TWI490374B - Electrolytic copper foil, and a secondary battery collector and a secondary battery using the same - Google Patents

Electrolytic copper foil, and a secondary battery collector and a secondary battery using the same Download PDF

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TWI490374B
TWI490374B TW102127920A TW102127920A TWI490374B TW I490374 B TWI490374 B TW I490374B TW 102127920 A TW102127920 A TW 102127920A TW 102127920 A TW102127920 A TW 102127920A TW I490374 B TWI490374 B TW I490374B
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intensity ratio
diffraction intensity
change
value
rate
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TW201428138A (en
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Michiya Kohiki
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Jx Nippon Mining & Metals Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/64Carriers or collectors
    • H01M4/66Selection of materials
    • H01M4/661Metal or alloys, e.g. alloy coatings
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • H01M10/0525Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Cell Electrode Carriers And Collectors (AREA)

Description

電解銅箔、以及使用其之二次電池集電體及二次電池Electrolytic copper foil, and secondary battery collector and secondary battery using same

本發明係關於一種作為以鋰離子二次電池為代表之二次電池之負極集電體材料而較佳之電解銅箔、以及使用其之二次電池集電體及二次電池。The present invention relates to an electrolytic copper foil which is preferably a negative electrode current collector material of a secondary battery typified by a lithium ion secondary battery, and a secondary battery current collector and a secondary battery using the same.

隨著行動電話、筆記型電腦等攜帶型機器之普及,小型且高電容之二次電池之需求不斷增長。又,用於電動汽車或油電混合車等之中、大型之二次電池之需求亦急速增長。於二次電池中,鋰離子二次電池由於輕量且能量密度較高,故而用於許多領域中。With the popularity of portable devices such as mobile phones and notebook computers, the demand for small and high-capacitance secondary batteries is growing. In addition, the demand for large secondary batteries used in electric vehicles or hybrid vehicles has also increased rapidly. Among secondary batteries, lithium ion secondary batteries are used in many fields because of their light weight and high energy density.

作為鋰離子二次電池,已知有將於鋁箔上塗佈有LiCoO2 、LiNiO2 、LiMn2 O4 等化合物者用作正極,將於銅箔上塗佈有碳質材料等作為活性物質者用作負極者。As a lithium ion secondary battery, a compound in which a compound such as LiCoO 2 , LiNiO 2 , or LiMn 2 O 4 is coated on an aluminum foil is used as a positive electrode, and a carbonaceous material or the like is applied as an active material to a copper foil. Used as a negative electrode.

一般而言,銅箔負極板係使用電解銅箔或壓延銅箔,根據以下之製程而製造。In general, a copper foil negative electrode plate is produced by using the electrolytic copper foil or the rolled copper foil according to the following process.

(1)將於溶劑中混練分散活性物質與黏結劑而成之糊塗佈於成為集電體之銅箔之單面或雙面而製作負極板材。(1) A paste obtained by kneading a dispersion of an active material and a binder in a solvent is applied to one side or both sides of a copper foil to be a current collector to prepare a negative electrode plate.

(2)於以150~300℃之溫度加熱數小時至數十小時而進行乾燥。(2) Drying by heating at a temperature of 150 to 300 ° C for several hours to several tens of hours.

(3)視需要對負極板材加壓。(3) Pressurize the negative plate as needed.

(4)實施剪切加工,成型為特定形狀之負極板。(4) Performing a shearing process to form a negative electrode plate of a specific shape.

於專利文獻1中,針對「若使集電體之厚度變薄,則集電體之強度變得脆弱,而於高溫下保存之情形或反覆充放電之情形時,發生活性物質自集電體之剝離、脫落,有時於充放電中促進由集電體之斷裂引起之電容下降」之問題,揭示有藉由提高集電體之強度而改善電池之充放電循環特性之技術。具體而言,獲知集電體之拉伸強度及延伸等機械特性受到(200)與(100)面之峰強度比之影響,以及進而於上述峰強度比中存在適當之範圍,而揭示有如下技術,即,藉由在非氧環境下加熱處理銅或銅合金,將該(200)與(100)面之峰強度比限定於特定之範圍內。In Patent Document 1, "when the thickness of the current collector is made thinner, the strength of the current collector becomes weak, and when it is stored at a high temperature or when it is repeatedly charged and discharged, an active material self-collecting body occurs. The problem of peeling off or falling off may promote the decrease in capacitance due to breakage of the current collector during charge and discharge, and discloses a technique for improving the charge and discharge cycle characteristics of the battery by increasing the strength of the current collector. Specifically, it is known that the tensile strength and the mechanical properties such as elongation of the current collector are affected by the peak intensity ratio of the (200) and (100) planes, and further, there is an appropriate range in the peak intensity ratio, and the following are disclosed. The technique is to limit the peak intensity ratio of the (200) to (100) planes to a specific range by heat-treating copper or a copper alloy in a non-oxygen environment.

又,於專利文獻2中,針對「由於碳等電極活性物質缺乏與銅等一般金屬表面之親和力,故而即便將於電極活性物質中添加有樹脂作為黏合劑之塗層設置於銅箔表面,塗層與銅箔表面之密接性仍然較低,因此於對銅箔實施捲繞等加工等以用作陰極時,由於產生活性物質與銅箔表面之密接不良,故而於作為集電體之活性物質與銅箔之電阻之增加、作為陰極之耐久性或壽命之方面亦存在問題」之情形,揭示有關於原本缺乏與銅箔表面之親和力之塗層與銅箔表面之密接性得到提高之銅箔之技術。具體而言,獲知銅箔側之特定之結晶方位之存在比率較大地影響銅箔表面之氧化物皮膜之與碳等塗層之密接性,於該特定之結晶方位之存在比率為特定之範圍時,可顯著地改善與塗層之密接性,而揭示有如下技術,即,作為特定之結晶方位,著眼於銅箔之200面與220面之結晶方位之積分強度比率(200)/(220),藉由調整最終退火後之冷壓延率,而將該積分強度比限定於特定之範圍內。Further, in Patent Document 2, "the electrode active material such as carbon lacks affinity with a general metal surface such as copper. Therefore, even if a coating of a resin as a binder is added to the electrode active material, the coating is applied to the surface of the copper foil. Since the adhesion between the layer and the surface of the copper foil is still low, when the copper foil is subjected to winding or the like for use as a cathode, the active material and the surface of the copper foil are poorly bonded, so that the active material as a current collector is used. In the case of an increase in the resistance of the copper foil, the durability or the life of the cathode, there is a case where the adhesion of the coating which is originally lacking in affinity with the surface of the copper foil and the surface of the copper foil is improved. Technology. Specifically, it is known that the ratio of the specific crystal orientation of the copper foil side greatly affects the adhesion of the oxide film on the surface of the copper foil to a coating such as carbon, and when the ratio of the specific crystal orientation is a specific range The adhesion to the coating layer can be remarkably improved, and the following technique is disclosed, that is, as a specific crystal orientation, the integrated intensity ratio (200)/(220) of the crystal orientation of the 200 faces and the 220 faces of the copper foil is focused on. The integrated intensity ratio is limited to a specific range by adjusting the cold rolling ratio after the final annealing.

