JP2014526140A - 製造方法および製造装置 - Google Patents

製造方法および製造装置 Download PDF

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Publication number
JP2014526140A
JP2014526140A JP2014517910A JP2014517910A JP2014526140A JP 2014526140 A JP2014526140 A JP 2014526140A JP 2014517910 A JP2014517910 A JP 2014517910A JP 2014517910 A JP2014517910 A JP 2014517910A JP 2014526140 A JP2014526140 A JP 2014526140A
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JP
Japan
Prior art keywords
substrate
scale
machine
processing unit
component area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014517910A
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English (en)
Japanese (ja)
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JP2014526140A5 (enExample
Inventor
ウィリアム マイケル フェアロン コリー
マクファーランド ジェフリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renishaw PLC
Original Assignee
Renishaw PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renishaw PLC filed Critical Renishaw PLC
Publication of JP2014526140A publication Critical patent/JP2014526140A/ja
Publication of JP2014526140A5 publication Critical patent/JP2014526140A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49771—Quantitative measuring or gauging

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP2014517910A 2011-07-06 2012-07-05 製造方法および製造装置 Pending JP2014526140A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11250638.1 2011-07-06
EP11250638 2011-07-06
PCT/GB2012/000569 WO2013004992A1 (en) 2011-07-06 2012-07-05 Method of manufacture and apparatus therefor

Publications (2)

Publication Number Publication Date
JP2014526140A true JP2014526140A (ja) 2014-10-02
JP2014526140A5 JP2014526140A5 (enExample) 2015-08-06

Family

ID=44511797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014517910A Pending JP2014526140A (ja) 2011-07-06 2012-07-05 製造方法および製造装置

Country Status (7)

Country Link
US (1) US20140123458A1 (enExample)
EP (1) EP2729427A1 (enExample)
JP (1) JP2014526140A (enExample)
KR (1) KR20140039245A (enExample)
CN (1) CN103619770A (enExample)
TW (1) TWI502672B (enExample)
WO (1) WO2013004992A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104112689A (zh) * 2013-04-18 2014-10-22 Ap系统股份有限公司 横梁和用于处理衬底的设备
US9346127B2 (en) 2014-06-20 2016-05-24 Velo3D, Inc. Apparatuses, systems and methods for three-dimensional printing
KR101720574B1 (ko) * 2014-12-12 2017-03-29 주식회사 이오테크닉스 레이저 가공 장치 및 그 구동 방법
WO2016131022A1 (en) * 2015-02-12 2016-08-18 Glowforge Inc. Cloud controlled laser fabrication
CN108367498A (zh) 2015-11-06 2018-08-03 维洛3D公司 Adept三维打印
WO2017100695A1 (en) 2015-12-10 2017-06-15 Velo3D, Inc. Skillful three-dimensional printing
US9931697B2 (en) 2016-02-18 2018-04-03 Velo3D, Inc. Accurate three-dimensional printing
US10252336B2 (en) 2016-06-29 2019-04-09 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
US11691343B2 (en) 2016-06-29 2023-07-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
US20180095450A1 (en) 2016-09-30 2018-04-05 Velo3D, Inc. Three-dimensional objects and their formation
US20180126650A1 (en) 2016-11-07 2018-05-10 Velo3D, Inc. Gas flow in three-dimensional printing
US20180186080A1 (en) 2017-01-05 2018-07-05 Velo3D, Inc. Optics in three-dimensional printing
US10357829B2 (en) 2017-03-02 2019-07-23 Velo3D, Inc. Three-dimensional printing of three-dimensional objects
CN106938371A (zh) * 2017-03-16 2017-07-11 广东工业大学 一种高精度激光切割机及其横梁
US20180281237A1 (en) 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
US10272525B1 (en) 2017-12-27 2019-04-30 Velo3D, Inc. Three-dimensional printing systems and methods of their use
US10144176B1 (en) 2018-01-15 2018-12-04 Velo3D, Inc. Three-dimensional printing systems and methods of their use
CN110508948A (zh) * 2018-05-22 2019-11-29 佛山市嘉实和生物科技有限公司 一种多功能组合激光设备
KR20230047214A (ko) 2019-07-26 2023-04-06 벨로3디, 인크. 3차원 물체 형상화에 대한 품질 보증
TWI866681B (zh) * 2023-12-08 2024-12-11 均華精密工業股份有限公司 同向式多軸作業設備

