TWI497618B - Lead connection device for semiconductor structure and connection method thereof - Google Patents

Lead connection device for semiconductor structure and connection method thereof Download PDF

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Publication number
TWI497618B
TWI497618B TW099117567A TW99117567A TWI497618B TW I497618 B TWI497618 B TW I497618B TW 099117567 A TW099117567 A TW 099117567A TW 99117567 A TW99117567 A TW 99117567A TW I497618 B TWI497618 B TW I497618B
Authority
TW
Taiwan
Prior art keywords
semiconductor member
semiconductor
lead
pressing
bonding
Prior art date
Application number
TW099117567A
Other languages
English (en)
Chinese (zh)
Other versions
TW201108341A (en
Inventor
安部光仁
川崎朋義
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201108341A publication Critical patent/TW201108341A/zh
Application granted granted Critical
Publication of TWI497618B publication Critical patent/TWI497618B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5122—Plural diverse manufacturing apparatus including means for metal shaping or assembling with means to feed work during tool contact

Landscapes

  • Wire Bonding (AREA)
  • Photovoltaic Devices (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW099117567A 2009-06-03 2010-06-01 Lead connection device for semiconductor structure and connection method thereof TWI497618B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009134312 2009-06-03

Publications (2)

Publication Number Publication Date
TW201108341A TW201108341A (en) 2011-03-01
TWI497618B true TWI497618B (zh) 2015-08-21

Family

ID=43297639

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099117567A TWI497618B (zh) 2009-06-03 2010-06-01 Lead connection device for semiconductor structure and connection method thereof

Country Status (7)

Country Link
US (1) US8967222B2 (https=)
EP (1) EP2439782A4 (https=)
JP (2) JP5143862B2 (https=)
KR (1) KR101281266B1 (https=)
CN (1) CN102449781B (https=)
TW (1) TWI497618B (https=)
WO (1) WO2010140503A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8196798B2 (en) * 2010-10-08 2012-06-12 Kulicke And Soffa Industries, Inc. Solar substrate ribbon bonding system
JP2012142427A (ja) * 2010-12-28 2012-07-26 Npc Inc 太陽電池ストリング製造装置
JP5753010B2 (ja) * 2011-06-30 2015-07-22 芝浦メカトロニクス株式会社 半導体セルのリード線接続装置及び接続方法
JP2013237055A (ja) * 2012-05-11 2013-11-28 Npc Inc 太陽電池セルの配線装置及び搬送装置
US8748212B2 (en) * 2012-08-31 2014-06-10 Komax Holding Ag Method and device for producing solar cell strings
DE102012220815A1 (de) * 2012-11-14 2014-05-28 Schmid Technology Systems Gmbh Vorrichtung und Verfahren zum Aufbringen von Kontaktdrähten auf Solarzellenwafer
JPWO2014119252A1 (ja) * 2013-02-01 2017-01-26 パナソニックＩｐマネジメント株式会社 太陽電池モジュールの製造方法及び太陽電池モジュールの製造装置
JP6184791B2 (ja) * 2013-07-26 2017-08-23 芝浦メカトロニクス株式会社 粘着テープの貼着装置及び貼着方法
CN205992536U (zh) * 2014-10-27 2017-03-01 杰宜斯科技有限公司 搭接装置的电线布置装置
KR101820103B1 (ko) * 2014-10-27 2018-01-18 엘지전자 주식회사 태양전지 모듈, 그 리페어 방법 및 리페어 장치
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
US10236406B2 (en) 2014-12-05 2019-03-19 Solarcity Corporation Systems and methods for targeted annealing of photovoltaic structures
EP3453053B1 (en) * 2016-05-06 2021-03-10 Applied Materials Italia Srl Apparatus for aligning a solar cell element, system for use in the manufacture of a solar cell arrangement, and method for aligning a solar cell element
US10084098B2 (en) * 2016-09-30 2018-09-25 Sunpower Corporation Metallization of conductive wires for solar cells
WO2019141362A1 (en) 2018-01-18 2019-07-25 Applied Materials Italia S.R.L. Apparatus for aligning a solar cell element, system for use in the manufacture of a solar cell arrangement, and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084107A (en) * 1989-06-05 1992-01-28 Mitsubishi Denki Kabushiki Kaisha Solar cell and solar cell array with adhered electrode
TW563211B (en) * 2001-05-18 2003-11-21 Hitachi Ltd Sheet for cleaning mold and method for manufacturing semiconductor device using the same
TWI266394B (en) * 2004-01-27 2006-11-11 Casio Computer Co Ltd Semiconductor device and method of fabricating the same
WO2009011209A1 (ja) * 2007-07-13 2009-01-22 Sanyo Electric Co., Ltd. 太陽電池モジュールの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4240587B2 (ja) * 1998-07-03 2009-03-18 株式会社エヌ・ピー・シー タブリードのはんだ付け装置
US6841728B2 (en) * 2002-01-04 2005-01-11 G.T. Equipment Technologies, Inc. Solar cell stringing machine
JP2005101519A (ja) * 2003-09-05 2005-04-14 Hitachi Chem Co Ltd 太陽電池ユニット及び太陽電池モジュール
JP4248389B2 (ja) * 2003-12-25 2009-04-02 シャープ株式会社 太陽電池モジュールの製造方法と太陽電池モジュールの製造装置
JP4286285B2 (ja) * 2004-03-31 2009-06-24 三洋電機株式会社 太陽電池の製造方法
JP2006278696A (ja) * 2005-03-29 2006-10-12 Kyocera Corp 太陽電池モジュール製造方法
JP5507034B2 (ja) * 2007-03-01 2014-05-28 三洋電機株式会社 太陽電池モジュール及びその製造方法
US8299350B2 (en) * 2007-08-02 2012-10-30 Sanyo Electric Co., Ltd. Solar cell module and method for manufacturing the same
JP5509542B2 (ja) * 2008-05-21 2014-06-04 日立化成株式会社 配線部材の接続構造体及び配線部材の接続方法
JP5377019B2 (ja) * 2009-03-23 2013-12-25 三洋電機株式会社 太陽電池モジュールの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084107A (en) * 1989-06-05 1992-01-28 Mitsubishi Denki Kabushiki Kaisha Solar cell and solar cell array with adhered electrode
TW563211B (en) * 2001-05-18 2003-11-21 Hitachi Ltd Sheet for cleaning mold and method for manufacturing semiconductor device using the same
TWI266394B (en) * 2004-01-27 2006-11-11 Casio Computer Co Ltd Semiconductor device and method of fabricating the same
WO2009011209A1 (ja) * 2007-07-13 2009-01-22 Sanyo Electric Co., Ltd. 太陽電池モジュールの製造方法

Also Published As

Publication number Publication date
JP2011014880A (ja) 2011-01-20
KR20120031025A (ko) 2012-03-29
WO2010140503A1 (ja) 2010-12-09
EP2439782A1 (en) 2012-04-11
US20120077302A1 (en) 2012-03-29
US8967222B2 (en) 2015-03-03
JP5143862B2 (ja) 2013-02-13
JP2013034021A (ja) 2013-02-14
EP2439782A4 (en) 2013-07-31
TW201108341A (en) 2011-03-01
KR101281266B1 (ko) 2013-07-03
CN102449781A (zh) 2012-05-09
CN102449781B (zh) 2014-10-08

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