[專利文獻1]日本特開2003-142106號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-142106

[專利文獻2]日本特開平11-310864號公報[Patent Document 2] Japanese Patent Laid-Open No. Hei 11-310864

然而,雖然於專利文獻1、2中均揭示有嘗試控制銅或銅合金之特定之結晶方位而提高循環特性或耐久性等物性之技術,但該物性係根據塗佈活性物質前之狀態之銅或銅合金進行評價。However, in Patent Documents 1 and 2, there is disclosed a technique of attempting to control a specific crystal orientation of copper or a copper alloy to improve physical properties such as cycle characteristics or durability, but the physical properties are based on copper in a state before application of an active material. Or copper alloy for evaluation.

另一方面,即便可實現特定之結晶方位之控制,但仍有就充放電循環特性之觀點而言不充分者,實際上存在不一致性。On the other hand, even if the control of the specific crystal orientation can be achieved, there is still an inconsistency in the case of insufficient charge/discharge cycle characteristics.

對於該不一致性,研究其原因,結果獲知:於活性物質之塗佈於銅或銅合金後之乾燥步驟中通常進行的於150℃~200℃加熱1小時左右之加熱處理中,由於乾燥步驟中之熱量之不一致性,而使銅或銅合金之結晶方位發生變化,結果充放電循環特性變得不穩定。因此,發現藉由將特定之結晶方位之加熱處理前後之變化幅度設為一定範圍以內可解決該課題,從而完成本發明。For the inconsistency, the reason is studied, and as a result, it is known that in the drying step of the active material after being applied to the copper or copper alloy, the heating process is usually carried out at 150 ° C to 200 ° C for about 1 hour, due to the drying step. The inconsistency of the heat causes a change in the crystal orientation of the copper or copper alloy, and as a result, the charge and discharge cycle characteristics become unstable. Therefore, it has been found that the problem can be solved by setting the range of change before and after the heat treatment of the specific crystal orientation within a certain range, and the present invention has been completed.

即,本發明係如下文者。That is, the present invention is as follows.

(1)一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於上述銅或銅合金以CuKα射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),根據下式求出之變化率的最大值為30%以下,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。(1) An electrolytic copper foil comprising copper or a copper alloy, which is irradiated with CuKα rays for the copper or copper alloy before heating at any one of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, the maximum value of the rate of change obtained by the following equation is 30% or less, and the maximum rate of change Value = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100.

(2)一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於上述銅或銅合金以CuKα射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),根據下式求出之變化率的最大值為10%以下,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。(2) An electrolytic copper foil consisting of copper or a copper alloy, which is irradiated with CuKα rays for the copper or copper alloy before heating at any temperature of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, the maximum value of the rate of change obtained by the following equation is 10% or less, and the maximum rate of change Value = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100.

(3)一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及20℃中任一溫度加熱1小時之前後,對於上述銅或銅合金以CuKα射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),根據下式求出之變化率的最大值為5%以下,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。(3) An electrolytic copper foil consisting of copper or a copper alloy, which is irradiated with CuKα rays for the copper or copper alloy before heating at any temperature of 120 ° C, 130 ° C, 150 ° C, and 20 ° C for 1 hour. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, the maximum value of the rate of change obtained by the following equation is 5% or less, and the maximum rate of change Value = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100.

(4)一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於上述銅或銅合金以CuKα射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),以下所定義之變化率之絕對值的最大值為30%以下,此處,變化率之絕對值的最大值為根據下式求出之變化率之最大值之絕對值的值或變化率之最小值之絕對值的值中較大之值,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。(4) An electrolytic copper foil comprising copper or a copper alloy, which is irradiated with CuKα rays for the copper or copper alloy before heating at any temperature of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, and the maximum value of the absolute value of the rate of change defined below is 30% or less, here, The maximum value of the absolute value of the rate of change is the larger of the value of the absolute value of the maximum value of the rate of change or the absolute value of the minimum value of the rate of change, and the maximum value of the rate of change = (( Diffraction intensity ratio after heating) - (diffraction intensity ratio before heating) / (diffraction intensity ratio before heating) × 100, minimum value of change rate = ((diffraction intensity ratio after heating is minimum) Value) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100.

(5)一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於上述銅或銅合金以CuKα射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),以下所定義之變化率之絕對值的最大值為10%以下,此處,變化率之絕對值的最大值為根據下式求出之變化率之最大值之絕對值的值或變化率之最小值之絕對值的值中較大之值,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射 強度比))/(加熱前之繞射強度比)×100。(5) An electrolytic copper foil comprising copper or a copper alloy, which is irradiated with CuKα rays for the copper or copper alloy before heating at any temperature of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, and the maximum value of the absolute value of the rate of change defined below is 10% or less, here, The maximum value of the absolute value of the rate of change is the larger of the value of the absolute value of the maximum value of the rate of change or the absolute value of the minimum value of the rate of change, and the maximum value of the rate of change = (( Diffraction intensity ratio after heating) - (diffraction intensity ratio before heating) / (diffraction intensity ratio before heating) × 100, minimum value of change rate = ((diffraction intensity ratio after heating is minimum) Value) - (diffraction before heating) Intensity ratio)) / (diffraction intensity ratio before heating) × 100.

(6)一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於上述銅或銅合金以CuKα射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),以下所定義之變化率之絕對值的最大值為5%以下,此處,變化率之絕對值的最大值為根據下式求出之變化率之最大值之絕對值的值或變化率之最小值之絕對值的值中較大之值,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。(6) An electrolytic copper foil comprising copper or a copper alloy, which is irradiated with CuKα rays for the copper or copper alloy before heating at any temperature of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, and the maximum value of the absolute value of the rate of change defined below is 5% or less, here, The maximum value of the absolute value of the rate of change is the larger of the value of the absolute value of the maximum value of the rate of change or the absolute value of the minimum value of the rate of change, and the maximum value of the rate of change = (( Diffraction intensity ratio after heating) - (diffraction intensity ratio before heating) / (diffraction intensity ratio before heating) × 100, minimum value of change rate = ((diffraction intensity ratio after heating is minimum) Value) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100.

(7)如(1)~(6)中任一項之電解銅箔,其於以200℃加熱1小時後之上述(200)面與(111)面之繞射強度比(200)/(111)為0.25~5.00。(7) The electrolytic copper foil according to any one of (1) to (6), which has a diffraction intensity ratio (200)/(()) and (111) plane after heating at 200 ° C for 1 hour. 111) is 0.25~5.00.

