TWI502672B - 用於製造電子或非電子組件之方法、其裝置及用於製造電子或非電子組件之基板 - Google Patents

用於製造電子或非電子組件之方法、其裝置及用於製造電子或非電子組件之基板 Download PDF

Info

Publication number
TWI502672B
TWI502672B TW101124511A TW101124511A TWI502672B TW I502672 B TWI502672 B TW I502672B TW 101124511 A TW101124511 A TW 101124511A TW 101124511 A TW101124511 A TW 101124511A TW I502672 B TWI502672 B TW I502672B
Authority
TW
Taiwan
Prior art keywords
substrate
scale
component
machine
processing component
Prior art date
Application number
TW101124511A
Other languages
English (en)
Chinese (zh)
Other versions
TW201312685A (zh
Inventor
柯里 威廉 麥可 費隆
傑佛瑞 麥法蘭
Original Assignee
任尼紹公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 任尼紹公司 filed Critical 任尼紹公司
Publication of TW201312685A publication Critical patent/TW201312685A/zh
Application granted granted Critical
Publication of TWI502672B publication Critical patent/TWI502672B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49771—Quantitative measuring or gauging

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
TW101124511A 2011-07-06 2012-07-06 用於製造電子或非電子組件之方法、其裝置及用於製造電子或非電子組件之基板 TWI502672B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11250638 2011-07-06

Publications (2)

Publication Number Publication Date
TW201312685A TW201312685A (zh) 2013-03-16
TWI502672B true TWI502672B (zh) 2015-10-01

Family

ID=44511797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101124511A TWI502672B (zh) 2011-07-06 2012-07-06 用於製造電子或非電子組件之方法、其裝置及用於製造電子或非電子組件之基板

Country Status (7)

Country Link
US (1) US20140123458A1 (enExample)
EP (1) EP2729427A1 (enExample)
JP (1) JP2014526140A (enExample)
KR (1) KR20140039245A (enExample)
CN (1) CN103619770A (enExample)
TW (1) TWI502672B (enExample)
WO (1) WO2013004992A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104112689A (zh) * 2013-04-18 2014-10-22 Ap系统股份有限公司 横梁和用于处理衬底的设备
US9346127B2 (en) 2014-06-20 2016-05-24 Velo3D, Inc. Apparatuses, systems and methods for three-dimensional printing
KR101720574B1 (ko) * 2014-12-12 2017-03-29 주식회사 이오테크닉스 레이저 가공 장치 및 그 구동 방법
WO2016131022A1 (en) * 2015-02-12 2016-08-18 Glowforge Inc. Cloud controlled laser fabrication
CN108367498A (zh) 2015-11-06 2018-08-03 维洛3D公司 Adept三维打印
WO2017100695A1 (en) 2015-12-10 2017-06-15 Velo3D, Inc. Skillful three-dimensional printing
US9931697B2 (en) 2016-02-18 2018-04-03 Velo3D, Inc. Accurate three-dimensional printing
US10252336B2 (en) 2016-06-29 2019-04-09 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
US11691343B2 (en) 2016-06-29 2023-07-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
US20180095450A1 (en) 2016-09-30 2018-04-05 Velo3D, Inc. Three-dimensional objects and their formation
US20180126650A1 (en) 2016-11-07 2018-05-10 Velo3D, Inc. Gas flow in three-dimensional printing
US20180186080A1 (en) 2017-01-05 2018-07-05 Velo3D, Inc. Optics in three-dimensional printing
US10357829B2 (en) 2017-03-02 2019-07-23 Velo3D, Inc. Three-dimensional printing of three-dimensional objects
CN106938371A (zh) * 2017-03-16 2017-07-11 广东工业大学 一种高精度激光切割机及其横梁
US20180281237A1 (en) 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
US10272525B1 (en) 2017-12-27 2019-04-30 Velo3D, Inc. Three-dimensional printing systems and methods of their use
US10144176B1 (en) 2018-01-15 2018-12-04 Velo3D, Inc. Three-dimensional printing systems and methods of their use
CN110508948A (zh) * 2018-05-22 2019-11-29 佛山市嘉实和生物科技有限公司 一种多功能组合激光设备
KR20230047214A (ko) 2019-07-26 2023-04-06 벨로3디, 인크. 3차원 물체 형상화에 대한 품질 보증
TWI866681B (zh) * 2023-12-08 2024-12-11 均華精密工業股份有限公司 同向式多軸作業設備

