JPWO2014119252A1 - 太陽電池モジュールの製造方法及び太陽電池モジュールの製造装置 - Google Patents
太陽電池モジュールの製造方法及び太陽電池モジュールの製造装置 Download PDFInfo
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- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
太陽電池ストリング2は、複数の太陽電池3が一列に配置され、隣接する太陽電池3同士にまたがるように接続部材5が配置され、電気的に接続されることによって形成される。
以下では、太陽電池ストリング2の接続構造について図2を用い、説明を行う。以下では、説明の便宜の為、隣接する2つの太陽電池3を区別し、一方を太陽電池3Aとし、他方を太陽電池3Bとして説明を行う。隣接する2つの太陽電池3の間では、異なる極性の集電極が対向するように配置される。つまり、太陽電池3Aのn側の集電極12bと、太陽電池3Bのp側の集電極11bが対向するように、太陽電池3A,3Bが配置される。そして、太陽電池3Aのn側電極12と、太陽電池3Bのp側電極11に、接続部材5がまたがるように配置される。より具体的には本実施形態では、太陽電池3Aの集電極12bと、太陽電池3Bの集電極11bに、接続部材5の銅箔16が重畳するように配置される。重畳した接続部材5と太陽電池3A、接続部材5と太陽電池3Bは、接着剤4により物理的に固定され、接続される。
図3は、太陽電池モジュール1の製造方法の手順を示すフローチャートである。始めに複数の太陽電池3を用意する。そして、隣接する太陽電池3A,3Bにおいて、太陽電池3Aのn側の集電極12bと、太陽電池3Bのp側の集電極11bが対向するようにして、所定の間隔を設け、太陽電池3A,3Bを配置する(第1の手段による第1の工程、図3のS1)。
Claims (6)
- 第1の太陽電池と第2の太陽電池を隣接するように配置する第1の工程と、
前記第1の太陽電池と前記第2の太陽電池に接着剤を配置する第2の工程と、
前記接着剤上に、前記第1の太陽電池と前記第2の太陽電池にまたがるように接続部材を配置する第3の工程と、
前記接続部材の前記第1の太陽電池と前記第2の太陽電池に重畳する部分を同時に加圧し、前記第1の太陽電池と前記第2の太陽電池に前記接続部材を仮固定する第4の工程と、
前記接着剤を硬化させ、前記第1の太陽電池と前記第2の太陽電池に前記接続部材を固定する第5の工程と、
を有する、太陽電池モジュールの製造方法。 - 前記配線部材として可撓性基板に配線パターンが形成されたものを用いる、請求項1に記載の太陽電池モジュールの製造方法。
- 前記接着剤としてフィルム状部材を用いる、請求項1または2に記載の太陽電池モジュールの製造方法。
- 第1の太陽電池と第2の太陽電池を隣接するように配置する第1の手段と、
前記第1の太陽電池と前記第2の太陽電池に接着剤を配置する第2の手段と、
前記接着剤上に、前記第1の太陽電池と前記第2の太陽電池にまたがるように接続部材を配置する第3の手段と、
前記接続部材の前記第1の太陽電池と前記第2の太陽電池に重畳する部分を同時に加圧し、前記第1の太陽電池と前記第2の太陽電池に前記接続部材を仮固定する第4の手段と、
前記接着剤を硬化させ、前記第1の太陽電池と前記第2の太陽電池に前記接続部材を固定する第5の手段と、
を行う、太陽電池モジュールの製造装置。 - 前記配線部材として可撓性基板に配線パターンが形成されたものを用いる、請求項4に記載の太陽電池モジュールの製造装置。
- 前記接着剤としてフィルム状部材を用いる、請求項4または5に記載の太陽電池モジュールの製造装置。
Applications Claiming Priority (3)
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JP2013018629 | 2013-02-01 | ||
JP2013018629 | 2013-02-01 | ||
PCT/JP2014/000303 WO2014119252A1 (ja) | 2013-02-01 | 2014-01-22 | 太陽電池モジュールの製造方法及び太陽電池モジュールの製造装置 |
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JPWO2014119252A1 true JPWO2014119252A1 (ja) | 2017-01-26 |
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US (1) | US20150340543A1 (ja) |
JP (1) | JPWO2014119252A1 (ja) |
DE (1) | DE112014000655T5 (ja) |
WO (1) | WO2014119252A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20160035907A1 (en) * | 2014-08-04 | 2016-02-04 | Lg Electronics Inc. | Solar cell module |
KR101661859B1 (ko) * | 2015-09-09 | 2016-09-30 | 엘지전자 주식회사 | 태양 전지 모듈 및 그 제조 방법 |
JP2017069291A (ja) * | 2015-09-28 | 2017-04-06 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール |
US20190013428A1 (en) * | 2016-02-19 | 2019-01-10 | Corner Star Limited | Connection cells for photovoltaic modules |
CN112490321A (zh) * | 2019-09-10 | 2021-03-12 | 福建省辉锐电子技术有限公司 | 一种fpcb焊带焊接方法 |
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2014
- 2014-01-22 JP JP2014559552A patent/JPWO2014119252A1/ja active Pending
- 2014-01-22 WO PCT/JP2014/000303 patent/WO2014119252A1/ja active Application Filing
- 2014-01-22 DE DE112014000655.6T patent/DE112014000655T5/de not_active Ceased
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2015
- 2015-07-29 US US14/812,381 patent/US20150340543A1/en not_active Abandoned
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