(8)如(1)~(7)中任一項之電解銅箔,其中,對於上述繞射強度比(200)/(111),根據下式求出之變化率之最小值為負值,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。(8) The electrolytic copper foil according to any one of (1) to (7), wherein, for the diffraction intensity ratio (200) / (111), the minimum value of the change rate obtained by the following formula is a negative value The minimum value of the change rate = ((the diffraction intensity ratio after heating is the minimum value) - (the diffraction intensity ratio before heating)) / (the diffraction intensity ratio before heating) × 100.

(9)一種電解銅箔之製造方法,用以製造(1)至(8)中任一項之電解銅箔,該方法如下:於至少含有銅源之電解用水溶液,添加相對於電解用水溶液以質量比率計為2ppm以上之膠,在調整為對極限電流密度比成為0.170以下之製箔條件下進行電解。(9) A method for producing an electrolytic copper foil, which is used for producing the electrolytic copper foil according to any one of (1) to (8), wherein the method is as follows: adding an aqueous solution for electrolysis to an electrolytic solution containing at least a copper source The gel having a mass ratio of 2 ppm or more was electrolyzed under the foil-forming conditions adjusted to have a limiting current density ratio of 0.170 or less.

(10)一種二次電池集電體,其使用有(1)至(8)中任一項之電解銅箔。(10) A secondary battery current collector using the electrolytic copper foil according to any one of (1) to (8).

(11)一種二次電池,其將(1)至(8)中任一項之電解銅箔用於集電 體。(11) A secondary battery using the electrolytic copper foil according to any one of (1) to (8) for collecting electricity body.

根據本發明,可提供一種作為以鋰離子二次電池為代表之二次電池之負極集電體材料而較佳的充放電循環壽命優異之電解銅箔、以及使用其之二次電池集電體及二次電池。According to the present invention, it is possible to provide an electrolytic copper foil which is excellent in charge and discharge cycle life as a negative electrode current collector material of a secondary battery typified by a lithium ion secondary battery, and a secondary battery current collector using the same And secondary batteries.

1‧‧‧封口板1‧‧‧ sealing plate

2‧‧‧絕緣墊片2‧‧‧Insulation gasket

3‧‧‧正極引線3‧‧‧positive lead

4‧‧‧上部絕緣板4‧‧‧Upper insulation board

5‧‧‧正極板5‧‧‧ positive plate

6‧‧‧負極板6‧‧‧Negative plate

7‧‧‧分隔件7‧‧‧Parts

8‧‧‧電池外殼8‧‧‧ battery case

9‧‧‧負極引線9‧‧‧Negative lead

10‧‧‧下部絕緣板10‧‧‧Lower insulation board

圖1係表示一般之二次電池之構造之概略圖。Fig. 1 is a schematic view showing the structure of a general secondary battery.

(電解銅箔)(electrolytic copper foil)

本實施形態之電解銅箔係由銅或銅合金構成者,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於上述銅或銅合金以CuKα射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),根據下式求出之變化率之絕對值的最大值為30%以下。此處,(200)、(111)之各面之繞射強度係根據XRD中之峰強度、或峰之積分強度而測定,繞射強度比係根據該等強度之比率而算出之指數。The electrodeposited copper foil of the present embodiment is made of copper or a copper alloy, and is heated by the CuKα ray for the copper or copper alloy before heating at any of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source is 30% or less of the maximum value of the absolute value of the rate of change obtained by the following equation. Here, the diffraction intensity of each of (200) and (111) is measured based on the peak intensity in XRD or the integrated intensity of the peak, and the diffraction intensity ratio is an index calculated from the ratio of the intensities.

變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100Maximum value of change rate = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100

又,於本實施形態之電解銅箔中,以200℃加熱1小時後之繞射強度比(200)/(111)之值較佳為0.25~5.00之範圍,特佳為0.25~4.00之範圍。進而,對於上述繞射強度比(200)/(111),以如下方式求出之變化率之絕對值的最大值為30%以下時,即便實施加熱結晶性仍穩定,故而可抑制循環特性之不一致性,就該觀點而言較佳。又,於繞射強度比(200)/(111)之值之變化率之最小值未取負值之情形時,較佳為變化率的最大值為30%以下。Further, in the electrodeposited copper foil of the present embodiment, the value of the diffraction intensity ratio (200) / (111) after heating at 200 ° C for 1 hour is preferably in the range of 0.25 to 5.00, particularly preferably in the range of 0.25 to 4.00. . Further, when the maximum value of the absolute value of the change rate obtained by the following method is 30% or less, the diffraction intensity ratio (200)/(111) is stable even when the heating crystallinity is applied, so that the cycle characteristics can be suppressed. Inconsistency is preferred from this point of view. Further, when the minimum value of the rate of change of the diffraction intensity ratio (200) / (111) does not take a negative value, the maximum value of the rate of change is preferably 30% or less.

此處,變化率之絕對值的最大值為根據下式求出之變化率的最大值之絕對值的值與變化率之最小值之絕對值的值中較大之值。Here, the maximum value of the absolute value of the change rate is a value which is a larger value of the absolute value of the maximum value of the change rate obtained by the following equation and the absolute value of the minimum value of the change rate.

變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100Minimum value of change rate = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100

變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100Maximum value of change rate = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100

根據其他之觀點,本發明提供一種上述繞射強度比(200)/(111)之值之變化率之絕對值的最大值、或該變化率的最大值為10%以下之電解銅箔。According to another aspect, the present invention provides an electrolytic copper foil having a maximum value of the absolute value of the rate of change of the diffraction intensity ratio (200)/(111) or a maximum value of the rate of change of 10% or less.

進而,根據其他之觀點,本發明提供一種上述繞射強度比(200)/(111)之值之變化率之絕對值的最大值、或該變化率的最大值為5%以下之電解銅箔。Further, according to another aspect, the present invention provides an electrolytic copper foil having a maximum value of the absolute value of the rate of change of the diffraction intensity ratio (200)/(111) or a maximum value of the change rate of 5% or less. .

本實施形態之電解銅箔之厚度可藉由提高拉伸強度而抑制活性物質脫落,故而該值越大越佳。然而,若集電體厚度變大,則電池內部之空隙體積減少,能量密度下降,因此較佳為15μm以下,最佳為6~12μm之範圍。The thickness of the electrodeposited copper foil of the present embodiment can suppress the fall of the active material by increasing the tensile strength, so that the larger the value, the better. However, when the thickness of the current collector is increased, the void volume inside the battery is reduced and the energy density is lowered. Therefore, the thickness is preferably 15 μm or less, and most preferably 6 to 12 μm.