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200540563A (en) * 2004-05-13 2005-12-16 Sanei Giken Co Ltd Exposure unit
WO2007135377A1 (en) * 2006-05-19 2007-11-29 Oerlikon Balzers Coating (Uk) Limited Method and tool for patterning thin films on moving substrates
US20080094593A1 (en) * 2006-09-01 2008-04-24 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8616240D0 (en) 1986-07-03 1986-08-13 Renishaw Plc Opto-electronic scale reading apparatus
JPH0360437A (ja) * 1989-07-26 1991-03-15 Hitachi Ltd 切断マーク
US5279044A (en) 1991-03-12 1994-01-18 U.S. Philips Corporation Measuring device for determining an absolute position of a movable element and scale graduation element suitable for use in such a measuring device
JPH11281320A (ja) * 1998-03-30 1999-10-15 Jasco Corp 位置センス装置
GB0109057D0 (en) 2001-04-11 2001-05-30 Renishaw Plc Absolute postition measurement
EP1410305A4 (en) 2001-06-28 2009-10-21 Entelos Inc METHOD AND DEVICE FOR COMPUTER MODELING AN ADAPTIVE IMMUNE REACTION
JP4320560B2 (ja) * 2003-05-14 2009-08-26 セイコーエプソン株式会社 液滴吐出装置
GB0413710D0 (en) 2004-06-21 2004-07-21 Renishaw Plc Scale reading apparatus
US7375795B2 (en) * 2004-12-22 2008-05-20 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP2007012426A (ja) * 2005-06-30 2007-01-18 Optrex Corp 有機ｅｌ表示パネルとその製造方法および検査方法
JP2009511276A (ja) * 2005-10-11 2009-03-19 ジーエスアイ・グループ・コーポレーション 光学的計測用スケールおよびそのレーザー式製造法
WO2008061186A2 (en) * 2006-11-15 2008-05-22 Zygo Corporation Distance measuring interferometer and encoder metrology systems for use in lithography tools
US8294878B2 (en) * 2009-06-19 2012-10-23 Nikon Corporation Exposure apparatus and device manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200540563A (en) * 2004-05-13 2005-12-16 Sanei Giken Co Ltd Exposure unit
WO2007135377A1 (en) * 2006-05-19 2007-11-29 Oerlikon Balzers Coating (Uk) Limited Method and tool for patterning thin films on moving substrates
US20080094593A1 (en) * 2006-09-01 2008-04-24 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method

Also Published As

Publication number Publication date
TW201312685A (zh) 2013-03-16
EP2729427A1 (en) 2014-05-14
WO2013004992A1 (en) 2013-01-10
CN103619770A (zh) 2014-03-05
KR20140039245A (ko) 2014-04-01
US20140123458A1 (en) 2014-05-08
JP2014526140A (ja) 2014-10-02

Similar Documents

Publication Publication Date Title
TW201312685A (zh) 製造方法及其裝置
JP5562424B2 (ja) ２つの基板を位置合わせするための装置
TWI627887B (zh) 用於自動調整點膠機之點膠單元的方法與裝置
TWI433256B (zh) 定位工具之ｘ-ｙ定位的校準方法及具有這種定位工具的裝置
JP5864929B2 (ja) インプリント装置および物品の製造方法
KR101242285B1 (ko) 홀더 조인트
TWI645267B (zh) 一種光學測量裝置和方法
US11784077B2 (en) Wafer overlay marks, overlay measurement systems, and related methods
TWI610341B (zh) 壓印設備、壓印系統及製造物品的方法
JP5847661B2 (ja) 基板の位置調整装置、基板の位置調整方法、プログラム及びコンピュータ記憶媒体
KR20180043321A (ko) 전자 디바이스용 전사 장치 및 전자 디바이스용 전사 방법
JP2019141918A (ja) ロボットの位置情報復元方法
JP6706164B2 (ja) アライメント装置、露光装置、およびアライメント方法
JP5930699B2 (ja) インプリント装置、インプリント方法およびデバイスの製造方法
JP2013131577A5 (enExample)
US11198287B2 (en) Screen printing machine
JP7070712B2 (ja) リニアスケールの検出値の補正方法
JP2002257506A (ja) 非接触膜厚測定装置
JP2013036804A (ja) ワークテーブルのピッチエラーの測定方法
CN112908898B (zh) 控片量测方法及量测装置
JP6639082B2 (ja) リソグラフィ装置、リソグラフィ方法、および物品製造方法
JP2015087687A (ja) 直接描画露光装置
JP5884273B2 (ja) 露光ユニット及び基板のプリアライメント方法
KR101387312B1 (ko) 프록시미티 노광장치, 프록시미티 노광장치의 기판위치 결정방법, 및 표시용 패널기판의 제조방법
KR102333943B1 (ko) 노광장치, 스테이지 교정 시스템, 및 스테이지 교정방법

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees