering of the dust to others.
Further, the adsorbing wear debris made of a ferromagnetic material in the gas flow control member by a magnetic, those provided with a wear debris suction unit, and the wear debris suction unit is made of a magnetic material adsorbed By arranging a magnet in contact with the material and making the adsorbing material magnetized, it is possible to more effectively prevent dust such as wear debris made of ferromagnetic material from rolling up. Yes.
In addition, when performing vacuuming by the vacuuming unit, if a rapid vacuuming is performed, a gas flow (also referred to as an air flow) is generated, and the dust rises with it, and the dust adheres to the processing substrate, and the quality In this case, the gas flow control member controls the evacuation airflow so that the airflow is generated but the dust does not rise in the entire chamber. For example, only the portion partitioned by the gas flow control member causes dust to rise and prevents scattering to the entire chamber.
Also provided with a wear debris adsorbing portion for magnetically adsorbing debris made of a ferromagnetic material carried along with the carrier transport, below the loading chamber and / or unloading chamber and above the exhaust port. in, and the wear debris suction unit is disposed a magnet in contact with the suction timber made of a magnetic material, is obtained by magnetized to absorbent wearing material, be in the form of the invention of claim 3 Thus, dust such as wear debris made of a ferromagnetic material can be reliably prevented from rolling up on the lower side of the chamber.
Adsorbed by magnetic, such as described above, due to the provision of the wear debris adsorption unit, where in wear debris generated or ferromagnetic material has been carried along with the transport of the carrier, the chamber in the loading chamber or unloading chamber When the pressure changes, the wear debris that rolls up and scatters is adsorbed and held, transported using the carrier again, and film is formed by the wear debris of the ferromagnetic material. It can prevent adverse effects on quality (occurrence of pinholes). The shape of the adsorbing material can take various shapes.

In addition, an air pocket part (separate space) where dust generated from the dust generation source is stored under the transport system dust generation source and is not easily affected by air supply and exhaust of the chamber. By providing the form of the invention according to claim 4 , it is possible to prevent the dust from being dispersed from the dust generation source. In particular, in the form of the invention of claim 4 , the air pocket portion is exhausted. By adopting the form of the invention of claim 5 in which a separate air pocket exhaust part is provided, it is possible to more effectively prevent the dust from being dispersed from the dust generation source.

In addition, a configuration in which such a wear debris adsorbing portion is further provided in the vicinity of a wear debris generation location in a transport system or the like so as to adsorb the wear debris generated at the wear debris generation location.
Furthermore, an adsorption material is arranged and partitioned so as to shield the place where wear debris is generated. The partition portion is locally evacuated, the partition portion is set to a low pressure from the outside, and the wear debris effectively flows out of the partition portion. The form which can prevent is also mentioned.
These can easily adsorb wear debris simply by placing a magnet in contact with the adsorbing material.
In this case, it is particularly effective when the wear residue generating source, which is the place where the wear residue causing dust is generated, is made of a magnet material.

Specifically, the processing substrate is roller-transferred using the carrier as a drive source and a gear separate from the carrier as a drive source, and the carrier is fitted with a roller-transfer rail and the gear below the carrier. The form of the invention of Claim 6 which is provided with the fitting tooth part linearly, obtains the driving force for conveyance from this fitting tooth part, and is roller-conveyed is mentioned.
More specifically, the processing substrate is a color filter forming substrate in which a glass substrate is used as a base substrate and a colored layer of each color is formed as a color filter on one surface side of the glass substrate, and an ITO film is formed on the color filter forming surface side. The invention of claim 7 , which is a sputtering apparatus for forming a film by sputtering, is effective in terms of mass productivity and quality.