又,作為用於電解銅箔之銅合金,較佳為於銅中添加有鋅、銀、錫0.01~30重量%之銅合金。又,亦可使用純度較高之銅。該等銅或銅合金只要為滿足在非水電解質二次電池之應用中必需之耐力、耐熱性、可撓性、導電率等特性者即可,尤其是藉由控制磷(P)或鐵(Fe)、銀(Ag)等微量添加於銅中之元素之添加量,可在不對電池性能產生不良影響之範圍內提高上述特性。又,對於作為不可避免之雜質而含有之鎳(Ni)、錫(Sn)等,只要在不對電池性能產生不良影響之範圍內,則亦可容許。Further, as the copper alloy for electrolytic copper foil, a copper alloy containing 0.01 to 30% by weight of zinc, silver or tin is preferably added to the copper. Also, copper of higher purity can be used. The copper or copper alloy may be any one that satisfies the characteristics such as endurance, heat resistance, flexibility, and electrical conductivity necessary for the application of the nonaqueous electrolyte secondary battery, particularly by controlling phosphorus (P) or iron ( The amount of the element added to the trace amount of copper, such as Fe) or silver (Ag), can be improved in the range which does not adversely affect the battery performance. Further, nickel (Ni), tin (Sn), or the like contained as an unavoidable impurity can be tolerated as long as it does not adversely affect the battery performance.

此種電解銅箔可藉由在至少含有銅源、及視需要之其他金屬成分之電解用水溶液中添加膠,並於調整為對極限電流密度比成為一定範 圍之製箔條件下進行電解而獲得。Such an electrolytic copper foil can be added to a solution for electrolysis using at least a copper source and, if necessary, other metal components, and is adjusted to a limit current limit ratio. Obtained by electrolysis under the conditions of the foil production.

此處,於電解用水溶液中添加之膠之量相對於電解用水溶液以重量比率計為2ppm以上,較佳為6ppm以上。Here, the amount of the gum added to the aqueous solution for electrolysis is 2 ppm or more, preferably 6 ppm or more, based on the weight ratio of the aqueous solution for electrolysis.

又,將電流密度調整為:對極限電流密度比成為0.170以下、較佳為成為0.160以下。Further, the current density is adjusted so that the ratio of the limiting current density is 0.170 or less, preferably 0.160 or less.

於本發明中,對極限電流密度比係根據下式而算出。In the present invention, the limiting current density ratio is calculated according to the following equation.

對極限電流密度比=實際之電流密度/極限電流密度Limit current density ratio = actual current density / limit current density

極限電流密度係根據銅濃度、硫酸濃度、給液速度、極間距離、及電解液溫度而變化,於本發明中,將成為正常鍍敷(銅以層狀析出之狀態)與粗化鍍敷(燒焦鍍敷,銅以結晶狀(球狀或針狀或樹冰狀等)析出之狀態,具有凹凸)之邊界之製箔條件的電流密度定義為極限電流密度,並於霍爾槽試驗(Hull cell test)中將成為正常鍍敷之極限(即將成為燒焦鍍敷之前)之電流密度(目視判斷)作為極限電流密度。The limiting current density varies depending on the copper concentration, the sulfuric acid concentration, the feed rate, the interelectrode distance, and the electrolyte temperature. In the present invention, normal plating (a state in which copper is precipitated in a layer) and rough plating are used. (Scorch plating, the current density of the foil-forming conditions in which the copper is precipitated in the form of crystals (spherical or needle-like or hoarfrost), and the boundary of the irregularities is defined as the limiting current density, and is tested in the Hall cell. In (Hull cell test), the current density (visual judgment) which is the limit of normal plating (before becoming burnt plating) is taken as the limiting current density.

具體而言,於霍爾槽試驗中,將銅濃度、硫酸濃度、及電解液溫度設定為銅箔之製造條件而進行霍爾槽試驗。然後,調查該電解液組成、電解液溫度下之銅層形成狀態(銅以層狀析出或形成為結晶狀)。然後,基於山本鍍金試驗器股份有限公司製作之電流密度簡表,根據試樣(test piece)之正常鍍敷與粗化鍍敷之邊界存在之部位之試樣之位置,求出該邊界之位置之電流密度。然後,將該邊界之位置之電流密度規定為極限電流密度。藉此,可知該電解液組成、電解液溫度下之極限電流密度。一般而言,若極間距離較短,則有極限電流密度變高之傾向。於實施例中,在霍爾槽試驗中使用之試樣為山本鍍金試驗器股份有限公司製造之霍爾槽試驗用橫銅板。Specifically, in the Hall cell test, the Hall concentration test was carried out by setting the copper concentration, the sulfuric acid concentration, and the electrolyte temperature to the production conditions of the copper foil. Then, the electrolyte composition and the state of formation of the copper layer at the temperature of the electrolyte (copper precipitated or formed into a crystal form) were investigated. Then, based on the current density profile produced by Yamamoto Gold Platter Tester Co., Ltd., the position of the boundary is obtained from the position of the sample where the normal plating of the test piece and the boundary of the rough plating are present. Current density. Then, the current density at the position of the boundary is defined as the limiting current density. Thereby, the limit current density at the electrolyte composition and the electrolyte temperature can be known. In general, if the distance between the electrodes is short, the limiting current density tends to be high. In the examples, the sample used in the Hall cell test was a transverse copper plate for Hall cell test manufactured by Yamamoto Gold Plating Tester Co., Ltd.

再者,先前之通例為將對極限電流密度比設為大於0.17而製造電解銅箔以調整銅箔粒子之形狀。霍爾槽試驗之方法例如記載於丸山 清著、日刊工業報社1983年6月30日出版之「鍍敷實務讀本」之157頁至160頁中。Further, in the conventional example, an electrolytic copper foil was produced to adjust the shape of the copper foil particles by setting the limiting current density ratio to be greater than 0.17. The method of the Hall groove test is described, for example, in Maruyama The 157 pages to 160 pages of the "Plating Practice Book" published by the Nikkan Kogyo Shimbun newspaper on June 30, 1983.

若為以此方式獲得之電解銅箔,則成為金屬組織變得微細,膠平均地滲入銅箔內之狀態。又,平均地滲入有膠之電解銅箔即便經過熱處理,金屬組織亦不易變化,結晶方位亦變得穩定。其結果為,於使用該銅箔作為集電體,並製作負極而形成電池時,該電池之充放電循環特性亦得到提高。According to the electrolytic copper foil obtained in this way, the metal structure becomes fine, and the gel penetrates into the copper foil in an average state. Further, even if the electrolytic copper foil which has been infiltrated with the rubber evenly is subjected to heat treatment, the metal structure does not easily change, and the crystal orientation becomes stable. As a result, when the copper foil is used as a current collector and a negative electrode is produced to form a battery, the charge and discharge cycle characteristics of the battery are also improved.

