TW201246434A - Transport mechanism of object to be processed - Google Patents

Transport mechanism of object to be processed Download PDF

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Publication number
TW201246434A
TW201246434A TW100139624A TW100139624A TW201246434A TW 201246434 A TW201246434 A TW 201246434A TW 100139624 A TW100139624 A TW 100139624A TW 100139624 A TW100139624 A TW 100139624A TW 201246434 A TW201246434 A TW 201246434A
Authority
TW
Taiwan
Prior art keywords
roller
substrate
processed
vacuum
conveying
Prior art date
Application number
TW100139624A
Other languages
Chinese (zh)
Other versions
TWI503916B (en
Inventor
Tetsuhiro Ohno
Shigemitsu Sato
Hiroki Oozora
Yoshikatsu Satou
Ryuuji MATSUOKA
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW201246434A publication Critical patent/TW201246434A/en
Application granted granted Critical
Publication of TWI503916B publication Critical patent/TWI503916B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)

Abstract

A transport mechanism of an object to be processed includes a transport member which carries the object to be processed and have a cylindroid slide shaft at a lower portion thereof, and a supporting member which connects with the slide shaft and includes a plurality of roller that has an U shaped groove portion which guides the transport member, wherein at least a contact portion of one among the slide shaft and the roller consist of a bulk body which includes silicon, aluminum, oxygen, and nitrogen, and at least a contact portion of the other one among the slide shaft and the roller consist of stainless steel.

Description

201246434 六、發明說明： 【發明所屬之技術領域】 本發明係關於在真空處理裝置中，搬送被處理體之搬送 機構。 • 本申明書主張基於2011年4月15曰申請之曰本專利申請 . 案201卜091409號之優先權，並將其内容引用於此. 【先前技術】 例如，用於電漿顯示器或液晶顯示器之大型玻璃基板， 需要在真二下升至所期望之溫度之加熱步驟；及以減 鍍、CVD(化學汽相沉積）、或蝕刻等之加工裝置成膜複數 層之各種成膜步驟。 自先前起，已將各種之成膜裝置提供實際使用。在將基 板於水平狀態下成膜之成膜裝置中，若基板大型化，則伴 隨於此會產生裝置亦大型化之問題。因此，近年，研發 有使基板大致直立來進行成膜等之縱型方式之成膜裝置。 圖17係顯示先前之成膜裝置之基本構成之圖。 先前之成膜裝置1〇〇係具備：基板裝卸室12〇 ;連結於t 直線上之第1至第3真空處理室2〇〇、22〇、240 ;及在大氣 側與真空處理室2〇〇、220、240間搬送基板支架之L/UL室 (Load/Unload:裝載/卸載）14〇。 此外，於L/UL室140安裝有真空排氣裝置3〇〇。於加熱室 安裝有加熱裝置及真空排氣裝置3〇〇。於各真空處理室 200、220、240,分別安裝有濺鍍裝置等之成膜裝置21〇、 230、250、及真空排氣裝置3〇〇。 159840.doc 201246434 又，於L/UL室140内及各真空處理室2〇〇、22〇、24〇内， 设置有.第1搬送路徑16〇，其係成為將基板支架從^^^室 140搬送至各真空處理室2〇〇、22〇、24〇之去路之第i搬送 路徑160，及成為從各真空處理室2〇〇、22〇、24〇經過加熱 至，搬送至L/UL室140之回路之第2搬送路徑18〇。 再者’成膜裝置1〇〇之最後部之第3真空處理室24〇，係 具備將基板支架從第丨搬送路徑（去路）16〇至第2搬送路徑 (回路）180 ’相對於2個搬送路徑16〇、18〇於橫向移動移載 之移載機構（未圖示該移載機構具有暫時舉起第1搬送路 徑（去路）160上之基板支架，並移載至第2搬送路徑（回 路）180之機構。 第1及第2搬送路徑160、18〇係包含一對軌道，基板支架 係藉由設置於其底部之複數對車輪，在該軌道上移動。 又’於基板支架之下表面設置有齒條，而於基板裝卸室 120、第1至第3真空處理室2〇〇、220、240，係分別設置有 以馬達之迴轉力迴轉之複數個小齒輪。藉由使小齒輪與齒 條唾合’來將馬達之驅動力傳達至基板支架，從而搬送基 板支架。 說明如此之先前之成膜裝置1()0之基本動作。 若在基板裝卸室12〇，將基板載置於基板支架，則該基 板支架在被搬送至L/UL室140，且將該L/UL室140真空排 氣’使其高真空化後，被搬送至準備於真空處理室200 内、成為去路之第1搬送路徑160。 一面在第1搬送路徑（去路）160搬送基板支架（基板載 159840.doc 201246434 體）’ 一面在真空處理室200、220、240中，對所載置之基 板施予加熱及成膜等真空處理。 在真空處理室240真空處理基板後，藉由未圖示之移載 機構將基板支架移載至成為回路之第2搬送路徑180,且在 真空處理室200、220、240中，分別進行成膜等真空處 理。基板支架在載置有經真空處理之基板之狀態下，經過 L/UL室140 ’在基板裝卸室12〇卸載基板。 然而，在如上所述之先前之齒條及小齒輪形式之搬送機 構中，因齒條與小齒輪之摩擦，產生因齒輪之缺損或磨耗 所造成之微粒（粉塵），而成為良率之降低、及裝置之壽命 縮短之主要原因。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2005-340425號公報 【發明内容】 [發明所欲解決之問題] 本發明係鑑於如此之先前之實際情況而研發者，其目的 在於提供一種被處理體之搬送機構’其係能夠抑制磨耗所 造成之微粒之產生，提高良率，並謀求裝置之長壽命化。 [解決問題之技術手段] 本發明之第1態樣之被處理體之搬送機構係具備：於下 部具備圓柱狀之滑動轴，且搬送被處理體之搬送構件；及 包含複數個和前述滑動軸接觸’且具備誘導前述搬送構件 之ϋ字狀之溝部之輥的支撐構件者；且亦可前述滑動軸及 159840.doc 201246434 *· > 前述輥中之一方之至少接觸部包含含有矽、鋁、氧、及氮 之主體，前述滑動軸及前述輥中之另一方之至少接觸部包 含不鐵鋼。 本發明之第2態樣之被處理體之搬送機構，在第丨態樣 中，前述主體亦可進一步包含釔、鈣、鎂、鋰、鈉之中至 少一種。 本發明之第3態樣之被處理體之搬送機構，在第丨或第2 態樣中，前述支撐構件之U字狀之溝部，其曲率半徑尺亦 可在15〜40 mm之範圍内。 本發明之第4態樣之被處理體之搬送機構，在第丨至第3 態樣之任一態樣中，藉由前述支撐構件，使前述搬送構件 移動之搬送速度亦可在1〜Sooomm/sec之範圍内。 本發明之第5被處理體之搬送機構，在第丨至第4態樣之 任一態樣中，藉由前述支撐構件，使前述搬送構件移動之 搬送加速度亦可為·加速時12〇〇 mm/sec2以下；減速時_ 650 mm/sec2以下。 本發明之第6態樣之成膜裝置，在第丨或第2態樣中.，前 述搬送構件亦可縱型搬送被處理體。 [發明之效果] 本發明之態樣之搬送機構可不依存於減壓下或大氣壓下 之使用環境，即可抑制磨耗引起之微粒之產生。 根據本發明之態樣之被處理體之搬送機構，可抑制磨耗 所造成之微粒之產生。再者，可提供一種能提高良率且 進一步謀求裝置之長壽命化之被處理體之搬送機構。 159840.doc 201246434 【實施方式】 以下，說明本發明之實施形態之被處理體之搬送機構。 圖1係示意地顯示具備本發明之實施形態之被處理體之 搬送機構的成膜裝置之一構成例。 該成膜裝置1係具備：2個L/UL室（Load/Unload:裝載/卸 載）1〇Α、10B，依序配置之支架儲藏室6〇、加熱室2〇 '第i 成膜室30、及第2成膜室40。又，於L/UL室10A、10B之前 面配置有基板裝卸室50。 各至之間係經由閥門（省略圖式）連通。又，於該等L/UL 室10A、10B、前述加熱室20、及第i成膜室3〇，分別獨立 設置有用於將該等之内部分別真空排氣之真空排氣裝置 12、22、32 ° 基板裝卸室50將從外部搬運來之基板2(被處理體）安裝 於支架70。支架70使基板2大致直立且固定保持，其後， 藉由迴轉機構（省略圖式），轉換方向至L/UL室i〇A、10B之 方向’平行地搬入至L/UL室10A、10Β» 又’如後所述，在基板裝卸室50中，由於從l/UL室 10A、10B搬送來載置有經真空處理之基板2之支架7〇，故 將該基板2從支架70卸載。將基板2卸載後之支架70利用於 下一個基板2之搬送。 L/UL室10 A、10B ’係在開放大氣壓的狀態下，進行基 板裝卸室50與支架70之裝載與卸載。 於L/UL室10A、10B ’分別設置有用於將其内部真空排 氣之真空排氣裝置12A、12B。 159840.doc 201246434 ㈣般而言，在隱㈣A、刪中，除了支架Μ之搬入 搬出以外，亦進行真空排氣與大氣壓開放。 在L/UL室10A、刚之前述作業時間，較各真空處理室 (加熱室20及成膜室3G、增之真空處理（加熱、成膜）所 需之加工時間大幅度地長之情形，L/UL室1()A、㈣為單 數時，支架70往真空處理室之裝載較費工夫，且在各真空 處理至中會產生無法進行真空處理之空白時間從而產生 生產效率降低之問題。 因此，在該成膜裝置中，言免置有複數個（圖示中為2 個）L/ULhOA、10B ;輸送至加熱室2〇、成膜室3〇、之 支架70 ;及暫時儲藏輸送至口仍^室i〇a、i〇b之支架之 支架健藏室60。#此’可謀求生產效率之提高。 於加熱至20没置加熱裝置23，升溫至適合基板2成膜之 溫度。 於加熱至2G’設置有用於將其内部真空排氣之真空排氣 裝置22。 基板2在成膜室3〇、40中，藉由成膜裝置33、43，進行 成膜處理。 作為成膜裝置33、43，並無特別限定，例如舉出濺鍍用 之陰極，或CVD用之平行平板型電極。 在如此之成膜裝置1中，對於被處理體即基板2，一面藉 由搬送構件搬送，一面施予加熱或成膜等 之處理。 搬送基板2之搬送構件，係具備保持基板2之支架7〇(載 體）、及搬送保持有基板2之支架7〇之線路8(^又，搬送構 159840.doc 201246434 件係縱型搬送基板2。 此處，將基板2縱置之宗旨，主要係由於隨著大型之液 晶顯示器及電漿顯示器之普及，基板本身亦大型化、薄型 化’因為橫置之情形，成膜裝置本身之平面積會隨之大型 化，故採用縱型從而謀求省空間化。又，因為橫置之情 形，會產生因基板2之自重所造成之彎曲，從而難以保持 平坦性’亦難以均一地成膜。 人且，在該成膜裝置1中，前述第！成膜室3〇係具有分別包 含去路與回路之線路80，且該線路8〇係全部貫通前述l/ul 室l〇A、10B、前述加熱室2〇、及成膜室3〇、4〇而配置。 線路80係具備第1線路81、及第2線路82。 又，成膜裝置1係具備將支架70從第i線路81至第2線路 (回路），相對於線路於橫向移動移載之移動裝置（未圖 不）。該移動裝置係具有暫時舉起第1線路81上之支架7〇, 並移載至第2線路82之機構。 圖2係顯示支架7〇之概略構成之立體圖。 如圖2所示，支架70係具備：包含鋁等之框狀框體71 ; 以沿著框體71之上邊之方式而設置之磁鐵72 ;以沿著框體 71之下邊之方式而設置之圓柱狀滑動軸73;用於承受基板 之負載，並保持基板2之水平度之基板座74;用於使基板 2保持於支架70之夹具75 ;及用於覆蓋基板2之周緣之非成 膜區域之遮罩76。 。線路80係具備：下部支撐機構84，其構成可一面支撐支 架7〇之負載，一面搬送支架70;及上部支撐機構88,其構 159840.doc 201246434 成為可不接觸地支撐支架70之上部。支架70構成為可於藉 由下部支撐機構84及上部支撐機構88保持大致垂直的狀態 下移動。 ~ 圖3及圖4係顯示下部支撐機構84之構成之立體圖。 如圖3所示，下部支撐機構84係具備馬達85、及報％。 如圖4所示’輥86係具備誘導支架川之^字狀溝部86a。構 成藉由馬達85驅動，使輥86迴轉，並使支架70在輥86上水 平移動◊具體而言，係構成設置於支架7〇之下部之滑動軸 73扣合於輥86之溝部86a，使支架7〇可水平移動。 在本發明之實施形態中，係以滑動轴73與輥86構成搬送 機構。藉由採用轴及輥方式，相較於齒條及小齒輪方式之 搬送機構，可大幅減少磨耗量。 又，在本發明之實施形態中，藉由將輥86之溝部86&設 為u字形狀，可順利地搬送’且可大幅抑制滑動軸73與輥 86之磨耗，從而可減少磨耗所造成之粉塵之產生。 又’圖5係顯示上部支撐機構88之構成之說明圖。 如圖5所示，上部支撐機構88係設置有複數個磁鐵89。 且’於支架70之上邊亦安裝有磁鐵72，磁鐵89與磁鐵72係 以於垂直方向對向’且各磁鐵89、72相互吸附的方式配 置。 藉由採用如此之構成，可使磁鐵89、72彼此相互吸附， 使支架70保持於垂直狀態。即，藉由將基板2垂直保持， 可抑制隨著基板2之大型化，成膜裝置1之設置面積之增 大，且可避免因大型基板2之彎曲所造成之影響。 159840.doc -10- 201246434 且’本發明之實施形態之被處理體之搬送機構，係載體 7〇之滑動軸73、或下部支撐機構84之輥86中之一方之至少 接觸部包含含有矽（Si)、鋁（A1)、氧（〇)、及氮（N)之主體， 而滑動軸73或輥86中之另一方之至少接觸部包含不鏽鋼 (SUS) 〇 藉由以如上所述之材料來構成滑動軸73或輥86之接觸 部’可抑制滑動轴73與輥86之磨耗，減少因磨耗所造成之 粉塵之產生。藉此’可提高良率，且可謀求裝置之長壽命 化。 作為如此之包含矽（Si)、鋁（A1)、氧（〇)、及氮（N)之主 體，並無特別限定，但最理想為例如在高溫環境下之機械 強度、耐熱衝擊性、及耐磨耗性優良之赛隆（SiAl〇N)。 在本發明之實施形態之被處理體之搬送機構中，前述主 體最理想為進-步含有釔、Μ、鎂、鋰、及鈉中之至少— 種。 再者，藉由使用含有如上所述之元素之材料，可大幅抑 制滑動轴73與輥86之磨耗，錢少0隸所造成之粉塵之 產生。 輥86所具有之叫狀溝部，其曲率半徑R最理想為在 20〜34 mm之範圍内。 如後揭之圖16所相對於溝部之曲率半徑R越小，滑 動係數越大’内部剪切應力則具有變小之傾向。 