As described above, the present invention is a film forming apparatus that forms a film on one surface side of a processing substrate while carrying the entire substrate in-line with the processing substrate mounted on the carrier. In the chamber, adverse effects on quality due to dust such as abrasion debris can be reduced.
Furthermore, even when wear debris made of a ferromagnetic material is generated in the transport system, it is possible to provide a film forming apparatus that can eliminate the adverse effect on quality due to the wear debris.
In particular, in a vertical in-line sputtering apparatus that performs sputtering processing while conveying the target and the processing substrate in an upright state, a large glass substrate of G6 generation or more is used as a base substrate, When sputter processing is performed using a color filter-formed substrate in which a colored layer of each color is formed as a color filter on one side of a glass substrate as a processing substrate, the adverse effect on quality due to wear debris made of a ferromagnetic material in the transport system is eliminated. It is possible to provide a sputtering apparatus that can perform the above process.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1A is a top view illustrating a state in an unloading chamber of an example of an embodiment of the sputtering apparatus of the present invention, and FIG. 1B is a perspective view from the A0 side of FIG. 1A. 2A is a schematic cross-sectional view showing a carrier and a rotating roll for conveyance, and FIG. 2B is a diagram illustrating the carrier and conveyance drive as seen from the B1 direction of FIG. 2A. 3 (a) shows the wear residue adsorbing portion at the gear fitting wear location, and FIG. 3 (b) is a view seen from the C1 side of FIG. 3 (a). 4 (a) shows the wear residue adsorbing portion at the wear portion of the roller conveyance, and FIG. 4 (b) is a view seen from the D1 side of FIG. 4 (a).
FIG. 1 is simplified and shows only the main part.
In addition to the carrier, FIG. 2 shows a rotating roller and a gear.
1-4, 1 is an unloading chamber, 1a is a wall part, 1b is a bottom part, 1c is a ceiling part, 2 is an exhaust on-off valve (for main exhaust), 2a is a vacuuming pipe, 3 is a supply pipe Open / close valve for gas, 3a is a supply pipe, 4 is a vacuuming part, 4a and 4b are open / close valves for vacuuming (also called exhaust ports), 4c is a vacuuming pipe, 5 is an adsorbing part, 5a is magnetic Body material, 5b is a magnet, 6 is a support member, 10 is a wear residue adsorbing part, 11 is an adsorption material, 12 is a magnet, 15 is an abrasion residue adsorbing part, 20 is a target, 21 is a shielding plate, 22 is a backing plate, 23 Is a holding chamber, 30 is a loading chamber, 31 is a chamber chamber, 32 is a wall portion, 100 is a carrier, 101 is a processing substrate holding portion, 110 is a frame body, 120 is a back plate, 130 is a processing substrate, 150 is a supporting portion, 161 and 162 are positioned Rotating rolls, 161a and 162a are shafts, 171 and 172 are conveying support rails (also simply referred to as support portions), 190 is a rotating roll (also referred to as a rotating body), 190a is a shaft, 200 is a groove forming portion, and 210 is a gear. .

First, an example of an embodiment of a sputtering apparatus of the present invention will be described with reference to the drawings.
The sputtering apparatus of this example is in-line with a processing substrate 130 having a large transparent glass substrate of G6 generation size (1800 mm × 1500 mm size) or larger for a display panel as a base substrate mounted on a carrier. 5 is a magnetron sputtering type sputtering apparatus that performs sputtering processing while transporting and sputter-deposits an ITO film for an electrode on one side of the processing substrate, and has the same arrangement as the arrangement shown in FIG. It is.
In this example, during the sputtering process, the processing substrate 130 is mounted on the carrier 100 shown in FIG. 2A, the surface of the processing substrate 130 on which the film is formed and the target 10 face each other in parallel, and are transported. However, the sputtering process is performed.
In the film forming apparatus of this example, as an exhaust mechanism for normal loading and unloading, an exhaust on-off valve 2 for main exhaust, a vacuuming pipe 2a, and an air supply mechanism for normal loading and unloading As shown, the air supply on-off valve 3 and the air supply pipe 3a are arranged on the wall 1a on the upper side of the chamber and on the side opposite to the film formation surface of the processing substrate 130. Dust is rolled up in the loading chamber 1 (corresponding to 831 in FIG. 5) and the loading chamber (corresponding to 811 in FIG. 5) during unloading in which the vacuum is brought to the atmosphere or during loading with vacuuming. In order to prevent this, the unloading chamber 1 (see FIG. 831) and a loading chamber (corresponding to 811 in FIG. 5), an exhaust port (corresponding to the evacuation opening / closing valves 4a and 4b) is arranged on the side opposite to the film forming surface of the processing substrate 130. In addition, a vacuum evacuation unit 4 is provided for performing vacuum evacuation by controlling the flow of the air flow so as to suppress the dust from being wound up from the exhaust port.
As described above, by providing the exhaust mechanism, the air supply mechanism, and the evacuation unit 4, the air flow on the film formation surface side of the processing substrate 130 is reduced compared to the case where the evacuation unit 4 is not provided, and the film formation surface side is reduced. Reduces the negative effects of dust quality.