(電池之構成)(Battery composition)

本實施形態之負極板及二次電池之特徵在於將上述銅箔用作負極集電體,對於除此以外之構成並無限定,可使用通常使用之公知者。又,典型之二次電池例如具備:負極板介隔分隔件與以鋰過渡金屬複合氧化物作為正極活性物質之主成分之正極板被絕緣配置而成之極板群、非水電解液、以及收納該極板群及非水電解質之電池外殼。The negative electrode plate and the secondary battery of the present embodiment are characterized in that the copper foil is used as a negative electrode current collector, and the other configuration is not limited, and a commonly used one can be used. In addition, a typical secondary battery includes, for example, a separator group in which a negative electrode plate is partitioned and a positive electrode plate in which a lithium transition metal composite oxide is used as a main component of a positive electrode active material, and a non-aqueous electrolyte solution, and A battery case that houses the electrode group and the non-aqueous electrolyte.

(負極)(negative electrode)

負極由上述負極集電體、以及形成於負極集電體之單面或雙面之負極活性物質構成。作為負極活性物質,可列舉:可吸藏釋出鋰之碳質物、金屬、金屬化合物(金屬氧化物、金屬硫化物、金屬氮化物)、及鋰合金等。The negative electrode is composed of the above-described negative electrode current collector and a negative electrode active material formed on one surface or both surfaces of the negative electrode current collector. Examples of the negative electrode active material include a carbonaceous material capable of absorbing and releasing lithium, a metal, a metal compound (metal oxide, metal sulfide, metal nitride), and a lithium alloy.

作為上述碳質物,可列舉:石墨、焦炭、碳纖維、球狀碳、熱分解氣相碳質物、樹脂燒成體等石墨質材料或碳質材料;藉由以500~3000℃對熱硬化性樹脂、等向性瀝青、中間相瀝青系碳、中間相瀝青系碳纖維、中間相小球體等實施熱處理而獲得之石墨質材料或碳質材料等。Examples of the carbonaceous material include a graphite material such as graphite, coke, carbon fiber, spherical carbon, a thermally decomposable gas phase carbonaceous material, or a resin fired material, or a carbonaceous material; and a thermosetting resin at 500 to 3000 ° C A graphite material or a carbonaceous material obtained by heat treatment such as an isotropic pitch, a mesophase pitch-based carbon, a mesophase pitch-based carbon fiber, or a mesophase small sphere.

作為上述金屬,可列舉:鋰、鋁、鎂、錫、矽等。Examples of the metal include lithium, aluminum, magnesium, tin, antimony, and the like.

作為上述金屬氧化物,可列舉:錫氧化物、矽氧化物、鋰鈦氧化物、鈮氧化物、鎢氧化物等。作為上述金屬硫化物,可列舉:錫硫化物、鈦硫化物等。作為上述金屬氮化物,可列舉:鋰鈷氮化物、鋰鐵氮化物、鋰錳 氮化物等。Examples of the metal oxide include tin oxide, cerium oxide, lithium titanium oxide, cerium oxide, and tungsten oxide. Examples of the metal sulfides include tin sulfides and titanium sulfides. Examples of the metal nitride include lithium cobalt nitride, lithium iron nitride, and lithium manganese. Nitride and the like.

作為鋰合金,可列舉:鋰鋁合金、鋰錫合金、鋰鉛合金、鋰矽合金等。Examples of the lithium alloy include a lithium aluminum alloy, a lithium tin alloy, a lithium lead alloy, and a lithium niobium alloy.

於負極活性物質含有層中可含有黏結劑。作為黏結劑,可列舉:含有羧基甲基纖維素(CMC)及苯乙烯丁二烯(SBR)之混合物。藉由使用含有CMC及SBR之黏結劑,可進一步提高負極活性物質與集電體之密接性。A binder may be contained in the negative electrode active material-containing layer. As a binder, a mixture containing carboxymethylcellulose (CMC) and styrene butadiene (SBR) is mentioned. By using a binder containing CMC and SBR, the adhesion between the negative electrode active material and the current collector can be further improved.

於負極活性物質含有層中可含有導電劑。作為導電劑,可列舉:乙炔黑、粉末狀膨脹石墨等石墨類、碳纖維粉碎物、石墨化碳纖維粉碎物等。A conductive agent may be contained in the negative electrode active material-containing layer. Examples of the conductive agent include graphites such as acetylene black and powdery expanded graphite, carbon fiber pulverized materials, and graphitized carbon fiber pulverized materials.

本發明提供以上述方式獲得之二次電池集電體。The present invention provides a secondary battery current collector obtained in the above manner.

(正極)(positive electrode)

正極係由正極集電體、及形成於上述正極集電體之單面或雙面之正極活性物質含有層構成。The positive electrode is composed of a positive electrode current collector and a positive electrode active material-containing layer formed on one surface or both surfaces of the positive electrode current collector.

作為正極集電體,可列舉:鋁板、鋁網狀材等。Examples of the positive electrode current collector include an aluminum plate and an aluminum mesh material.

正極活性物質含有層例如含有活性物質與黏結劑。作為正極活性物質,可列舉:二氧化錳、二硫化鉬、LiCoO2 、LiNiO2 、LiMn2 O4 等硫屬化合物。該等硫屬化合物亦可以2種以上之混合物而使用。作為黏結劑,可使用如氟系樹脂、聚烯烴樹脂、苯乙烯系樹脂、丙烯酸系樹脂之熱塑性彈性體系樹脂;或如氟橡膠之橡膠系樹脂。The positive electrode active material-containing layer contains, for example, an active material and a binder. Examples of the positive electrode active material include chalcogen compounds such as manganese dioxide, molybdenum disulfide, LiCoO 2 , LiNiO 2 , and LiMn 2 O 4 . These chalcogen compounds may be used in combination of two or more kinds. As the binder, a thermoplastic elastomer resin such as a fluorine resin, a polyolefin resin, a styrene resin or an acrylic resin; or a rubber resin such as a fluororubber can be used.

於活性物質含有層中,可進而含有乙炔黑、粉末狀膨脹石墨等石墨類、碳纖維粉碎物、石墨化碳纖維粉碎物等作為導電輔助材。Further, as the conductive auxiliary material, a graphite such as acetylene black or powdery expanded graphite, a carbon fiber pulverized product, or a graphitized carbon fiber pulverized material may be contained in the active material-containing layer.

(分隔件)(separator)

於正極與負極間可配置分隔件、或固體或凝膠狀之電解質層。作為分隔件,可使用例如具有20~30μm之厚度之聚乙烯多孔質膜、聚丙烯多孔質膜等。A separator or a solid or gel electrolyte layer may be disposed between the positive electrode and the negative electrode. As the separator, for example, a polyethylene porous film having a thickness of 20 to 30 μm, a polypropylene porous film, or the like can be used.

(非水電解質)(non-aqueous electrolyte)

非水電解質可使用具有液狀、凝膠狀或固體狀之形態者。又,非水電解質較理想為含有非水溶劑、以及溶解於該非水溶劑中之電解質。The nonaqueous electrolyte can be used in the form of a liquid, a gel or a solid. Further, the nonaqueous electrolyte is preferably an electrolyte containing a nonaqueous solvent and dissolved in the nonaqueous solvent.