為減v因π動所造成之磨耗，肖率半徑r較大（溝部淺） 159840.doc 201246434 另一方面’為防止因轉動疲勞所造成之切削，曲率半徑 R較小（溝部深）為佳》考慮該等之滑動係數與内部剪切應 力’藉由將溝部之曲率半徑設在特定範圍，可抑制轉動疲 勞所造成之切削、及因滑動所造成之磨耗兩者。例如，將 溝部之曲率半徑R設在20 mm S R$ 34 mm最理想。 又，在本發明之實施形.態之被處理體之搬送機構中，使 前述支架70(搬送構件）移動之搬送速度[mm/sec]，即使在 減壓或大氣壓之任一之條件下，最理想為^3000之範圍。 又 使則述支.70(搬送構件）移動時之搬送速产 [mm/sec2]，若前述支架7〇加速之際超過12〇〇，則會產生搬 送偏差而不理想。另一方面，若前述支架7〇減速之際超過 650 ’則會產生搬送偏差而不理想。但，該等之數值係基 於將前述支架70之重量設為240 “之情形之實測資料者。 且，具備本發明之實施形態之被處理體之搬送機構之成 膜裝置1，係藉由沿著第1線路81(去路）移動之支架7〇(搬送 構件），將基板2(被處理體），從前述[/仍^室1〇A、1〇B，通 過前述支架儲藏室60、加熱室20，搬運至成膜室3〇、4〇; 在成膜室30、40經成膜後，載置前述基板2之搬送構件， 係在成膜室30、40之内部，藉由移動構件，從第i線路 81(去路）移動至第2線路82(回路），且沿著第2線路82，從 成膜室30、40之内部，通過前述加熱室2〇、 搬運至前述·室·、·。 ⑷至 此時，在本發明之實施形態之搬送機財，#由規定滑 動軸與輥之接觸部之材料，可減少滑動軸與輥之間之摩 159840.doc 201246434 擦。藉此，可抑制因磨耗所造成之粉塵之產生。其結果， 在本發明之實施形態之被處理體之搬送機構中，可提高户 率，且可謀求裝置之長壽命化。 (實驗例） 以下，說明為確認本發明之實施形態之效果所進行之 驗例。 夏 (對搬送方式之評估） 首先⑨運行在大氣中之搬送路徑中，就軸及輥式之搬 送路彷（實驗例丨），與齒條及小齒輪形式之搬送路徑 例2、3)，測定並評估其磨耗量之差異。 齒條及小齒輪、轴及輥，不論哪一方均使用包含 咖峨者。又，將報具有之溝部之㈣，設為”形 狀。 使加重了 260 kg之負載之支架，以〇65 m/秒之速度在 長度12 m之搬送路徑來回運行，測定每個輥平均之磨耗粉 量0 又，在齒條及小齒輪形式之搬送路徑中，進行使齒條與 小齒輪之動作完全同步之情形（實驗例2)、及完全不同步^ 情形（實驗例3)。 於圖6顯示實驗例卜實驗例3中，搬送路徑之 每個親平均之磨耗粉4之關係。丨，磨耗粉量係於親下配 置盤子’以電子天平來測定。 從圖6可明知，轴及親搬送之實驗m，相較於齒條及小 齒輪搬送之實驗例2、3，可大幅減少磨耗量。 159840.doc -13- 201246434 (對輥材料及溝部形狀之評估） 在以下之實驗中’就軸及輥形式之搬送路徑，將輥之材 質及溝部之形狀做各種改變，在大氣中進行運行實驗，測 定並評估其磨耗量之差異。又，轴之材質係全部統一為 SUS440C 。 使加重了 260 kg之負載之支架，以0 65 m/秒之速度，在 長度12 m之搬送路徑來回運行’測定每2個輥平均之總磨 耗粉量。 (實驗例4) 將輥之材質設為ai2o3。 (實驗例5) 將輥之材質設為SUS440C(表面粗糙度Ra : i 6 μιη)。 (實驗例6) 將輥之材質設為SUS440C(表面粗糙度Ra<〇 4 μιη)。 (實驗例7) 將輥之材質設為使用陶瓷系材料之USR-1。此處， 「USR-1」係於含有矽（Si)、鋁（Α1)、氧（〇)、及氮（Ν)之主 體’進一步含有元素Μ(釔、鈣、鎂、鋰、及鈉之中至少一 種）而成之陶曼系材料之簡稱。該陶究系材料之適當之組 合[mol%]之範圍為：q<a1<33、〇<〇<33、25<Ν<60、〇<(元 素Μ)<7，其餘為si。又，作為該陶瓷系材料之適當之物性 值’舉出3點彎曲強度[MPa] : >850、破壞韌性值 [MPa·!!! ] : >5、楊氏係數[GPa] : >29〇、及容積密度 [g.cm-3] : >3.2等。 159840.doc •14· 201246434 (實驗例8) 將輥之材質設為SUS440C。且’將溝部之形狀設為v字 形狀。 於圖7顯示實驗例4〜實驗例8中’搬送路徑之來回次數與 每2個輥平均之總磨耗粉量之關係。 從圖7可明知’相較於包含Al2〇3之實驗例4之親，包含 SUS系材料之實驗例5、6之輥更能抑制磨耗量。又，表面 粗繞度Ra小之實驗例6，相較於表面粗鏠度Ra大之實驗例 5，磨耗量較小。 再者，發現包含USR-1之實驗例7之輥，比包含sus系材 料之輥’能進一步大幅地減少磨耗量。 又，關於輥具有之溝部之形狀，在設為v字形狀之實驗 例8中’相較於設為U字形狀之實驗例5、6磨耗較大。認為 此為在V字形狀之溝部之左右，產生了周速差之緣故。藉 此’發現藉由將溝部設為U字形狀，可順利地進行搬送。 (對赛隆之評估） 在以下之實驗中，關於軸&輥形式之搬送路徑，係就包 含赛隆（SiA讀)之報以各種條件進行運行實驗，測定並評 估其磨耗量之差異。 ’以0.65m/秒之速度，在 測定每2個輥平均之總磨 使加重了 260 kg之負載之支架 長度12 m之搬送路徑來回運行， 耗粉量。 (實驗例9) 在真空中進行運行實驗。 159840.doc -15. 201246434 (實驗例ίο) 在大氣中進行運行實驗。 (實驗例11) 在真空中，加熱至12(rc，進行運行實驗。 (實驗例12) 在真空中，以2 m/秒之速度高速運行，進行運行實驗。 (實驗例13) 使用包含SUS系材料之輥，在真空中進行運行實驗。 於圖8〜圖12分別顯示實驗例9〜實驗例13中，來回次數與 每2個輥平均之總磨耗粉量之關係。 分別於圖8表示在真空中進行運行實驗之情形，於圓9表 不在大氣中進行運行實驗之情形，於圖1〇表示在加熱真空 中進行運行實驗之情形，於圖叫示在真空中進行高速= 行實驗之情形，於圖12表示在真空中進行運行實驗之情 形。 將圖8與圖12進行比較可明知，使用賽隆作為輥之材質 之實驗例9，相較於使用包含sus系材料之輥之實驗例 13 ’在真空搬送中亦可大幅減少磨耗量。 - 又，從圖9〜圖11可明知，可藉由使用赛隆作為輥之材 質，在大氣搬送、真空加熱搬送、真空高速搬送之任一情 形中均可大幅減少磨耗量。即，確認了藉由使用赛隆作為 輥之材質，使用空間為減壓下、大氣壓下（即，減壓氛圍 或大氣壓氛圍）之任一者，均可抑制滑動軸與輥間之摩擦 至較低。 159840.doc 16- 201246434 (對真空搬送與真空加熱搬送之組合運行之評估） 在以下之實驗中，改變軸與輥之材質之組合，且在真办 中及大氣巾進行運行實驗，敎並評估其隸量之差異; 使加重了 260 kg之負載之支架，以〇65 m/秒之速度在 長度120 m之搬送路#來回運行。此時，依序進行i *川 2Pa之真空搬送60萬循環、及以ηn。 ^及以12〇C之真空加熱搬送2〇萬 循環，測定每2個輥平均之總磨耗粉量。 (實驗例14) 將轴材質設為SUS，並純之㈣設為赛隆。 (實驗例15) 將轴材質設為SUS，並將親之材f設為sus。 於圖13顯示搬送路徑之來回次數與每以固輥平均之總磨 耗粉量之關係。 從圖1 3可明知，相妨热1 i , , α 相較於將輥之材質設為sus之實驗例 15 ’將輥之材質設為赛隆之實驗例"之輥在真空搬送、真 空加熱搬送之組合搬送，亦可大幅減少磨耗量。 (對軸材料與報材料之評估） 1 M Ttf驗中’將軸與輥之材質之組合進行各種改 變，在大氣中進行運件眘私 、， 連订貫驗，測定並評估其磨耗量之差 異0 使加重了 260 kg之負載之支架，以〇 65 m/秒之速度在 長度12 m之搬送路徑來回運行，敎每2純平均之總磨 耗粉量。 (實驗例16) 159840.doc -17- 201246434 將軸材質設為SUS440C ’並將輥之材質設為SUS440C(表 面粗糙度Ra : 1.6 μπι)。 (實驗例17) 將軸材質設為SUS440C，並將輥之材質設為SUS440C(表 面粗糙度Ra : 0·2 μπι)。 (實驗例18) 將軸材質設為SUS440C ’並將輥之材質設為USR-1。 (實驗例19) 將軸材質設為SUS304C ’並將輥之材質設為usR-i。 於圖14顯示實驗例16〜實驗例19中，搬送路徑之來回次 數與每2個輥平均之總磨耗粉量之關係。 從圖14可明知，相較於軸、輥雙方均包含S|JS系材料之 實驗例16、17，將一方（此處為輥）設為usRji實驗例 18、19之輥能大幅減少磨耗量。又，認為將輥設為咖系 材料，並將轴設為USR-丨之情形，亦可獲得相同之效果。、 (對真空搬送與大氣搬送之組合運行之評估） 在以下之實驗中，改變軸與輥之材質之組合，在真空中 及大氣中進行運行實驗，測定並評估其磨耗量之差異f 使加重了 26〇kg之負載之支架，以〇65m/秒之速度 2長度12 m之搬送路徑來回運行。此時，依序進行⑷〇· Pa之真空搬送60萬循環、咖之真空加熱搬送201246434 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a conveying mechanism for conveying a to-be-processed object in a vacuum processing apparatus. • The present application claims priority to PCT Application No. 091,409, filed on Apr. 15, 2011, which is hereby incorporated by reference. The large-sized glass substrate requires a heating step of raising the temperature to a desired temperature; and a film forming step of forming a plurality of layers by a processing apparatus such as deplating, CVD (Chemical Vapor Deposition), or etching. Various film forming apparatuses have been provided for practical use since the beginning. In a film forming apparatus in which a substrate is formed in a horizontal state, if the substrate is enlarged, there is a problem that the apparatus is also increased in size. Therefore, in recent years, a film forming apparatus having a vertical type in which a substrate is substantially erected to form a film or the like has been developed. Figure 17 is a view showing the basic configuration of a conventional film forming apparatus. The conventional film forming apparatus 1 includes a substrate loading and unloading chamber 12A, first to third vacuum processing chambers 2〇〇, 22〇, and 240 connected to a straight line, and a vacuum processing chamber 2 at the atmosphere side. L, 220, 240 transfer the substrate holder L / UL room (Load / Unload: loading / unloading) 14 〇. Further, a vacuum exhaust device 3 is attached to the L/UL chamber 140. A heating device and a vacuum exhaust device are installed in the heating chamber. Film forming apparatuses 21A, 230, and 250 and a vacuum exhausting apparatus 3 are attached to each of the vacuum processing chambers 200, 220, and 240, respectively. 159840.doc 201246434 Further, in the L/UL chamber 140 and in each of the vacuum processing chambers 2, 22, and 24, a first transport path 16A is provided, which is a substrate holder from the ^^^ chamber. 140 is transported to the i-th transfer path 160 of each of the vacuum processing chambers 2, 22, and 24, and is heated from the respective vacuum processing chambers 2, 22, and 24 to the L/UL. The second transport path 18 of the circuit of the chamber 140 is 〇. In addition, the third vacuum processing chamber 24A of the last part of the film forming apparatus 1 is provided with the substrate holder from the second transport path (outgoing) 16〇 to the second transport path (loop) 180' with respect to two The transfer path 16〇, 18〇 is transferred to the lateral transfer transfer mechanism (the transfer mechanism is not shown to temporarily lift the substrate support on the first transfer path (outgoing) 160, and is transferred to the second transfer path ( The mechanism of the circuit 180. The first and second transport paths 160 and 18 are a pair of tracks, and the substrate holder is moved on the track by a plurality of pairs of wheels disposed at the bottom thereof. A rack is provided on the surface, and a plurality of pinions that are rotated by the rotational force of the motor are provided in the substrate loading and unloading chamber 120 and the first to third vacuum processing chambers 2, 220, and 240. The substrate is spouted to convey the driving force of the motor to the substrate holder to transport the substrate holder. The basic operation of the film forming apparatus 1 () 0 as described above is explained. If the substrate loading and unloading chamber 12 is placed, the substrate is placed. In the substrate holder, the substrate holder is After being transported to the L/UL chamber 140, the L/UL chamber 140 is evacuated and vacuumed, and then transferred to the first transport path 160 which is prepared in the vacuum processing chamber 200 and becomes an outward path. (1) The transport path (detour) 160 transports the substrate holder (substrate 159840.doc 201246434). In the vacuum processing chambers 200, 220, and 240, the substrate is placed in a vacuum process such as heating and film formation. After the processing chamber 240 vacuum-processes the substrate, the substrate holder is transferred to the second transfer path 180 which is the circuit by a transfer mechanism (not shown), and vacuum is formed in the vacuum processing chambers 200, 220, and 240, respectively. The substrate holder is loaded with the vacuum-treated substrate, and the substrate is unloaded in the substrate loading and unloading chamber 12 through the L/UL chamber 140'. However, in the previous rack and pinion form as described above, the substrate is transported. In the mechanism, due to the friction between the rack and the pinion, particles (dust) caused by the loss or wear of the gear are generated, which is the main reason for the decrease in the yield and the shortening of the life of the device. [Prior Art Paper] [Patent literature [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-340425 [Draft of the Invention] [Problems to be Solved by the Invention] The present invention has been made in view of such a prior art, and an object thereof is to provide a conveyance of a to-be-processed object. The mechanism of the object to be processed according to the first aspect of the present invention is characterized in that it is capable of suppressing the generation of fine particles caused by abrasion, and improving the yield and the life of the device. a lower one having a cylindrical sliding shaft and a conveying member for conveying the object to be processed; and a supporting member including a plurality of rollers that are in contact with the sliding shaft and having a U-shaped groove for inducing the conveying member; The sliding shaft and the 159840.doc 201246434 *· > at least one of the contact portions includes a body containing bismuth, aluminum, oxygen, and nitrogen, and at least the contact portion of the other of the sliding shaft and the roller includes Iron steel. In the transport mechanism of the object to be processed according to the second aspect of the present invention, in the first aspect, the body may further contain at least one of barium, calcium, magnesium, lithium, and sodium. In the third or second aspect of the present invention, the U-shaped groove portion of the support member may have a radius of curvature of 15 to 40 mm. In the transport mechanism of the object to be processed according to the fourth aspect of the present invention, in any of the second to third aspects, the transporting speed of the transport member by the support member may be 1 to Sooomm. Within the scope of /sec. In the transport mechanism of the fifth object to be processed according to the present invention, in any of the second to fourth aspects, the transporting acceleration for moving the transport member by the support member may be 12 加速 during acceleration. Mm/sec2 or less; _ 650 mm/sec2 or less during deceleration. In the film forming apparatus according to the sixth aspect of the present invention, in the second or second aspect, the conveying member may vertically convey the object to be processed. [Effect of the Invention] The conveying mechanism of the aspect of the present invention can suppress the generation of particles due to abrasion without depending on the use environment under reduced pressure or atmospheric pressure. According to the conveying mechanism of the object to be processed according to the aspect of the invention, generation of particles due to abrasion can be suppressed. Further, it is possible to provide a transfer mechanism of a target object which can improve the yield and further increase the life of the device. 159840.doc 201246434 [Embodiment] Hereinafter, a transport mechanism of a target object according to an embodiment of the present invention will be described. Fig. 1 is a view showing an example of a configuration of a film forming apparatus including a conveying mechanism of a target object according to an embodiment of the present invention. The film forming apparatus 1 includes two L/UL chambers (Load/Unload) 1〇Α, 10B, a rack storage chamber 6〇 arranged in order, and a heating chamber 2〇'i i film forming chamber 30. And the second film forming chamber 40. Further, a substrate loading and unloading chamber 50 is disposed in front of the L/UL chambers 10A and 10B. Each is connected to each other via a valve (omitted from the drawing). Further, in the L/UL chambers 10A and 10B, the heating chamber 20, and the i-th film forming chamber 3, vacuum exhausting devices 12 and 22 for evacuating the inside of the respective L/UL chambers 10 and 22, respectively, are separately provided. The 32° substrate loading and unloading chamber 50 is attached to the holder 70 from the substrate 2 (subject to be processed) that is transported from the outside. The holder 70 causes the substrate 2 to be substantially upright and fixedly held, and thereafter, by the turning mechanism (omitted from the drawing), the direction of the transition to the direction of the L/UL chambers i〇A, 10B' is carried in parallel to the L/UL chambers 10A, 10Β. » As will be described later, in the substrate loading and unloading chamber 50, since the holder 7 of the vacuum-treated substrate 2 is placed and transported from the l/UL chambers 10A and 10B, the substrate 2 is unloaded from the holder 70. The holder 70 after the substrate 2 is unloaded is used for the conveyance of the next substrate 2. The L/UL chambers 10 A, 10B' are loaded and unloaded by the substrate loading and unloading chamber 50 and the holder 70 in a state where the atmospheric pressure is released. Vacuum exhausting devices 12A, 12B for evacuating the inside of the L/UL chambers 10A, 10B' are provided, respectively. 