The film forming apparatus of this example includes a lower part of the loading chamber (corresponding to 811 in FIG. 5) and / or the unloading chamber 1 (corresponding to 831 in FIG. 5), and vacuum opening / closing valves (exhaust ports) 4a and 4b. On the upper side of this, the wear debris of the ferromagnetic material that has been carried along with the carrier transport, which is dropped by the air flow caused by the change in vacuum pressure during exhaust or supply during loading or unloading A wear debris adsorbing portion that adsorbs debris by magnetism is provided.
In this case, the wear residue adsorbing portion is provided with a magnet in contact with the adsorbing material made of a magnetic material and magnetizing the adsorbing material.
Further, a wear residue adsorbing portion that magnetically adsorbs wear residue made of a ferromagnetic material generated in the transport system is provided in the vicinity of the occurrence location.
In the sputtering apparatus of this example, as shown in FIG. 2A, the carrier 100 sequentially fits the processing substrate 130 and the back plate 120 into the frame 110 and holds the processing substrate 130. It has.
Here, a color filter forming substrate in which a colored layer of each color is formed as a color filter on one surface side of a G6 generation size transparent glass substrate is used as the processing substrate 130, and an ITO film is formed by sputtering on the color filter forming surface side. To do.

A mechanism for preventing the dust from rolling up, which is provided in the loading chamber (corresponding to 811 in FIG. 5) and / or the unloading chamber 1 (corresponding to 831 in FIG. 5), which is a feature of this example, will be described.
The mechanism for preventing the dust from being rolled up provided in the loading chamber and / or the unloading chamber is basically the same, and only the unloading chamber 1 will be described here.
In this example, as shown in FIGS. 1 (a) and 1 (b), evacuation opening / closing valves 4a and 4b are arranged at the bottom 1b of the unloading chamber 1 as exhaust ports, and the vacuum The on / off valves 4a and 4b are connected by a vacuum piping 4c. With the on / off valves 4a and 4b being opened, a vacuum pump such as a rotary pump or a mechanical booster pump is used to To pull.
In this example, the main exhaust that evacuates the inside of the unloading chamber 1 is a rotary pump connected via a vacuuming pipe 2a with the exhaust on-off valve 2 open, or a mechanical booster as necessary. A vacuum pump such as a pump is used to evacuate the atmosphere.
Of course, it is performed with the air supply on-off valve 3 closed.
The air supply for returning the unloading chamber 1 to the atmosphere is performed by unloading the purified air or nitrogen gas connected through the air supply pipe 3a with the air supply opening / closing valve 3 opened. This is done by introducing it into the chamber 1.
Of course, in this case, the evacuation opening / closing valves 4a and 4b are closed.
In the case of this example, at the time of evacuation from the above atmosphere, at the time of returning to the atmosphere, the evacuation opening / closing valves 4a and 4b are opened, and this is used as an exhaust port to perform evacuation. This suppresses the hoisting.
When evacuating from the atmosphere, abrupt evacuation is prevented, and when returning to the atmosphere, the purified atmosphere or nitrogen gas or the like introduced from the air supply on-off valve 3 is used. This prevents the sudden flow caused by.

Further, in this example, an adsorption portion for adsorbing the wear debris made of a ferromagnetic material is provided, and the wear debris made of a ferromagnetic material that has reached here once is evacuated from the atmosphere or to the atmosphere. It is structured so that it can be prevented from rolling up when returning.
As shown in FIG. 1 (b), the attracting portion 5 is a plate-like magnetic material 5b that is simply mounted on a magnet 5a, but dust such as wear debris made of a ferromagnetic material is magnetic material. When adhering to 5b, it is magnetized and magnetically adsorbed on the magnetic material 5b, and can be prevented from winding up when evacuating from the atmosphere or returning to the atmosphere.

In this example, as shown in FIG. 3, in the transport system, wear debris adsorption that magnetically adsorbs wear debris made of a ferromagnetic material at a gear fitting wear location where the gear 210 and the groove forming portion 200 are fitted together. Part 10 is provided.
Here, the adsorbing material 11 made of a magnetic material is disposed so as to cover the side surface and the lower portion of the wear debris generation site, and the magnet 12 is disposed on the lower inner surface of the adsorbing material to form the wear debris adsorbing portion 10.
As described above, by arranging the magnet 12 in contact with the attracting material 11 made of a magnetic material, the attracting material 11 made of a magnetic material is magnetized, and wear debris made of a ferromagnetic material is attracted magnetically. .
Further, in this example, in the transport system, the rotating body 190 contacts the transport rails 171 and 172 in order to transport the transport rails 171 and 172 below the carrier 100 while supporting the load while rotating. As shown in FIG. 4, a first wear debris adsorbing portion 15 that magnetically adsorbs wear debris made of a ferromagnetic material is provided so as to cover the side surface and the lower portion of the rotating body 190 as shown in FIG. Yes.
Also in this case, the magnet is disposed in contact with the adsorbing material made of the magnetic material, so that the adsorbing material 11 made of the magnetic material is magnetized, and wear debris made of the ferromagnetic material is adsorbed magnetically.

Here, as the target 10, for example, a sintered target material having a composition of In ₂ O ₃ , 90 w% + SnO ₂ , 10 w% and having a thickness of 8 mm to 15 mm is used, but the size is increased. For this purpose, a Cu plate is used as a backing material, indium solder is used as an adhesive layer, and a plurality of sintered target materials are connected to form a square shape.
Sputtering is performed in an Ar gas atmosphere under a pressure of 10 ⁻⁵ torr to 10 ⁻² torr using a plate-shaped ITO having a film composition to be formed as a target.
In this case, the film is formed at a low temperature from the viewpoint of the heat resistance (degassing from CF) of the colored layer forming the CF.

The sputtering apparatus of this example performs the sputtering process while being transported in the same manner as the sputtering apparatus shown in FIG. 5. The flow from the placement of each chamber and the loading and unloading of the processing substrate is basically shown in FIG. This is the same as the sputtering apparatus shown in FIG.
The carrier 100 in this example is the same as the carrier 860 shown in FIG.
The carrier 100 is basically transported in the same manner as the sputtering apparatus shown in FIG. 5, and as shown in FIG. 2, a groove is formed by cutting a groove that transmits the driving force from the driving motor by meshing with the gear 210. The portion 200 is provided at the lower portion of the carrier 100, and further, in order to suppress wear due to the gear 210 as much as possible, a conveyance support rail 171 having a flat portion on both sides and below the groove forming portion 200 of the carrier 100, 172 is provided to support the load of the carrier so that the flat portions of the carrier-side transport support rails 171 and 172 ride on a rotating body 190 such as a bobbin different from the gear 210 on the main body side. It has become.
In this example, a plurality of such rotating bodies 190 and gears 210 are arranged along the conveyance path for conveyance.

In the sputtering apparatus of this example, simply, the processing substrate 130 (corresponding to 863 in FIG. 5) is put into a loading chamber (corresponding to 811 in FIG. 5), and a spare chamber (corresponding to 812 in FIG. 6) is provided. Then, it is put into the first sputter chamber (corresponding to 813 in FIG. 5), sputtered while being transported, and carried into the rotation processing part (corresponding to 820 in FIG. 5). The direction is changed, the direction is changed, and the second sputtering chamber (corresponding to 833 in FIG. 5) is put and sputtered while being conveyed.
Then, after sputtering, the material is unloaded through a preliminary chamber (corresponding to 832 in FIG. 5) and an unloading chamber 1 (corresponding to 831 in FIG. 5).
In addition, there is a mechanical partition at the boundary of each chamber, and the opening of each partition is performed with the same degree of vacuum in the chambers on both sides.
Moreover, about the material of frame 110 other than the process board | substrate holding | maintenance part 101, rigidity, big, strong, and a light thing are preferable, and Ti and stainless steel are mentioned.