作為非水溶劑,可列舉:碳酸伸乙酯、碳酸二甲酯、碳酸甲基乙酯、碳酸二乙酯、γ-丁內酯等。所使用之非水溶劑之種類可設為1種或2種以上。Examples of the nonaqueous solvent include ethyl carbonate, dimethyl carbonate, methyl ethyl carbonate, diethyl carbonate, and γ-butyrolactone. The type of the nonaqueous solvent to be used may be one or two or more.

作為電解質,可列舉:過氯酸鋰(LiClO4 )、六氟磷酸鋰(LiPF6 )、四氟硼酸鋰(LiBF4 )、六氟砷鋰(LiAsF6 )等。電解質可單獨使用,亦可以混合物之形態使用。Examples of the electrolyte include lithium perchlorate (LiClO 4 ), lithium hexafluorophosphate (LiPF 6 ), lithium tetrafluoroborate (LiBF 4 ), and lithium hexafluoroarsenide (LiAsF 6 ). The electrolyte may be used singly or in the form of a mixture.

本發明提供由二次電池集電體構成之負極、以及含有該等構件且以下述方法構成之二次電池。The present invention provides a negative electrode comprising a secondary battery current collector, and a secondary battery comprising the members and configured by the following method.

[實施例][Examples]

(製造例1)(Manufacturing Example 1)

於電解槽中配置直徑約3133mm、寬度2476.5mm之鈦製之轉筒,且於筒之周圍間隔5mm左右之極間距離配置電極。於該電解槽中導入含有表1中記載之濃度之添加劑之硫酸銅水溶液。然後,調節至表1中記載之對極限電流密度比,使銅析出於轉筒之表面,並剝取析出於轉筒之表面之銅,繼而製造下述發明例1之電解銅箔。銅箔之厚度為10μm。A titanium cylinder having a diameter of about 3,133 mm and a width of 2476.5 mm was placed in the electrolytic cell, and electrodes were placed at intervals of about 5 mm around the cylinder. An aqueous copper sulfate solution containing the additive of the concentration described in Table 1 was introduced into the electrolytic cell. Then, the ratio of the limiting current density ratio described in Table 1 was adjusted to deposit copper on the surface of the drum, and copper deposited on the surface of the drum was peeled off, and then the electrolytic copper foil of the following Invention Example 1 was produced. The thickness of the copper foil was 10 μm.

(製造例2~9)(Manufacturing Example 2 to 9)

除設為表1所示之添加量、及對極限電流密度比以外,以與製造例1同樣之條件製作電解銅箔。再者,製造例2、3、4、5之板厚分別為12μm、8μm、18μm、10μm。又,製造例6~9之板厚為10μm。又,對於製造例2~9,亦將所剝取之銅箔供於繼而後述之發明例或比較例之電解銅箔之製造。An electrolytic copper foil was produced under the same conditions as in Production Example 1 except that the amount of addition shown in Table 1 and the ratio of the limiting current density were used. Further, the plate thicknesses of Production Examples 2, 3, 4, and 5 were 12 μm, 8 μm, 18 μm, and 10 μm, respectively. Further, the plate thicknesses of Production Examples 6 to 9 were 10 μm. Further, in Production Examples 2 to 9, the peeled copper foil was also supplied to the production of the electrolytic copper foil of the invention example or the comparative example described later.

(發明例1~5)(Inventive Examples 1 to 5)

對製造例1~5之電解銅箔進行加熱處理。再者,對於各個電解銅箔,以120℃、130℃、150℃、及200℃各進行1小時加熱處理。測定各自之加熱後之(200)面與(111)面的藉由以CuKα射線作為放射源之XRD所得之繞射強度。The electrolytic copper foils of Production Examples 1 to 5 were subjected to heat treatment. Further, each of the electrolytic copper foils was subjected to heat treatment at 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour. The diffraction intensity of each of the heated (200) plane and the (111) plane by XRD using CuKα ray as a radiation source was measured.

進而,根據下式求出(200)面、(111)面之結晶方位中之繞射強度比(200)/(111)之變化率的最大值、最小值及變化率之絕對值的最大值、以及變化值之最大值、最小值及變化值之絕對值的最大值。Further, the maximum value of the maximum value, the minimum value, and the absolute value of the rate of change of the diffraction intensity ratio (200)/(111) in the crystal orientation of the (200) plane and the (111) plane is obtained by the following equation. And the maximum value of the absolute value of the maximum value, the minimum value, and the change value of the change value.

將結果表示於表2中。The results are shown in Table 2.

※1變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100*1 Minimum value of change rate = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating) / (diffraction intensity ratio before heating) × 100

※2變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100*2 Maximum value of change rate = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100

變化率之絕對值的最大值為上述變化率的最大值之絕對值的值及變化率之最小值之絕對值的值中較大之值。The maximum value of the absolute value of the rate of change is a larger value of the value of the absolute value of the maximum value of the above-described rate of change and the value of the absolute value of the minimum value of the rate of change.

※3變化值之最小值=(加熱後之繞射強度比最小值)-(加熱前之繞射強度比)*3 The minimum value of the change value = (the diffraction intensity ratio after heating is the minimum value) - (the diffraction intensity ratio before heating)

※4變化值之最大值=(加熱後之繞射強度比最大值)-(加熱前之繞射強度比)*4 The maximum value of the change value = (the diffraction intensity ratio after heating is the maximum value) - (the diffraction intensity ratio before heating)

變化值之絕對值的最大值設為上述變化值之最大值之絕對值的值及變化值之最小值之絕對值的值中較大之值。The maximum value of the absolute value of the change value is set to a larger value of the absolute value of the maximum value of the change value and the absolute value of the minimum value of the change value.

(比較例1~4)(Comparative examples 1 to 4)

對於分別於製造例6~9中所得之電解銅箔,以與發明例1同樣之步驟進行加熱處理。又,求出(200)面、(111)面之結晶方位中之繞射強度比(200)/(111)之變化率的最大值及最小值、以及變化值之最大值及最小值。The electrolytic copper foil obtained in each of Production Examples 6 to 9 was subjected to heat treatment in the same manner as in Inventive Example 1. Further, the maximum value and the minimum value of the rate of change of the diffraction intensity ratio (200)/(111) in the crystal orientation of the (200) plane and the (111) plane, and the maximum value and the minimum value of the change value are obtained.

將結果表示於表2中。The results are shown in Table 2.

(充放電循環特性之評價)(Evaluation of charge and discharge cycle characteristics)

對於上述實施例、比較例中所得之銅箔,根據以下之步驟製作圖1所 示之圓筒型之鋰離子二次電池,並測定循環壽命。With respect to the copper foil obtained in the above examples and comparative examples, the following procedure was used to produce the FIG. A cylindrical lithium ion secondary battery was shown and the cycle life was measured.