159840.doc 201246434 (4) In general, in the case of Hidden (4) A and Deletion, in addition to the loading and unloading of the support, vacuum evacuation and atmospheric pressure are also opened. In the L/UL chamber 10A, the processing time required for each of the vacuum processing chambers (the heating chamber 20 and the film forming chamber 3G, and the vacuum processing (heating, film formation)) is significantly longer than the processing time. When the L/UL chambers 1 () A and (4) are singular, the loading of the holder 70 into the vacuum processing chamber takes time, and a blank time during which vacuum processing cannot be performed occurs in each vacuum processing, thereby causing a problem of a decrease in production efficiency. Therefore, in the film forming apparatus, a plurality of (two in the drawing) L/ULhOA, 10B are provided, and the holder 70 is conveyed to the heating chamber 2, the film forming chamber 3, and the temporary storage and transportation. The holder storage room 60 of the holder of the room i〇a, i〇b is still in the mouth. #这' can improve the production efficiency. The heating device 23 is heated to 20, and the temperature is raised to a temperature suitable for film formation of the substrate 2. A vacuum evacuation device 22 for evacuating the inside of the substrate is provided at a temperature of 2 G'. The substrate 2 is subjected to a film formation process by film forming apparatuses 33 and 43 in the film forming chambers 3, 40. The devices 33 and 43 are not particularly limited, and examples thereof include a cathode for sputtering or a flat for CVD. In the film forming apparatus 1, the substrate 2 to be processed is subjected to heat treatment or film formation while being transported by the transport member. The transport member for transporting the substrate 2 is provided with a holding substrate. 2 bracket 7〇 (carrier), and the line 8 for transporting the holder 7 of the substrate 2 (^, the transport structure 159840.doc 201246434 is the vertical transfer substrate 2. Here, the purpose of the substrate 2 is set vertically. Mainly due to the popularity of large-scale liquid crystal displays and plasma displays, the substrate itself is also large and thin. 'Because of the horizontal placement, the flat area of the film forming apparatus itself will be enlarged, so the vertical type is adopted. In addition, in the case of the film forming apparatus 1, the film forming apparatus 1 is difficult to maintain the flatness by bending due to the self-weight of the substrate 2, and it is difficult to uniformly form the film. The film forming chamber 3 has a line 80 including an outward path and a circuit, and the line 8 is completely penetrated through the l/ul chambers lA, 10B, the heating chamber 2, and the film forming chamber 3, 4〇 and configured. The 80th system includes the first line 81 and the second line 82. The film forming apparatus 1 includes a moving device that moves the holder 70 from the i-th line 81 to the second line (loop) and moves in the lateral direction with respect to the line ( The mobile device has a mechanism for temporarily lifting the holder 7〇 on the first line 81 and transferring it to the second line 82. Fig. 2 is a perspective view showing a schematic configuration of the holder 7〇. As shown in the figure, the bracket 70 includes a frame-shaped housing 71 including aluminum or the like, a magnet 72 provided along the upper side of the housing 71, and a cylindrical sliding portion disposed along the lower side of the housing 71. a shaft 73; a substrate holder 74 for receiving the load of the substrate and maintaining the level of the substrate 2; a jig 75 for holding the substrate 2 on the holder 70; and a cover for covering the non-film formation area of the periphery of the substrate 2. Cover 76. . The line 80 is provided with a lower support mechanism 84 which is configured to support the load of the support 7 while supporting the support 70, and an upper support mechanism 88 which is 159840.doc 201246434 which can support the upper portion of the support 70 without contact. The bracket 70 is configured to be movable in a substantially vertical state by the lower support mechanism 84 and the upper support mechanism 88. ~ Fig. 3 and Fig. 4 are perspective views showing the configuration of the lower support mechanism 84. As shown in FIG. 3, the lower support mechanism 84 is provided with a motor 85 and a report %. As shown in Fig. 4, the "roller 86" is provided with a chevron groove portion 86a for inducing a stent. The structure is driven by the motor 85 to rotate the roller 86, and the bracket 70 is horizontally moved on the roller 86. Specifically, the sliding shaft 73 disposed at the lower portion of the bracket 7 is engaged with the groove portion 86a of the roller 86. The bracket 7〇 can be moved horizontally. In the embodiment of the present invention, the slide shaft 73 and the roller 86 constitute a conveying mechanism. By using the shaft and roller method, the amount of wear can be significantly reduced compared to the rack and pinion type of conveying mechanism. Further, in the embodiment of the present invention, the groove portion 86 & of the roller 86 has a U-shape, so that the groove portion 86 & can be smoothly conveyed, and the abrasion of the sliding shaft 73 and the roller 86 can be greatly suppressed, thereby reducing wear and tear. The generation of dust. Further, Fig. 5 is an explanatory view showing the configuration of the upper support mechanism 88. As shown in FIG. 5, the upper support mechanism 88 is provided with a plurality of magnets 89. Further, a magnet 72 is attached to the upper side of the holder 70, and the magnet 89 and the magnet 72 are disposed to face each other in the vertical direction and the magnets 89 and 72 are attracted to each other. By adopting such a configuration, the magnets 89, 72 can be attracted to each other, and the holder 70 can be held in a vertical state. In other words, by holding the substrate 2 vertically, it is possible to suppress an increase in the installation area of the film forming apparatus 1 as the size of the substrate 2 is increased, and the influence of the bending of the large substrate 2 can be avoided. 