The sputtering apparatus of this example is one example, and the present invention is not limited to this.
An embodiment in which the structure for preventing the dust dust such as abrasion debris of the unloading chamber 1 of this example shown in FIG. 1 from being applied to another type of magnetron type sputtering apparatus is also included.
Moreover, the form which applies the structure of the wear residue adsorption | suction part 10 of this example shown in FIG. 3 and the abrasion residue adsorption | suction part 15 shown in FIG. 4 to the magnetron type | system | group sputtering apparatus of another form is also mentioned.
Moreover, the form which sputter | spatters in the state which inclined the process board | substrate 130 and the target 10 from the perpendicular direction, or was made into a horizontal state and mutually opposed in parallel is also mentioned.
Of course, it is good also as a form which provided the structure arrangement | positioning of each part shown in FIG. 5 linearly.
Further, instead of the structure of the wear residue adsorbing portion 10 shown in FIG. 3 and the wear residue adsorbing portion 15 shown in FIG. 4 in this example, a structure in which the adsorbing material 11 is arranged so as to cover the upper side of the wear residue generation location is also provided. Also mentioned.

In addition, in order to effectively suppress the dust from being rolled up when evacuation is performed by the evacuation unit 4, one or more gas flow control members for controlling the gas flow in the chamber may be provided. Can be mentioned.
Thereby, the gas flow (airflow) in the chamber can be controlled, and the adverse effect on the film formation surface of the processing substrate 130 can be further reduced.
In particular, when a gas flow control member is provided to control the gas flow so as to surround the dust generation source (conveyance roller, etc.) and prevent the dust from rolling up from the dust generation source. Is more effective.
The gas flow control member is provided with a wear debris adsorbing portion that magnetically adsorbs wear debris made of a ferromagnetic material, and the wear debris adsorbing portion has a magnet in contact with the adsorbing material made of a magnetic material. In the case where the adsorbing material is magnetized, it is even more preferable in terms of quality.
In addition, an air pocket part (separate space) where dust generated from the dust generation source is stored under the transport system dust generation source and is not easily affected by air supply and exhaust of the chamber. The form which is provided is also mentioned.
In this method, the air pocket portion side is evacuated by controlling so that the airflow always flows to the air pocket portion side.

Further, in addition to the loading chamber and the unloading chamber, a configuration is also possible in which a partition portion is configured by partitioning the adsorption material so as to shield a place where wear residue is generated, and the partition portion is locally evacuated.
In this case, the partition portion can be set to a lower pressure than the outside, and wear debris can be effectively prevented from flowing out of the partition portion.
Moreover, the form by which the abrasion residue generation source of the abrasion residue generation | occurrence | production site | part is created with the magnet material is also mentioned.
In this case, since the abrasion debris is a magnet, it is possible to reduce the probability of adhering to the glass substrate on which the film is formed by being attracted to the chamber of the film forming apparatus and the deposition preventing plate at the time of film forming.

FIG. 1A is a top view illustrating a state in an unloading chamber of an example of an embodiment of the sputtering apparatus of the present invention, and FIG. 1B is a perspective view from the A0 side of FIG. 1A. FIG. FIG. 2A is a schematic cross-sectional view showing a carrier and a rotating roll for conveyance, and FIG. 2B is a diagram showing a carrier and a gear for conveying driving as seen from the B1 direction of FIG. is there. FIG. 3A shows the wear residue adsorbing portion at the gear fitting wear location, and FIG. 3B is a view seen from the C1 side of FIG. 3A. FIG. 4A shows the wear residue adsorbing portion at the wear portion of the roller conveyance, and FIG. 4B is a view seen from the D1 side of FIG. 4A. FIG. 5A is a schematic configuration layout diagram of an in-line type ITO sputter film forming apparatus, and FIG. 5B is a view showing a carrier used in the ITO sputter film forming apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Unloading chamber 1a Wall part 1b Bottom part 1c Ceiling part 2 Exhaust on-off valve 2a (Vacuum evacuation pipe 3) Air supply on-off valve 3a Air supply on / off valve 3a Air supply pipe 4 Vacuum evacuation parts 4a, 4b On-off valve (also called exhaust port)
4c Piping for vacuum 5 Adsorbing part 5a Magnetic material 5b Magnet 6 Support member 10 Wear debris adsorbing part 11 Adsorbing material 12 Magnet 15 Wear debris adsorbing part 20 Target 21 Shielding plate 22 Backing plate 23 Holding part 30 Loading chamber 31 Chamber chamber 32 Wall portion 100 Carrier 101 Processing substrate holding portion 110 Frame body 120 Back plate 130 Processing substrate 150 Support portions 161 and 162 Positioning rotary rolls 161a and 162a Shafts 171 and 172 Conveyance support rail (also simply referred to as a support portion)
190 Rotating roll (also called rotating body)
190a Shaft 200 Groove forming portion 210 Gear 10 Wear debris adsorbing portion 11 Adsorption material 12 Magnet 15 Wear debris adsorbing portion 20 Target 21 Shielding plate 22 Backing plate 23 Holding portion 30 Loading chamber 31 Chamber chamber 32 Wall portion 100 Carrier 101 Processing substrate holding portion DESCRIPTION OF SYMBOLS 110 Frame body 120 Back plate 130 Process substrate 150 Support part 161, 162 Positioning rotation roll 161a, 162a Axes 171, 172 Conveyance support rail (also simply referred to as support part)
190 Rotating roll (also called rotating body)
190a Shaft 200 Groove forming part 210 Gear 811 Loading chamber 812 Preliminary chamber 813 Sputtering chamber 820 Rotating processing part 821 Rotating part 831 Unloading chamber 832 Preliminary chamber 833 Sputtering chamber 841 to 843 Chamber partition 841a to 843a Chamber partition 860, 860a Carrier 860A Substrate Holding portion 861 Frame body 862 Back plate (also referred to as pressing plate)
863 Processing substrate 864 Support unit 865 Positioning rotation rollers 865a and 865b Shafts 866 and 867 Support unit (support unit for conveyance)
868 Groove forming portion 869 Rotating roller (also referred to as rotating portion)
869a shaft 871 target 891 horizontal direction 892 vertical direction

Claims (7)

A film forming apparatus for forming a film on one surface side of a processing substrate while carrying the whole substrate in-line with the processing substrate mounted on the carrier, and loading the loading substrate and / or the unloading chamber for loading In addition to the exhaust mechanism and the air supply mechanism for unloading, in order to prevent dust from being rolled up during exhaust or air supply, an exhaust is provided at the lower part of the loading chamber and / or the lower part of the unloading chamber. It is equipped with a vacuum evacuation unit that evacuates so that dust is prevented from rolling up from the exhaust port, and when the vacuum evacuation is performed by the vacuum evacuation unit , In order to suppress effectively, one or more gas flow control members for controlling the gas flow in the chamber are disposed, The gas flow control member is provided with a wear debris adsorbing portion that magnetically adsorbs wear debris made of a ferromagnetic material, and the wear debris adsorbing portion is in contact with an adsorbing material made of a magnetic material. A film forming apparatus , wherein a magnet is provided and the adsorbing material is magnetized . The film forming apparatus according to claim 1 , wherein the gas controls a gas flow so as to surround a dust generation source (a transfer roller unit or the like) and prevent the dust from rolling up from the dust generation source. A film forming apparatus comprising a flow control member. 3. The film forming apparatus according to claim 1 , wherein the ferromagnetic material is carried along with carrier transport to a lower portion of the loading chamber and / or an unloading chamber and to the upper side of the exhaust port. the composed wear debris adsorbed by the magnetic film forming apparatus characterized in that it comprises a wear debris adsorption unit. 4. The film forming apparatus according to claim 1 , wherein dust generated from the dust generation source is stored under the dust generation source of the transport system, and air supply and exhaust of the chamber are performed. The film forming apparatus is provided with an air pocket portion (separate space) that is not easily affected by this. 5. The film forming apparatus according to claim 4 , further comprising an air pocket exhaust part for exhausting the air pocket part. The film forming apparatus according to any one of claims 1 to 5, wherein the substrate is roller-rolled by using a processing substrate as a carrier and a gear separate from the carrier as a driving source. A roller conveying rail and a fitting tooth portion that engages with the gear are provided in a straight line at the bottom, and a driving force for conveyance is obtained from the fitting tooth portion, and the roller is conveyed. A film forming apparatus. 7. The film forming apparatus according to claim 1 , wherein the processing substrate has a glass substrate as a base substrate, and a colored layer of each color is formed as a color filter on one surface side of the glass substrate. A film forming apparatus, comprising: a filter forming substrate, and a sputtering apparatus for forming an ITO film on the color filter forming surface side by sputtering.

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