(1)將作為負極活性物質之鱗片狀石墨粉末50重量份、作為黏結劑之苯乙烯丁二烯橡膠5重量份、以及作為增黏劑之相對於羧基甲基纖維素1重量份溶解於水99重量份中而成之增黏劑水溶液23重量份進行混練分散,而獲得負極用糊。將該負極用糊藉由刮刀方式以厚度200μm雙面塗佈於壓延銅箔試樣表面,並於200℃加熱30分鐘而進行乾燥。加壓並將厚度調整為160μm後,藉由剪切加工使其成型,從而獲得負極板6。(1) 50 parts by weight of flaky graphite powder as a negative electrode active material, 5 parts by weight of styrene butadiene rubber as a binder, and 1 part by weight as a tackifier with respect to carboxymethylcellulose in water 23 parts by weight of an aqueous solution of a tackifier prepared in 99 parts by weight was kneaded and dispersed to obtain a paste for a negative electrode. This negative electrode paste was applied to the surface of the rolled copper foil sample by a doctor blade method at a thickness of 200 μm, and dried by heating at 200 ° C for 30 minutes. After pressurizing and adjusting the thickness to 160 μm, it was molded by shearing to obtain a negative electrode plate 6.

(2)將作為正極活性物質之LiCoO2 粉末50重量份、作為導電劑之乙炔黑1.5重量份、作為黏結劑之PTFE50%水性分散液7重量份、作為增黏劑之羧基甲基纖維素1%水溶液41.5重量份進行混練分散,而獲得正極用糊。將該正極用糊藉由刮刀方式以厚度約230μm雙面塗佈於厚度30μm之由鋁箔構成之集電體上,並於200℃加熱1小時而進行乾燥。加壓並將厚度調整為180μm後,藉由剪切加工使其成型,從而獲得正極板5。(2) 50 parts by weight of LiCoO 2 powder as a positive electrode active material, 1.5 parts by weight of acetylene black as a conductive agent, 7 parts by weight of a PTFE 50% aqueous dispersion as a binder, and carboxymethyl cellulose 1 as a tackifier 41.5 parts by weight of the % aqueous solution was kneaded and dispersed to obtain a paste for a positive electrode. This positive electrode paste was applied on both sides of a current collector made of an aluminum foil having a thickness of 30 μm by a doctor blade method at a thickness of about 230 μm, and dried by heating at 200 ° C for 1 hour. After pressurizing and adjusting the thickness to 180 μm, it was molded by shearing to obtain a positive electrode plate 5.

(3)將正極板5與負極板6以介隔厚度20μm之由聚丙烯樹脂製之微多孔膜構成之分隔件7而絕緣之狀態捲繞為螺旋狀,並將由此所得之電極群收納於電池外殼8中。(3) The positive electrode plate 5 and the negative electrode plate 6 are wound in a spiral shape with a separator 7 made of a microporous film made of a polypropylene resin having a thickness of 20 μm, and the electrode group thus obtained is housed in a spiral shape. In the battery case 8.

(4)將自負極板6連接之負極引線9經由下部絕緣板10而與上述外殼8電性連接。同樣地,將自正極板5連接之正極引線3經由上部絕緣板4而電性連接於封口板1之內部端子。其後,注入非水電解液,將封口板1與電池外殼8經由絕緣墊片(gasket)2而填縫封口,並以直徑17mm、高度50mm之尺寸製作電池電容為780mAh之圓筒型鋰離子二次電池。(4) The negative electrode lead 9 connected from the negative electrode plate 6 is electrically connected to the outer casing 8 via the lower insulating plate 10. Similarly, the positive electrode lead 3 connected from the positive electrode plate 5 is electrically connected to the internal terminal of the sealing plate 1 via the upper insulating plate 4. Thereafter, a non-aqueous electrolyte solution was injected, and the sealing plate 1 and the battery can 8 were caulked and sealed via an insulating gasket 2, and a cylindrical lithium ion having a battery capacity of 780 mAh was produced in a size of 17 mm in diameter and 50 mm in height. Secondary battery.

(5)關於電解液,係注入特定量之「於碳酸伸乙酯30體積%、碳酸乙基甲酯50體積%、丙酸甲酯20體積%之混合溶劑中,溶解作為電解質之六氟磷酸鋰(LiPF6 )1.0莫耳」而成之電解液。使該電解液含浸於正極活性物質層及負極活性物質層內。(5) In the electrolyte solution, a specific amount of lithium hexafluorophosphate (LiPF) as an electrolyte is dissolved in a mixed solvent of 30% by volume of ethyl carbonate, 50% by volume of ethyl methyl carbonate, and 20% by volume of methyl propionate. 6 ) 1.0 mole of electrolyte. This electrolyte solution is impregnated into the positive electrode active material layer and the negative electrode active material layer.

其次,對於上述實施例及比較例中所得之電池,使用各20個電池,而評價充放電循環特性。Next, with respect to the batteries obtained in the above Examples and Comparative Examples, 20 batteries were used, and the charge and discharge cycle characteristics were evaluated.

在此,充放電循環特性係於20℃之環境下重複由以下之充電條件及放電條件構成之充放電循環而評價。Here, the charge and discharge cycle characteristics were evaluated by repeating a charge and discharge cycle composed of the following charging conditions and discharge conditions in an environment of 20 ° C.

-充電條件:以4.2V進行2小時之定電流-定電壓充電,於電池電壓達到4.2V之前進行550mA(0.7CmA)之定電流充電後,進而充電直至電流值衰減而成為40mA(0.05CmA)為止。- Charging conditions: constant current charging at 4.2V for 2 hours - constant current charging at 550 mA (0.7 CmA) before the battery voltage reaches 4.2 V, and then charging until the current value decays to 40 mA (0.05 CmA) until.

-放電條件:於以780mA(1CmA)之定電流放電至3.0V之放電終止電壓時,將第3次循環中之電容作為初期電容,於放電電容相對於初期電容而降低至80%為止計算循環數。將充放電循環數之平均值之結果示於表3中。-Discharge condition: When discharging at a constant current of 780 mA (1 CmA) to a discharge termination voltage of 3.0 V, the capacitance in the third cycle is used as an initial capacitance, and the cycle is calculated until the discharge capacitance is reduced to 80% with respect to the initial capacitance. number. The results of the average of the number of charge and discharge cycles are shown in Table 3.

Claims (12)

一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於該銅或銅合金的表面以CuK α射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),根據下式求出之變化率的最大值為30%以下,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。 An electrolytic copper foil consisting of copper or a copper alloy, and after being heated at any temperature of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour, the surface of the copper or copper alloy is irradiated with CuK α rays. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, the maximum value of the rate of change obtained by the following equation is 30% or less, and the maximum rate of change Value = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100. 一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於該銅或銅合金的表面以℃uK α射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),根據下式求出之變化率的最大值為10%以下,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。 An electrolytic copper foil consisting of copper or a copper alloy, after heating at any temperature of 120 ° C, 130 ° C, 150 ° C and 200 ° C for 1 hour, the surface of the copper or copper alloy is ° CuK α ray The diffraction intensity ratio (200)/(111) between the (200) plane and the (111) plane in the X-ray diffraction of the radiation source, and the maximum value of the change rate obtained by the following equation is 10% or less, and the rate of change Maximum value = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100. 一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於該銅或銅合金的表面以℃uK α射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),根據下式求出之變化率的最大值為5%以下,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。 An electrolytic copper foil consisting of copper or a copper alloy, after heating at any temperature of 120 ° C, 130 ° C, 150 ° C and 200 ° C for 1 hour, the surface of the copper or copper alloy is ° CuK α ray The diffraction intensity ratio (200)/(111) between the (200) plane and the (111) plane in the X-ray diffraction of the radiation source, and the maximum value of the change rate obtained by the following equation is 5% or less, and the rate of change Maximum value = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100. 一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於該銅或銅合金的表面以℃uK α射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),以下所定義之變化率之絕對值的最大值為30%以下,此處,變化率之絕對值的最大值為根據下式求出之變化率之最大值之絕對值的值或變化率之最小值之絕對值的值中較大之值, 變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。 An electrolytic copper foil consisting of copper or a copper alloy, after heating at any temperature of 120 ° C, 130 ° C, 150 ° C and 200 ° C for 1 hour, the surface of the copper or copper alloy is ° CuK α ray The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the radiation source, and the maximum value of the absolute value of the rate of change defined below is 30% or less, here The maximum value of the absolute value of the change rate is a value which is a larger value of the absolute value of the maximum value of the change rate or the absolute value of the minimum value of the change rate. Maximum value of change rate = ((diffraction intensity ratio after heating) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100, minimum value of change rate = (( The diffraction intensity ratio after heating is the minimum value - (diffraction intensity ratio before heating) / / (diffraction intensity ratio before heating) × 100. 一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於該銅或銅合金的表面以CuK α射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),以下所定義之變化率之絕對值的最大值為10%以下,此處,變化率之絕對值的最大值為根據下式求出之變化率之最大值之絕對值的值或變化率之最小值之絕對值的值中較大之值,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。 An electrolytic copper foil consisting of copper or a copper alloy, and after being heated at any temperature of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour, the surface of the copper or copper alloy is irradiated with CuK α rays. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, and the maximum value of the absolute value of the rate of change defined below is 10% or less, here, The maximum value of the absolute value of the rate of change is the larger of the value of the absolute value of the maximum value of the rate of change or the absolute value of the minimum value of the rate of change, and the maximum value of the rate of change = (( Diffraction intensity ratio after heating) - (diffraction intensity ratio before heating) / (diffraction intensity ratio before heating) × 100, minimum value of change rate = ((diffraction intensity ratio after heating is minimum) Value) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100. 一種電解銅箔,係由銅或銅合金構成,於以120℃、130℃、150℃及200℃中任一溫度加熱1小時之前後,對於該銅或銅合金的表面以CuK α射線作為放射源之X射線繞射中之(200)面與(111)面的繞射強度比(200)/(111),以下所定義之變化率之絕對值的最大值為5%以下,此處,變化率之絕對值的最大值為根據下式求出之變化率之最大值之絕對值的值或變化率之最小值之絕對值的值中較大之值,變化率之最大值=((加熱後之繞射強度比最大值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。 An electrolytic copper foil consisting of copper or a copper alloy, and after being heated at any temperature of 120 ° C, 130 ° C, 150 ° C, and 200 ° C for 1 hour, the surface of the copper or copper alloy is irradiated with CuK α rays. The diffraction intensity ratio (200)/(111) of the (200) plane and the (111) plane in the X-ray diffraction of the source, and the maximum value of the absolute value of the rate of change defined below is 5% or less, here, The maximum value of the absolute value of the rate of change is the larger of the value of the absolute value of the maximum value of the rate of change or the absolute value of the minimum value of the rate of change, and the maximum value of the rate of change = (( Diffraction intensity ratio after heating) - (diffraction intensity ratio before heating) / (diffraction intensity ratio before heating) × 100, minimum value of change rate = ((diffraction intensity ratio after heating is minimum) Value) - (diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100. 如申請專利範圍第1至6項中任一項之電解銅箔,其於以200℃加熱1 小時後之該(200)面與(111)面之繞射強度比(200)/(111)為0.25~5.00。An electrolytic copper foil according to any one of claims 1 to 6, which is heated at 200 ° C. The diffraction intensity ratio (200) / (111) of the (200) plane and the (111) plane after the hour is 0.25 to 5.00. 如申請專利範圍第1至6項中任一項之電解銅箔,其中,對於該繞射強度比(200)/(111),根據下式求出之變化率之最小值為負值,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。The electrolytic copper foil according to any one of claims 1 to 6, wherein, for the diffraction intensity ratio (200) / (111), the minimum value of the rate of change obtained according to the following formula is a negative value, and the change The minimum value of the rate = ((the diffraction intensity ratio after heating is the minimum value) - (the diffraction intensity ratio before heating)) / (the diffraction intensity ratio before heating) × 100. 如申請專利範圍第7項之電解銅箔,其中,對於該繞射強度比(200)/(111),根據下式求出之變化率之最小值為負值,變化率之最小值=((加熱後之繞射強度比最小值)-(加熱前之繞射強度比))/(加熱前之繞射強度比)×100。The electrolytic copper foil according to item 7 of the patent application, wherein, for the diffraction intensity ratio (200) / (111), the minimum value of the rate of change obtained according to the following formula is a negative value, and the minimum value of the change rate = ( (Diffraction intensity ratio after heating) - ((diffraction intensity ratio before heating)) / (diffraction intensity ratio before heating) × 100. 一種電解銅箔之製造方法,用以製造申請專利範圍第1至9項中任一項之電解銅箔,該方法如下:於至少含有銅源之電解用水溶液,添加相對於電解用水溶液以質量比率計為2ppm以上之膠,在調整為對極限電流密度比成為0.170以下之製箔條件下進行電解。The invention relates to a method for producing an electrolytic copper foil, which is used for manufacturing the electrolytic copper foil according to any one of claims 1 to 9, which is as follows: adding an aqueous solution for electrolysis for at least a copper source with an aqueous solution for electrolysis The gel having a ratio of 2 ppm or more was electrolyzed under the foil-forming conditions adjusted to have a limiting current density ratio of 0.170 or less. 一種二次電池集電體,其使用有申請專利範圍第1至9項中任一項之電解銅箔。A secondary battery current collector using the electrolytic copper foil according to any one of claims 1 to 9. 一種二次電池,其將申請專利範圍第1至9項中任一項之電解銅箔用於集電體。A secondary battery using the electrolytic copper foil according to any one of claims 1 to 9 for a current collector.
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