TWI491016B - 用於無引線接合至封裝基板之總成之短線最小化 - Google Patents

用於無引線接合至封裝基板之總成之短線最小化 Download PDF

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Publication number
TWI491016B
TWI491016B TW101136593A TW101136593A TWI491016B TW I491016 B TWI491016 B TW I491016B TW 101136593 A TW101136593 A TW 101136593A TW 101136593 A TW101136593 A TW 101136593A TW I491016 B TWI491016 B TW I491016B
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Taiwan
Prior art keywords
microelectronic
terminals
package
component
microelectronic package
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TW101136593A
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English (en)
Chinese (zh)
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TW201322416A (zh
Inventor
Richard Dewitt Crisp
Wael Zohni
Belgacem Haba
Frank Lambrecht
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Invensas Corp
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Priority claimed from US13/439,354 external-priority patent/US8629545B2/en
Application filed by Invensas Corp filed Critical Invensas Corp
Publication of TW201322416A publication Critical patent/TW201322416A/zh
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Publication of TWI491016B publication Critical patent/TWI491016B/zh

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
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    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • G—PHYSICS
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    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
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  • Semiconductor Memories (AREA)
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TW101136593A 2011-10-03 2012-10-03 用於無引線接合至封裝基板之總成之短線最小化 TWI491016B (zh)

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CN112687614B (zh) 2019-10-17 2024-11-26 美光科技公司 包含多个装置堆叠的微电子装置组合件和封装体以及相关方法
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KR101840240B1 (ko) 2018-05-04
EP2764541A1 (en) 2014-08-13
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