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11281320A (ja) * 1998-03-30 1999-10-15 Jasco Corp 位置センス装置
JP2004337726A (ja) * 2003-05-14 2004-12-02 Seiko Epson Corp 液滴吐出装置、電気光学装置の製造方法、電気光学装置、電子機器および基板
JP2006178463A (ja) * 2004-12-22 2006-07-06 Asml Netherlands Bv リソグラフィ装置、デバイス製造方法及びそれによって製造されたデバイス
JP2007012426A (ja) * 2005-06-30 2007-01-18 Optrex Corp 有機ｅｌ表示パネルとその製造方法および検査方法
WO2008029757A1 (fr) * 2006-09-01 2008-03-13 Nikon Corporation Procédé de commande d'objet mobile, système de commande d'objet mobile, procédé et appareil de formation de motif, procédé et appareil d'exposition, procédé de fabrication de dispositif et procédé d'étalonnage
JP2010510672A (ja) * 2006-11-15 2010-04-02 ザイゴ コーポレーション リソグラフィツールにおいて使用される距離測定干渉計及びエンコーダ測定システム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8616240D0 (en) 1986-07-03 1986-08-13 Renishaw Plc Opto-electronic scale reading apparatus
JPH0360437A (ja) * 1989-07-26 1991-03-15 Hitachi Ltd 切断マーク
US5279044A (en) 1991-03-12 1994-01-18 U.S. Philips Corporation Measuring device for determining an absolute position of a movable element and scale graduation element suitable for use in such a measuring device
GB0109057D0 (en) 2001-04-11 2001-05-30 Renishaw Plc Absolute postition measurement
EP1410305A4 (en) 2001-06-28 2009-10-21 Entelos Inc METHOD AND DEVICE FOR COMPUTER MODELING AN ADAPTIVE IMMUNE REACTION
JP2005326550A (ja) * 2004-05-13 2005-11-24 Sanee Giken Kk 露光装置
GB0413710D0 (en) 2004-06-21 2004-07-21 Renishaw Plc Scale reading apparatus
JP2009511276A (ja) * 2005-10-11 2009-03-19 ジーエスアイ・グループ・コーポレーション 光学的計測用スケールおよびそのレーザー式製造法
GB2438600B (en) * 2006-05-19 2008-07-09 Exitech Ltd Method for patterning thin films on moving substrates
US8294878B2 (en) * 2009-06-19 2012-10-23 Nikon Corporation Exposure apparatus and device manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11281320A (ja) * 1998-03-30 1999-10-15 Jasco Corp 位置センス装置
JP2004337726A (ja) * 2003-05-14 2004-12-02 Seiko Epson Corp 液滴吐出装置、電気光学装置の製造方法、電気光学装置、電子機器および基板
JP2006178463A (ja) * 2004-12-22 2006-07-06 Asml Netherlands Bv リソグラフィ装置、デバイス製造方法及びそれによって製造されたデバイス
JP2007012426A (ja) * 2005-06-30 2007-01-18 Optrex Corp 有機ｅｌ表示パネルとその製造方法および検査方法
WO2008029757A1 (fr) * 2006-09-01 2008-03-13 Nikon Corporation Procédé de commande d'objet mobile, système de commande d'objet mobile, procédé et appareil de formation de motif, procédé et appareil d'exposition, procédé de fabrication de dispositif et procédé d'étalonnage
JP2010510672A (ja) * 2006-11-15 2010-04-02 ザイゴ コーポレーション リソグラフィツールにおいて使用される距離測定干渉計及びエンコーダ測定システム

Also Published As

Publication number Publication date
TW201312685A (zh) 2013-03-16
EP2729427A1 (en) 2014-05-14
WO2013004992A1 (en) 2013-01-10
CN103619770A (zh) 2014-03-05
TWI502672B (zh) 2015-10-01
KR20140039245A (ko) 2014-04-01
US20140123458A1 (en) 2014-05-08

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