159840.doc -10- 201246434 Further, in the conveying mechanism of the object to be processed according to the embodiment of the present invention, at least one of the sliding shaft 73 of the carrier 7 or the roller 86 of the lower supporting mechanism 84 includes a crucible ( The main body of Si), aluminum (A1), oxygen (〇), and nitrogen (N), and at least the contact portion of the other of the sliding shaft 73 or the roller 86 contains stainless steel (SUS) by using the material as described above The contact portion constituting the slide shaft 73 or the roller 86 can suppress the abrasion of the slide shaft 73 and the roller 86, and reduce the generation of dust due to abrasion. By this, the yield can be improved, and the life of the device can be extended. The main body including bismuth (Si), aluminum (A1), oxygen (〇), and nitrogen (N) is not particularly limited, but is preferably, for example, mechanical strength and thermal shock resistance in a high-temperature environment. Sialon (SiAl〇N) with excellent wear resistance. In the transport mechanism of the object to be processed according to the embodiment of the present invention, it is preferable that the main body further contains at least one of lanthanum, cerium, magnesium, lithium, and sodium. Further, by using a material containing the elements as described above, the abrasion of the sliding shaft 73 and the roller 86 can be greatly suppressed, and the dust generated by the money is less. The roller 86 has a groove portion having a radius of curvature R desirably in the range of 20 to 34 mm. As shown in Fig. 16, the smaller the radius of curvature R with respect to the groove portion, the larger the slip coefficient, and the internal shear stress tends to become smaller. In order to reduce the wear caused by π motion, the irradiance radius r is large (the shallow groove is shallow) 159840.doc 201246434 On the other hand, 'to prevent the cutting caused by rotational fatigue, the radius of curvature R is small (ditch depth) is better Considering these sliding coefficients and internal shear stresses, by setting the radius of curvature of the groove portion to a specific range, both the cutting caused by the rotational fatigue and the abrasion caused by the sliding can be suppressed. For example, it is preferable to set the radius of curvature R of the groove portion to 20 mm S R$ 34 mm. Further, in the transport mechanism of the object to be processed according to the embodiment of the present invention, the transport speed [mm/sec] for moving the holder 70 (transport member) is under any condition of decompression or atmospheric pressure. The ideal is the range of ^3000. Further, when the transport speed of the support 70 (transport member) is moved, [mm/sec2], if the carriage 7 is accelerated more than 12 〇〇, the conveyance deviation may not occur. On the other hand, if the bracket 7 is decelerated to exceed 650 ′, the conveyance deviation may not occur. However, the numerical values are based on the fact that the weight of the holder 70 is 240". The film forming apparatus 1 including the conveying mechanism of the object to be processed according to the embodiment of the present invention is The holder 7 (transport member) on which the first line 81 (outward path) is moved, and the substrate 2 (subject to be processed) is heated from the above-mentioned holder storage chamber 60 by the above-mentioned [/rooms 1〇A, 1〇B] The chamber 20 is transported to the film forming chambers 3〇, 4〇; after the film forming chambers 30 and 40 are formed, the transport member on which the substrate 2 is placed is placed inside the film forming chambers 30 and 40, and the moving member is moved. Moving from the i-th line 81 (outgoing) to the second line 82 (loop), and along the second line 82, from the inside of the film forming chambers 30, 40, through the heating chamber 2, to the aforementioned chamber (4) At this time, in the embodiment of the present invention, the material of the contact portion between the sliding shaft and the roller is reduced by the material of the contact portion between the sliding shaft and the roller, whereby the friction between the sliding shaft and the roller is reduced by 159840.doc 201246434. It is possible to suppress the generation of dust due to abrasion. As a result, the object to be processed in the embodiment of the present invention is moved. In the delivery mechanism, the user rate can be increased, and the life of the device can be increased. (Experimental Example) Hereinafter, a test case for confirming the effect of the embodiment of the present invention will be described. Summer (Evaluation of the transportation method) First, In the transport path running in the atmosphere, the difference between the wear amount is measured and evaluated in the case of the transfer method of the shaft and the roller type (experimental example), and the transport path examples 2 and 3) in the form of rack and pinion. For the strips, pinions, shafts, and rollers, the one that uses the curry is used, and the (four) that has the groove is set to "shape." The bracket with a load of 260 kg is loaded and operated at a speed of m65 m/sec in a transport path of 12 m in length, and the average amount of wear of each roller is measured. 0, the transport path in the form of rack and pinion In the case where the operation of the rack and the pinion is completely synchronized (Experimental Example 2) and the case of complete misalignment (Experimental Example 3). Fig. 6 shows the relationship between the average wear powder 4 of each of the transport paths in Experimental Example 3.丨, the amount of abrasion powder is determined by placing the plate on the parent's side with an electronic balance. As is apparent from Fig. 6, the experiment m of the shaft and the parent transfer can greatly reduce the amount of wear compared to the experimental examples 2 and 3 in which the rack and the pinion are transported. 159840.doc -13- 201246434 (Evaluation of the shape of the roll material and the groove shape) In the following experiment, the material of the roll and the shape of the groove were changed in the transfer path of the shaft and the roll, and the operation experiment was carried out in the atmosphere. , determine and evaluate the difference in the amount of wear. In addition, the material of the shaft is unified to SUS440C. The rack with a load of 260 kg was loaded and operated at a speed of 0 65 m/sec in a transport path of 12 m in length. The average amount of powder consumed per two rolls was determined. (Experimental Example 4) The material of the roll was set to ai2o3. (Experimental Example 5) The material of the roll was SUS440C (surface roughness Ra: i 6 μmη). (Experimental Example 6) The material of the roll was SUS440C (surface roughness Ra < 〇 4 μιη). (Experimental Example 7) The material of the roll was USR-1 using a ceramic material. Here, "USR-1" is a substance containing bismuth (Si), aluminum (Α1), oxygen (〇), and nitrogen (Ν) and further contains elemental lanthanum (钇, calcium, magnesium, lithium, and sodium). Abbreviation for at least one of the Taman materials. The appropriate combination of the ceramic materials [mol%] ranges from: q < a1 < 33, 〇 < 〇 < 33, 25 < Ν < 60, 〇 < (element Μ) < 7, the rest Si. Further, as a suitable physical property value of the ceramic-based material, a three-point bending strength [MPa]: >850, a fracture toughness value [MPa·!!!]: >, a Young's coefficient [GPa]: >; 29 〇, and bulk density [g.cm-3]: > 3.2 and so on. 159840.doc •14· 201246434 (Experimental Example 8) The material of the roller was set to SUS440C. Further, the shape of the groove portion is set to a v shape. Fig. 7 shows the relationship between the number of round trips of the transport path and the total amount of wear powder per two rolls in Experimental Examples 4 to 8. As is clear from Fig. 7, the amount of abrasion of the experimental examples 5 and 6 containing the SUS-based material was more suppressed than that of the experimental example 4 containing Al2?3. Further, in Experimental Example 6 in which the surface roughness Ra was small, the amount of abrasion was small as compared with Experimental Example 5 in which the surface roughness Ra was large. Further, it was found that the roll of the experimental example 7 containing USR-1 can further reduce the amount of abrasion much more than the roll of the sus-containing material. Further, regarding the shape of the groove portion of the roller, in the experimental example 8 which is a v-shape, the wear was larger than that of the experimental examples 5 and 6 which were U-shaped. It is considered that this is a difference in the circumferential speed between the left and right sides of the V-shaped groove portion. By this, it is found that the groove can be smoothly conveyed by setting the groove portion into a U shape. (Evaluation of Sialon) In the following experiments, the transfer path in the form of a shaft & roll was run on various conditions including the Sialon (SiA reading), and the difference in wear amount was measured and evaluated. At a speed of 0.65 m/sec, the total grinding of the average of each of the two rolls was measured to increase the load of the 260 kg load and the transport path of the carriage length of 12 m was run back and forth, and the amount of powder consumed. (Experimental Example 9) A running experiment was carried out in a vacuum. 159840.doc -15. 201246434 (Experimental example ίο) Run experiments in the atmosphere. (Experimental Example 11) In a vacuum, it was heated to 12 (rc, and an operation experiment was performed. (Experimental Example 12) In a vacuum, a high-speed operation was performed at a speed of 2 m/sec, and an operation experiment was performed. (Experimental Example 13) Using SUS The roller of the material was subjected to a running test in a vacuum. The relationship between the number of round trips and the total amount of total abrasion powder per two rolls in Experimental Example 9 to Experimental Example 13 is shown in Fig. 8 to Fig. 12, respectively. In the case of running experiments in a vacuum, in the case where the round 9 is not in the atmosphere for running experiments, FIG. 1 shows the case where the running experiment is performed in a heating vacuum, and the drawing is shown in the vacuum for high speed = line experiment. In the case, the operation experiment was carried out in a vacuum in Fig. 12. Comparing Fig. 8 with Fig. 12, it is known that the experiment 9 using the sialon as the material of the roller is compared with the experiment using the roller containing the sus material. Example 13 'In the vacuum transfer, the amount of wear can be greatly reduced. - As can be seen from Fig. 9 to Fig. 11, it is possible to use the material of the roll as the material of the roll, and to carry out the air transfer, the vacuum heat transfer, and the vacuum high speed transfer. In a situation The amount of wear can be greatly reduced. That is, it is confirmed that the sliding axis can be suppressed by using the material of the roll as a roll and using the space under reduced pressure or at atmospheric pressure (that is, a reduced pressure atmosphere or an atmospheric pressure atmosphere). The friction between the roller and the roller is low. 159840.doc 16- 201246434 (Assessment of the combined operation of vacuum transfer and vacuum heat transfer) In the following experiment, the combination of the material of the shaft and the roll was changed, and in the actual operation The air towel was subjected to a running test, and the difference in the tensor was evaluated. The bracket with the weight of 260 kg was loaded and operated at a speed of 65 m/sec in the transport path #120 m in length. I * Chuan 2Pa vacuum transfer 600,000 cycles, and ηn. ^ and 12 〇C vacuum heating transfer 2 million cycles, measuring the average total wear powder amount per two rolls. (Experimental Example 14) Shaft material Set to SUS, and pure (4) to Sialon. (Experimental Example 15) Set the shaft material to SUS and set the material f to sus. Figure 13 shows the number of round trips of the transport path and the average of each fixed roller. The relationship between the total amount of wear and the amount of powder. It can be known from Figure 13 that it is suitable for heat 1 i , α is compared with the experimental example 15 in which the material of the roll is sus. The material of the roll is set to the combination of vacuum transfer and vacuum heat transfer, and the amount of wear can be greatly reduced. (Evaluation of the shaft material and the reported material) 1 M Ttf test "Change the combination of the material of the shaft and the roller, carry out the handling in the atmosphere, and check and evaluate the wear amount." The difference of 0 causes the rack with a load of 260 kg to be loaded and operated at a speed of m65 m/sec in a transport path of 12 m in length, and the total amount of powder consumed per 2 pure average. (Experimental Example 16) 159840.doc -17- 201246434 The shaft material was SUS440C' and the material of the roller was SUS440C (surface roughness Ra: 1.6 μπι). (Experimental Example 17) The shaft material was SUS440C, and the material of the roller was SUS440C (surface roughness Ra: 0·2 μπι). (Experimental Example 18) The shaft material was SUS440C' and the material of the roller was USR-1. (Experimental Example 19) The shaft material was set to SUS304C' and the material of the roll was set to usR-i. Fig. 14 shows the relationship between the number of round trips of the transport path and the total amount of total wear powder per two rolls in Experimental Example 16 to Experimental Example 19. As is clear from Fig. 14, in comparison with Experimental Examples 16 and 17 in which both the shaft and the roller contain the S|JS-based material, one of the rolls (here, the roll) was set to usRji. The rolls of the experimental examples 18 and 19 can greatly reduce the amount of wear. . Further, it is considered that the same effect can be obtained by setting the roll to a coffee material and setting the axis to USR-丨. (Evaluation of combined operation of vacuum transfer and atmospheric transfer) In the following experiments, the combination of the material of the shaft and the roll was changed, and the running experiment was carried out in a vacuum and in the atmosphere, and the difference in the wear amount was measured and evaluated. A 26-kg load bracket is used to run back and forth at a speed of 65 m/s and a length of 12 m. At this time, the vacuum transfer of (4) 〇· Pa is performed in 600,000 cycles, and the vacuum heating of the coffee is carried out.

^大氣搬送㈣循環、及心高速搬㈣萬循環， 每2個觀平均（相當於2個小室）之總磨耗粉量。 U (實驗例20) 159840.doc 201246434 將軸材質設為SUS440C，並將輥之材質設為SUS440C。 (實驗例21) 將軸材質設為SUS440C，並將輥之材質設為usR_i。 於圖15顯不實驗例20〜實驗例2丨中，搬送路徑之來回次 數〃每2個輥平均之總磨耗粉量之關係。 從圖15可明知，相較於軸、輥雙方均包含sus系材料之 實驗例20 ’將一方（此處為輥）設為USR-1之實驗例21之 輥，在真空搬送、真空加熱搬送、大氣搬送、真空高速搬 送之組合搬送中，均可大幅減少磨耗量。 (對輥之溝部形狀之評估） 砰估輥之溝部之曲率半徑，與滑動係數及内部剪切應力 之關係。 (實驗例22) 就具有曲率半徑尺=00(平面）、R=34 mrn、R=28 mm、 R-20 mm之溝部之輥，分別測定滑動量及内部剪切應力。 於圖16顯示溝部之曲率半徑R與滑動係數及内部剪切應 力之關係。 從圖16可知，溝部之曲率半徑R越小，滑動係數越大， 另一方面，溝部之曲率半徑R越大，内部剪切應力越小。 • 為減少滑動造成之磨耗，曲率半徑R較大（溝部淺）為 佳。另一方面’為防止因轉動疲勞所造成之切削曲率半 徑R較小（溝部深）為佳。考慮該等之滑動係數與内部剪切 應力，藉由將溝部之曲率半徑設在特定範圍，可抑制轉動 疲勞所造成之切削與滑動所導致之磨耗兩者。例如，將曲 159840.doc -19- 201246434 率半徑R設在20mmSR$34mm最理想。 在本發明之實施形態中，搬送機構係包含：「搬送構件 (支架），其係於下部具備圓柱狀之滑動軸，且搬送被處理 體」；及「支樓構件’其係包含複數個和前述滑動軸接 觸，且具備誘導前述搬送構件之U字狀之溝部之親」；且 藉由規定前述滑動軸與前述輥之接觸部之材料，即使所使 用之空間在減壓下、大氣壓下（即，減壓氛圍或大氣壓氛 圍）中之任一者，均可減少滑動軸與輥之間之摩擦。藉 此，本發明之實施形態之搬送機構可不依存於減壓下或大 氣壓下之使用環境’來抑制磨耗所造成之微粒之產生。 以上，雖已說明本發明之實施形態之被處理體之搬送機 構，但本發明並不限定於此，在不脫離發明之宗旨之範圍 内，可進行適當之變更。 [產業上之可利用性] 本發明可廣泛適用於被處理體之搬送機構。 【圖式簡單說明】 圖1係示意地顯示具備本發明之實施形態之被處理體之 搬送機構的成膜裝置之一構成例。 圖2係顯示搭載基板之基板支架之一例之圖。 圖3係顯示基板支架之下部支撐機構之一例之圖。 圖4係顯示基板支架之下部支撐機構之一例之圖。 圖5係顯示基板支架之上部支撐機構之一例之圖。 圖6係顯示改變了搬送方式之情形之搬送路徑之來回次 數與磨耗粉量的關係之圖。 159840.doc •20· 201246434 式之情形之搬送路徑之來回次數 圖7係_示改變搬送方 與磨耗粉量的關係之圖。 圖8係顯示在真空中進行運行實 來回次數與磨耗粉量的關係之圖。 圖9係_示在大氣巾進行運行實 來回次數與磨耗粉量的關係之圖。 驗之情形之搬送路徑之 驗之情形之搬送路徑之 广圖〇係&在加熱真空+進行運行實驗之情形之搬送路 徑之來回次數與磨耗粉量的關係之圖。 係顯不在真空中進行高速運行實驗之情形之搬送路 徑之來回次數與磨耗粉量的關係之圖。 圖係顯示在真空中進行運行實驗《情形之搬送路徑之 來回次數與磨耗粉量的關係之圖。 圖13係顯示以真空搬送與真空加熱搬送之組合，進行運 仃實驗之情形之搬送路徑之來回次數與磨耗粉量的關係之 圖0 圖14係顯示將軸之材質、及輥之材質之組合進行各種改 變之情形的搬送路徑之來回次數與磨耗粉量之關係之圖。 圖15係顯示以真空搬送與大氣搬送之組合，進行運行實 驗之情形之搬送路徑之來回次數與磨耗粉量的關係之圖。 圖16係顯示關於輥之溝部之曲率半徑R、滑動係數及内 部剪切應力的關係之圖。 圖17係示意地顯示先前之具備被處理體之搬送機構之成 膜裝置的一構成例之圖。 【主要元件符號說明】 159840.doc -2卜 201246434 1 成膜裝置 2 基板（被處理體） 10Α L/UL 室 10Β L/UL 室 12A 真空排氣裝置 12B 真空排氣裝置 20 加熱室 22 真空排氣裝置 23 加熱裝置 30 成膜室 32 真空排氣裝置 33 成膜裝置 40 成膜室 43 成膜裝置 50 基板裝卸機構 60 支架搬送構件 70 支架 71 框狀框體 72 磁鐵 73 滑動軸 74 基板座 75 夾具 76 遮罩 80 線路 159840.doc ·22· 201246434 81 第1線路（去路） 82 第2線路（回路） 84 下部支撐機構 85 馬達 86 輥 86a 溝部 88 上部支撐機構 89 磁鐵 100 成膜裝置 120 基板裝卸室 140 L/UL 室 160 第1搬送路徑 180 第2搬送路徑 200 第1真空處理室 210 成膜裝置 220 第2真空處理室 230 成膜裝置 240 第3真空處理室 250 成膜裝置 300 真空排氣裝置 159840.doc -23-^ Atmospheric transport (four) cycle, and high-speed moving (four) million cycles, the total amount of wear per 2 observations (equivalent to 2 small rooms). U (Experimental Example 20) 159840.doc 201246434 The shaft material is SUS440C, and the material of the roller is SUS440C. (Experimental Example 21) The shaft material was set to SUS440C, and the material of the roller was set to usR_i. In Fig. 15, the relationship between the number of round trips of the transport path and the total amount of total wear powder per two rolls was shown in Experimental Example 20 to Experimental Example 2. As can be seen from Fig. 15, in the experimental example 20 in which the sus-based material is included in both the shaft and the roller, the one (here, the roller) is the roller of the experimental example 21 of the USR-1, and is transported by vacuum transfer or vacuum heating. In the combined transfer of atmospheric transfer and vacuum high-speed transfer, the amount of wear can be greatly reduced. (Evaluation of the shape of the groove portion of the roll) The relationship between the radius of curvature of the groove portion of the roll and the sliding coefficient and the internal shear stress is evaluated. (Experimental Example 22) The amount of slip and the internal shear stress were measured for each of the rolls having the groove portions of the radius of curvature = 00 (planar), R = 34 mrn, R = 28 mm, and R - 20 mm. Fig. 16 shows the relationship between the radius of curvature R of the groove portion and the sliding coefficient and the internal shear stress. As can be seen from Fig. 16, the smaller the radius of curvature R of the groove portion is, the larger the sliding coefficient is. On the other hand, the larger the radius of curvature R of the groove portion, the smaller the internal shear stress. • To reduce the wear caused by sliding, the radius of curvature R is larger (shallow groove). On the other hand, it is preferable to prevent the cutting radius radius R from being small due to rotational fatigue (ditch portion depth). Considering the sliding coefficient and the internal shear stress, by setting the radius of curvature of the groove portion to a specific range, both the cutting and the sliding caused by the rotational fatigue can be suppressed. For example, it is most desirable to set the radius 159 of the 159840.doc -19- 201246434 to 20mm SR$34mm. In the embodiment of the present invention, the conveying mechanism includes: a conveying member (a holder) having a cylindrical sliding shaft at a lower portion and conveying the object to be processed; and a "branch member" including a plurality of sums The sliding shaft is in contact with the U-shaped groove portion of the conveying member, and the material of the contact portion between the sliding shaft and the roller is defined, even if the space used is under reduced pressure and atmospheric pressure ( That is, the pressure between the sliding shaft and the roller can be reduced by either of a reduced pressure atmosphere or an atmospheric pressure atmosphere. Therefore, the conveying mechanism according to the embodiment of the present invention can suppress the generation of fine particles caused by abrasion without depending on the use environment under reduced pressure or atmospheric pressure. In the above, the transport mechanism of the object to be processed according to the embodiment of the present invention has been described, but the present invention is not limited thereto, and may be appropriately modified without departing from the scope of the invention. [Industrial Applicability] The present invention can be widely applied to a transport mechanism of a target object. [Brief Description of the Drawings] Fig. 1 is a view showing an example of a configuration of a film forming apparatus including a conveying mechanism of a target object according to an embodiment of the present invention. Fig. 2 is a view showing an example of a substrate holder on which a substrate is mounted. Fig. 3 is a view showing an example of a support mechanism for the lower portion of the substrate holder. Fig. 4 is a view showing an example of a support mechanism for the lower portion of the substrate holder. Fig. 5 is a view showing an example of a support mechanism for the upper portion of the substrate holder. Fig. 6 is a view showing the relationship between the number of round trips of the transport path and the amount of wear powder in the case where the transport mode is changed. 159840.doc •20· 201246434 The number of round trips of the transport path in the case of Fig. 7 is a diagram showing the relationship between the change of the transporter and the amount of wear powder. Fig. 8 is a graph showing the relationship between the number of actual running times and the amount of abrasion powder in a vacuum. Fig. 9 is a graph showing the relationship between the number of actual running times of the air towel and the amount of abrasion powder. In the case of the inspection of the transport path, the transfer path is a map of the relationship between the number of round trips of the transport path and the amount of wear powder in the case of heating vacuum + running test. A graph showing the relationship between the number of round trips of the transport path and the amount of wear powder in the case where the high-speed operation experiment is not performed in a vacuum. The graph shows the relationship between the number of round trips of the transport path and the amount of wear powder in a running experiment in a vacuum. Fig. 13 is a view showing the relationship between the number of round trips of the transport path and the amount of abrasion powder in the case of carrying out the transport experiment by the combination of vacuum transfer and vacuum heat transfer. Fig. 14 shows the combination of the material of the shaft and the material of the roll. A graph showing the relationship between the number of round trips of the transport path and the amount of wear powder in the case of various changes. Fig. 15 is a graph showing the relationship between the number of round trips of the transport path and the amount of wear powder in the case where the operation is carried out by a combination of vacuum transfer and atmospheric transfer. Fig. 16 is a view showing the relationship between the radius of curvature R, the sliding coefficient, and the internal shear stress of the groove portion of the roller. Fig. 17 is a view schematically showing a configuration example of a film forming apparatus of a conventional conveying mechanism having a target object. [Description of main component symbols] 159840.doc -2 BU 201246434 1 Film forming apparatus 2 Substrate (subject to be processed) 10Α L/UL chamber 10Β L/UL chamber 12A Vacuum exhaust unit 12B Vacuum exhaust unit 20 Heating chamber 22 Vacuum row Gas device 23 Heating device 30 Film forming chamber 32 Vacuum exhaust device 33 Film forming device 40 Film forming chamber 43 Film forming device 50 Substrate handling mechanism 60 Bracket conveying member 70 Bracket 71 Frame frame 72 Magnet 73 Slide shaft 74 Base plate 75 Fixture 76 Mask 80 Line 159840.doc ·22· 201246434 81 1st line (outgoing) 82 2nd line (loop) 84 Lower support mechanism 85 Motor 86 Roller 86a Groove 88 Upper support mechanism 89 Magnet 100 Film forming apparatus 120 Substrate handling Room 140 L/UL chamber 160 First transport path 180 Second transport path 200 First vacuum processing chamber 210 Film forming apparatus 220 Second vacuum processing chamber 230 Film forming apparatus 240 Third vacuum processing chamber 250 Film forming apparatus 300 Vacuum exhaust Device 159840.doc -23-

Claims (1)

201246434 七、申請專利範圍： ^ 一種被處理體之搬送機構，其係包含： 於下部具備圓柱狀之滑動軸，且搬送被處理體之搬送 構件；及 包含複數個和前述滑動轴接觸，且具備誘導前述搬送 構件之u字狀之溝部之輥的支撐構件；且 則述滑動軸及前述輥中之一方之至少接觸部包含含有 石夕、Is、氧、及氮之主體， 剛述滑動轴及前述報中之另一方之至少接觸部包含不 鏽鋼》 2.如請求項1之被處理體之搬送機構，其中前述主體係進 步包含釔、鈣、鎂、鋰、及鈉中之至少一種。 3·如請求項1或2之被處理體之搬送機構，纟中前述支推構 件之u字狀之溝部，其曲率半徑尺在15〜4〇麵之範圍 内。 如請求項1或2之被處理體之搬送機構，其中藉由前述支 撐構件使削述搬送構件移動之搬送速度在卜3嶋随〜〇 之範圍内。 5·如請求項UiU之被處理體之搬送機構，其中藉由前述支 撐構件使前述搬送構件移動之搬送加速度，加速時為 12〇〇mm/Sec2以下’而減速時為-65〇随/似2以下。 6.如4求項1或2之被處理體之搬送機構，其中前述搬送構 件係縱型搬送前述被處理體。 159840.doc201246434 VII. Patent application scope: ^ A transporting mechanism for a processed object, comprising: a sliding member having a cylindrical sliding shaft at a lower portion and transporting the object to be processed; and comprising a plurality of sliding shaft contacts and having a support member that induces a roller of the U-shaped groove portion of the conveying member; and at least one of the sliding shaft and the roller includes a body including a stone, an Is, an oxygen, and a nitrogen, and the sliding shaft and At least the contact portion of the other of the aforementioned newspapers includes stainless steel. 2. The conveying mechanism of the object to be processed according to claim 1, wherein the advancement of the main system includes at least one of barium, calcium, magnesium, lithium, and sodium. 3. The conveying mechanism of the object to be processed according to claim 1 or 2, wherein the U-shaped groove portion of the supporting member has a radius of curvature of 15 to 4 inches. The conveying mechanism of the object to be processed according to claim 1 or 2, wherein the conveying speed at which the conveying member is moved by the supporting member is within a range of 〇3嶋. 5. The conveying mechanism of the object to be processed of the request item UiU, wherein the conveying acceleration by moving the conveying member by the support member is 12 〇〇mm/Sec2 or less during acceleration, and -65 〇 is/like when decelerating 2 or less. 6. The transport mechanism of the object to be processed according to claim 1, wherein the transporting member transports the object to be processed in a vertical direction. 159840.doc
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